CN215749624U - Punching device for chip processing - Google Patents
Punching device for chip processing Download PDFInfo
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- CN215749624U CN215749624U CN202122303430.9U CN202122303430U CN215749624U CN 215749624 U CN215749624 U CN 215749624U CN 202122303430 U CN202122303430 U CN 202122303430U CN 215749624 U CN215749624 U CN 215749624U
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- buffer
- sliding
- rod
- assembly
- punching
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Abstract
The utility model relates to the technical field of punching devices, in particular to a punching device for chip processing, which comprises a rack, a punching assembly, a downward pressing buffer assembly and a material buffer assembly, wherein the rack is provided with a plurality of punching holes; the stamping assembly is arranged on the frame; a sliding rod is arranged on the frame; the material buffering component is arranged on the sliding rod in a sliding mode. According to the utility model, the downward pressing buffer assembly is arranged, the electric telescopic rod controls the mold clamp to clamp the mold, and the first buffer piece is used for providing elastic buffer connection between the first sliding block and the second sliding block; therefore, the material is prevented from being damaged due to excessive impact force of the die on the material in the pressing process, so that the material is protected, and the production quality of the material is improved; through the arrangement of the material buffering assembly, the placing plate is subjected to buffering protection by using a second buffering piece; when the material on the placing plate receives the pressure of the stamping assembly, the second buffer part elastically supports the placing plate, so that certain elastic buffer force is provided for the material, and the material is protected.
Description
Technical Field
The utility model relates to the technical field of punching devices, in particular to a punching device for chip processing.
Background
Chips are a general term for semiconductor device products, and are a way of miniaturizing circuits, including semiconductor devices, passive components, etc., in electronics, and are often manufactured on the surface of a semiconductor wafer, and a processing procedure of chips during processing is called die cutting.
The utility model with the application number of CN202021472518.2 discloses a chip punching device for processing electronic products, which improves the safety of materials during blanking by arranging a storage box, a storage box and a bubble pad; however, if the material is stressed too much in the punching process, the material is easy to damage, the chip size is small, and defective products are easy to generate once the procedure is wrong.
SUMMERY OF THE UTILITY MODEL
The utility model provides a punching device for processing a chip, aiming at the technical problems in the background art, wherein a downward pressing buffer assembly is arranged, an electric telescopic rod controls a die clamp to clamp a die, and a first buffer piece is utilized to provide elastic buffer connection between a first sliding block and a second sliding block; therefore, the material is prevented from being damaged due to excessive impact force of the die on the material in the pressing process, so that the material is protected, and the production quality of the material is improved; through the arrangement of the material buffering assembly, the placing plate is subjected to buffering protection by using a second buffering piece; when the material on the placing plate receives the pressure of the stamping assembly, the second buffer part elastically supports the placing plate, so that certain elastic buffer force is provided for the material, and the material is protected.
The technical scheme of the utility model is as follows: a punching device for chip processing comprises a frame, a punching assembly, a pressing buffer assembly and a material buffer assembly; the stamping assembly is arranged on the frame; a sliding rod is arranged on the frame; the material buffer component is arranged on the sliding rod in a sliding manner; one end of the downward pressing buffering assembly is arranged on the sliding rod in a sliding mode, the other end of the downward pressing buffering assembly is connected to the stamping end of the stamping assembly, and the downward pressing buffering assembly is located between the stamping assembly and the material buffering assembly.
Preferably, the downward pressing buffer assembly comprises a first sliding block, an electric telescopic rod, a die clamp and a first buffer piece; the first sliding block is arranged on the sliding rod in a sliding mode; the electric telescopic rod is arranged on the first sliding block; the mold clamp is arranged at one end of the electric telescopic rod close to the mold; the one end setting of bolster is on a sliding block, and the other end setting of bolster is on material buffering subassembly.
Preferably, the stamping assembly comprises a sliding frame, a sliding seat and a stamping part; the sliding frame is arranged on the rack; the sliding seat is arranged on the sliding frame in a sliding manner; the stamping part is arranged on the sliding seat.
Preferably, the material buffering assembly comprises a placing plate, a second buffering piece and a second sliding block; the second sliding block is arranged on the sliding rod in a sliding manner; the placing plate is arranged on the second sliding block and is in sliding connection with the rack; the one end setting of No. two bolster is placing the one end that the board kept away from the punching press subassembly, and the other end setting of No. two bolsters is in the frame.
Preferably, the second buffer piece comprises a connecting rod, a guide sleeve rod and a second spring; the connecting rod is sleeved on the guide sleeve rod in a sliding manner; no. two springs slide to be set up on the direction loop bar, and the one end setting of No. two springs is on the connecting rod, and the other end setting of No. two springs is on the direction loop bar.
Preferably, a second clamping block is arranged on the connecting rod; the second clamping block is arranged on the guide sleeve rod in a sliding mode.
Preferably, a second clamping groove is formed in the guide sleeve rod; no. two fixture blocks slide and set up on No. two draw-in grooves.
Preferably, the first buffer piece comprises a buffer sleeve rod, a buffer rod and a first spring; the buffer rods are arranged at two ends of the buffer sleeve rod in a sliding manner; the first spring is arranged on the buffer loop bar in a sliding manner, and two ends of the first spring are respectively arranged on the two groups of buffer bars; a first clamping block is arranged on the buffer rod; a first clamping groove is formed in the buffer sleeve rod; a card piece slides and sets up on a draw-in groove.
Preferably, the buffer rod is provided with buffer washers at both ends.
Compared with the prior art, the technical scheme of the utility model has the following beneficial technical effects:
the first sliding block and the second sliding block are elastically connected in a buffering mode through a buffering piece; therefore, the material is prevented from being damaged due to excessive impact force of the die on the material in the pressing process, so that the material is protected, and the production quality of the material is improved;
secondly, buffering and protecting the placing plate by using a second buffer part through arranging a material buffering assembly; when the material on the placing plate receives the pressure of the stamping assembly, the second buffer part elastically supports the placing plate, so that certain elastic buffer force is provided for the material, and the material is protected.
Drawings
Fig. 1 is a schematic structural diagram of an embodiment of the present invention.
FIG. 2 is a cross-sectional view of one embodiment of the present invention.
Fig. 3 is a partially enlarged structural diagram of a portion a in fig. 2.
Fig. 4 is a partially enlarged structural diagram of a portion B in fig. 2.
Reference numerals: 1. a frame; 2. a stamping assembly; 3. pressing the buffer component; 4. a material buffer assembly; 5. material preparation; 6. a carriage; 7. a sliding seat; 8. stamping parts; 9. a mold; 10. a slide bar; 11. a first sliding block; 12. an electric telescopic rod; 13. a mold clamp; 14. placing the plate; 15. a second buffer member; 16. a connecting rod; 17. a guide loop bar; 18. a second spring; 19. a second clamping block; 20. a second card slot; 21. a second slider; 22. a first buffer part; 23. a buffer loop bar; 24. a buffer rod; 25. a first spring; 26. a first clamping block; 27. a first card slot; 28. a cushion washer.
Detailed Description
Example one
As shown in fig. 1 to 4, the punching device for processing a chip provided by the utility model comprises a frame 1, a punching assembly 2, a pressing buffer assembly 3 and a material buffer assembly 4;
the stamping assembly 2 is arranged on the frame 1; a sliding rod 10 is arranged on the frame 1; the material buffering component 4 is arranged on the sliding rod 10 in a sliding manner; one end of the downward pressing buffering component 3 is arranged on the sliding rod 10 in a sliding mode, the other end of the downward pressing buffering component 3 is connected to the stamping end of the stamping component 2, and the downward pressing buffering component 3 is located between the stamping component 2 and the material buffering component 4.
Example two
As shown in fig. 1 to 4, in the punching apparatus for processing a chip according to the present embodiment, compared to the first embodiment, the push-down buffer assembly 3 includes a first sliding block 11, an electric telescopic rod 12, a mold clamp 13, and a first buffer 22; a first sliding block 11 is arranged on the sliding rod 10 in a sliding mode; the electric telescopic rod 12 is arranged on the first sliding block 11; the mold clamp 13 is arranged at one end of the electric telescopic rod 12 close to the mold 9; one end setting of a bolster 22 is on sliding block 11, and the other end setting of a bolster 22 is on material buffering subassembly 4.
In the embodiment, by arranging the downward pressing buffer component 3, the electric telescopic rod 12 controls the die clamp 13 to clamp the die 9, and the first buffer piece 22 is used for providing elastic buffer connection between the first sliding block 11 and the second sliding block 21; thereby avoid mould 9 to cause too big impulsive force to material 5 at the in-process that pushes down, lead to material 5 to take place to damage to provide the protection to material 5, improve the production quality of material 5.
EXAMPLE III
As shown in fig. 1 to 4, the punching apparatus for chip processing according to the present embodiment includes, in comparison with the first embodiment, a punching assembly 2 including a carriage 6, a sliding seat 7, and a punching member 8; the sliding frame 6 is arranged on the frame 1; the sliding seat 7 is arranged on the sliding frame 6 in a sliding manner; the stamping part 8 is arranged on the sliding seat 7.
Example four
As shown in fig. 1 to 4, in the punching apparatus for processing a chip according to the present embodiment, compared with the first embodiment, the material buffering assembly 4 includes a placing plate 14, a second buffering member 15, and a second sliding block 21; the second sliding block 21 is arranged on the sliding rod 10 in a sliding manner; the placing plate 14 is arranged on the second sliding block 21 and is connected with the rack 1 in a sliding manner; one end of the second buffer 15 is arranged at one end of the placing plate 14 far away from the stamping component 2, and the other end of the second buffer 15 is arranged on the frame 1.
In the embodiment, by arranging the material buffer assembly 4, the placing plate 14 is protected by buffering by the buffer member two 15; when the material 5 on the placing plate 14 receives the pressure of the stamping component 2, the second buffer piece 15 elastically supports the placing plate 14, so that certain elastic buffer force is provided for the material 5, and the material 5 is protected.
EXAMPLE five
As shown in fig. 1 to 4, in the punching device for chip processing according to the present embodiment, compared to the fourth embodiment, the second buffer 15 includes a connecting rod 16, a guide sleeve rod 17, and a second spring 18; the connecting rod 16 is sleeved on the guide sleeve rod 17 in a sliding manner; the second spring 18 is arranged on the guide sleeve rod 17 in a sliding mode, one end of the second spring 18 is arranged on the connecting rod 16, and the other end of the second spring 18 is arranged on the guide sleeve rod 17.
EXAMPLE six
As shown in fig. 1 to 4, in the punching apparatus for chip processing according to the present embodiment, compared to the fifth embodiment, a second fixture block 19 is disposed on the connecting rod 16; the second latch block 19 is slidably arranged on the guide sleeve rod 17.
In this embodiment, the second latch 19 is provided to prevent the exercise-grade goose liver 16 from falling off the guide bar 17.
EXAMPLE seven
As shown in fig. 1 to 4, in the punching apparatus for chip processing according to the present embodiment, compared to the sixth embodiment, the guide sleeve rod 17 is provided with a second card slot 20; the second latch 19 is slidably disposed on the second slot 20.
In the present embodiment, a second engaging groove 20 is provided to guide the sliding movement of the second engaging piece 19 on the guide sleeve rod 17.
Example eight
As shown in fig. 1 to 4, in the punching device for chip processing according to the present embodiment, compared to the fourth embodiment, the first buffer 22 includes a buffer sleeve rod 23, a buffer rod 24, and a first spring 25; the buffer rods 24 are arranged at two ends of the buffer loop rod 23 in a sliding manner; the first spring 25 is arranged on the buffer loop bar 23 in a sliding manner, and two ends of the first spring 25 are respectively arranged on the two groups of buffer bars 24; a first clamping block 26 is arranged on the buffer rod 24; a first clamping groove 27 is formed in the buffer loop bar 23; the first clamping block 26 is slidably arranged on the first clamping groove 27.
Example nine
As shown in fig. 1 to 4, in the punching apparatus for chip processing according to the present embodiment, buffer washers 28 are provided at both ends of the buffer rod 24, compared to the eighth embodiment.
In this embodiment, a cushion washer 28 is provided to protect the cushion rod 24 from being cushioned.
It is to be understood that the above-described embodiments of the present invention are merely illustrative of or explaining the principles of the utility model and are not to be construed as limiting the utility model. Therefore, any modification, equivalent replacement, improvement and the like made without departing from the spirit and scope of the present invention should be included in the protection scope of the present invention. Further, it is intended that the appended claims cover all such variations and modifications as fall within the scope and boundaries of the appended claims or the equivalents of such scope and boundaries.
Claims (9)
1. A punching device for chip processing is characterized by comprising a rack (1), a punching assembly (2), a pressing buffer assembly (3) and a material buffer assembly (4);
the stamping assembly (2) is arranged on the frame (1); a sliding rod (10) is arranged on the frame (1); the material buffer component (4) is arranged on the sliding rod (10) in a sliding manner; one end of the downward pressing buffering component (3) is arranged on the sliding rod (10) in a sliding mode, the other end of the downward pressing buffering component (3) is connected to the punching end of the punching component (2), and the downward pressing buffering component (3) is located between the punching component (2) and the material buffering component (4).
2. The punching device for chip processing according to claim 1, wherein the pressing buffer assembly (3) comprises a first sliding block (11), an electric telescopic rod (12), a die clamp (13) and a first buffer member (22); the first sliding block (11) is arranged on the sliding rod (10) in a sliding mode; the electric telescopic rod (12) is arranged on the first sliding block (11); the mould clamp (13) is arranged at one end of the electric telescopic rod (12) close to the mould (9); one end of a buffer piece (22) is arranged on the first sliding block (11), and the other end of the buffer piece (22) is arranged on the material buffer assembly (4).
3. The die-cutting device for chip processing according to claim 1, wherein the punching assembly (2) comprises a sliding frame (6), a sliding seat (7) and a punching part (8); the sliding frame (6) is arranged on the rack (1); the sliding seat (7) is arranged on the sliding frame (6) in a sliding manner; the stamping part (8) is arranged on the sliding seat (7).
4. The punching device for processing the chip as claimed in claim 1, wherein the material buffering assembly (4) comprises a placing plate (14), a second buffering member (15) and a second sliding block (21); the second sliding block (21) is arranged on the sliding rod (10) in a sliding mode; the placing plate (14) is arranged on the second sliding block (21) and is in sliding connection with the rack (1); one end of a second buffer piece (15) is arranged at one end, far away from the stamping assembly (2), of the placing plate (14), and the other end of the second buffer piece (15) is arranged on the rack (1).
5. The punching device for chip processing according to claim 4, wherein the second buffer member (15) comprises a connecting rod (16), a guide sleeve rod (17) and a second spring (18); the connecting rod (16) is sleeved on the guide sleeve rod (17) in a sliding manner; the second spring (18) is arranged on the guide sleeve rod (17) in a sliding mode, one end of the second spring (18) is arranged on the connecting rod (16), and the other end of the second spring (18) is arranged on the guide sleeve rod (17).
6. The punching device for chip processing according to claim 5, wherein a second clamping block (19) is arranged on the connecting rod (16); the second clamping block (19) is arranged on the guide sleeve rod (17) in a sliding mode.
7. The punching device for chip processing according to claim 6, wherein the guide sleeve rod (17) is provided with a second clamping groove (20); the second clamping block (19) is slidably arranged on the second clamping groove (20).
8. The punching device for chip processing according to claim 4, wherein the first buffer member (22) comprises a buffer sleeve rod (23), a buffer rod (24) and a first spring (25); the buffer rods (24) are arranged at two ends of the buffer sleeve rod (23) in a sliding manner; the first spring (25) is arranged on the buffer sleeve rod (23) in a sliding mode, and two ends of the first spring (25) are respectively arranged on the two groups of buffer rods (24); a first clamping block (26) is arranged on the buffer rod (24); a first clamping groove (27) is formed in the buffer sleeve rod (23); the first clamping block (26) is slidably arranged on the first clamping groove (27).
9. The die-cutting device for chip processing according to claim 8, wherein the buffer rods (24) are provided with buffer washers (28) at both ends thereof.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122303430.9U CN215749624U (en) | 2021-09-23 | 2021-09-23 | Punching device for chip processing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122303430.9U CN215749624U (en) | 2021-09-23 | 2021-09-23 | Punching device for chip processing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215749624U true CN215749624U (en) | 2022-02-08 |
Family
ID=80090129
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122303430.9U Active CN215749624U (en) | 2021-09-23 | 2021-09-23 | Punching device for chip processing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215749624U (en) |
-
2021
- 2021-09-23 CN CN202122303430.9U patent/CN215749624U/en active Active
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