CN215735599U - Cooling device for modular data center - Google Patents

Cooling device for modular data center Download PDF

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Publication number
CN215735599U
CN215735599U CN202122176662.2U CN202122176662U CN215735599U CN 215735599 U CN215735599 U CN 215735599U CN 202122176662 U CN202122176662 U CN 202122176662U CN 215735599 U CN215735599 U CN 215735599U
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cooling
data center
container
liquid
server
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CN202122176662.2U
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孙卫鹏
张文豪
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Yishite Henan Communication Technology Co ltd
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Yishite Henan Communication Technology Co ltd
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Abstract

The utility model relates to a cooling device for a modular data center, and belongs to the field of data center heat dissipation. The cooling device for the modular data center comprises a cooling container, a liquid cooling plate, a cover and a water tank; the liquid cooling plate is provided with a plurality of server installation cavities in the inner cavity of the cooling container so as to divide the inner cavity of the cooling container into a plurality of server installation cavities, cooling pipes for flowing cooling water are arranged in the liquid cooling plate, each cooling pipe is provided with a water inlet and a water outlet extending out of the cooling container, and the server installation cavities are used for installing servers of a data center so that the surfaces of the servers are tightly attached to the surfaces of the liquid cooling plate; the cover is movably assembled at the top of the cooling container, one side of the cover, which faces the cooling container, is provided with an upward-concave groove, the bottom of the groove is fixed with at least two cooling fans which are arranged at intervals along the left-right direction, and the bottom of the groove is also provided with a threading hole for a cable on a server to pass through; the water tank provides cooling water for the liquid cooling plate. And a liquid cooling and air cooling mode is adopted, so that the cooling effect of the data center is improved.

Description

Cooling device for modular data center
Technical Field
The utility model relates to the technical field of data center heat dissipation, in particular to a cooling device for a modular data center.
Background
The data center machine room is a large space for providing operation for the server, but the internal temperature of the space is high due to strong equipment performance, high concentration and large heat productivity, and the performance of the server is reduced due to long-term operation. Among the current data center server cooling technology, most computer lab adopt air conditioning system to refrigerate, because the air current distribution influence of air itself, it is not good to have some rack radiating effect in whole computer lab, simultaneously because adopt air cooling circulation just needs a large amount of fans to carry out air cycle, can't be accurate cool off each server to cause data center in the aspect of the air conditioner energy consumption to account for than great.
In addition, a small part of high-end machine rooms are directly soaked and cooled by water or special solution, the whole data center server is soaked in liquid for circulating cooling, and air cooling is replaced by insulating cooling liquid. After the cooling liquid absorbs heat and is gasified, the cooling liquid directly absorbs the heat and enters the external circulation for cooling, and the liquefied cooling liquid is used for heat dissipation again. Therefore, any cooling equipment such as a fan or an air conditioner is not needed, and much space is saved. However, this method requires extremely high requirements for the manufacturing of the server itself and the material of the cooling solution itself, and thus the operation cost and the investment cost are extremely high, and it is difficult to realize large-scale application.
SUMMERY OF THE UTILITY MODEL
In view of this, the present invention provides a cooling device for a modular data center, so as to solve the technical problems of high energy consumption and high cost of the data center in the prior art.
In order to achieve the purpose, the technical scheme adopted by the utility model is as follows:
a cooling device for a modular data center, comprising:
the cooling container is of a cuboid structure and is used for being placed in the machine room, the length direction of the cooling container is defined as the left-right direction, and the width direction of the cooling container is defined as the front-back direction;
the liquid cooling plate is arranged in the inner cavity of the cooling container, a plurality of server installation cavities are formed in the left direction and the right direction, the inner cavity of the cooling container is divided into a plurality of server installation cavities, cooling pipes for flowing cooling water are arranged in the liquid cooling plate, each cooling pipe is provided with a water inlet and a water outlet extending out of the cooling container, and the server installation cavities are used for installing servers of a data center so that the surfaces of the servers are tightly attached to the surfaces of the liquid cooling plate;
the cover is movably assembled at the top of the cooling container along the front-back direction so as to seal the inner cavity of the cooling container, one side of the cover, which faces the cooling container, is provided with an upward and inward concave groove, and the bottom of the groove is fixed with at least two cooling fans which are arranged at intervals along the left-right direction;
and the water tank is used for providing cooling water for the liquid cooling plates, and the water inlet and the water outlet on each liquid cooling plate are communicated with the water tank.
The beneficial effects of the above technical scheme are: when the cooling device for the modular data center is used, a server of the data center is placed in the server installation cavity, the surface of the server is attached to the liquid cooling plate, heat generated during the operation of the server is transferred into the liquid cooling plate through the shell of the server and exchanges heat with cooling water in the liquid cooling plate, so that the heat of the server is reduced, the temperature of the server is reduced, meanwhile, after the cooling fan is started, the air flow around the server can be accelerated, namely the heat flow and transfer are accelerated, the heat can exchange with the liquid cooling plates on the left side and the right side of the server more quickly and comprehensively, and the cooling fan can play a role of air cooling, so that the cooling of the server is realized more quickly. Compared with the prior art, the cooling device for the modular data center has low energy consumption, can recycle cooling water, does not need special cooling liquid, and reduces the heat dissipation cost.
Furthermore, two adjacent server installation cavities share the same liquid cooling plate.
Has the advantages that: a liquid cooling board can dispel the heat to the server of both sides simultaneously, can reduce the use quantity of liquid cooling board.
Furthermore, a pair of side walls of the cooling container, which are arranged in parallel and at intervals along the left-right direction, are provided with mounting grooves extending along the up-down direction, the groove width of each mounting groove is matched with the thickness of the liquid cooling plate, and the liquid cooling plates are clamped in the corresponding mounting grooves from top to bottom.
Has the advantages that: the installation and the taking out of the liquid cooling plate are convenient.
Further, a pair of lateral wall top that the left right direction of edge of cooling container was arranged is equipped with the slide that extends along the fore-and-aft direction, the lid includes two lid bodies and connects the closing cap body between two lid bodies, is equipped with the spout that extends along the fore-and-aft direction on the lid body, rotates between two relatively parallel's of spout the lateral wall to be equipped with and correspond slide sliding fit's pulley, still is equipped with on the cooling container to be used for carrying out spacing stopper to the lid body, and the thickness of closing cap body is less than the thickness of lid body to form with two lid bodies the recess, radiator fan fixes the bottom surface at the closing cap body.
Has the advantages that: the weight of the whole cover is reduced, and the cover is convenient to open and close, so that the liquid cooling plate and the server can be installed conveniently.
Preferably, be equipped with the heat dissipation mesh that is netted distribution on the closing cap body, the through wires hole sets up on the closing cap body, and the through wires hole is the slot hole that extends along left and right directions.
Has the advantages that: the heat generated by the server can also be dissipated from the heat dissipation mesh on the sealing cover body, so that the heat dissipation path of the server is increased, and the heat dissipation of the server is facilitated.
Preferably, a filter screen is fixed on one side of the sealing cover body, which is back to the cooling container, and filter meshes on the filter screen are communicated with the radiating meshes.
Has the advantages that: when the server works, foreign matters such as external dust are prevented from entering the cooling container to influence the normal work of the server.
Preferably, each liquid cooling plate shares same inlet tube and water tank intercommunication to same outlet pipe and water tank intercommunication are shared to each liquid cooling plate, all are provided with the stop valve on inlet tube and the outlet pipe.
Has the advantages that: the use quantity of water pipes can be reduced, and the cooling pipes in the liquid cooling plates are convenient to communicate with the water tank.
Furthermore, a stop valve is arranged at the water inlet end of the cooling pipe in each liquid cooling plate.
Has the advantages that: the business turn over mutual independence of cooling water in each liquid cooling board avoids some server installation cavity when not installing the server, to the liquid cooling board confession cooling water of this server installation cavity, avoids the waste of water resource.
Furthermore, damping springs distributed in a rectangular array are arranged at positions, corresponding to the server installation cavities, on the bottom wall of the cooling container.
Has the advantages that: the server easily produces vibrations when working, and damping spring can absorb vibrations, guarantees the stability of server work.
Drawings
FIG. 1 is an overall schematic view of a modular data center cooling device of the present invention with the cover removed;
FIG. 2 is a top view of a cooling vessel of the cooling device for a modular data center of the present invention;
FIG. 3 is a front view of a cooling vessel of the cooling device for a modular data center of the present invention;
FIG. 4 is a schematic view of the cooling vessel of the cooling device for a modular data center of the present invention after installation of the liquid cooled panels and the servers;
FIG. 5 is a front view of a cover of the cooling device for a modular data center of the present invention;
FIG. 6 is a top view of a cover of the cooling device for a modular data center of the present invention.
Description of reference numerals: 1-cooling container, 2-liquid cooling plate, 3-cooling pipe, 4-water inlet, 5-water outlet, 6-stop valve, 7-server installation cavity, 8-server, 9-cover, 10-cooling fan, 11-water tank, 12-threading hole, 13-installation groove, 14-slideway, 15-pulley, 16-limiting block, 17-sliding cover body, 18-sealing cover body, 19-cooling mesh hole, 20-filter screen, 21-water inlet pipe, 22-water outlet pipe, 23-damping spring, 24-damping pad and 25-chute.
Detailed Description
The utility model is described in further detail below with reference to the drawings and the detailed description.
The utility model discloses a specific embodiment of a cooling device for a modular data center, which comprises the following steps:
as shown in fig. 1 to 6, the cooling device for a modular data center includes: cooling container 1, liquid cooling plate 2, cover 9 and water tank 11.
Specifically, as shown in fig. 1, fig. 2 and fig. 3, the cooling container 1 is a cuboid structure and is used for being placed in a machine room, the length direction of the cooling container 1 is defined as the left-right direction, the width direction of the cooling container 1 is the front-back direction, and the cooling container is enclosed by a front side wall, a rear side wall, a left side wall, a right side wall and a bottom wall. Be equipped with the mounting groove 13 of one-to-one on preceding lateral wall and the back lateral wall, mounting groove 13 extends along upper and lower direction, and the groove width of mounting groove 13 and the thickness adaptation of liquid cooling plate 2 to interval arrangement has a plurality ofly in the left and right sides direction.
The number of the liquid cooling plates 2 is the same as that of the mounting grooves 13, and the liquid cooling plates are arranged in the inner cavity of the cooling container 1 and are inserted into the mounting grooves 13 from top to bottom. The liquid cooling plate 2 divides the inner cavity of the cooling container 1 into a plurality of server installation cavities 7, servers 8 of a data center are installed in the server installation cavities 7, when the servers 8 are installed, the surfaces of the servers are tightly attached to the surfaces of the liquid cooling plates 2 on the left side and the right side, and set gaps are reserved between the front side and the rear side of each server 8 and the front side and the rear side of the cooling container 1. Because the server will produce vibrations when normally working, therefore in this embodiment, be equipped with four damping spring 23 that are the distribution of rectangle array on the bottom diapire of cooling container, be equipped with shock pad 24 simultaneously on the lateral wall around the cooling container to absorb vibrations, as shown in fig. 4 specifically.
The liquid cooling plate 2 is made of heat conducting materials, a cooling pipe 3 used for flowing cooling water is arranged in each liquid cooling plate 2, and the cooling pipe 3 is arranged in the liquid cooling plate 2 in a snake-shaped surrounding mode. The cooling pipe 3 is provided with a water inlet 4 and a water outlet 5, and the water inlet 4 and the water outlet 5 of the cooling pipe 3 both extend out of the cooling container 1. In order to save pipes, the water inlets 4 of the cooling pipes 3 on the liquid cooling plates 2 are communicated with the water tank 11 after being communicated with the same water inlet pipe 21, and the water outlets 5 of the cooling pipes 3 on the liquid cooling plates 2 are communicated with the water tank 11 after being communicated with the same water outlet pipe 22. All be provided with stop valve 6 on inlet tube 21 and the outlet pipe 22, this stop valve 6 is electronic stop valve, and when the stop valve was opened, the hydroenergy in the water tank 11 can enter into each cooling tube, carries out circulation flow, cools down server 8. In this embodiment, all be provided with the stop valve on the cooling tube 3's in every liquid cooling board 2 intaking, like this, the business turn over mutual independence of each 2 internal cooling water of liquid cooling boards, when avoiding not installing server 8 in some server installation cavity 7, to 2 cooling water supplies of liquid cooling board of this server installation cavity 7, avoids the waste of water resource.
As shown in fig. 2, 5 and 6, a cover 9 is movably fitted on the top of the temperature-reducing container 1 in the front-rear direction to cover the inner cavity of the temperature-reducing container 1. Specifically, the top of a pair of side walls arranged along the left-right direction of the cooling container 1 is provided with a slideway 14 extending along the front-back direction, and the slideway 14 is recessed downwards into the cooling container 1. The cover 9 comprises two sliding cover bodies 17 and a sealing cover body 18 connected between the two sliding cover bodies 17, sliding grooves 25 extending in the front-back direction are formed in the sliding cover bodies 17, pulleys 15 in sliding fit with corresponding sliding ways 14 are rotatably assembled between two opposite parallel side walls of the sliding grooves 25, and at least two pulleys 15 are arranged in the front-back direction. In order to prevent the cover 9 from falling off from the cooling container 1 in the sliding process, a limiting block 16 for limiting the sliding cover body 17 is further arranged on the cooling container 1. The thickness of the cover 18 is smaller than that of the sliding cover 17 to form a groove with the two sliding covers 17, and two cooling fans 10 are fixed at the bottom of the cover 17 and are arranged symmetrically and at intervals.
In order to improve the heat dissipation efficiency of the server 8, in this embodiment, the sliding cover 17 is provided with heat dissipation mesh holes 19 distributed in a mesh shape, so that the heat generated by the server 8 can be dissipated outwards from the heat dissipation mesh holes 19. The cover 17 is further provided with a threading hole 12 through which a cable on the server 8 passes, and the threading hole 12 is a long hole extending in the left-right direction and is located at an end portion of the cover 18. Considering that the external dust and other impurities can enter the cooling container 1 from the heat dissipation mesh 19, in this embodiment, a filter screen 20 is fixed on the side of the sealing cover 18 facing away from the cooling container 1, and the filter mesh on the filter screen 20 is communicated with the heat dissipation mesh 19.
When the cooling device for the modular data center is used, the server 8 of the data center is placed in the server installation cavity 7, the surface of the server 8 is attached to the liquid cooling plates 2 on the left side and the right side, heat generated when the server works is transferred into the liquid cooling plates 2 through the shell of the server 8 and exchanges heat with cooling water in the liquid cooling plates 2, and therefore the heat of the server is reduced, and the temperature of the server is lowered. Meanwhile, after the cooling fan 10 is started, the air flow around the server 8 can be accelerated, that is, the flow and the transfer of heat are accelerated, so that the heat can be exchanged with the liquid cooling plates 2 on the left side and the right side of the server more quickly and comprehensively, and the cooling fan can also play a role of air cooling, so that the cooling of the server is realized more quickly. In addition, heat generated by the server can also escape from the heat dissipation meshes on the cover, so that the temperature is reduced quickly. Compared with the prior art, the cooling device for the modular data center has low energy consumption, can recycle cooling water, does not need special cooling liquid, and reduces the heat dissipation cost.
In other embodiments, two liquid cold plates correspond with the lateral wall of cooling container and enclose into the server installation cavity, and two server installation cavities need four liquid cold plates promptly, like this, and two adjacent server installation cavities do not share a liquid cold plate, and two liquid cold plates that constitute the server installation cavity only dispel the heat to the liquid cold plate in this server installation cavity.
In other embodiments, the liquid cooling plate can also be welded directly in the cooling container.
In other embodiments, the cover may not be provided with heat dissipating mesh holes, and the heat dissipating fan blows air only in the cooling container to accelerate heat flow. Accordingly, the filter screen may not be provided at this time.
In other embodiments, the cooling pipes in each liquid cooling plate can be separately communicated with the water tank, and the water inlet pipe and the water outlet pipe are not shared by the cooling pipes.
The above-described embodiments of the present invention do not limit the scope of the present invention. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the scope of the claims of the present invention.

Claims (9)

1. A cooling device for a modular data center, comprising:
the cooling container is of a cuboid structure and is used for being placed in the machine room, the length direction of the cooling container is defined as the left-right direction, and the width direction of the cooling container is defined as the front-back direction;
the liquid cooling plate is arranged in the inner cavity of the cooling container, a plurality of server installation cavities are formed in the left direction and the right direction, the inner cavity of the cooling container is divided into a plurality of server installation cavities, cooling pipes for flowing cooling water are arranged in the liquid cooling plate, each cooling pipe is provided with a water inlet and a water outlet extending out of the cooling container, and the server installation cavities are used for installing servers of a data center so that the surfaces of the servers are tightly attached to the surfaces of the liquid cooling plate;
the cover is movably assembled at the top of the cooling container along the front-back direction so as to seal the inner cavity of the cooling container, one side of the cover, which faces the cooling container, is provided with an upward and inward concave groove, the bottom of the groove is fixed with at least two cooling fans arranged at intervals along the left-right direction, and the bottom of the groove is also provided with a threading hole for a cable on a server to pass through;
and the water tank is used for providing cooling water for the liquid cooling plates, and the water inlet and the water outlet on each liquid cooling plate are communicated with the water tank.
2. The cooling device for a modular data center according to claim 1, wherein two adjacent server installation cavities share the same liquid cooling plate.
3. The cooling device for the modular data center according to claim 2, wherein a pair of side walls of the cooling container, which are arranged in parallel and spaced in the left-right direction, are provided with mounting grooves extending in the up-down direction, the width of the mounting grooves is adapted to the thickness of the liquid cooling plate, and the liquid cooling plate is clamped in the corresponding mounting grooves from top to bottom.
4. The cooling device for the modular data center according to any one of claims 1 to 3, wherein a pair of side walls of the cooling container disposed in the left-right direction are provided at tops thereof with slideways extending in the front-rear direction, the cover comprises two cover bodies and a cover body connected between the two cover bodies, the cover body is provided with a sliding groove extending in the front-rear direction, a pulley slidably fitted to the corresponding slideway is rotatably fitted between the two opposite parallel side walls of the sliding groove, the cooling container is further provided with a stopper for limiting the cover body, the thickness of the cover body is smaller than that of the cover body so as to form the groove with the two cover bodies, and the cooling fan is fixed to a bottom surface of the cover body.
5. The cooling device for the modular data center according to claim 4, wherein the cover body is provided with heat dissipation mesh holes distributed in a net shape, the threading holes are formed in the cover body, and the threading holes are long holes extending in the left-right direction.
6. The cooling device for the modular data center according to claim 5, wherein a filter screen is fixed on a side of the cover body facing away from the cooling container, and filter meshes on the filter screen are communicated with the heat dissipation meshes.
7. The cooling device for the modular data center according to any one of claims 1 to 3, wherein each of the liquid cooling plates shares a same water inlet pipe to communicate with the water tank, each of the liquid cooling plates shares a same water outlet pipe to communicate with the water tank, and the water inlet pipe and the water outlet pipe are provided with stop valves.
8. The cooling device for the modular data center according to claim 6, wherein a stop valve is disposed on the water inlet end of the cooling pipe in each liquid cooling plate.
9. The cooling device for the modular data center according to any one of claims 1 to 3, wherein the damping springs are arranged in a rectangular array at positions corresponding to each server installation cavity on the bottom wall of the cooling container.
CN202122176662.2U 2021-09-09 2021-09-09 Cooling device for modular data center Active CN215735599U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202122176662.2U CN215735599U (en) 2021-09-09 2021-09-09 Cooling device for modular data center

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202122176662.2U CN215735599U (en) 2021-09-09 2021-09-09 Cooling device for modular data center

Publications (1)

Publication Number Publication Date
CN215735599U true CN215735599U (en) 2022-02-01

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ID=80017643

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202122176662.2U Active CN215735599U (en) 2021-09-09 2021-09-09 Cooling device for modular data center

Country Status (1)

Country Link
CN (1) CN215735599U (en)

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