CN215735532U - Heat radiation structure of embedding samming heating panel - Google Patents
Heat radiation structure of embedding samming heating panel Download PDFInfo
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- CN215735532U CN215735532U CN202121827732.XU CN202121827732U CN215735532U CN 215735532 U CN215735532 U CN 215735532U CN 202121827732 U CN202121827732 U CN 202121827732U CN 215735532 U CN215735532 U CN 215735532U
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Abstract
The utility model relates to the technical field of heat dissipation, in particular to a heat dissipation structure embedded with a uniform-temperature heat dissipation plate. The heat dissipation structure comprises a heat dissipation shell, a heat dissipation fin array, a temperature-equalizing heat dissipation module and a phase change plate, wherein a heat dissipation cavity is arranged in the heat dissipation shell, the heat dissipation fin array is connected to the back of the heat dissipation cavity, a heat dissipation groove is reserved in the heat dissipation cavity, the temperature-equalizing heat dissipation module is connected in the heat dissipation groove, a plurality of pipeline interfaces are arranged on the temperature-equalizing heat dissipation module, the phase change plate is connected with the heat dissipation fin array, a phase change pipeline is arranged in the phase change plate, and the pipeline interfaces of the temperature-equalizing heat dissipation module are respectively connected with the phase change pipeline to form a circulation loop. The uniform temperature radiating module is welded on the shell and is directly contacted with the heat source, namely the thermal resistance from the heat source to the uniform temperature radiating module is lower, so that the heat can be better collected; the back side of the temperature-equalizing heat-radiating module is contacted with cold air with lower temperature, so that the heat-radiating efficiency is higher.
Description
Technical Field
The utility model relates to the technical field of heat dissipation, in particular to a heat dissipation structure embedded with a uniform-temperature heat dissipation plate.
Background
Along with the improvement of the integration level of the product, the heat consumption is higher and higher, if the generated heat is not dissipated in time, the temperature of the chip is increased, the efficiency is reduced, the service life is shortened, and even the device fails. Therefore, a device with better heat transfer performance is needed to solve the heat dissipation problem.
In the prior art, a heat radiating fin is arranged on a machine shell of a device for heat radiation, or a condensing part is added on the heat radiating fin of the whole machine shell for increasing the heat radiation effect, so that the device containing a chip is subjected to overall large-scale heat radiation. However, in the whole device, the heat generated by each working part is different, for example, the heat near the chip heat source is greater than that far away from the chip, and the conventional heat dissipation structure cannot solve the problem of local overheating in a targeted manner in the case of large-range heat dissipation, and has no effect of concentrated heat dissipation on the heavy heat source.
SUMMERY OF THE UTILITY MODEL
The utility model provides a heat dissipation structure embedded into a uniform-temperature heat dissipation plate, and aims to solve the problem of local heat dissipation of a heating device.
The utility model provides a heat dissipation structure embedded in a uniform-temperature heat dissipation plate, which comprises a heat dissipation shell, a heat dissipation fin array, a uniform-temperature heat dissipation module and a phase change plate, wherein a heat dissipation cavity is arranged in the heat dissipation shell, the heat dissipation fin array is connected to the back of the heat dissipation cavity, a heat dissipation groove is reserved on the heat dissipation cavity, the uniform-temperature heat dissipation module is connected in the heat dissipation groove, a plurality of pipeline interfaces are arranged on the uniform-temperature heat dissipation module, the phase change plate is connected with the heat dissipation fin array, a phase change pipeline is arranged in the phase change plate, and the pipeline interfaces of the uniform-temperature heat dissipation module are respectively connected with the phase change pipeline to form a circulation loop.
As a further improvement of the present invention, an array slot is reserved on the heat sink array, the array slot corresponds to the heat sink slot, and the uniform temperature heat sink module is disposed in the array slot.
As a further improvement of the present invention, the temperature-equalizing heat-dissipating module includes a temperature-equalizing plate welded in the heat-dissipating slot, the temperature-equalizing plate is provided with a temperature-equalizing inner cavity and a plurality of pipeline interfaces communicated with the temperature-equalizing inner cavity, the pipeline interfaces protrude out of the temperature-equalizing plate and are located in the array slot, and the temperature-equalizing inner cavity is communicated with the phase-change pipeline through the pipeline interfaces to form a circulation loop.
As a further improvement of the utility model, the uniform temperature heat dissipation module comprises hollow pipes and a heat dissipation plate, one or more hollow pipes are embedded in the heat dissipation plate, the heat dissipation plate is welded in the heat dissipation groove, two ends of each hollow pipe are respectively provided with a pipeline interface, the pipeline interfaces of the hollow pipes protrude out of the heat dissipation plate and are positioned in the array groove, and the hollow pipes are communicated with the phase change pipeline through the pipeline interfaces to form a circulation loop.
As a further improvement of the utility model, the hollow pipe comprises a first hollow pipe, the first hollow pipe roundly penetrates through the whole heat dissipation plate, and two end pipeline interfaces of the first hollow pipe are connected with the same phase change plate.
As a further improvement of the utility model, the hollow pipes comprise second hollow pipes, a plurality of heat dissipation subareas are arranged on the heat dissipation plate, the second hollow pipes are roundly penetrated through the single heat dissipation subarea, and pipeline interfaces of a plurality of the second hollow pipes are connected with the same phase change plate.
As a further improvement of the utility model, the radiating fin array is provided with radiating fin gaps which are communicated with the array groove positions, and the phase change plate is arranged in the radiating fin gaps and connected with a plurality of pipeline interfaces.
As a further improvement of the utility model, the phase change plate is connected to the back side of the radiating fin array, the phase change plate covers the back side of the radiating fin array completely or partially, and the pipeline interface penetrates through the array slot and then is connected with the phase change pipeline.
The utility model has the beneficial effects that: the uniform temperature radiating module is welded on the shell and is directly contacted with the heat source, namely the thermal resistance from the heat source to the uniform temperature radiating module is lower, so that the heat can be better collected; the back side of the temperature-equalizing heat-radiating module is contacted with cold air with lower temperature, so that the heat-radiating efficiency is higher.
Drawings
FIG. 1 is a first structural diagram of a heat dissipation structure embedded in a uniform temperature heat dissipation plate according to the present invention;
FIG. 2 is a first structural diagram of the temperature-equalizing thermal module according to the present invention;
FIG. 3 is a cross-sectional view of a first structure of a heat sink structure embedded in a uniform temperature heat sink according to the present invention;
FIG. 4 is a second structural diagram of a heat dissipation structure of the embedded uniform temperature heat dissipation plate of the present invention;
FIG. 5 is a second structural diagram of the temperature equalizing heat dissipating module according to the present invention;
FIG. 6 is a cross-sectional view of a second structure of the heat sink structure of the present invention;
FIG. 7 is a third structural diagram of the heat dissipation structure of the embedded uniform temperature heat dissipation plate of the present invention;
FIG. 8 is a third structural diagram of the temperature equalizing thermal module according to the present invention;
FIG. 9 is a cross-sectional view of a third structure of the heat sink structure of the present invention with a uniform temperature heat sink embedded therein;
FIG. 10 is a fourth structural view of the heat dissipating structure of the embedded uniform temperature heat dissipating plate according to the present invention;
FIG. 11 is a fourth structural diagram of the temperature equalizing heat dissipating module of the present invention;
fig. 12 is a sectional view of a fourth structure of the heat dissipating structure of the embedded uniform temperature heat dissipating plate of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments.
The utility model relates to a heat dissipation structure embedded in a uniform-temperature heat dissipation plate, which comprises a heat dissipation shell 1, a heat dissipation fin array 2, a uniform-temperature heat dissipation module and a phase change plate 3, wherein a heat dissipation cavity is arranged in the heat dissipation shell 1, the heat dissipation fin array 2 is connected to the back of the heat dissipation cavity, a heat dissipation groove is reserved on the heat dissipation cavity, the uniform-temperature heat dissipation module is connected in the heat dissipation groove, a plurality of pipeline interfaces 4 are arranged on the uniform-temperature heat dissipation module, the phase change plate 3 is connected with the heat dissipation fin array 2, a phase change pipeline 31 is arranged in the phase change plate 3, and the pipeline interfaces 4 of the uniform-temperature heat dissipation module are respectively connected with the phase change pipeline 31 to form a circulation loop.
The uniform-temperature heat dissipation mould is embedded into the heat dissipation groove position, directly contacts with a heat source, better collects heat, disperses or cools the collected heat through a circulation loop formed by the uniform-temperature heat dissipation mould and the phase change plate 3, a refrigerant is injected into the circulation loop, a liquid refrigerant in the cavity inside the uniform-temperature heat dissipation module evaporates into a gaseous state after receiving the heat source emitted by the heat source and flows into the phase change plate 3 along the liquid outlet pipeline interface 4, the phase change plate 3 is cooled by air and contacts with the heat dissipation fin array 2, the gaseous refrigerant is cooled into the liquid refrigerant, and the liquid refrigerant flows back into the uniform-temperature heat dissipation module along the liquid inlet pipeline interface 4 to continuously collect heat. The temperature-equalizing heat dissipation module is added to cool the refrigerant, the original air cooling of the heat dissipation fin array 2 is matched, and the heat dissipation effect is greatly improved due to the effect of the double heat dissipation processes.
An array slot 21 is reserved on the radiating fin array 2, the array slot 21 corresponds to the radiating slot, and the uniform temperature radiating module is arranged in the array slot 21. The arrangement of the array slot position 21 reserves an installation station, so that the connection of the uniform temperature heat dissipation module with the heat dissipation shell 1, the pipeline interface 4 and the phase change plate 3 is facilitated.
The heat dissipation structure of the embedded uniform-temperature heat dissipation plate can be divided into the following several implementation modes:
the first embodiment is as follows:
as shown in fig. 1 to 3, the temperature-equalizing heat dissipation module includes a temperature-equalizing plate 5, the temperature-equalizing plate 5 is welded in the heat dissipation slot, the temperature-equalizing plate 5 is provided with a temperature-equalizing inner cavity 51 and a plurality of pipeline interfaces 4 communicated with the temperature-equalizing inner cavity 51, the pipeline interfaces 4 protrude from the temperature-equalizing plate 5 and are located in the array slot 21, and the temperature-equalizing inner cavity 51 is communicated with the phase-change pipeline 31 through the pipeline interfaces 4 to form a circulation loop. A heat dissipation groove position is reserved on the heat dissipation cavity as a welding position, the temperature equalizing plate 5 is directly welded on the cavity, an inlet and outlet pipeline interface 4 is reserved on the temperature equalizing plate 5, and the phase change plate 3 can be directly connected to complete cavity heat dissipation. The liquid refrigerant flows into the temperature-equalizing inner cavity 51 from the pipeline inlet, and the temperature-equalizing inner cavity 51 can fully collect heat on a heat source to gasify the refrigerant in the cavity by a structure tiled with the temperature-equalizing plate 5, and the gaseous refrigerant flows out from the pipeline outlet, enters the phase-change plate 3 to be cooled, liquefied and phase-changed, and then flows back to the pipeline inlet for circulating cooling.
The rear-side vapor chamber 5 may be one or more. The die-casting heat dissipation teeth are located among the die-casting heat dissipation teeth, cannot be located on the outermost side directly, can be protected by the die-casting teeth, and are not prone to being damaged by collision.
Example two:
as shown in fig. 4 to 6, on the basis of the first embodiment, the temperature equalizing plate 5 may be connected to a plurality of pipe inlets and a plurality of pipe outlets, so as to increase the flow amount of the refrigerant to improve the heat dissipation effect, and the plurality of pipe inlets and the pipe outlets are connected to the same phase change plate 3.
The temperature equalizing inner cavity 51 can also be divided into a plurality of temperature equalizing sub-cavities, each temperature equalizing sub-cavity is connected with a group of pipeline inlets and pipeline outlets, and the pipeline inlets and the pipeline outlets of the plurality of temperature equalizing sub-cavities are connected into the same phase change plate 3 together to form a loop.
According to the heat dissipation requirement, the number of the phase change plates 3 can be increased, and a plurality of pipeline inlets and a plurality of pipeline outlets are connected to the phase change plates 3 in a dispersing way to improve the heat dissipation efficiency.
Example three:
as shown in fig. 7 to 9, the uniform temperature heat dissipation module includes a hollow tube 6 and a heat dissipation plate 7, one or more hollow tubes 6 are embedded in the heat dissipation plate 7, the heat dissipation plate 7 is welded in the heat dissipation groove, two ends of each hollow tube 6 are respectively provided with a pipeline interface 4, the pipeline interface 4 of the hollow tube 6 protrudes out of the heat dissipation plate 7 and is located in the array groove 21, and the hollow tube 6 is communicated with the phase change pipeline 31 through the pipeline interface 4 to form a circulation loop.
And reserving a welding position in the heat dissipation cavity, directly welding the heat dissipation plate 7 embedded with the hollow tube 6 to the heat dissipation cavity, and connecting the phase change plate 3 to the reserved interface to promote the heat dissipation of the cavity. The heat dissipation plate 7 is installed on the back side of the heat dissipation shell 1, the heat dissipation plate 7 is connected with the heat dissipation shell 1 through a fastening piece, the heat dissipation plate 7 on the back side is located among the plurality of heat dissipation teeth, and the heat dissipation effect is achieved by air cooling of the heat dissipation plate 7 and heat transfer of the heat dissipation teeth in a matching mode.
Specifically, the hollow tube 6 comprises a first hollow tube 61, the first hollow tube 61 is circuitously penetrated through the whole heat dissipation plate 7, and the pipeline joints 4 at two ends of the first hollow tube 61 are connected with the same phase change plate 3. According to the heat dissipation requirement, the first hollow pipe 61 can be laid on the heat dissipation plate 7 in a roundabout mode, heat dissipation is carried out on the heat source through a refrigerant circulating inside, and pipe openings at two ends of the heat dissipation plate, namely a pipeline inlet and a pipeline outlet, are respectively connected with the same phase change plate 3 to form a loop.
Example four:
as shown in fig. 10 to 12, in the third embodiment, the hollow tube 6 includes a second hollow tube 62, the heat dissipation plate 7 is provided with a plurality of heat dissipation partitions, the second hollow tube 62 bypasses and penetrates through a single heat dissipation partition, and the pipeline interfaces 4 of the plurality of second hollow tubes 62 are connected to the same phase change plate 3. According to the requirement on the heat dissipation efficiency of the heat source, a plurality of second hollow pipes 62 are arranged on the heat dissipation plate 7 to perform centralized heat dissipation on the heat source, liquid inlet and outlet ports at two ends of each second hollow pipe 62 are respectively connected with the phase change plate 3 to form a circulation loop, and the plurality of second hollow pipes 62 form a plurality of circulation loops to perform dispersed heat dissipation on the heat source, so that the liquid cooling efficiency is increased, and the heat dissipation is more efficient.
Example five:
on the basis of the first to the fourth embodiments, the heat sink array 2 is provided with the heat sink gaps 22, the heat sink gaps 22 are communicated with the array slots 21, and the phase change plate 3 is arranged in the heat sink gaps 22 and connected with the plurality of pipeline interfaces 4. The phase change plate 3 is connected in the reserved radiating fin gap 22, the size of the original radiating fin array 2 is not increased or excessively occupied, the phase change plate 3 is fully contacted with radiating teeth on the radiating fin array 2, and heat is radiated out by means of the radiating teeth.
The phase change plate 3 can also be connected to the back side of the heat sink array 2, the phase change plate 3 covers the back side of the heat sink array 2 completely or partially, and the pipeline interface 4 penetrates through the array slot 21 and then is connected with the phase change pipeline 31. Phase change plate 3 is connected in the dorsal design of fin array 2, can need not to reserve the space on fin array 2 is inside to connect phase change plate 3, adapts to the fin array 2 of multiple not isostructure more, covers simultaneously and makes phase change plate 3 bigger with fin array 2's area of contact at the dorsal part, more does benefit to thermal giving off.
The foregoing is a more detailed description of the utility model in connection with specific preferred embodiments and it is not intended that the utility model be limited to these specific details. For those skilled in the art to which the utility model pertains, several simple deductions or substitutions can be made without departing from the spirit of the utility model, and all shall be considered as belonging to the protection scope of the utility model.
Claims (8)
1. The utility model provides a heat radiation structure of embedding samming heating panel, its characterized in that, includes heat dissipation shell, fin array, samming heat dissipation module, phase change board, the inside heat dissipation cavity that is equipped with of heat dissipation shell, the back at the heat dissipation cavity is connected to the fin array, it has the heat dissipation trench to reserve on the heat dissipation cavity, samming heat dissipation module connects in the heat dissipation trench, be equipped with a plurality of pipeline interfaces on the samming heat dissipation module, the fin array is connected to the phase change board, the inside phase change pipeline that is equipped with of phase change board, the pipeline interface of samming heat dissipation module connects the phase change pipeline respectively and constitutes circulation circuit.
2. The heat dissipation structure embedded with the uniform temperature heat dissipation plate as claimed in claim 1, wherein an array slot is reserved on the heat dissipation plate array, the array slot corresponds to the position of the heat dissipation slot, and the uniform temperature heat dissipation module is disposed in the array slot.
3. The heat dissipating structure embedded in a uniform temperature heat dissipating plate of claim 2, wherein the uniform temperature heat dissipating module comprises a uniform temperature plate welded in the heat dissipating slots, the uniform temperature plate has a uniform temperature inner cavity and a plurality of pipeline interfaces communicated with the uniform temperature inner cavity, the pipeline interfaces protrude out of the uniform temperature plate and are located in the array slots, and the uniform temperature inner cavity is communicated with the phase change pipeline through the pipeline interfaces to form a circulation loop.
4. The heat dissipation structure embedded with a uniform temperature heat dissipation plate as claimed in claim 2, wherein the uniform temperature heat dissipation module comprises a hollow tube and a heat dissipation plate, one or more hollow tubes are embedded in the heat dissipation plate, the heat dissipation plate is welded in the heat dissipation groove, two ends of each hollow tube are provided with pipeline interfaces, the pipeline interfaces of the hollow tubes protrude out of the heat dissipation plate and are located in the array groove, and the hollow tubes are communicated with the phase change pipeline through the pipeline interfaces to form a circulation loop.
5. The heat dissipating structure embedded in a temperature uniforming heat dissipating plate as claimed in claim 4, wherein the hollow tubes comprise a first hollow tube, the first hollow tube is circuitously penetrated through the heat dissipating plate, and two ends of the first hollow tube are connected to the same phase change plate via pipeline interfaces.
6. The heat dissipating structure embedded in a temperature uniforming heat dissipating plate as claimed in claim 4, wherein the hollow tubes comprise second hollow tubes, the heat dissipating plate has a plurality of heat dissipating partitions, the second hollow tubes are connected to the same phase change plate via pipe joints, and the second hollow tubes are connected to the same phase change plate via pipe joints.
7. The heat dissipating structure embedded in a uniform temperature heat dissipating plate as claimed in claim 2, wherein the heat dissipating fin array has heat dissipating fin gaps communicating with the array slots, and the phase change plate is disposed in the heat dissipating fin gaps and connected to the plurality of pipe joints.
8. The heat dissipating structure embedded in a temperature uniforming heat dissipating plate as claimed in claim 2, wherein the phase change plate is connected to the backside of the heat dissipating fin array, the phase change plate covers the backside of the heat dissipating fin array, and the pipe interfaces are connected to the phase change pipes after passing through the array slots.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121827732.XU CN215735532U (en) | 2021-08-06 | 2021-08-06 | Heat radiation structure of embedding samming heating panel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121827732.XU CN215735532U (en) | 2021-08-06 | 2021-08-06 | Heat radiation structure of embedding samming heating panel |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215735532U true CN215735532U (en) | 2022-02-01 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121827732.XU Active CN215735532U (en) | 2021-08-06 | 2021-08-06 | Heat radiation structure of embedding samming heating panel |
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| Country | Link |
|---|---|
| CN (1) | CN215735532U (en) |
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2021
- 2021-08-06 CN CN202121827732.XU patent/CN215735532U/en active Active
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