CN215735350U - Face shell of electronic equipment and electronic equipment - Google Patents
Face shell of electronic equipment and electronic equipment Download PDFInfo
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- CN215735350U CN215735350U CN202122241521.4U CN202122241521U CN215735350U CN 215735350 U CN215735350 U CN 215735350U CN 202122241521 U CN202122241521 U CN 202122241521U CN 215735350 U CN215735350 U CN 215735350U
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- groove
- side wall
- glue inlet
- electronic equipment
- electronic device
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Abstract
The utility model discloses a face shell of electronic equipment and the electronic equipment, and the face shell of the electronic equipment is characterized by comprising a plastic matrix and a metal piece; the metal piece comprises a plate-shaped connecting part and an embedding part positioned on the side edge of the connecting part, and the embedding part is embedded in the plastic base body in an in-mold injection molding mode; the embedding part comprises a first side wall and a second side wall, wherein the first side wall is bent downwards from the side edge of the connecting part, and the second side wall is bent upwards from the bottom of the side wall; the plastic base body comprises an upper surface, the plastic base body is provided with a glue inlet and a groove, the glue inlet is formed by downwards sinking the upper surface, and the groove is positioned on the outer side of the glue inlet; the first side wall and the second side wall are respectively positioned at two sides of the groove, and the plastic base body further comprises a covering part positioned between the inner surface of the groove and the first side wall and between the inner surface of the groove and the second side wall. The utility model avoids the compression deformation of the metal piece during injection filling, and improves the quality of the surface shell of the electronic equipment.
Description
Technical Field
The utility model relates to the technical field of electronics, in particular to a face shell of electronic equipment and the electronic equipment.
Background
For example, the face shell of electronic equipment such as a mobile phone and a tablet personal computer is usually manufactured by adopting a mode of injection molding of a high-strength stamping aluminum sheet in a mold, and is limited by the size of the face shell, and the thickness of the stamping aluminum sheet is relatively limited, so that the structural strength of the face shell is relatively low, when the face shell is injection molded, glue drawing holes are arranged on the side surface of a plastic machine body of the face shell, and the side surface of the stamping aluminum sheet is propped against the side surface of the stamping aluminum sheet after the row position passes through the glue drawing holes by utilizing the row position, so that the stamping aluminum sheet is prevented from being deformed by extrusion during injection molding, although the problem of outward turning deformation of a hardware stamping part during injection molding can be solved to a certain extent by the mode, the defect that the row position is propped against the deformation of the part is actually overcome, and the part which is not propped against the side surface of the hardware stamping part can still deform to a certain extent, so that the side surface of the hardware stamping part deforms into a wave shape after injection molding is completed, and finally, when the cover plate of the electronic equipment is assembled on the face shell, the wavy gap is formed, which affects the quality of the electronic device.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a face shell of electronic equipment, which can effectively solve the problem of hardware deformation when the face shell is subjected to in-mold injection molding.
The second purpose of the utility model is to provide an electronic device.
In order to achieve the first purpose, the utility model adopts the following technical scheme:
the face shell of the electronic equipment comprises a plastic base body and a metal piece; the metal piece comprises a plate-shaped connecting part and an embedding part positioned on the side edge of the connecting part, and the embedding part is embedded in the plastic matrix in an in-mold injection molding manner;
the embedding part comprises a first side wall and a second side wall, wherein the first side wall is bent downwards from the side edge of the connecting part, and the second side wall is bent upwards from the bottom of the side wall;
the plastic base body comprises an upper surface, a glue inlet formed by downwards sinking the upper surface and a groove are formed in the plastic base body, and the groove is positioned on the outer side of the glue inlet; the first side wall and the second side wall are respectively positioned at two sides of the groove, and the plastic base body further comprises a covering part positioned between the inner surface of the groove and the first side wall and the second side wall.
Preferably, a communicating groove used for communicating the glue inlet and the groove is further formed in the upper surface of the plastic base body.
Preferably, the groove extends along the length direction of the plastic substrate.
Preferably, the glue inlet is arranged opposite to the middle part of the groove in the length direction, a connecting line between the center of the glue inlet and the middle part of the groove in the length direction forms a central line, and the parts of the groove on the two sides of the central line are mutually symmetrical.
Preferably, the width of the groove is greater than or equal to 4 mm.
Preferably, the thickness of the covering part is 0.1-0.2 mm.
Preferably, the plastic substrate is provided with a plurality of glue inlets and grooves arranged along the length direction of the plastic substrate.
In order to achieve the second purpose, the utility model adopts the following technical scheme:
the electronic equipment comprises the panel shell of the electronic equipment.
The technical scheme of the utility model is that
When the injection molding filling device is used for molding, a metal piece is placed in a cavity of an injection mold, a glue inlet point of the injection mold corresponds to a glue inlet of a plastic substrate, and a groove is formed in the position, located on the outer side of the glue inlet, of the plastic substrate, so that a blocking rib is formed on the mold at the outer side of a glue inlet point of the injection mold and the mold at the closing position.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a cross-sectional view of the present invention;
fig. 3 is a view taken along direction a of fig. 1.
The reference numbers illustrate:
| reference numerals | Name (R) | Reference numerals | Name (R) |
| 10 | |
20 | |
| 101 | Upper surface of | 21 | Connecting |
| 102 | Covering |
22 | Embedding |
| 11 | |
221 | |
| 12 | |
222 | |
| 13 | Communicating groove |
The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that all the directional indicators (such as up, down, left, right, front, and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the movement situation, etc. in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indicator is changed accordingly.
In addition, the descriptions related to "first", "second", etc. in the present invention are for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.
As shown in fig. 1, 2 and 3, a front cover of an electronic device according to the present invention includes a plastic substrate 10 and a metal member 20, wherein the metal member 20 is made by a stamping process and includes a plate-shaped connecting portion 21 and an embedding portion 22, the embedding portion 22 is located at a side of the connecting portion 21, and the embedding portion 22 is embedded in the plastic substrate 10 by an injection molding method. The embedding part 22 is U-shaped or V-shaped, and includes a first sidewall 221 formed by bending the side edge of the connecting part 21 downward, and a second sidewall 222 formed by bending the bottom of the first sidewall 221 upward, and the first sidewall 221 and the second sidewall 222 form a substantially U-shaped or V-shaped structure. The plastic substrate 10 includes an upper surface 101, the upper surface 101 is larger than and level with the upper surface of the connecting portion 21, a glue inlet 11 formed by the upper surface 101 being recessed downward and a groove 12 are provided on the plastic substrate 10, the groove 12 is located outside the glue inlet 11 in the width direction of the plastic substrate 10, the groove 12 is located just above the embedding portion 22 in the thickness direction of the plastic substrate 10, and the first sidewall 221 and the second sidewall 222 of the embedding portion are located at two sides of the groove 12 respectively, the plastic substrate 10 further includes a covering portion 102 located between the inner surface of the groove 12 and the first sidewall 221 and the second sidewall 222, that is, when injection molding, a part of molten plastic material covers the inner side surface of the embedding portion 22 to form the covering portion 102.
In the utility model, when in molding, the metal piece 20 is placed in a cavity of the injection mold, a glue inlet point of the injection mold corresponds to a glue inlet 11 of the plastic base body 10, and the groove 12 is arranged at a position on the plastic base body 10, which is positioned at the outer side of the glue inlet 11, so that a blocking rib is formed at the outer side of a mold closing point and the glue inlet point of the injection mold, and when in injection molding and filling, mold flow is blocked by the blocking rib and preferentially flows to a position with a larger width in the cavity, so that the mold flow flows to the outer sides of the first side wall 221 and the second side wall 222 from the position with the larger width, and the pressure from the mold flow on the inner side and the outer side of the embedding part 22 is in a balanced state, thereby avoiding the metal piece 20 from being deformed by pressure during injection molding and filling, and further improving the quality of a panel shell of the electronic equipment.
In a preferred embodiment, the upper surface 101 of the plastic substrate 10 is further provided with a communicating groove 13, the communicating groove 13 communicates the glue inlet 11 with the groove 12, specifically, one end of the communicating groove 13 communicates with the glue inlet 11, and the other end communicates with the middle part of the length direction of the groove 12, the communicating groove 13 is matched with the glue inlet 11 and matched with a runner of an injection mold, so that a mold flow can flow into the inner sides of the first side wall 221 and the second side wall 222 to form the covering part 102 during injection filling. The groove 12 extends along the length direction (i.e. the Y direction in the figure) of the plastic substrate 10, and the glue inlet 11 is disposed at a position opposite to the middle of the groove 12 in the length direction, a connecting line between the center of the glue inlet 11 and the middle of the groove 12 in the length direction forms a central line O, and the portions of the groove 12 at both sides of the central line O are symmetrical to each other, so that when a mold flow passes through the corresponding stop rib at the groove 12, the mold flow can be divided more evenly towards both sides. The width of the groove 12 is greater than or equal to 4mm so as to ensure that the stop rib formed on the die can play an effective role in blocking and shunting the flow. The thickness of the covering part 102 is set to 0.1-0.2mm, so as to avoid touching the embedding part 22 before injection molding.
In addition, a plurality of the above-mentioned glue inlets 11 and grooves 12 are arranged in the length direction of the plastic substrate 10, that is, a groove 12 is arranged outside each glue inlet 11, and the distance between adjacent glue inlets 11 is set according to the actual condition of the injection mold.
The electronic equipment comprises the face shell of the electronic equipment, and specifically can be a mobile phone, a tablet computer, a notebook computer, intelligent wearable equipment and the like.
The above description is only a preferred embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications and equivalents of the technical solutions of the present invention, which are made by using the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (8)
1. The face shell of the electronic equipment is characterized by comprising a plastic base body and a metal piece; the metal piece comprises a plate-shaped connecting part and an embedding part positioned on the side edge of the connecting part, and the embedding part is embedded in the plastic matrix in an in-mold injection molding manner;
the embedding part comprises a first side wall and a second side wall, wherein the first side wall is bent downwards from the side edge of the connecting part, and the second side wall is bent upwards from the bottom of the side wall;
the plastic base body comprises an upper surface, a glue inlet formed by downwards sinking the upper surface and a groove are formed in the plastic base body, and the groove is positioned on the outer side of the glue inlet; the first side wall and the second side wall are respectively positioned at two sides of the groove, and the plastic base body further comprises a covering part positioned between the inner surface of the groove and the first side wall and the second side wall.
2. The front cover of an electronic device as claimed in claim 1, wherein a connecting groove for connecting the glue inlet and the groove is further disposed on the upper surface of the plastic substrate.
3. The front cover of an electronic device as claimed in claim 1, wherein the groove extends along a length direction of the plastic substrate.
4. The front cover of an electronic device as claimed in claim 3, wherein the glue inlet is disposed opposite to the middle of the groove in the length direction, a connecting line between the center of the glue inlet and the middle of the groove in the length direction forms a center line, and the parts of the groove located at both sides of the center line are symmetrical to each other.
5. The front cover of an electronic device according to claim 3, wherein the width of the groove is greater than or equal to 4 mm.
6. The face housing of an electronic device according to claim 1, wherein the thickness of the covering portion is 0.1-0.2 mm.
7. The front cover of an electronic device as claimed in claim 1, wherein the plastic substrate has a plurality of glue inlets and grooves arranged along a length direction of the plastic substrate.
8. Electronic device, characterized in that it comprises a front cover of an electronic device according to any of claims 1-7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122241521.4U CN215735350U (en) | 2021-09-15 | 2021-09-15 | Face shell of electronic equipment and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122241521.4U CN215735350U (en) | 2021-09-15 | 2021-09-15 | Face shell of electronic equipment and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215735350U true CN215735350U (en) | 2022-02-01 |
Family
ID=80020926
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122241521.4U Active CN215735350U (en) | 2021-09-15 | 2021-09-15 | Face shell of electronic equipment and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215735350U (en) |
-
2021
- 2021-09-15 CN CN202122241521.4U patent/CN215735350U/en active Active
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