CN215720489U

CN215720489U - Modularized chip fixing frame for chip manufacturing process

Info

Publication number: CN215720489U
Application number: CN202121611019.1U
Authority: CN
Inventors: 卢景璇
Original assignee: Anhui Haizhiliang Storage Equipment Co ltd
Current assignee: Anhui Haizhiliang Storage Equipment Co ltd
Priority date: 2021-07-15
Filing date: 2021-07-15
Publication date: 2022-02-01
Anticipated expiration: 2031-07-15

Abstract

The utility model belongs to the technical field of chip manufacturing, and particularly relates to a modular chip fixing frame for a chip manufacturing process, which comprises a fixing plate, wherein connecting columns are fixed on the surfaces of two sides of the fixing plate, sliding chutes are fixed on the opposite end surfaces of the connecting columns, a mounting plate is arranged between the two connecting columns, a damping plate is fixed on the surface of one side, close to the fixing plate, of the mounting plate, pulleys matched with the sliding chutes are arranged at the two ends of the damping plate and the mounting plate, and the two ends of the damping plate and the mounting plate are both in sliding connection with the sliding chutes through the pulleys; the chip placing groove is damped by arranging the first damping spring and the second damping spring, and meanwhile, the damping plate and the mounting plate can slide on the sliding groove due to impact force generated by vibration of the fixing frame; the shock absorption is conveniently carried out on the impact force through the sliding of the fixed rod on the fixed plate, the shock absorption performance of the fixed frame is effectively improved, and therefore the stability of the fixed frame is guaranteed.

Description

Modularized chip fixing frame for chip manufacturing process

Technical Field

The utility model belongs to the technical field of chip manufacturing, and particularly relates to a modular chip fixing frame for a chip manufacturing process.

Background

Chips, precisely silicon wafers, are also called integrated circuits. It is the main product of microelectronics technology. The chip is an integrated circuit containing many gate circuits, and has small volume, low power consumption, low cost and high speed, and can be widely used in the fields of computers, communication equipment, robots or household appliances, etc.

The existing fixing frame is lack of shock absorption, when shock is generated, a processed chip can be damaged, and the chip is fixed and is not firm, so that the processing quality of the chip can be seriously influenced, and the product quality is influenced.

SUMMERY OF THE UTILITY MODEL

In order to solve the problems in the prior art, the utility model provides a modularized chip fixing frame for a chip manufacturing process.

The purpose of the utility model can be realized by the following technical scheme:

a modularized chip fixing frame for a chip manufacturing process comprises a fixing plate, connecting columns are fixed on the surfaces of two sides of the fixing plate, sliding chutes are fixed on the opposite end surfaces of the connecting columns, a mounting plate is arranged between the two connecting columns, a damping plate is fixed on the surface of one side, close to the fixing plate, of the mounting plate, pulleys matched with the sliding chutes are arranged at the two ends of the damping plate and the mounting plate, and the two ends of the damping plate and the mounting plate are both in sliding connection with the sliding chutes through the pulleys; the damping plate is characterized in that fixing rods are symmetrically fixed on the surface of one side, close to the fixing plate, of the damping plate, one end of each fixing rod is connected with the surface of the corresponding fixing plate in a sliding mode, and a sliding groove matched with the corresponding fixing rods is formed in the surface of the corresponding fixing plate.

According to the preferable technical scheme of the modular chip fixing frame for the chip manufacturing process, a fixing groove is formed in the surface, away from the damping plate, of one side of the mounting plate, a chip placing groove is formed in the fixing groove, and fixing mechanisms are arranged on the two sides of the fixing groove.

According to the preferable technical scheme of the modular chip fixing frame for the chip manufacturing process, the fixing mechanism comprises grooves, the grooves are formed in the two sides of the fixing groove, a limiting spring is arranged in each groove, one end of the limiting spring is fixedly connected with the inner wall of each groove, the other end of the limiting spring is fixedly connected with one end of a limiting rod, and the limiting rod extends into the fixing groove to the outside and is inserted into the side wall of the chip placing groove.

According to the preferable technical scheme of the modular chip fixing frame for the chip manufacturing process, the chip placing groove is internally and transversely provided with the placing plate, one side, close to the mounting plate, of the placing plate is fixedly provided with the first damping spring, and the other end of the first damping spring is fixedly connected with the inner wall of the chip placing groove.

According to the preferable technical scheme of the modular chip fixing frame for the chip manufacturing process, the middle part of the end face of one side, far away from the opposite end face, of the fixing rod is fixedly provided with the fixing ring, the fixing ring is fixedly provided with the pull ring, the pull ring is fixedly provided with the connecting rod, one end of the connecting rod is fixedly provided with the second damping spring, and one end of the second damping spring is fixedly connected with the surface of the fixing plate.

As the preferable technical scheme of the modularized chip fixing frame for the chip manufacturing process, supporting columns are symmetrically fixed on one side of the fixing plate, which is far away from the connecting column.

The utility model has the beneficial effects that:

1. the chip placing groove is damped by arranging the first damping spring and the second damping spring, and meanwhile, the damping plate and the mounting plate can slide on the sliding groove due to impact force generated by vibration of the fixing frame; the shock absorption is conveniently carried out on the impact force through the sliding of the fixed rod on the fixed plate, the shock absorption performance of the fixed frame is effectively improved, and therefore the stability of the fixed frame is guaranteed.

2. Through being provided with fixed establishment and fixed slot, when the chip standing groove is fixed for when the mount vibrations, the chip in the chip standing groove can remain stable, guarantees that the chip can not take place to damage, has guaranteed the production quality of chip.

Drawings

In order to facilitate understanding for those skilled in the art, the present invention will be further described with reference to the accompanying drawings.

FIG. 1 is a schematic structural diagram of a modular chip holder for use in a chip manufacturing process according to the present invention;

FIG. 2 is an enlarged view taken at A of FIG. 1 according to the present invention;

fig. 3 is an enlarged view of fig. 1 at B in the present invention.

Description of the main elements

In the figure: 1. a support pillar; 2. a fixing plate; 3. connecting columns; 4. mounting a plate; 5. a damper plate; 6. a fixing mechanism; 61. a groove; 62. a limiting rod; 63. a limiting spring; 7. fixing grooves; 8. fixing the rod; 9. a chip placing groove; 10. a first damping spring; 11. placing the plate; 12. a chute; 13. a second damping spring; 14. a fixing ring; 15. a pull ring; 16. a connecting rod.

Detailed Description

The technical solutions of the present invention will be described clearly and completely with reference to the following embodiments, and it should be understood that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1-3, a modular chip fixing frame for a chip manufacturing process includes a fixing plate 2, connecting posts 3 are fixed on the surfaces of two sides of the fixing plate 2, and supporting posts 1 are symmetrically fixed on one side of the fixing plate 2 away from the connecting posts 3; the opposite end surfaces of the connecting columns 3 are fixedly provided with sliding chutes 12, a mounting plate 4 is arranged between the two connecting columns 3, the surface of one side of the mounting plate 4, which is close to the fixed plate 2, is fixedly provided with a damping plate 5, the two ends of the damping plate 5 and the mounting plate 4 are provided with pulleys matched with the sliding chutes 12, and the two ends of the damping plate 5 and the mounting plate 4 are both in sliding connection with the sliding chutes 12 through the pulleys; the damping plate 5 is provided with a fixing rod 8 on one side surface of the fixing plate 2, the fixing rod 8 is connected with the surface of the fixing plate 2 in a sliding mode, and a sliding groove matched with the fixing rod 8 is formed in the surface of the fixing plate 2.

Specifically, a fixing ring 14 is fixed in the middle of one side end face of the fixing rod 8 far away from the opposite end face, a pull ring 15 is fixed on the fixing ring 14, a connecting rod 16 is fixed on the pull ring 15, a second damping spring 13 is fixed at one end of the connecting rod 16, and one end of the second damping spring 13 is fixedly connected with the surface of the fixing plate 2.

Specifically, a fixing groove 7 is formed in the surface of one side, away from the damping plate 5, of the mounting plate 4, a chip placing groove 9 is formed in the fixing groove 7, and fixing mechanisms 6 are arranged on two sides of the fixing groove 7; the fixing mechanism 6 comprises a groove 61, the two sides of the fixing groove 7 are provided with the grooves 61, a limiting spring 63 is arranged in the groove 61, one end of the limiting spring 63 is fixedly connected with the inner wall of the groove 61, the other end of the limiting spring 63 is fixedly connected with one end of a limiting rod 62, and the limiting rod 62 extends into the fixing groove 7 to the outside and is inserted into the side wall of the chip placing groove 9; through being provided with fixed establishment 6 and fixed slot 7, when chip standing groove 9 fixes for when the mount vibrations, the chip in the chip standing groove 9 can remain stable, guarantees that the chip can not take place to damage, has guaranteed the production quality of chip.

Specifically, a placing plate 11 is transversely arranged in the chip placing groove 9, a first damping spring 10 is fixed on one side of the placing plate 11 close to the mounting plate 4, and the other end of the first damping spring 10 is fixedly connected with the inner wall of the chip placing groove 9; the chip placing groove 9 is damped by arranging a first damping spring 10 and a second damping spring 13, and meanwhile, the damping plate 5 and the mounting plate 4 can slide on the sliding groove 12 due to impact force generated by vibration of the fixing frame; the impact force is buffered and damped conveniently by sliding the fixed rod 8 on the fixed plate 2, and the damping performance of the fixed frame is effectively improved, so that the stability of the fixed frame is ensured.

The working principle and the using process of the utility model are as follows: the chip placing groove 9 is placed in the fixing groove 7, the limiting rod 62 is moved towards the chip placing groove 9 under the elastic force of the limiting spring 63, is simultaneously inserted into the side wall of the chip placing groove 9, and is placed on the chip placing groove 9, so that the chip can be fixed; when the mount receives the vibration, shock attenuation board 5 and mounting panel 4 just can slide on spout 12, transmit the dead lever 8 with the vibration on, carry out the shock attenuation to the chip in the chip standing groove 9, prevent that the chip from taking place to damage.

The preferred embodiments of the utility model disclosed above are intended to be illustrative only. The preferred embodiments are not exhaustive and do not limit the utility model to the precise embodiments disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the utility model and the practical application, to thereby enable others skilled in the art to best utilize the utility model. The utility model is limited only by the claims and their full scope and equivalents.

Claims

1. The utility model provides a modularization chip mount for chip manufacturing process, includes fixed plate (2), its characterized in that: connecting columns (3) are fixed on the surfaces of two sides of the fixed plate (2), sliding chutes (12) are fixed on the opposite end surfaces of the connecting columns (3), a mounting plate (4) is arranged between the two connecting columns (3), a damping plate (5) is fixed on the surface of one side, close to the fixed plate (2), of the mounting plate (4), pulleys matched with the sliding chutes (12) are arranged at the two ends of the damping plate (5) and the mounting plate (4), and the two ends of the damping plate (5) and the mounting plate (4) are both in sliding connection with the sliding chutes (12) through the pulleys; the damping plate is characterized in that a fixing rod (8) is symmetrically fixed on the surface of one side, close to the fixing plate (2), of the damping plate (5), one end of the fixing rod (8) is connected with the surface of the fixing plate (2) in a sliding mode, and a sliding groove matched with the fixing rod (8) is formed in the surface of the fixing plate (2).

2. The modular chip holder according to claim 1, wherein: the mounting plate is characterized in that a fixing groove (7) is formed in the surface, far away from the damping plate (5), of one side of the mounting plate (4), a chip placing groove (9) is formed in the fixing groove (7), and fixing mechanisms (6) are arranged on the two sides of the fixing groove (7).

3. The modular chip holder according to claim 2, wherein: the fixing mechanism (6) comprises a groove (61), the two sides of the fixing groove (7) are provided with the grooves (61), a limiting spring (63) is arranged in the groove (61), one end of the limiting spring (63) is fixedly connected with the inner wall of the groove (61), the other end of the limiting spring (63) is fixedly connected with one end of a limiting rod (62), and the limiting rod (62) extends to the inside of the fixing groove (7) to the outside and is inserted and connected onto the side wall of the chip placing groove (9).

4. The modular chip holder according to claim 3, wherein: the chip placing groove is characterized in that a placing plate (11) is transversely arranged in the chip placing groove (9), a first damping spring (10) is fixed on one side, close to the mounting plate (4), of the placing plate (11), and the other end of the first damping spring (10) is fixedly connected with the inner wall of the chip placing groove (9).

5. The modular chip holder according to claim 1, wherein: one side end face middle part of keeping away from relative terminal surface is fixed with solid fixed ring (14) dead lever (8), gu be fixed with pull ring (15) on fixed ring (14), be fixed with connecting rod (16) on pull ring (15), the one end of connecting rod (16) is fixed with second damping spring (13), the one end of second damping spring (13) and the fixed surface of fixed plate (2) are connected.

6. The modular chip holder according to claim 1, wherein: and supporting columns (1) are symmetrically fixed on one side of the fixing plate (2) far away from the connecting column (3).