CN215713490U - Hanging tool for electroplating processing of wafer - Google Patents
Hanging tool for electroplating processing of wafer Download PDFInfo
- Publication number
- CN215713490U CN215713490U CN202122060135.5U CN202122060135U CN215713490U CN 215713490 U CN215713490 U CN 215713490U CN 202122060135 U CN202122060135 U CN 202122060135U CN 215713490 U CN215713490 U CN 215713490U
- Authority
- CN
- China
- Prior art keywords
- hanger
- back plate
- wafer
- sealing back
- wedge
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
The utility model relates to a hanger for electroplating processing of a wafer, which comprises a hanger substrate, wherein the surface of the hanger substrate is provided with a concave cavity capable of placing a wafer product, a sealing back plate is fixedly fastened on the concave cavity, at least three limiting columns are arranged on the outer side of the concave cavity on the surface of the hanger substrate, wedge blocks are arranged on one sides of the limiting columns facing to grooves, the inclination angles of the wedge blocks are arranged along the same circumferential direction, arc grooves are respectively formed in the positions, corresponding to the limiting columns, of the surface edge of the sealing back plate, arc surfaces are arranged along the same direction, the arc grooves of the sealing back plate are attached to the wedge blocks to realize locking, at least three limiting columns are arranged on the semicircular circumferential surface, and the semicircular circumferential surface on the other side, opposite to the sealing back plate, of the sealing back plate is fixed through at least one screw. This application convenient operation when can guaranteeing to electroplate the quality, improves the workman and to the operating efficiency of hanger in order to improve production machining efficiency, can also avoid liquid medicine etc. excessively to remain in the hanger.
Description
Technical Field
The utility model relates to a hanger for electroplating processing of a wafer.
Background
In the electroplating equipment for the wafer products, the wafer is put in the liquid of the electroplating tank through a hanger to carry out the operation of the electroplating process. Only one side of the wafer is electroplated at a time, and the other side of the wafer needs to be sealed and protected, and the wafer is sealed by a back plate, a matched plane seal and an O-shaped ring at present.
Traditional sealed backplate locking structure is screwed up with the bolt of circumference equipartition and is realized sealing to the sealing washer compression, but this locking structure has a great deal of shortcoming:
firstly, the bolt is frequently assembled and disassembled, the thread pair is seriously abraded, and metal abrasive particles are generated to pollute electrolyte and products;
secondly, 10 bolts are generally arranged, and time and labor are wasted when the bolts are manually assembled and disassembled each time, so that the production efficiency is influenced;
thirdly, through the bolt fastening, must relate to the trompil on sealed backplate, can lead to the liquid medicine to remain in the screw, the washing cleanness of being inconvenient for can lead to follow-up production liquid medicine cross contamination.
Disclosure of Invention
The utility model aims to provide a hanger for wafer electroplating processing, which is convenient to operate, can ensure the electroplating quality, improve the operation efficiency of workers on the hanger to improve the production processing efficiency, and can avoid excessive residues of liquid medicine and the like in the hanger.
In order to achieve the purpose, the utility model adopts the technical scheme that:
the utility model provides a hanger for wafer electroplating processing, which comprises a hanger substrate, wherein the surface of the hanger substrate is provided with a concave cavity capable of placing a wafer product, a sealing back plate is fixedly fastened on the concave cavity, the surface of the hanger substrate is positioned on the outer side of the concave cavity and provided with at least three limiting columns, one sides of the limiting columns, facing to grooves, are provided with wedge blocks, the inclination angles of the wedge blocks are arranged along the same circumferential direction, the surface edge of the sealing back plate is provided with arc grooves corresponding to the positions of the limiting columns respectively, each arc groove is a wedge surface arranged along the same direction, the arc grooves of the sealing back plate are attached to the wedge blocks to realize locking, the at least three limiting columns are positioned on the semicircular circumferential surface, and the semicircular circumferential surface on the other side, opposite to the sealing back plate, is fixed through at least one screw.
Optionally, a grabbing handle convenient to screw is arranged on the outer side face of the sealing back plate.
Due to the application of the technical scheme, compared with the prior art, the utility model has the following advantages:
according to the hanger for electroplating processing of the wafer, the sealing back plate can realize quick positive locking pressure at the position of the hanger substrate and is fastened by combining the screw, the operation is smooth and convenient, the electroplating quality can be ensured, meanwhile, the operation efficiency of workers on the hanger is improved, the production processing efficiency is improved, the assembling and disassembling beat of the hanger can be shortened to 40 seconds, and meanwhile, excessive residues of liquid medicine and the like in the hanger can be avoided.
Drawings
Some specific embodiments of the utility model will be described in detail hereinafter, by way of illustration and not limitation, with reference to the accompanying drawings. The same reference numbers in the drawings identify the same or similar elements or components. Those skilled in the art will appreciate that the drawings are not necessarily drawn to scale. In the drawings:
fig. 1 is a schematic structural diagram of a rack for wafer electroplating according to an embodiment of the present invention.
Wherein the reference numerals are as follows:
1. the hanging tool comprises a hanging tool base plate, 2 a sealing back plate, 3 a limiting column, 4 a wedge-shaped block, 5 an arc-shaped groove, 6 and a screw.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the accompanying drawings, and it should be understood that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention.
In addition, the technical features involved in the different embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.
The embodiment provides a rack for wafer electroplating processing, as shown in fig. 1, which may generally include a rack substrate 1, the rack substrate 1 has a cavity on the surface for placing a wafer product, a sealing back plate 2 is buckled and fixed on the concave cavity, three limit columns 3 are arranged on the surface of the hanger base plate 1 and positioned at the outer side of the concave cavity, one side of the limiting column 3 facing the groove is provided with a wedge block 4, the inclination angles of the wedge blocks 4 are arranged along the same circumferential direction, arc-shaped grooves 5 are respectively arranged on the surface edge of the sealing back plate 2 corresponding to the positions of the limiting columns 3, each arc-shaped groove 5 is a wedge-shaped surface arranged along the same direction, the arc-shaped grooves 5 of the sealing back plate 2 are attached to the wedge-shaped blocks 4 to realize locking, the three limiting columns 3 are located on the circumferential surface of a semicircle, and the circumferential surface of the semicircle on the other side opposite to the sealing backboard 2 is fixed through at least one screw 6.
That is to say, the wedge of the wedge 4 that spacing post 3 had on one side towards the recess sets up along the tangential of circle to can fix a position the deadlock to the arc wall 5 of wedge face better, combine the secondary of screw 6 tightly decide can realize better that it is fixed to the deadlock between hanger base plate 1 and sealed backplate 2. According to the hanger for electroplating processing of the wafer, the sealing back plate 2 can realize quick positive locking pressure at the position of the hanger substrate 1 and is fastened by combining the screw 6, the operation is smooth and convenient, the electroplating quality can be guaranteed, the operation efficiency of workers on the hanger is improved, the production processing efficiency is improved, the assembling and disassembling beat of the hanger can be shortened to 40 seconds, and meanwhile, excessive residues of liquid medicine and the like in the hanger can be avoided.
In order to facilitate the operation, a grabbing handle which is convenient to twist is arranged on the outer side surface of the sealing back plate 2.
The above embodiments are merely illustrative of the technical concept and features of the present invention, and the purpose thereof is to enable those skilled in the art to understand the content of the present invention and implement the utility model, and not to limit the scope of the utility model, and all equivalent changes or modifications made according to the spirit of the present invention should be covered by the scope of the present invention.
Claims (2)
1. The utility model provides a hanger for wafer electroplating process, includes the hanger base plate, hanger base plate surface has the cavity that can place the wafer product lock is fixed with sealed backplate on the cavity, a serial communication port, hanger base plate surface is located the outside of cavity is provided with at least three spacing post, spacing post has the inclination of wedge and sets up along same circumferencial direction towards one side of recess, the surface edge of sealed backplate corresponds to the arc wall has been seted up respectively to the position of spacing post, each the arc wall is the wedge that sets up along same direction, the arc wall laminating of sealed backplate the locking is realized to the wedge, wherein, at least three spacing post is located semicircular global fixed through at least one screw on the semicircular opposite side global that sealed backplate is relative.
2. The rack of claim 1, wherein a gripping handle is disposed on the outer side of the sealing back plate for facilitating screwing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122060135.5U CN215713490U (en) | 2021-08-30 | 2021-08-30 | Hanging tool for electroplating processing of wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122060135.5U CN215713490U (en) | 2021-08-30 | 2021-08-30 | Hanging tool for electroplating processing of wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215713490U true CN215713490U (en) | 2022-02-01 |
Family
ID=80009078
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122060135.5U Active CN215713490U (en) | 2021-08-30 | 2021-08-30 | Hanging tool for electroplating processing of wafer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215713490U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114775025A (en) * | 2022-05-19 | 2022-07-22 | 新阳硅密（上海）半导体技术有限公司 | Wafer clamp and electroplating device |
-
2021
- 2021-08-30 CN CN202122060135.5U patent/CN215713490U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114775025A (en) * | 2022-05-19 | 2022-07-22 | 新阳硅密（上海）半导体技术有限公司 | Wafer clamp and electroplating device |
| CN114775025B (en) * | 2022-05-19 | 2023-09-08 | 新阳硅密（上海）半导体技术有限公司 | Wafer clamp and electroplating device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN215713490U (en) | Hanging tool for electroplating processing of wafer | |
| CN207464729U (en) | For the processing tool of bend pipe workpiece | |
| CN216006066U (en) | Positive pressure type wafer electroplating hanger convenient to clean | |
| CN216006068U (en) | Wafer electroplating hanger | |
| CN209568139U (en) | A kind of coating clamp | |
| CN206169551U (en) | Casing and mounting panel welding special fixture | |
| CN216006067U (en) | Locking mechanism of wafer electroplating hanger | |
| CN209868190U (en) | Novel fine grinding die for composite material | |
| CN209766395U (en) | Silicon chip single-side processing clamp | |
| CN206913059U (en) | Automobile back door lock ring installing plate Handheld clamp | |
| CN216990867U (en) | Special device for processing combined structural part | |
| CN217860121U (en) | Dune buggy pushes down sign indicating number frock | |
| CN216781509U (en) | Fixing and clamping device for circular supporting sleeve | |
| CN213319747U (en) | Tool for clamping top cover of waveguide box | |
| CN110614519A (en) | Planetary gear gasket well type oil groove processing tool | |
| CN211361485U (en) | Cylinder sleeve clamp of cylinder sleeve machining center | |
| CN210099512U (en) | Auxiliary clamp with adjustable symmetry degree | |
| CN212122441U (en) | Clamp for valve cover of pressure limiting valve | |
| CN220346247U (en) | Stepped stack spraying clamp | |
| CN218710860U (en) | Aluminum profile surface coating device | |
| CN213053815U (en) | Control arm processing location centre gripping frock | |
| CN213195685U (en) | Ring processing tool | |
| CN214686085U (en) | Appearance processing tool for spherical excircle workpiece of aircraft | |
| CN211218784U (en) | Special fixture for volute universal template | |
| CN210024514U (en) | Clamp for processing transition block |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |