CN215713482U

CN215713482U - Potsherd is electroplated and is pressed from both sides

Info

Publication number: CN215713482U
Application number: CN202122361996.7U
Authority: CN
Inventors: 韩友生; 袁晓波
Original assignee: Kunshan Dongwei Technology Co Ltd
Current assignee: Kunshan Dongwei Technology Co Ltd
Priority date: 2021-09-28
Filing date: 2021-09-28
Publication date: 2022-02-01
Anticipated expiration: 2031-09-28

Abstract

The utility model relates to the technical field of electroplating clamps and discloses a ceramic wafer electroplating clamp. The ceramic chip electroplating clamp comprises a first clamping part and a second clamping part, wherein one end of the first clamping part is provided with a first clamping head, and the other end of the first clamping part is connected with an external mechanism; the second clamping part is hinged with the first clamping part, one end of the second clamping part is provided with a second clamping head opposite to the first clamping head, and the first clamping head and the second clamping head can clamp a ceramic wafer to be electroplated; the first clamping head and one of the second clamping heads are provided with an elastic part capable of conducting electricity, the elastic part can be elastically abutted to the ceramic plate, the elastic part plays a role in buffering the ceramic plate, and the electroplating clamp is effectively prevented from crushing the ceramic plate.

Description

Potsherd is electroplated and is pressed from both sides

Technical Field

The utility model relates to the technical field of electroplating clamps, in particular to a ceramic wafer electroplating clamp.

Background

On a PCB board, copper is used to interconnect components on the substrate, and if copper is exposed to air for a long time, it is easily tarnished by oxidation, and it also suffers from corrosion and loses solderability. Therefore, copper tracks, vias and plated through holes must be protected using specific techniques including organic lacquers, oxide films, and electroplating techniques, which are standard operations to ensure solderability and protect the circuit from corrosion.

In the electroplating production process of the PCB, an electroplating clamp is needed to clamp the substrate on a steel belt of the conveying mechanism, and the substrate is driven by the steel belt to run in an electroplating bath to complete the electroplating process of the PCB. The electroplating clamp in the prior art adopts a rigid clamping head, so that a PCB is easily extruded and deformed, and even a ceramic sheet with higher brittleness is crushed.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a ceramic chip electroplating clamp, which solves the problem that the existing electroplating clamp is easy to crush ceramic chips.

In order to achieve the purpose, the utility model adopts the following technical scheme:

a ceramic wafer plating clip, comprising:

the clamping device comprises a first clamping part, a second clamping part and a clamping mechanism, wherein one end of the first clamping part is provided with a first clamping head, and the other end of the first clamping part is connected with an external mechanism; and

the second clamping part is hinged with the first clamping part, one end of the second clamping part is provided with a second clamping head opposite to the first clamping head, and the first clamping head and the second clamping head can clamp a ceramic wafer to be electroplated;

one of the first clamping head and the second clamping head is provided with an elastic part which can conduct electricity, and the elastic part can elastically abut against the ceramic plate.

Alternatively, the resilient member is integrally formed with the first gripping head or the second gripping head.

Alternatively, the first clamping head or the second clamping head, where the elastic member is not provided, is provided with at least two spaced clamping points corresponding to the elastic member.

As an alternative, the elastic member includes an elastic main body and connecting portions disposed at two ends of the elastic main body, the connecting portions are connected to the first clamping portion or the second clamping portion, and the elastic main body is disposed at an interval from the first clamping portion or the second clamping portion.

Alternatively, the elastic body and the connecting portion are connected to form a U-shaped structure.

As an alternative, the other end of the first clamping part is provided with a first suction member, the second clamping part is provided with a second suction member corresponding to the first suction member, the first suction member and the second suction member are mutually sucked, so that the first clamping head and the second clamping head clamp the ceramic wafer.

As an alternative, the first attraction piece and the second attraction piece are both magnetic bodies, and the opposite surfaces of the first attraction piece and the second attraction piece are opposite in magnetism; alternatively, the first and second electrodes may be,

one of the first suction piece and the second suction piece is a magnet, and the other one is an iron piece.

As an alternative, an adjusting piece is arranged between the second suction piece and the second clamping part, and the adjusting piece is used for adjusting the distance between the second suction piece and the second clamping part.

As an alternative scheme, a boss is arranged on the second clamping part, the boss is opposite to one surface of the first clamping part and is an inclined surface, and the second suction piece is connected with the inclined surface through the adjusting piece, so that the second suction piece is opposite to the first suction piece in suction.

As an alternative, the second clamping portion comprises a clamping plate and an operating rod, one end of the clamping plate is provided with the second clamping head, the other end of the clamping plate is hinged to the first clamping portion and the operating rod respectively, the operating rod is connected with the first clamping portion through a connecting plate, two ends of the connecting plate are hinged to the operating rod and the first clamping portion respectively, and a hinge point of the connecting plate and the operating rod is located between the second suction piece and the clamping plate.

The utility model has the beneficial effects that:

the ceramic chip electroplating clamp comprises a first clamping part and a second clamping part, wherein a first clamping head is arranged at one end of the first clamping part, a second clamping head corresponding to the first clamping head is arranged at one end of the second clamping part, and an elastic part capable of conducting electricity is arranged on one of the first clamping head and the second clamping head and can be elastically abutted against the ceramic chip, so that the elastic part has a buffering effect on the ceramic chip, and the ceramic chip is effectively prevented from being crushed by the electroplating clamp.

Drawings

FIG. 1 is a schematic structural diagram of a ceramic wafer electroplating clip according to the present invention;

fig. 2 is a schematic structural diagram of the elastic member provided by the present invention.

In the figure:

100. a first clamping portion; 110. a first gripping head; 120. a first absorbing member;

200. a second clamping portion; 210. a second gripping head; 220. an elastic member; 221. an elastic body; 222. a connecting portion; 230. a second engaging member; 240. an adjustment member; 250. a boss; 260. a splint; 270. an operating lever; 280. a pinch roller; 290. a locking member;

300. a connecting plate.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the utility model and are not limiting of the utility model. It should be further noted that, for the convenience of description, only some of the structures related to the present invention are shown in the drawings, not all of the structures.

In the description of the present invention, unless expressly stated or limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, e.g., as meaning permanently connected, removably connected, or integral to one another; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

In the description of the present embodiment, the terms "upper", "lower", "right", "left", and the like are used based on the orientations and positional relationships shown in the drawings only for convenience of description and simplification of operation, and do not indicate or imply that the referred device or element must have a specific orientation, be configured and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used only for descriptive purposes and are not intended to have a special meaning.

As shown in fig. 1, the present embodiment provides a ceramic wafer electroplating clamp, which is used for clamping a ceramic wafer during a ceramic wafer electroplating process. The ceramic chip electroplating clamp comprises a first clamping part 100 and a second clamping part 200, wherein one end of the first clamping part 100 is provided with a first clamping head 110, the other end of the first clamping part 100 is connected with an external mechanism (not shown in the figure), the second clamping part 200 is hinged with the first clamping part 100, one end of the second clamping part 200 is provided with a second clamping head 210 opposite to the first clamping head 110, and the first clamping head 110 and the second clamping head 210 can clamp a ceramic chip to be electroplated; one of the first clamping head 110 and the second clamping head 210 is provided with an elastic part 220 capable of conducting electricity, the elastic part 220 can be elastically abutted against the ceramic plate, and the elastic part 220 plays a role in buffering the ceramic plate, so that the rigid clamping head can be effectively prevented from crushing the ceramic plate.

In this embodiment, the external mechanism is a transmission device, which is disposed at the upper end of the first clamping portion 100 and can drive the electroplating clamp holding the ceramic wafer to operate in the electroplating bath, thereby completing the electroplating process of the ceramic wafer.

Preferably, the elastic member 220 is integrally formed with the first clamping head 110 or the second clamping head 210, and the integrally formed structure enables the elastic member 220 to be firmly connected with the first clamping head 110 or the second clamping head 210, and the processing is convenient.

In this embodiment, as shown in fig. 1, the elastic member 220 is a resilient sheet, and is disposed on the second clamping head 210 and integrally formed with the second clamping head 210, and since the first clamping head 110 is fixedly disposed, when clamping the ceramic wafer, the second clamping head 210 gradually approaches the first clamping head 110 to clamp the ceramic wafer tightly, and therefore, the elastic member 220 is disposed on the movable second clamping head 210, so as to better achieve a buffering effect on the ceramic wafer. It should be noted that, when the elastic element 220 is disposed on the first clamping head 110, the buffering effect on the ceramic wafer can also be achieved.

Specifically, as shown in fig. 2, the elastic member 220 includes an elastic body 221 and connecting portions 222 disposed at two ends of the elastic body 221, the connecting portions 222 are connected to the second clamping portion 200, and the elastic body 221 and the second clamping portion 200 are disposed at an interval to reserve a space for bending deformation of the elastic body 221, so as to achieve an elastic buffering effect.

Preferably, as shown in fig. 2, the elastic body 221 and the connecting portion 222 are connected to form a U-shaped structure, the connecting portion 222 is located at both sides of the U-shaped opening to facilitate connection with the second clamping head 210, and the elastic body 221 and the second clamping head 210 have a sufficient space therebetween.

Preferably, the first clamping head 110 is provided with at least two spaced clamping points corresponding to the elastic body 221, and the spaced clamping points enable the elastic member 220 to exert a better elastic effect. In this embodiment, the two clamping points are provided, the lower end of the first clamping portion 100 is bifurcated into two parts, the two parts are respectively connected with one first clamping head 110, and the outer widths of the two first clamping heads 110 are smaller than the width of the elastic body 221, so that the two first clamping heads 110 arranged at intervals are over against the elastic body 221 at a position with good elasticity, and the elastic buffering effect of the elastic member 220 on the ceramic wafer is further improved.

In order to clamp the ceramic wafer by the electroplating clamp, as shown in fig. 1, a first suction element 120 is disposed at an upper end of the first clamping portion 100, a second suction element 230 corresponding to the first suction element 120 is disposed on the second clamping portion 200, and the first suction element 120 and the second suction element 230 are sucked to each other, so that the first clamping head 110 and the second clamping head 210 clamp the ceramic wafer. The mode of clamping the ceramic wafer through the attraction of the first suction element 120 and the second suction element 230 is more convenient to use, and the clamping force of the electroplating clamp on the ceramic wafer can be controlled at a preset value, so that the ceramic wafer is effectively prevented from being cracked in the electroplating process.

Specifically, threaded holes are correspondingly formed in the first absorbing element 120, the first clamping part 100 and the transmission device, and the first absorbing element 120 is fixedly connected with the first clamping part 100 and the transmission device through bolts; the second engaging element 230 is also connected to the second clamping portion 200 by bolts.

In order to adapt the electroplating clip to ceramic wafers with different thicknesses, an adjusting piece 240 is arranged between the second suction element 230 and the second clamping part 200, and the adjusting piece 240 is used for adjusting the distance between the second suction element 230 and the second clamping part 200. In this embodiment, the adjusting member 240 is a bolt and a nut, and the length of the bolt screwed into the second suction member 230 can be adjusted by adjusting the position of the nut on the bolt, so as to adjust the distance between the second suction member 230 and the second clamping portion 200.

Because the first clamping part 100 and the upper end of the second clamping part 200 form a certain included angle, when the first suction element 120 and the second suction element 230 are directly arranged on the first clamping part 100 and the second clamping part 200, a certain included angle is formed between the opposite surfaces of the first suction element 120 and the second suction element 230, the first suction element and the second suction element are not right opposite, and stable suction between the first suction element and the second suction element is influenced. In order to realize the opposite attraction between the first attraction part 120 and the second attraction part 230, the second clamping part 200 is provided with a boss 250, one surface of the boss 250 opposite to the first clamping part 100 is an inclined surface, and the second attraction part 230 is connected with the inclined surface through an adjusting part 240, so that the second attraction part 230 and the first attraction part 120 are opposite to attract, the attraction force between the second attraction part 230 and the first attraction part 120 is maximized, and the ceramic wafer is firmly clamped.

Optionally, the first suction element 120 and the second suction element 230 are both magnetic bodies, and the opposite surfaces of the first suction element 120 and the second suction element 230 are opposite in magnetism, so that the first suction element 120 and the second suction element 230 can be sucked with each other. Or, one of the first suction element 120 and the second suction element 230 is a magnet, and the other is an iron element, so that the first suction element 120 and the second suction element 230 can be mutually sucked.

Further, as shown in fig. 1, the second clamping portion 200 includes a clamping plate 260 and an operating rod 270, the lower end of the clamping plate 260 is provided with a second clamping head 210, the upper end of the clamping plate is hinged to the first clamping portion 100 and the operating rod 270, the operating rod 270 is connected to the first clamping portion 100 through a connecting plate 300, two ends of the connecting plate 300 are hinged to the operating rod 270 and the first clamping portion 100, respectively, and a hinge point of the connecting plate 300 and the operating rod 270 is located between the second suction member 230 and the clamping plate 260. The clamping plate 260, the operating rod 270, the connecting plate 300 and the first clamping part 100 are connected in a hinged manner to form a double-rocker mechanism, when the operating rod 270 is rotated along a first direction, the second absorbing part 230 is separated from the first absorbing part 120, the clamping plate 260 rotates in a direction far away from the first clamping part 100, the first clamping head 110 and the second clamping head 210 are opened, and the clamping of the ceramic wafer is released; when the operation rod 270 is rotated in the second direction, the second suction element 230 is sucked with the first suction element 120, the clamping plate 260 is rotated in a direction approaching the first clamping portion 100, and the first clamping head 110 and the second clamping head 210 are closed to clamp the ceramic wafer.

The range of the rotation angle of the clamping plate 260 in this embodiment is limited by the double-rocker mechanism itself, and in practical cases, the range of the rotation angle of the clamping plate 260 can be adjusted by adjusting the length and the position relationship of each component in the double-rocker mechanism as required.

Preferably, the clamping plates 260 are provided in two, which are respectively coupled to both sides of the operating lever 270, and the second clamping heads 210 are respectively provided at the lower ends of the two clamping plates 260, and the second clamping heads 210 are coupled to the two coupling portions 222 of the elastic member 220. The clamp plate 260 is 7-shaped, the upper end of the clamp plate is hinged to the lower end of the operating rod 270 and the second clamping portion 200, preferably, a protrusion is disposed on the second clamping portion 200, and the clamp plate 260 is connected to the protrusion, so that a certain distance is maintained between the clamp plate 260 and the lower end of the second clamping portion 200, and a space for disposing the first clamping head 110 is reserved; while ensuring a better strength of the first clamping portion 100.

Further, two connection plates 300 are also provided, respectively connected to both sides of the operating lever 270, to stably connect the operating lever 270 and the first clamping part 100. Preferably, the first clamping portion 100 and the position where the operating rod 270 is hinged to the connecting plate 300 are provided with protrusions, and both ends of the connecting plate 300 are respectively connected to the protrusions, so as to improve the strength of the joint and to make the double-rocker mechanism formed among the clamping plate 260, the operating rod 270, the connecting plate 300 and the first clamping portion 100 move smoothly.

In order to rotate the operating lever 270 conveniently, a pressing wheel 280 and a locking member 290 are arranged on the operating lever 270, the pressing wheel 280 is sleeved on the upper end of the operating lever 270, a step is arranged at the upper end of the operating lever 270, the bottom of the pressing wheel 280 abuts against the step, and the locking member 290 is used for fixing the pressing wheel 280. When the operating rod 270 is rotated, the electroplating clip can be opened by applying an acting force to the pressing wheel 280, so that the operation of opening the electroplating clip is facilitated.

Further, in order to prevent the corrosion of the plating solution, an anti-corrosion coating, such as a teflon coating, is disposed on the lower side of the clamping plate 260 and the lower side wall surface of the first clamping portion 100, so as to prevent the plating clamp from being corroded by the plating solution when the plating clamp clamps the ceramic wafer in the plating tank, thereby protecting the plating clamp.

It should be understood that the above-described embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. Numerous obvious variations, adaptations and substitutions will occur to those skilled in the art without departing from the scope of the utility model. And are neither required nor exhaustive of all embodiments. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the protection scope of the claims of the present invention.

Claims

1. A ceramic wafer electroplating clamp is characterized by comprising:

the clamping device comprises a first clamping part (100), wherein one end of the first clamping part (100) is provided with a first clamping head (110), and the other end of the first clamping part is connected with an external mechanism; and

the second clamping part (200) is hinged with the first clamping part (100), one end of the second clamping part (200) is provided with a second clamping head (210) opposite to the first clamping head (110), and the first clamping head (110) and the second clamping head (210) can clamp a ceramic wafer to be electroplated;

one of the first clamping head (110) and the second clamping head (210) is provided with an elastic part (220) capable of conducting electricity, and the elastic part (220) can be elastically abutted against the ceramic plate.

2. Ceramic wafer plating clip according to claim 1, characterized in that the resilient member (220) is integrally formed with the first clamping head (110) or the second clamping head (210).

3. The ceramic wafer plating clip as recited in claim 1, wherein the first clamping head (110) or the second clamping head (210) without the elastic member (220) is provided with at least two spaced clamping points corresponding to the elastic member (220).

4. The ceramic wafer plating clip as recited in claim 1, wherein the elastic member (220) comprises an elastic body (221) and connecting portions (222) disposed at two ends of the elastic body (221), the connecting portions (222) are connected to the first clamping portion (100) or the second clamping portion (200), and the elastic body (221) is disposed at a distance from the first clamping portion (100) or the second clamping portion (200).

5. Ceramic wafer plating clip according to claim 4, characterized in that the resilient body (221) and the connection portion (222) are connected to form a U-shaped structure.

6. The ceramic wafer electroplating clamp according to any one of claims 1-5, wherein a first suction element (120) is arranged at the other end of the first clamping portion (100), a second suction element (230) corresponding to the first suction element (120) is arranged on the second clamping portion (200), and the first suction element (120) and the second suction element (230) are mutually sucked, so that the first clamping head (110) and the second clamping head (210) clamp the ceramic wafer.

7. The ceramic wafer electroplating clip as claimed in claim 6, wherein the first absorbing element (120) and the second absorbing element (230) are both magnetic bodies, and the opposite surfaces of the first absorbing element (120) and the second absorbing element (230) are opposite in magnetism; alternatively, the first and second electrodes may be,

one of the first suction element (120) and the second suction element (230) is a magnet, and the other is an iron element.

8. The ceramic wafer electroplating clip as claimed in claim 6, wherein an adjusting piece (240) is arranged between the second suction piece (230) and the second clamping portion (200), and the adjusting piece is used for adjusting the distance between the second suction piece (230) and the second clamping portion (200).

9. The ceramic wafer electroplating clamp as claimed in claim 8, wherein the second clamping portion (200) is provided with a boss (250), one surface of the boss (250) opposite to the first clamping portion (100) is an inclined surface, and the second suction element (230) is connected with the inclined surface through the adjusting member (240) so that the second suction element (230) and the first suction element (120) are in opposite suction.

10. The ceramic wafer electroplating clamp as claimed in claim 6, wherein the second clamping portion (200) comprises a clamping plate (260) and an operating rod (270), one end of the clamping plate (260) is provided with the second clamping head (210), the other end of the clamping plate is hinged to the first clamping portion (100) and the operating rod (270), the operating rod (270) is connected to the first clamping portion (100) through a connecting plate (300), two ends of the connecting plate (300) are hinged to the operating rod (270) and the first clamping portion (100), and a hinge point of the connecting plate (300) and the operating rod (270) is located between the second suction member (230) and the clamping plate (260).