CN215703833U - Mould is used in production of cell-phone shell convenient to carry out rapid cooling - Google Patents
Mould is used in production of cell-phone shell convenient to carry out rapid cooling Download PDFInfo
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- CN215703833U CN215703833U CN202121796780.7U CN202121796780U CN215703833U CN 215703833 U CN215703833 U CN 215703833U CN 202121796780 U CN202121796780 U CN 202121796780U CN 215703833 U CN215703833 U CN 215703833U
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Abstract
The utility model discloses a mold for producing a mobile phone shell, which is convenient for rapid cooling and is arranged on the inner surface of an injection molding machine; the method comprises the following steps: the base is arranged on the inner surface of the cavity, the inner surface of the base is provided with an embedded groove which can be used in a nested manner, the inner surface of the base is provided with a pipeline with water, and the edge end of the outer surface of the base is connected with a sealing block with a sealing effect; the temperature monitor is arranged at the water outlet end of the outer surface of the pipeline, and the edge end of the outer surface is connected with a refrigerating device with a refrigerating effect. This mould is used in production of cell-phone shell convenient to carry out rapid cooling sets up the cooling that has the built-in groove that can assemble the installation and uses the pipeline, and through the setting of the sealed piece of installation, prevents the condition of leaking to and be convenient for clean the use after long-time the use, and prevent that the inner structure from appearing blockking up, and through the refrigerating plant of the end of intaking of installation, effectual improvement cooling effect.
Description
Technical Field
The utility model relates to the technical field of a mold for producing a mobile phone shell, in particular to a mold for producing a mobile phone shell, which is convenient for rapid cooling.
Background
After the cell-phone is made, can make the mould usually and carry out the reverse mould production cell-phone shell, the cell-phone shell protects the use, and the cell-phone shell adopts silica gel to make usually when producing, and other materials to it is the same in other mould production products, makes the cell-phone shell at the inside filling material of mould, but there is certain defect when using still in mould for the production of current cell-phone shell, for example:
however, the prior art has the following disadvantages: the use of can not effectual rapid cooling of carrying on when using, and current heat sink can not effectual change cooling structure when using, perhaps maintains it and uses, can't improve the availability factor of device.
In order to solve the problems, innovative design is urgently needed on the basis of the original mold structure.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a mould for producing a mobile phone shell, which is convenient for rapid cooling, and aims to solve the problems that the existing cooling device cannot effectively replace a cooling structure or maintain the cooling structure during use, and the use efficiency of the device cannot be improved in the background technology, and the use cannot be effectively and rapidly cooled.
In order to achieve the purpose, the utility model provides the following technical scheme: a mould for producing a mobile phone shell convenient for rapid cooling is arranged on the inner surface of an injection molding machine;
the method comprises the following steps:
the base is arranged on the inner surface of the cavity, the inner surface of the base is provided with an embedded groove which can be used in a nested manner, the inner surface of the base is provided with a pipeline with water, and the edge end of the outer surface of the base is connected with a sealing block with a sealing effect;
the temperature monitor is arranged at the water outlet end of the outer surface of the pipeline, the edge end of the outer surface is connected with a refrigerating device with a refrigerating effect, and a support frame for fixing and supporting the temperature monitor is arranged on the outer surface of the temperature monitor;
the embedded groove is arranged on the outer surface of the base, a refrigeration semiconductor with refrigeration is arranged on the inner surface of the embedded groove, the upper end of the outer surface of the embedded groove is connected with a limiting block with protection and fixation, a heat dissipation device used for heat dissipation is arranged at the edge end of the outer surface of the limiting block, and a buckle with clamping and fixation is connected at the edge end of the outer surface;
the fixing block is arranged on the outer surface of the heat dissipation device, the inner surface of the fixing block is provided with a through hole with a nested fixing device, the upper surface of the fixing block is provided with a protective sheet with a protective effect, the inner surface of the fixing block is nested with a special-shaped nut with positioning and fixing functions, and the inner surface of the fixing block is provided with an inner hexagonal screw with thread fixing function.
Through the structure, different positions of the device can be cooled conveniently during use, and the cooling speed of the device can be improved conveniently.
Preferably, the inner surface of the base is provided with the built-in groove with the anti-blocking structure, the inner surface of the built-in groove is provided with the pipeline with the refrigeration water passing structure, and the sealing block with the sealing structure is nested and arranged on the inner surface of the built-in groove.
Through above-mentioned structure, effectively carry out certain heat dissipation use to the core bottom of installation when using to prevent that water from flowing out.
Preferably, the temperature monitor with an outlet water temperature detection structure is installed at one end of the outer surface of the pipeline, the refrigerating device with an inlet water refrigerating structure is installed at the other end of the outer surface of the pipeline, and the support frame with a support structure is installed on the outer surface of the pipeline.
Through above-mentioned structure, be convenient for when using to flow the water after the refrigeration to the delivery port from the water inlet to set up the device that has temperature monitoring at the delivery port, carry out certain control to the temperature.
Preferably, the refrigeration semiconductor with the refrigeration structure is installed in the nesting groove in a nesting mode, the limiting block with the clamping limiting structure is arranged at the upper end of the outer surface of the refrigeration semiconductor, and a heat dissipation device for the further heat dissipation structure is installed on the outer surface of the refrigeration semiconductor.
Through above-mentioned structure, be convenient for carry out stable heat dissipation when using and use, the both sides of mainly used base dispel the heat, make stably reach the balance.
Preferably, the outer surface of the heat sink is provided with the buckle having the clamping structure, the outer surface of the heat sink is provided with the fixing blocks having the symmetrical fixing structures, and the inner surface of the heat sink is provided with the stepped through hole.
Through above-mentioned structure, effectual fixed the use when using, be convenient for fix the heat sink of difference.
Preferably, the inner surface of the through hole is provided with the special-shaped nut with a rectangular base and is arranged in the inner surface of the protection sheet with a protection structure, and the inner surface of the through hole is provided with the hexagon socket head cap screw with a thread fixing structure.
Through above-mentioned structure, effectual protection to the structure of installation is used when using to threaded connection prevents to drop.
Compared with the prior art, the utility model has the beneficial effects that: the mould for producing the mobile phone shell is convenient for rapid cooling;
1. the cooling pipeline arranged in the built-in groove capable of being assembled and installed is arranged, the situation of water leakage is prevented through the arrangement of the installed sealing block, the cleaning and the use after long-time use are facilitated, the blockage of the internal structure is prevented, the cooling effect is effectively improved through the installed refrigerating device at the water inlet end, the working and production efficiency is improved, and the use of the cooling device is conveniently controlled through the installed temperature monitor;
2. the setting has the refrigeration semiconductor that nested installation was used, installs in the both ends of base, and the both sides of cell-phone shell mould, carries out timely cooling to the device and uses to stopper and heat abstractor's through the installation cooperation is used, and the long-pending heat of effectual improvement device's cooling effect prevents that both sides from appearing, increases the cooling effect, and through the protective sheet of installation, carries out stable fixed use, security when increasing the device and using to the refrigeration structure of installation.
Drawings
FIG. 1 is a schematic perspective view of the present invention;
FIG. 2 is a schematic diagram of a semi-sectional three-dimensional structure of a base according to the present invention;
FIG. 3 is a schematic diagram of a semi-sectional three-dimensional structure of the pipeline of the present invention;
FIG. 4 is a schematic view of a partially cut-away perspective structure of a refrigeration semiconductor according to the present invention;
fig. 5 is a schematic diagram of the exploded perspective structure of the present invention.
In the figure: 1. a base; 2. a built-in groove; 3. a pipeline; 4. a sealing block; 5. a temperature monitor; 6. a refrigeration device; 7. a support frame; 8. embedding a sleeve groove; 9. a refrigeration semiconductor; 10. a limiting block; 11. a heat sink; 12. buckling; 13. a fixed block; 14. a through hole; 15. a protective sheet; 16. a special-shaped nut; 17. a hexagon socket head cap screw.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-5, the present invention provides a technical solution: a mould for producing a mobile phone shell convenient for rapid cooling is arranged on the inner surface of an injection molding machine; the method comprises the following steps: the base 1 is arranged on the inner surface of the cavity, the inner surface of the base is provided with an embedded groove 2 which can be used in a nesting mode, the inner surface of the base is provided with a pipeline 3 with water, and the outer surface edge end of the base is connected with a sealing block 4 with a sealing effect; the temperature monitor 5 is arranged at the water outlet end of the outer surface of the pipeline 3, the edge end of the outer surface is connected with a refrigerating device 6 with a refrigerating effect, and a support frame 7 for fixing and supporting is arranged on the outer surface of the temperature monitor; the embedded groove 8 is arranged on the outer surface of the base 1, a refrigeration semiconductor 9 with refrigeration is arranged on the inner surface of the embedded groove, the upper end of the outer surface of the embedded groove is connected with a limiting block 10 with protection and fixation, the edge end of the outer surface of the limiting block 10 is provided with a heat dissipation device 11 with heat dissipation use, and the edge end of the outer surface of the embedded groove is connected with a buckle 12 with clamping and fixation; and the fixed block 13 is arranged on the outer surface of the heat dissipation device 11, the inner surface of the fixed block is provided with a through hole 14 with a nested fixing device, the upper surface of the fixed block is provided with a protective sheet 15 with a protective effect, the inner surface of the fixed block is nested with a special-shaped nut 16 with a positioning fixing function, and the inner surface of the fixed block is provided with an inner hexagonal screw 17 with a thread fixing function.
When in use, the pipeline 3 installed in the base 1 is effectively and stably installed, and the cooling is carried out, and the refrigeration semiconductors 9 installed on two sides of the base 1 are used, so that the temperature of the whole group device is balanced, and the rapid cooling is facilitated.
The inner surface of the base 1 is provided with an inner groove 2 with an anti-blocking structure, the inner surface of the inner groove 2 is provided with a pipeline 3 with a refrigeration water passing structure, and the inner surface of the inner groove is provided with a sealing block 4 with a sealing structure in a nested mode.
A temperature monitor 5 with an outlet water temperature detection structure is arranged at one end of the outer surface of the pipeline 3, a refrigerating device 6 with an inlet water refrigerating structure is arranged at the other end of the outer surface, and a supporting frame 7 with a supporting structure is arranged on the outer surface of the pipeline.
When the water leakage prevention device is used, the refrigerating device 6 installed on the support frame 7 is started, flowing water is refrigerated, the temperature of one end of the pipeline 3 installed through the built-in groove 2 flows to the temperature monitor 5 to be monitored, and when the pipeline 3 is used, the sealing block 4 with the sealing effect is installed in the built-in groove 2 arranged on the inner surface of the base 1, so that the water leakage is prevented.
A refrigeration semiconductor 9 with a refrigeration structure is nested in the nesting groove 8, a limiting block 10 with a clamping limiting structure is arranged at the upper end of the outer surface, and a heat dissipation device 11 for a further heat dissipation structure is arranged on the outer surface of the limiting block.
The outer surface of the heat sink 11 is provided with a buckle 12 having a snap structure, and the outer surface is provided with a fixing block 13 having a symmetrical fixing structure, and the inner surface is provided with a through hole 14 having a step shape.
The inner surface of the through-hole 14 is fitted with a profile nut 16 having a rectangular base and is fitted into the inner surface of the shield plate 15 having a shield structure, and the inner surface is fitted with a hexagon socket screw 17 having a screw-fixing structure.
When using, will start the refrigeration semiconductor 9 of installing in the nested groove 8, carry out the work of cooling down, and when using refrigeration semiconductor 9, the heat abstractor 11 of stopper 10 installation through the installation fixes the use, carries out further cooling and uses, and heat abstractor 11 is in the installation, connects protection piece 15 through the buckle 12 of installation to and the through-hole 14 that the fixed block 13 that sets up is seted up, and uses through the cooperation of special-shaped nut 16 and interior hexagonal screw 17, carries out stable fixed.
The working principle is as follows: when the mould for producing the mobile phone shell convenient for rapid cooling is used, according to the figures 1-5, the device is firstly placed at a position needing to work, when in use, the refrigerating device 6 arranged by the supporting frame 7 is started, water flows through the pipeline 3 arranged in the built-in groove 2 arranged on the base 1, the redundant built-in groove 2 arranged by the sealing block 4 is sealed, water leakage is prevented, the temperature monitor 5 is used for monitoring the temperature of the water flow circulating for one circle, then the refrigeration semiconductor 9 is started, the installed heat dissipation device 11 is promoted to be fixed through the limiting block 10 and is matched with cooling for use, when the heat dissipation device 11 is installed, the buckle 12 is clamped in the nested groove 8 and is matched with the through hole 14 arranged on the fixing block 13 through the protective sheet 15 arranged at the upper end, and the installed special-shaped nut 16 and the installed hexagon socket screw 17 are locked in the through hole 14, and performing stable connection use. The overall practicability is increased.
Those not described in detail in this specification are within the skill of the art.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. A mould for producing a mobile phone shell convenient for rapid cooling is arranged on the inner surface of an injection molding machine;
it is characterized by comprising:
the base is arranged on the inner surface of the cavity, the inner surface of the base is provided with an embedded groove which can be used in a nested manner, the inner surface of the base is provided with a pipeline with water, and the edge end of the outer surface of the base is connected with a sealing block with a sealing effect;
the temperature monitor is arranged at the water outlet end of the outer surface of the pipeline, the edge end of the outer surface is connected with a refrigerating device with a refrigerating effect, and a support frame for fixing and supporting the temperature monitor is arranged on the outer surface of the temperature monitor;
the embedded groove is arranged on the outer surface of the base, a refrigeration semiconductor with refrigeration is arranged on the inner surface of the embedded groove, the upper end of the outer surface of the embedded groove is connected with a limiting block with protection and fixation, a heat dissipation device used for heat dissipation is arranged at the edge end of the outer surface of the limiting block, and a buckle with clamping and fixation is connected at the edge end of the outer surface;
the fixing block is arranged on the outer surface of the heat dissipation device, the inner surface of the fixing block is provided with a through hole with a nested fixing device, the upper surface of the fixing block is provided with a protective sheet with a protective effect, the inner surface of the fixing block is nested with a special-shaped nut with positioning and fixing functions, and the inner surface of the fixing block is provided with an inner hexagonal screw with thread fixing function.
2. The mold for producing the mobile phone shell convenient for rapid cooling of the mobile phone shell according to claim 1, characterized in that: the inner surface of the base is provided with the built-in groove with the anti-blocking structure, the inner surface of the built-in groove is provided with the pipeline with the refrigeration water passing structure, and the sealing block with the sealing structure is nested and arranged on the inner surface of the built-in groove.
3. The mold for producing the mobile phone shell convenient for rapid cooling of the mobile phone shell according to claim 1, characterized in that: the temperature monitor with a water outlet temperature detection structure is installed at one end of the outer surface of the pipeline, the refrigerating device with a water inlet refrigerating structure is installed at the other end of the outer surface of the pipeline, and the supporting frame with a supporting structure is installed on the outer surface of the refrigerating device.
4. The mold for producing the mobile phone shell convenient for rapid cooling of the mobile phone shell according to claim 1, characterized in that: the refrigeration semiconductor with the refrigeration structure is installed in the embedded groove in an embedded mode, the limiting block with the clamping limiting structure is arranged at the upper end of the outer surface of the refrigeration semiconductor, and a heat dissipation device for the further heat dissipation structure is installed on the outer surface of the refrigeration semiconductor.
5. The mold for producing the mobile phone shell convenient for rapid cooling of the mobile phone shell according to claim 1, characterized in that: the outer surface of the heat dissipation device is provided with the buckle with the clamping structure, the outer surface of the heat dissipation device is provided with the fixing blocks with the symmetrical fixing structures, and the inner surface of the heat dissipation device is provided with the step-shaped through hole.
6. The mold for producing the mobile phone shell convenient for rapid cooling of the mobile phone shell according to claim 1, characterized in that: the inner surface of the through hole is provided with the special-shaped nut with a rectangular base, and is arranged in the inner surface of the protection sheet with a protection structure, and the inner surface of the through hole is provided with the hexagon socket head cap screw with a thread fixing structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121796780.7U CN215703833U (en) | 2021-08-03 | 2021-08-03 | Mould is used in production of cell-phone shell convenient to carry out rapid cooling |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121796780.7U CN215703833U (en) | 2021-08-03 | 2021-08-03 | Mould is used in production of cell-phone shell convenient to carry out rapid cooling |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215703833U true CN215703833U (en) | 2022-02-01 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121796780.7U Active CN215703833U (en) | 2021-08-03 | 2021-08-03 | Mould is used in production of cell-phone shell convenient to carry out rapid cooling |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215703833U (en) |
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2021
- 2021-08-03 CN CN202121796780.7U patent/CN215703833U/en active Active
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