CN215702234U

CN215702234U - SMD carrier tape forming device with die-cutting mechanism

Info

Publication number: CN215702234U
Application number: CN202122296275.2U
Authority: CN
Inventors: 龚卫锋
Original assignee: Dongguan Runjin Packing Products Co ltd
Current assignee: Dongguan Runjin Packing Products Co ltd
Priority date: 2021-09-18
Filing date: 2021-09-18
Publication date: 2022-02-01
Anticipated expiration: 2031-09-18

Abstract

The utility model discloses a SMD carrier tape forming device with a die cutting mechanism, which comprises a SMD carrier tape forming box and a die cutting box arranged in the SMD carrier tape forming box, wherein a material placing disc and a material receiving disc are arranged at the top of the SMD carrier tape forming box, a lifting cylinder is arranged at the top in the die cutting box, a die cutting base is arranged at the bottom in the die cutting box, a die cutting head is connected to the bottom of a piston rod of the lifting cylinder, a connecting disc is arranged at the joint of the piston rod and the die cutting head, the die cutting head is connected with the connecting disc through a fixing screw, the base is arranged at the bottom of the SMD carrier tape forming box, stand columns are arranged at four top corners at the bottom of the base, and a split box door is arranged at one side of the SMD carrier tape forming box. The die cutting head can be controlled and operated conveniently through the matching of the arranged lifting air cylinder and the piston rod, and the die cutting head is connected with the connecting disc through the fixing screw, so that the die cutting heads of different die cutting types can be replaced according to production requirements and models, and the die cutting head is simple to operate, convenient to use and cost-saving.

Description

SMD carrier tape forming device with die-cutting mechanism

Technical Field

The utility model relates to the technical field of SMD (surface mounted device) production, in particular to an SMD carrier tape forming device with a die cutting mechanism.

Background

SMD is a surface mount device, which is a surface mount technology, and it belongs to one of SMT, the latter is a latest generation electronic assembly technology, and it compresses traditional electronic components into a device with a volume of only a few tenths, so that it realizes high density, high reliability, miniaturization, low cost of electronic product assembly, and automation of production. The miniaturized component is called as an SMY component, the process method for assembling the component on the printing is called as an SMT process, the solution schemes of different manufacturers are different for SMD carrier tape forming, but the steps of die cutting forming, punching and the like are not needed, the existing die cutting mechanism is of an integral structure, the integral structure needs to be replaced by different die cutting heads, and the use is inconvenient.

SUMMERY OF THE UTILITY MODEL

The present invention is directed to a SMD carrier tape forming apparatus having a die-cutting mechanism, so as to solve the problems mentioned in the background art.

In order to achieve the purpose, the utility model provides the following technical scheme:

the utility model provides a SMD carrier band forming device with die-cutting mechanism, includes SMD carrier band shaping case and installs the cross cutting case in SMD carrier band shaping case, blowing dish and material collecting tray are installed at the top of SMD carrier band shaping case, the lift cylinder is installed at cross cutting incasement top, the cross cutting base is installed to cross cutting incasement bottom, the piston rod bottom of lift cylinder is connected with the die-cutting head, the connection pad is installed with the junction of die-cutting head to the piston rod, the die-cutting head passes through the fixed screw and is connected with the connection pad.

Preferably, a base is installed at the bottom of the SMD carrier tape forming case.

Preferably, four top corners of the bottom of the base are provided with the upright posts.

Preferably, a side of the SMD carrier tape forming case is mounted with a two-piece door.

Preferably, the top of the SMD carrier tape forming box is provided with a feeding hole for feeding and a discharging hole for discharging.

Preferably, through holes which are positioned at the same horizontal height with the die cutting base are symmetrically formed in two sides of the die cutting box.

Preferably, a plurality of guide rollers for guiding are further arranged in the SMD carrier tape forming box.

Compared with the prior art, the utility model has the beneficial effects that:

1. in this SMD carrier band forming device with die-cutting mechanism, through the cooperation of the lift cylinder and the piston rod that set up, can control the cross cutting head, be convenient for operate, and the cross cutting head passes through the fixed screw and is connected with the connection pad, can change the cross cutting head of different cross cutting types according to production demand and model, easy operation, convenient to use practices thrift the cost.

2. Among this SMD carrier band forming device with die-cutting mechanism, base and stand through setting up are used for supporting SMD carrier band shaping case, improve stability, through the split type chamber door that sets up, can regularly check and maintain SMD carrier band shaping incasement part, convenient to use.

3. In this SMD carrier band forming device with die-cutting mechanism, still be provided with the guide roll that a plurality of is used for the direction in the SMD carrier band forming box, adjustable SMD carrier band transmission direction improves the stability of structure.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic view of the internal structure of the SMD carrier tape forming box of the present invention;

fig. 3 is a schematic view of the structure of the die-cutting box of the present invention.

The meaning of the various reference symbols in the drawings:

10. SMD carrier tape forming box; 11. a base; 12. a box door; 13. a column; 14. a feed inlet; 15. a discharge port;

20. placing a tray;

30. a material receiving disc;

40. die cutting boxes; 41. a lifting cylinder; 42. die cutting the base; 43. a through hole; 44. a piston rod; 45. die cutting a head; 46. a connecting disc;

50. and a guide roller.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like, indicate orientations and positional relationships based on those shown in the drawings, and are used only for convenience of description and simplicity of description, and do not indicate or imply that the equipment or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be considered as limiting the present invention.

Example 1

The SMD carrier tape forming device comprises an SMD carrier tape forming box 10 and a die cutting box 40 arranged in the SMD carrier tape forming box 10, a material placing disc 20 and a material receiving disc 30 are arranged at the top of the SMD carrier tape forming box 10, a lifting cylinder 41 is arranged at the top in the die cutting box 40, a die cutting base 42 is arranged at the bottom in the die cutting box 40, a die cutting head 45 is connected to the bottom of a piston rod 44 of the lifting cylinder 41, a connecting disc 46 is arranged at the connecting position of the piston rod 44 and the die cutting head 45, and the die cutting head 45 is connected with the connecting disc 46 through a fixing screw.

Further, base 11 is installed to the bottom of SMD carrier tape forming box 10, and stand 13 is all installed to four apex angle departments in base 11's bottom, is used for supporting SMD carrier tape forming box 10 through base 11 and the stand 13 that sets up, improves stability.

Specifically, a split type box door 12 is installed on one side of the SMD carrier tape forming box 10, and the internal parts of the SMD carrier tape forming box 10 can be regularly checked and maintained through the split type box door 12, which is convenient to use.

It is worth to be noted that the top of the SMD carrier tape forming box 10 is provided with a feeding port 14 for feeding and a discharging port 15 for discharging, and both sides of the die cutting box 40 are symmetrically provided with through holes 43 which are located at the same horizontal height as the die cutting base 42, so as to facilitate feeding and discharging.

In addition, a plurality of guide rollers 50 for guiding are further arranged in the SMD carrier tape forming box 10, so that the structural stability is improved.

When the SMD carrier tape forming device with the die cutting mechanism in this embodiment is used, an operator selects the die cutting head 45 corresponding to or required according to the model of the SMD carrier tape, and connects the die cutting head 45 with the connection pad 46 through a fixing screw, puts the SMD carrier tape on the material placing tray 20, die-cuts the SMD carrier tape through the die cutting box 40, and when the die cutting head 45 needs to be replaced, the box door 12 is opened, and the die cutting head 45 at the bottom of the piston rod 44 is replaced.

In the SMD carrier tape forming device with the die cutting mechanism, the die cutting head 45 can be controlled through the matching of the arranged lifting cylinder 41 and the piston rod 44, so that the operation is convenient, the die cutting head 45 is connected with the connecting disc 46 through the fixing screw, the die cutting heads 45 with different die cutting types can be replaced according to the production requirements and models, the operation is simple, the use is convenient, and the cost is saved.

The foregoing shows and describes the general principles, essential features, and advantages of the utility model. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, and the preferred embodiments of the present invention are described in the above embodiments and the description, and are not intended to limit the present invention. The scope of the utility model is defined by the appended claims and equivalents thereof.

Claims

1. The utility model provides a SMD carrier band forming device with die-cutting mechanism which characterized in that: including SMD carrier band forming box (10) and install cross cutting case (40) in SMD carrier band forming box (10), blowing dish (20) and material collecting tray (30) are installed to the top of SMD carrier band forming box (10), lift cylinder (41) are installed at the top in cross cutting case (40), cross cutting base (42) are installed to the bottom in cross cutting case (40), piston rod (44) bottom of lift cylinder (41) is connected with die cutting head (45), connection pad (46) are installed with the junction of die cutting head (45) in piston rod (44), die cutting head (45) are connected with connection pad (46) through fixed screw.

2. The SMD carrier tape forming apparatus having the die cutting mechanism as set forth in claim 1, wherein: and a base (11) is arranged at the bottom of the SMD carrier tape forming box (10).

3. The SMD carrier tape forming apparatus having the die cutting mechanism as set forth in claim 2, wherein: four apex angle departments in bottom of base (11) all install stand (13).

4. The SMD carrier tape forming apparatus having the die cutting mechanism as set forth in claim 1, wherein: one side of the SMD carrier tape forming box (10) is provided with a split box door (12).

5. The SMD carrier tape forming apparatus having the die cutting mechanism as set forth in claim 1, wherein: the top of the SMD carrier band forming box (10) is provided with a feeding hole (14) for feeding and a discharging hole (15) for discharging.

6. The SMD carrier tape forming apparatus having the die cutting mechanism as set forth in claim 1, wherein: through holes (43) which are positioned at the same horizontal height with the die cutting base (42) are symmetrically formed in two sides of the die cutting box (40).

7. The SMD carrier tape forming apparatus having the die cutting mechanism as set forth in claim 1, wherein: and a plurality of guide rollers (50) for guiding are also arranged in the SMD carrier tape forming box (10).