CN215697556U - Pin bending device for semiconductor diode production - Google Patents
Pin bending device for semiconductor diode production Download PDFInfo
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- CN215697556U CN215697556U CN202122151679.2U CN202122151679U CN215697556U CN 215697556 U CN215697556 U CN 215697556U CN 202122151679 U CN202122151679 U CN 202122151679U CN 215697556 U CN215697556 U CN 215697556U
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- semiconductor diode
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Abstract
The utility model relates to the technical field of semiconductor diode production and processing equipment, in particular to a pin bending device for semiconductor diode production, which comprises a conveying mechanism, a bending mechanism and a finished product box, wherein the conveying mechanism comprises a conveying frame, a conveying belt and a bending die, the conveying belt is arranged on the conveying frame and is driven by a conveying motor, a plurality of bending dies are uniformly arranged on the belt surface of the conveying belt along the length direction, a lower die groove and two bending grooves are formed in the bending die, a semiconductor diode can be aligned and placed on the bending die through the lower die groove and the two bending grooves, the bending mechanism is arranged above the conveying frame, the bending mechanism comprises a bending frame, a bending cylinder and a bending block, the bending block is arranged on the bending frame and above the conveying belt through the bending cylinder, the bending cylinder can drive the bending block to be matched with the bending die to bend pins of a product, and the pin bending mechanism is convenient and stable, the processed product can be driven by the conveyer belt to fall into a finished product box.
Description
Technical Field
The utility model relates to the technical field of semiconductor diode production and processing equipment, in particular to a pin bending device for semiconductor diode production.
Background
A semiconductor diode refers to a two-terminal electronic device that utilizes semiconductor characteristics. The most common semiconductor diodes are PN junction diodes and metal semiconductor contact diodes. They have in common the asymmetry of the current-voltage characteristic, i.e. the current exhibits a good conductivity in one direction and a high resistance in the opposite direction. Can be used for rectification, wave detection, voltage stabilization, constant current, variable capacitance, switching, luminescence, photoelectric conversion and the like. In order to facilitate the use, the pins of the semiconductor diode need to be bent during manufacturing. The existing pin bending device has some problems in use, needs to be transited depending on manual work, and can damage products in the processing process.
SUMMERY OF THE UTILITY MODEL
In order to solve the problems, the utility model provides a pin bending device for producing a semiconductor diode, which comprises a conveying mechanism, a bending mechanism and a finished product box, wherein the conveying mechanism comprises a conveying frame, a conveying belt and a bending die, the conveying belt is arranged on the conveying frame and is driven by a conveying motor, a plurality of bending dies are uniformly arranged on the belt surface of the conveying belt along the length direction, a lower die groove and two bending grooves are arranged on the bending die, the semiconductor diode can be placed on a bending die in an aligned mode through the lower die groove and the two bending grooves, the bending mechanism is installed above the conveying frame and comprises a bending frame, a bending cylinder and a bending block, the bending block is installed on the bending frame through the bending cylinder and located above the conveying belt, the bending cylinder can drive the bending block to be matched with the bending die to bend pins of products, convenience and stability are achieved, and the processed products can be driven by the conveying belt to fall into a finished product box.
The utility model provides a pin bending device for semiconductor diode production, which comprises a conveying mechanism, a bending mechanism and a finished product box, wherein the conveying mechanism comprises a conveying frame, a conveying belt and a plurality of bending dies, the conveying belt is arranged on the conveying frame, the upper belt surface of the conveying belt is horizontal, a conveying motor for driving the conveying belt is arranged on the conveying frame, the bending dies are arranged in plurality, the bending dies are fixedly arranged on the belt surface of the conveying belt and are distributed at equal intervals along the length direction of the conveying belt, the upper surface of the bending die is provided with a lower die groove and two bending grooves, and the two bending grooves are respectively positioned on two opposite sides of the lower die groove; the bending mechanism comprises a bending frame, a bending cylinder and a bending block, the bending frame fixing frame is arranged above the conveying belt, the bending cylinder is vertically installed on the bending frame, the bending block is fixedly arranged at the bottom end of the bending cylinder, a pressing block and two bending heads are arranged on the bottom surface of the bending block, the pressing block is installed on the bottom surface of the bending block through a spring, an upper die groove is formed in the bottom surface of the bending block, the two bending heads are respectively located on two opposite sides of the pressing block, when a bending die is located under the bending block, the lower die groove and the bending heads are respectively right opposite to the upper die groove and the bending grooves, a supporting plate is horizontally and fixedly arranged under the bending block on the conveying frame and located between an upper belt surface and a lower belt surface of the conveying belt, and a finished product box is arranged below the conveying end of the conveying belt.
As a further scheme of the pin bending device for semiconductor diode production, the bending head is a strip-shaped plate, the bending head is vertically and fixedly arranged on the bottom surface of the pressing block, the bottom end of the bending head is movably provided with the extrusion sleeve, and the axis of the extrusion sleeve is horizontal and is vertical to the connecting line of the two bending heads.
According to the pin bending device for producing the semiconductor diode, the plurality of supporting rollers are arranged on the conveying frame, and the supporting rollers are positioned between the upper belt surface and the lower belt surface of the conveying belt.
According to the pin bending device for semiconductor diode production, the connecting line of the two bending grooves on the bending die is perpendicular to the conveying direction of the conveying belt, the upper surface of the bending die is provided with the two strip-shaped grooves which are respectively positioned on the two sides of the lower die cavity, and the two ends of the strip-shaped groove are respectively communicated with the lower die cavity and the bending groove on the corresponding side.
As a further scheme of the pin bending device for producing the semiconductor diode, the extrusion sleeve is fixedly arranged at the bottom end of the bending head through the door-shaped rod and is parallel to the conveying direction of the conveying belt.
As a further scheme of the pin bending device for producing the semiconductor diode, the upper surface of the bending die and the lower surface of the pressing block are both provided with cushion layers.
As a further scheme of the pin bending device for producing the semiconductor diode, the finished product box is a hollow box body with an open top end, and a support plate for placing the finished product box is fixedly arranged on the mounting frame.
Compared with the prior art, the utility model has the following beneficial effects: the device can improve the bending efficiency of the pins of the semiconductor diode, the semiconductor diode is aligned and placed on the bending die and is driven by the conveying belt, the bending cylinder can drive the bending block to be matched with the bending die to bend the pins of the semiconductor diode, the bending block is contacted with the pins through two extrusion sleeves at the bottom end of the bending block in the bending process, the damage to products is effectively avoided, the semiconductor diode after being bent is continuously conveyed by the conveying belt and finally drops into a finished product box, and the finished product box is manually and periodically collected and replaced.
Drawings
FIG. 1 is an external structural view of the present invention;
FIG. 2 is a schematic cross-sectional structural view of the present invention;
FIG. 3 is a schematic top view of the present invention;
FIG. 4 is a schematic top view of the bending mold according to the present invention;
FIG. 5 is a schematic bottom view of the bending block of the present invention;
FIG. 6 is a schematic view of the installation of the compression sleeve of the present invention;
the labels in the figure are: 1. finished product box, 2, conveying frame, 3, conveying belt, 4, bending die, 5, lower die groove, 6, bending groove, 7, bending frame, 8, bending cylinder, 9, bending block, 10, pressing block, 11, bending head, 12, supporting plate, 13, extrusion sleeve, 14 and upper die groove.
Detailed Description
As shown in the figure: the utility model provides a pin bending device is used in semiconductor diode production, including conveying mechanism, mechanism and finished product box 1 bend, conveying mechanism includes carriage 2, conveyer belt 3 and the mould 4 of bending, install drive roll and driven voller on carriage 2, conveyer belt 3 is installed on carriage 2 through drive roll and driven voller, the upper band face level of conveyer belt 3, install the conveying motor who is used for driving conveyer belt 3 on carriage 2, conveying motor's power take off end passes through the driving chain, drive gear or other transmission parts are connected with the drive roll transmission, with the work of drive conveyer belt 3, conveying motor is servo motor. The bending die 4 is a plurality of bending dies 4, the bending dies 4 are all fixedly arranged on the surface of the conveying belt 3 and are distributed at equal intervals along the length direction of the conveying belt 3, the bending die 4 is a cubic block, the upper surface of the bending die 4 is provided with a lower die cavity 5 and two bending grooves 6, the lower die cavity 5 is used for placing the main body part of the semiconductor diode, the two bending grooves 6 are respectively positioned at two opposite sides of the lower die cavity 5, the connecting line of the two bending grooves 6 is vertical to the conveying direction of the conveying belt 3, the upper surface of the bending die 4 is provided with two strip-shaped grooves which are respectively positioned at two sides of the lower die cavity 5, two ends of each strip-shaped groove are respectively communicated with the lower die cavity 5 and the bending groove 6 at the corresponding side, the semiconductor diode is placed in the bending die 4, the main body part of the bending device is correspondingly clamped in the bending grooves 6, two pins of the bending device are respectively arranged in the two strip-shaped grooves, and the end parts of the two pins are respectively positioned at the notches of the two bending grooves 6.
The mechanism of bending is installed on carriage 2, the mechanism of bending is including bending frame 7, bend cylinder 8 and the piece 9 of bending, bending frame 7 is door-shaped frame, bending frame 7 mount is established in the top of conveyer belt 3, bending cylinder 8 is vertical to be installed on bending frame 7, bending block 9 sets firmly in the bottom of bending cylinder 8, under the drive of conveyer belt 3, a plurality of moulds 4 of bending pass through the below of the piece 9 of bending in proper order, the bottom of the piece 9 of bending is provided with test probe, test probe can be proximity switch or photoelectric switch etc., test probe, the control element of bending cylinder 8 and the control element of conveying motor all are connected with the controller, the controller is the singlechip, the controller can be according to test probe's detection signal control conveying motor and the operating condition of bending cylinder 8. The bending block 9 is a cubic block, the bottom surface of the bending block is provided with a pressing block 10 and two bending heads 11, the pressing block 10 is arranged on the bottom surface of the bending block 9 through a spring, the bottom surface of the pressing block 10 is provided with an upper die groove 14, the upper die groove 14 is a groove adapted to the main part of the semiconductor diode, the upper die groove 14 and the lower die groove 5 are butted to cover the main part of the semiconductor diode, the two bending heads 11 are respectively positioned at two opposite sides of the pressing block 10, the bending heads 11 are strip-shaped plates vertically and fixedly arranged on the bottom surface of the bending block 9, the connecting line of the corresponding positions of the two bending heads 11 is vertical to the conveying direction of the conveying belt 3, when one bending die 4 moves to be right below the bending block 9, the lower die groove 5 and the upper die groove 14 are right opposite, the two bending heads 11 are respectively right opposite to the two bending grooves 6, the bending cylinder 8 is extended to drive the bending heads 11 to be close to the bending die 4, and finally the pressing block 10 is pressed on the bending block 9, the lower die cavity 5 and the upper die cavity 14 are butted to enclose the main body part of the semiconductor diode, and the two bending heads 11 are respectively pressed into the two bending grooves 6, so that the pins of the semiconductor diode are bent. Furthermore, the bottom end of the bent head 11 is movably provided with an extrusion sleeve 13 through a door-shaped rod, the extrusion sleeve 13 is movably sleeved on the cross rod of the door-shaped rod, and the axis of the extrusion sleeve is horizontal and vertical to the connecting line of the two bent heads 11.
The conveying frame 2 is provided with a plurality of supporting rollers, the supporting rollers are connected with the conveying frame 2 through belt seat bearings, the axes of the supporting rollers are horizontal and are positioned between the driving roller and the driven roller, and the supporting rollers are positioned between the upper belt surface and the lower belt surface of the conveying belt 3 to ensure that the upper belt surface of the conveying belt 3 is horizontal. A supporting plate 12 is horizontally and fixedly arranged on the conveying frame 2 and is positioned right below the bending block 9, the supporting plate 12 is positioned between the upper belt surface and the lower belt surface of the conveying belt 3, and the supporting plate 12 is used for supporting the bending die 4 when pins are bent, so that the pin bending effect is ensured. The finished product box 1 is arranged below the conveying end of the conveying belt 3, the semiconductor diodes which are bent on the conveying belt 3 can be separated from the bending die 4 at the reversing position of the conveying front end of the conveying belt 3, and the falling semiconductor diodes directly fall into the finished product box 1. Finished product box 1 is the open cavity box body in top, sets firmly the extension board that is used for placing finished product box 1 on the mounting bracket.
When the device is used for bending pins of a semiconductor diode, the conveying motor works to drive the conveying belt 3 to uniformly run, the semiconductor diode to be processed is placed on the bending die 4, the main part of the semiconductor diode is positioned in the lower die cavity 5, the two pin parts of the semiconductor diode are respectively positioned at the notch positions of the two bending grooves 6, when the conveying belt 3 conveys the bending die 4 with the semiconductor diode placed to the position under the bending block 9, the conveying belt 3 stops running, the bending cylinder 8 extends to drive the bending head 11 to press downwards, finally, the pressing block 10 of the bending head 11 is attached to the bending die 4 and enables the lower die cavity 5 to be butted with the upper die cavity 14, at the moment, the two bending heads 11 are respectively pressed into the two bending grooves 6, so that the pins of the semiconductor diode are bent, the bottom end of the bending head 11 bends the pins of the semiconductor diode through the extrusion sleeve 13, and the damage to the product is avoided, further, the upper surface of the bending die 4 and the lower surface of the pressing block 10 are both provided with a cushion layer, openings are formed in positions, corresponding to the notches, on the cushion layer, and the cushion layer is an elastic cushion or an anti-abrasion cushion. The cylinder 8 that bends after bending contracts and drives the lifting of the piece 9 that bends, then conveyer belt 3 continues to remove, and when the product of bending through the stitch was carried the head end by conveyer belt 3, conveyer belt 3 continued to carry and can be driven this mould 4 that bends and incline and finally invert, and the semiconductor diode on the mould 4 that bends of this in-process falls in finished product box 1 below conveyer belt 3, and personnel will hold the finished product box 1 of product and take away and change empty finished product box 1 periodically.
Although the present invention has been described with reference to a preferred embodiment, it should be understood that various changes, substitutions and alterations can be made herein without departing from the spirit and scope of the utility model as defined by the appended claims.
Claims (7)
1. The utility model provides a pin bending device is used in semiconductor diode production which characterized in that: the bending machine comprises a conveying mechanism, a bending mechanism and a finished product box (1), wherein the conveying mechanism comprises a conveying frame (2), a conveying belt (3) and a bending die (4), the conveying belt (3) is installed on the conveying frame (2) and the upper belt surface of the conveying belt is horizontal, a conveying motor used for driving the conveying belt (3) is installed on the conveying frame (2), a plurality of bending dies (4) are arranged on the belt surface of the conveying belt (3) and are distributed at equal intervals along the length direction of the conveying belt (3), a lower die groove (5) and two bending grooves (6) are formed in the upper surface of each bending die (4), and the two bending grooves (6) are respectively located on two opposite sides of the lower die groove (5); the bending mechanism comprises a bending frame (7), a bending cylinder (8) and a bending block (9), the bending frame (7) is fixedly arranged above the conveying belt (3), the bending cylinder (8) is vertically arranged on the bending frame (7), the bending block (9) is fixedly arranged at the bottom end of the bending cylinder (8), a pressing block (10) and two bending heads (11) are arranged on the bottom surface of the bending block (9), the pressing block (10) is arranged on the bottom surface of the bending block (9) through a spring, an upper die groove (14) is formed in the bottom surface of the bending block, the two bending heads (11) are respectively arranged on two opposite sides of the pressing block (10), when one bending die (4) is arranged under the bending block (9), a lower die groove (5) and the bending head (11) are respectively opposite to the upper die groove (14) and the bending groove (6), a supporting plate (12) is horizontally and fixedly arranged on the conveying frame (2) and is arranged under the bending block (9), the supporting plate (12) is positioned between the upper belt surface and the lower belt surface of the conveying belt (3), and the finished product box (1) is arranged below the conveying tail end of the conveying belt (3).
2. The pin bending device for producing the semiconductor diode as claimed in claim 1, wherein: the bending head (11) is a strip-shaped plate, the bending head (11) is vertically and fixedly arranged on the bottom surface of the pressing block (10), the bottom end of the bending head (11) is movably provided with an extrusion sleeve (13), and the axis of the extrusion sleeve (13) is horizontal and is perpendicular to the connecting line of the two bending heads (11).
3. The pin bending device for producing the semiconductor diode as claimed in claim 2, wherein: a plurality of supporting rollers are installed on the conveying frame (2), and the supporting rollers are located between the upper belt surface and the lower belt surface of the conveying belt (3).
4. The pin bending device for producing the semiconductor diode as claimed in claim 2, wherein: the line of two bending grooves (6) on the bending die (4) is perpendicular to the conveying direction of the conveying belt (3), two strip-shaped grooves are formed in the upper surface of the bending die (4), the two strip-shaped grooves are located on two sides of the lower die groove (5) respectively, and two ends of each strip-shaped groove are communicated with the lower die groove (5) and the bending groove (6) on the corresponding side respectively.
5. The pin bending apparatus for semiconductor diode production as claimed in claim 4, wherein: the extrusion sleeve (13) is fixedly arranged at the bottom end of the bend (11) through a door-shaped rod, and the extrusion sleeve (13) is parallel to the conveying direction of the conveying belt (3).
6. The pin bending apparatus for semiconductor diode production as claimed in claim 4, wherein: and cushion layers are arranged on the upper surface of the bending die (4) and the lower surface of the pressing block (10).
7. The pin bending device for producing the semiconductor diode as claimed in claim 1, wherein: finished product box (1) is the open cavity box body in top, sets firmly the extension board that is used for placing finished product box (1) on the mounting bracket.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122151679.2U CN215697556U (en) | 2021-09-07 | 2021-09-07 | Pin bending device for semiconductor diode production |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122151679.2U CN215697556U (en) | 2021-09-07 | 2021-09-07 | Pin bending device for semiconductor diode production |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215697556U true CN215697556U (en) | 2022-02-01 |
Family
ID=80016298
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122151679.2U Active CN215697556U (en) | 2021-09-07 | 2021-09-07 | Pin bending device for semiconductor diode production |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215697556U (en) |
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2021
- 2021-09-07 CN CN202122151679.2U patent/CN215697556U/en active Active
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