CN215681488U - Automatic intelligent control system of switch board - Google Patents

Automatic intelligent control system of switch board Download PDF

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Publication number
CN215681488U
CN215681488U CN202121933854.7U CN202121933854U CN215681488U CN 215681488 U CN215681488 U CN 215681488U CN 202121933854 U CN202121933854 U CN 202121933854U CN 215681488 U CN215681488 U CN 215681488U
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CN
China
Prior art keywords
cabinet main
cabinet
conductor
main part
temperature sensing
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Expired - Fee Related
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CN202121933854.7U
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Chinese (zh)
Inventor
周亚玲
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Chongqing Chemical Industry Vocational College
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Chongqing Chemical Industry Vocational College
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Priority to CN202121933854.7U priority Critical patent/CN215681488U/en
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Abstract

The utility model discloses an automatic intelligent control system of a control cabinet, which comprises an intelligent cabinet main body, wherein an inwards-recessed cabinet cavity is formed in one side of the intelligent cabinet main body, a cabinet door is connected to one end of the cabinet cavity, embedded semiconductor refrigerating sheets are arranged in the middle positions of two ends of the intelligent cabinet main body, and a temperature-sensitive controller installed in an embedded mode is arranged at the lower end of each semiconductor refrigerating sheet at one end of the intelligent cabinet main body. According to the intelligent cabinet, after the semiconductor refrigeration sheets at the two ends of the intelligent cabinet main body are electrified, the semiconductor refrigeration sheets towards one end inside the intelligent cabinet main body are cooled, the inside of the intelligent cabinet main body can be cooled, the internal elements of the intelligent cabinet main body can be ensured to work at a proper temperature, the service life of the intelligent cabinet main body is prolonged, and when the temperature is higher than a preset value, the temperature sensing controller is powered on, so that the temperature sensing controller automatically cools the inside of the intelligent cabinet main body, the intelligent cabinet main body can be ensured to work at a proper temperature, and the automatic temperature control of the intelligent cabinet is realized.

Description

Automatic intelligent control system of switch board
Technical Field
The utility model relates to the technical field of intelligent control cabinets, in particular to an automatic intelligent control system of a control cabinet.
Background
The control cabinet is formed by connecting an electrical switch device and a measuring instrument, the protection electric appliance and auxiliary equipment are assembled in a closed or semi-closed metal cabinet or on a screen, tools are arranged in a certain sequence, the control cabinet is arranged to meet the requirement of normal operation of an electric power system, the maintenance is convenient, the safety of a person and surrounding equipment is not endangered, a circuit can be switched on or switched off by a manual switch or an automatic switch during operation, a system capable of automatically monitoring and controlling is additionally arranged on the basis of the control cabinet of the intelligent system control cabinet, the automatic regulation and control of electronic elements in the intelligent system control cabinet during operation are facilitated, the existing intelligent system control cabinet does not have a good heat dissipation function, the temperature of the control cabinet is overhigh, the control cabinet and the electronic elements in the cabinet are damaged, and a fire disaster is seriously caused.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide an automatic intelligent control system of a control cabinet, which aims to solve the problems in the background technology.
To achieve the above object, the present invention provides the following solutions:
the utility model provides an automatic intelligent control system of switch board, includes intelligent cabinet main part, inside sunken cabinet chamber has been seted up to one side of intelligent cabinet main part, the one end in cabinet chamber is connected with the cabinet door, the both ends intermediate position department of intelligent cabinet main part all is provided with embedded semiconductor refrigeration piece, the semiconductor refrigeration piece lower extreme of intelligent cabinet main part one end is provided with the temperature-sensing controller of embedded installation, electric connection between semiconductor refrigeration piece and the temperature-sensing controller.
As a further improvement of the technical scheme, hinges of the adaptation are arranged at equidistant positions on two sides of the joint end of the cabinet cavity and the cabinet door, the intelligent cabinet main body is in running fit with the cabinet door, and a cabinet lock mechanism is arranged at the middle position of one end of the cabinet door, which is far away from the intelligent cabinet main body.
As a further improvement of the technical scheme, the two ends of the intelligent cabinet main body are provided with first mounting openings which are sunken inwards at the positions of the semiconductor refrigeration pieces, the semiconductor refrigeration pieces are mounted in the first mounting openings, the intelligent cabinet main body is provided with second mounting openings which are sunken inwards at the positions of the temperature-sensitive controllers, and the temperature-sensitive controllers are mounted in the second mounting openings.
As a further improvement of this technical scheme, the inside one end of temperature sensing controller is provided with the physiosis formula temperature sensing element, the one end of physiosis formula temperature sensing element is connected with conductor sleeve, conductor sleeve inside has passed first wire and has kept away from the physiosis formula temperature sensing element's one end and wear out conductor sleeve, conductor sleeve keeps away from the physiosis formula temperature sensing element's one end top and is connected with the conductor return bend, the conductor return bend is kept away from conductor sleeve's one end and is connected with the movable contact, the one end that the physiosis formula temperature sensing element was kept away from to first wire is connected with the transfer power supply case, the upper end of transfer power supply case is connected with the second wire, the one end that the transfer power supply case was kept away from to the second wire is connected with the stationary contact.
As a further improvement of the technical scheme, a temperature-sensitive material is arranged inside the liquid expansion type temperature sensing element, an inwardly concave first opening is formed in the middle position of one end, close to the conductor sleeve, of the liquid expansion type temperature sensing element, a through second opening is formed in the middle position of the conductor sleeve, the first wire penetrates through the second opening and penetrates into the liquid expansion type temperature sensing element through the first opening, and the first wire is in sliding fit with the conductor sleeve.
As a further improvement of the technical scheme, the inside one end of semiconductor refrigeration piece is provided with insulating heat conduction ceramic wafer, the inside one end facility of keeping away from insulating heat conduction ceramic wafer of semiconductor refrigeration piece has insulating heat conduction ceramic wafer down, the one end that insulating heat conduction ceramic wafer is close to last insulating heat conduction ceramic wafer down is provided with metallic conductor under a plurality of, the one end that goes up insulating heat conduction ceramic wafer and is close to insulating heat conduction ceramic wafer down is provided with metallic conductor on a plurality of, metallic conductor and last metallic conductor interval arrangement have a plurality of N type semiconductor and P type semiconductor down.
As a further improvement of the technical scheme, the lower metal conductors are arranged at equal intervals, the upper metal conductors are arranged at equal intervals, and the upper metal conductors and the lower metal conductors are staggered by half the length of the conductors in a one-to-one correspondence.
As a further improvement of the technical scheme, two sides of the lower metal conductor are connected with direct current sets, a direct current power supply is arranged in the direct current sets, two leads are led out of the direct current power supply, and the two leads are connected with two sides of the lower metal conductor independently.
Compared with the prior art, the utility model has the beneficial effects that:
be provided with the semiconductor refrigeration piece at the both ends of intelligence cabinet main part, the inside one end of intelligence cabinet main part is produced cold towards after the semiconductor refrigeration piece circular telegram, can cool down to intelligence cabinet main part inside, guarantee intelligence cabinet main part internal member and work under suitable temperature, the life of extension intelligence cabinet main part, one side in intelligence cabinet main part is provided with temperature-sensing controller, temperature-sensing controller can monitor the inside temperature of intelligence cabinet main part, when the temperature is too high the default, the switch-on is to temperature-sensing controller's power supply, make temperature-sensing controller carry out the automation cooling in to intelligence cabinet main part, guarantee intelligence cabinet main part and work under suitable temperature, realize the automatic temperature control of intelligence cabinet.
Drawings
FIG. 1 is a schematic perspective view of an automated intelligent control system of a control cabinet;
FIG. 2 is a schematic diagram of a split structure of the automated intelligent control system of the control cabinet;
FIG. 3 is a schematic diagram of the internal structure of a temperature-sensing controller of the automated intelligent control system of the control cabinet;
FIG. 4 is a schematic diagram showing a disassembled internal structure of a temperature-sensing controller of the automated intelligent control system of the control cabinet;
FIG. 5 is a schematic diagram of the internal structure of a semiconductor refrigeration chip of the control cabinet automation intelligent control system;
in the figure: 1. an intelligent cabinet main body; 2. a cabinet cavity; 3. a cabinet door; 4. a first mounting opening; 5. a semiconductor refrigeration sheet; 6. a second mounting opening; 7. a temperature-sensitive controller; 8. a hinge; 9. a liquid-expansion temperature sensing element; 10. a conductor sleeve; 11. a conductor bend; 12. a first conductive line; 13. a transfer power box; 14. a second conductive line; 15. a stationary contact; 16. a movable contact; 17. a first opening; 18. a second opening; 19. a DC power pack; 20. an upper insulating heat-conducting ceramic sheet; 21. a lower insulating heat-conducting ceramic sheet; 22. an upper metal conductor; 23. a lower metal conductor; 24. an N-type semiconductor; 25. p type semiconductor, 26, cabinet lock mechanism.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like, indicate orientations and positional relationships based on those shown in the drawings, and are used only for convenience of description and simplicity of description, and do not indicate or imply that the equipment or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be considered as limiting the present invention.
Example 1
Referring to fig. 1 to 5, in the embodiment of the present invention, an automatic intelligent control system for a control cabinet includes an intelligent cabinet main body 1, an inward-recessed cabinet cavity 2 is formed at one side of the intelligent cabinet main body 1, a cabinet door 3 is connected to one end of the cabinet cavity 2, embedded semiconductor chilling plates 5 are disposed at middle positions of two ends of the intelligent cabinet main body 1, a temperature-sensitive controller 7 installed in an embedded manner is disposed at a lower end of the semiconductor chilling plate 5 at one end of the intelligent cabinet main body 1, the semiconductor chilling plates 5 are electrically connected to the temperature-sensitive controller 7, when an internal element of the intelligent cabinet main body 1 operates, heat is generated inside the intelligent cabinet main body 1, the heat is accumulated inside the intelligent cabinet main body 1 to raise an overall temperature of the intelligent cabinet main body 1, at this time, when a temperature sensed by the temperature-sensitive controller 7 installed inside the intelligent cabinet main body 1 exceeds a predetermined value, the inside of the temperature-sensitive controller 7 is closed to electrify the semiconductor chilling plates 5, 5 circular telegrams of semiconductor refrigeration piece produce the Peltier effect for the one end of 1 inside of intelligent cabinet main part of orientation produces cold and cools down the heat dissipation to 1 inside of intelligent cabinet main part, and the temperature of guarantee 1 inside of intelligent cabinet main part is in the temperature range of a suitable electronic component work, makes intelligent cabinet main part 1 can carry out the automated control of temperature.
Preferably, cabinet chamber 2 and cabinet door 3's handing-over one end both sides equidistant position department all is provided with the hinge 8 of adaptation, intelligence cabinet main part 1 and cabinet door 3 normal running fit, cabinet door 3 keeps away from the one end intermediate position department of intelligence cabinet main part 1 and is provided with cabinet locking mechanism 26, hinge 8 can make and produce the normal running relationship between intelligence cabinet main part 1 and the cabinet door 3, be convenient for cabinet chamber 2 exposes cabinet chamber 2 on the intelligence cabinet main part 1 for the rotation of intelligence cabinet main part 1, be convenient for install the inside component of intelligence cabinet main part 1 through cabinet chamber 2, dismantle and the maintenance, cabinet locking mechanism 26 is convenient for pin the normal running fit of intelligence cabinet main part 1 and cabinet door 3, make cabinet door 3 protect the inside electronic component of intelligence cabinet main part 1 with cabinet chamber 2 closure on the intelligence cabinet main part 1.
Preferably, the inside sunken first installing opening 4 has been seted up at semiconductor refrigeration piece 5's position department in 1 both ends of intelligence cabinet main part, semiconductor refrigeration piece 5 is installed in first installing opening 4, inside sunken second installing opening 6 has been seted up at temperature-sensing controller 7's position department in intelligence cabinet main part 1, temperature-sensing controller 7 is installed in second installing opening 6, semiconductor refrigeration piece 5 of being convenient for of first installing opening 4 is installed on intelligence cabinet main part 1, second installing opening 6 is convenient for temperature-sensing controller 7 and is installed on intelligence cabinet main part 1, be convenient for semiconductor refrigeration piece 5 and temperature-sensing controller 7 cooperation carry out holistic temperature automated control to intelligence cabinet main part 1.
Preferably, an end inside the temperature sensing controller 7 is provided with a liquid expansion type temperature sensing element 9, one end of the liquid expansion type temperature sensing element 9 is connected with a conductor sleeve 10, a first lead 12 penetrates through the conductor sleeve 10, one end, far away from the liquid expansion type temperature sensing element 9, of the first lead 12 penetrates out of the conductor sleeve 10, a conductor bent pipe 11 is connected above one end, far away from the liquid expansion type temperature sensing element 9, of the conductor sleeve 10, one end, far away from the conductor sleeve 10, of the conductor bent pipe 11 is connected with a movable contact 16, one end, far away from the liquid expansion type temperature sensing element 9, of the first lead 12 is connected with a transfer power box 13, the upper end of the transfer power box 13 is connected with a second lead 14, one end, far away from the transfer power box 13, of the second lead 14 is connected with a stationary contact 15, when the liquid expansion type temperature sensing element 9 senses that the temperature inside the intelligent cabinet main body 1 rises and reaches a preset value, the conductor sleeve 10 is pushed to enable the conductor bent pipe 11 to move to drive the movable contact 16 at one end of the conductor bent pipe 11 to move and the stationary contact 16 moves and the stationary contact The contacts 15 are contacted to form a closed circuit, so that the circuit of the semiconductor refrigeration piece 5 is closed, the power supply to the semiconductor refrigeration piece 5 is started, the closed circuit is disconnected from the closed circuit of the semiconductor refrigeration piece 5 when the temperature in the intelligent cabinet main body 1 is reduced to reach a preset value, the power supply to the semiconductor refrigeration piece 5 is stopped, and the temperature in the intelligent cabinet main body 1 is controlled within a proper range for the work of elements in the intelligent cabinet main body 1.
Preferably, a temperature sensitive material is arranged inside the liquid expansion type temperature sensing element 9, a first opening 17 which is recessed inwards is arranged at the middle position of one end of the liquid expansion type temperature sensing element 9 close to the conductor sleeve 10, a second opening 18 which is through is arranged at the middle position of the conductor sleeve 10, the first lead 12 passes through the second opening 18 and penetrates into the liquid expansion type temperature sensing element 9 through the first opening 17, the first lead 12 is in sliding fit with the conductor sleeve 10, the sliding fit of the conductor sleeve 10 and the first lead 12 is convenient for pushing the conductor elbow 11 to carry out linkage fit of the internal elements of the temperature sensitive controller 7 when the temperature sensitive substances inside the liquid expansion type temperature sensing element 9 expand and contract to change temperature sensing, make movable contact 16 and stationary contact 15 contact for the circuit of semiconductor refrigeration piece 5 is closed, begins to supply power to semiconductor refrigeration piece 5, makes semiconductor refrigeration piece 5 work to inside cooling of intelligent cabinet main part 1 then.
Preferably, an upper insulating heat-conducting ceramic sheet 20 is arranged at one end inside the semiconductor refrigerating sheet 5, a lower insulating heat-conducting ceramic sheet 21 is arranged at one end of the semiconductor refrigerating sheet 5 far away from the upper insulating heat-conducting ceramic sheet 20, a plurality of lower metal conductors 23 are arranged at one end of the lower insulating heat-conducting ceramic sheet 21 close to the upper insulating heat-conducting ceramic sheet 20, a plurality of upper metal conductors 22 are arranged at one end of the upper insulating heat-conducting ceramic sheet 20 close to the lower insulating heat-conducting ceramic sheet 21, a plurality of N-type semiconductors 24 and P-type semiconductors 25 are arranged between the lower metal conductors 23 and the upper metal conductors 22 at intervals, after the semiconductor refrigerating sheet 5 is electrified, a peltier effect is generated between the N-type semiconductors 24 and the P-type semiconductors 25 which are connected through the upper metal conductors 22 and the lower metal conductors 23, so that the upper insulating heat-conducting ceramic sheet 20 at one end of the semiconductor refrigerating sheet 5 generates cold, and the lower insulating heat-conducting ceramic sheet 21 at the other end generates heat, cool down the electronic component of intelligence cabinet main part 1 inside through last insulating heat conduction potsherd 20 end ground, the temperature ability control after the guarantee intelligence cabinet main part 1 inside electronic component heaies up when using is at reasonable within range, avoids causing in the intelligence cabinet main part 1 that electronic component leads to because of the high temperature intelligent cabinet main part 1 burns out.
Preferably, the lower metal conductors 23 are arranged at equal intervals, the upper metal conductors 22 and the lower metal conductors 23 are staggered by half the length of the conductors in a one-to-one correspondence, and the arrangement mode of the upper metal conductors 22 and the lower metal conductors 23 is convenient for the N-type semiconductors 24 and the P-type semiconductors 25 in the semiconductor chilling plates 5 to form a Peltier effect, so that two ends of cold and hot are generated.
Preferably, the two sides of the lower metal conductor 23 are connected with the direct current set 19, a direct current power supply is arranged in the direct current set 19, two leads are led out from the direct current power supply and are separately connected with the two sides of the lower metal conductor 23, the peltier effect can be effectively realized under the condition of power supply of the direct current power supply, and the direct current set 19 provides power for the semiconductor refrigerating sheet 5 to generate the peltier effect.
The working principle of the utility model is as follows:
after intelligent cabinet main part 1 begins to work, the inside component of intelligent cabinet main part 1 can produce the heat, the heat makes the whole temperature of intelligent cabinet main part 1 rise in intelligent cabinet main part 1 cohesion, when the inside temperature rise of intelligent cabinet main part 1 rises the predetermined value of excess temperature sensing controller 7, the liquid expanding temperature sensing element 9 inside temperature sensing controller 7 is because expend with heat and contract with cold, make temperature sensing controller 7 close the power supply circuit of semiconductor refrigeration piece 5, supply power to semiconductor refrigeration piece 5, after semiconductor refrigeration piece 5 circular telegram, the Peltier effect takes place, semiconductor refrigeration piece 5 produces cold towards the inside one end of intelligent cabinet main part 1, cool down to intelligent cabinet main part 1 is inside, ensure that the inside component of intelligent cabinet main part 1 works under suitable temperature, stable work efficiency, and the service life is prolonged, and the probability of intelligent cabinet burnout is reduced.
Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that various changes in the embodiments and/or modifications of the utility model can be made, and equivalents and modifications of some features of the utility model can be made without departing from the spirit and scope of the utility model.

Claims (8)

1. The utility model provides an automatic intelligent control system of switch board, includes intelligent cabinet main part (1), its characterized in that: inside sunken cabinet chamber (2) have been seted up to one side of intelligence cabinet main part (1), the one end in cabinet chamber (2) is connected with cabinet door (3), the both ends intermediate position department of intelligence cabinet main part (1) all is provided with embedded semiconductor refrigeration piece (5), semiconductor refrigeration piece (5) lower extreme of intelligence cabinet main part (1) one end is provided with temperature sensing controller (7) of embedded installation, electric connection between semiconductor refrigeration piece (5) and temperature sensing controller (7).
2. The control cabinet automated intelligent control system of claim 1, wherein: cabinet chamber (2) and cabinet door (3) handing-over one end both sides equidistant position department all are provided with hinge (8) of adaptation, intelligence cabinet main part (1) and cabinet door (3) normal running fit, the one end intermediate position department that intelligence cabinet main part (1) was kept away from in cabinet door (3) is provided with cabinet locking mechanical system (26).
3. The control cabinet automated intelligent control system of claim 1, wherein: inside sunken first installing opening (4) have been seted up at the position department of semiconductor refrigeration piece (5) in intelligence cabinet main part (1) both ends, install in first installing opening (4) semiconductor refrigeration piece (5), inside sunken second installing opening (6) have been seted up in the position department of intelligence cabinet main part (1) at temperature-sensing controller (7), temperature-sensing controller (7) are installed in second installing opening (6).
4. The control cabinet automated intelligent control system of claim 1, wherein: one end inside the temperature-sensing controller (7) is provided with a liquid expansion type temperature sensing element (9), one end of the liquid expansion type temperature sensing element (9) is connected with a conductor sleeve (10), a first lead (12) penetrates through the conductor sleeve (10), one end of the first lead (12) far away from the liquid expansion type temperature sensing element (9) penetrates out of the conductor sleeve (10), a conductor bent pipe (11) is connected above one end of the conductor sleeve (10) far away from the liquid expansion type temperature sensing element (9), one end of the conductor bent pipe (11) far away from the conductor sleeve (10) is connected with a movable contact (16), one end of the first lead (12) far away from the liquid expansion type temperature sensing element (9) is connected with a transfer power box (13), the upper end of the transfer power supply box (13) is connected with a second lead (14), and one end, far away from the transfer power supply box (13), of the second lead (14) is connected with a static contact (15).
5. The control cabinet automated intelligent control system of claim 4, wherein: the inside of liquid expanding temperature sensing element (9) is provided with temperature sensitive material, inside sunken first opening (17) have been seted up to one end intermediate position department that liquid expanding temperature sensing element (9) are close to conductor sleeve (10), second opening (18) that link up have been seted up to the intermediate position department of conductor sleeve (10), inside first wire (12) passed second opening (18) and penetrated liquid expanding temperature sensing element (9) by first opening (17), first wire (12) and conductor sleeve (10) sliding fit.
6. The control cabinet automated intelligent control system of claim 1, wherein: the inside one end of semiconductor refrigeration piece (5) is provided with insulating heat conduction ceramic wafer (20), the inside one end facility of keeping away from insulating heat conduction ceramic wafer (20) of semiconductor refrigeration piece (5) has lower insulating heat conduction ceramic wafer (21), the one end that insulating heat conduction ceramic wafer (21) is close to insulating heat conduction ceramic wafer (20) down is provided with metallic conductor (23) down under a plurality of, the one end that goes up insulating heat conduction ceramic wafer (20) is close to insulating heat conduction ceramic wafer (21) down is provided with metallic conductor (22) on a plurality of, interval arrangement has a plurality of N type semiconductor (24) and P type semiconductor (25) down between metallic conductor (23) and last metallic conductor (22).
7. The control cabinet automated intelligent control system of claim 6, wherein: the lower metal conductors (23) are arranged at equal intervals, the upper metal conductors (22) are arranged at equal intervals, and the upper metal conductors (22) and the lower metal conductors (23) are staggered by half the conductor length in a one-to-one correspondence mode.
8. The control cabinet automated intelligent control system of claim 6, wherein: two sides of the lower metal conductor (23) are connected with a direct current set (19), a direct current power supply is arranged in the direct current set (19), two leads are led out of the direct current power supply, and the two leads are separately connected with two sides of the lower metal conductor (23).
CN202121933854.7U 2021-08-18 2021-08-18 Automatic intelligent control system of switch board Expired - Fee Related CN215681488U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202121933854.7U CN215681488U (en) 2021-08-18 2021-08-18 Automatic intelligent control system of switch board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202121933854.7U CN215681488U (en) 2021-08-18 2021-08-18 Automatic intelligent control system of switch board

Publications (1)

Publication Number Publication Date
CN215681488U true CN215681488U (en) 2022-01-28

Family

ID=79953357

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202121933854.7U Expired - Fee Related CN215681488U (en) 2021-08-18 2021-08-18 Automatic intelligent control system of switch board

Country Status (1)

Country Link
CN (1) CN215681488U (en)

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Granted publication date: 20220128