CN215678810U - Packaging structure of SMD pyroelectric infrared sensor - Google Patents
Packaging structure of SMD pyroelectric infrared sensor Download PDFInfo
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- CN215678810U CN215678810U CN202122009185.0U CN202122009185U CN215678810U CN 215678810 U CN215678810 U CN 215678810U CN 202122009185 U CN202122009185 U CN 202122009185U CN 215678810 U CN215678810 U CN 215678810U
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Abstract
The utility model discloses a packaging structure of a patch type pyroelectric infrared sensor, belonging to the technical field of infrared detection equipment, the key points of the technical proposal comprise a base and a cover cap, the lower end surface of the cover cap is fixedly connected with an annular inserting plate, the outer side wall of the annular inserting plate is provided with a plurality of first threaded holes which are distributed in an annular parallel mode in a penetrating mode, the upper end face of the base is provided with an annular inserting groove, the outer side wall of the base is in through connection with a plurality of second threaded holes matched with the first threaded holes, one ends of the second threaded holes close to the annular slot are all communicated with the annular slot, the outer side wall of the base is provided with a plurality of screws matched with the first threaded holes and the second threaded holes, therefore, the base and the cover cap are conveniently disassembled after the sensor is assembled, and the problem that the infrared optical sensitive element in the base and an electronic device are not convenient to replace when the base and the cover cap are fixed by glue at present is solved.
Description
Technical Field
The utility model relates to the technical field of infrared detection equipment, in particular to a packaging structure of a patch type pyroelectric infrared sensor.
Background
The pyroelectric infrared sensor is a sensor for detecting infrared radiation, which is manufactured by utilizing the principle of pyroelectric effect, can detect infrared radiation signals emitted by human bodies or certain animals and the like, converts the infrared radiation signals into electric signals after a series of processing such as filtering, amplification and the like, and causes the response of an external device, and has wide application in the fields of intelligent home, security monitoring, flame detection, gas detection, temperature monitoring and the like. Downwardly extending is used for carrying out signal output with external circuit and is connected, but has inconvenient welding operation, the problem that manual operation is inefficient. Moreover, the pyroelectric infrared sensor adopting the TO encapsulation has long pin lead and large integral volume, and can not adapt TO the development trend of integration and miniaturization in the electronic industry more and more.
The packaging structure of the prior patch type pyroelectric infrared sensor is inconvenient for disassembling the base and the cover cap after the sensor is assembled, and is inconvenient for replacing infrared optical sensitive elements and electronic devices in the base when the base and the cover cap are fixed by glue.
SUMMERY OF THE UTILITY MODEL
Aiming at the problems, the utility model provides a packaging structure of a patch type pyroelectric infrared sensor to solve the problems.
The utility model is realized in such a way that the packaging structure of the chip pyroelectric infrared sensor comprises a base and a cover cap, two electronic devices are arranged at the bottom end in the base, a supporting column is arranged in the base, the upper end surface of the supporting column is provided with an infrared optical sensitive element, an infrared optical filter is arranged in an opening of the upper end surface of the cap, the lower end surface of the cover cap is fixedly connected with an annular inserting plate, the outer side wall of the annular inserting plate is provided with a plurality of first threaded holes which are distributed in an annular and parallel mode in a penetrating way, the upper end surface of the base is provided with an annular slot, the outer side wall of the base is in through connection with a plurality of second threaded holes matched with the first threaded holes, one ends of the plurality of second threaded holes close to the annular slot are all communicated with the annular slot, the lateral wall of base is provided with a plurality of and first screw hole and second screw hole assorted screw.
In order to seal a gap between the base and the cap, the packaging structure of the chip pyroelectric infrared sensor is preferably configured such that the upper end of the outer side wall of the base is fixedly connected with a sealing ring, and the upper end of the sealing ring extends to the upper side of the base.
In order to guide moisture falling onto the sealing ring down conveniently, the outer side wall of the sealing ring is preferably arc-shaped as the packaging structure of the patch type pyroelectric infrared sensor.
In order to facilitate the discharge of the moisture entering the gap between the cap and the sealing ring through the plurality of flow guide holes, the packaging structure of the chip pyroelectric infrared sensor is preferably configured such that the lower end surface of the sealing ring is provided with the plurality of flow guide holes in a penetrating manner, and the plurality of flow guide holes are all inclined and are distributed in a staggered manner.
In order to hide the head of the screw into the blind hole and improve the attractiveness of the sensor after installation, as an optimal packaging structure of the patch type pyroelectric infrared sensor provided by the utility model, the outer side wall of the base is provided with a plurality of blind holes matched with the second threaded holes, and the plurality of blind holes are respectively communicated with the outer side walls of the plurality of second threaded holes.
Compared with the prior art, the utility model has the beneficial effects that:
when the packaging structure of the patch type pyroelectric infrared sensor is assembled, the annular inserting plate at the lower end of the cover cap is gradually inserted into the annular inserting groove at the upper end of the base, the plurality of first threaded holes are aligned with the plurality of second threaded holes, then screws are screwed into the aligned holes respectively to fix the annular inserting plate in the annular inserting groove, then the assembly of the base and the cap is completed, when the infrared optical sensitive element and the electronic device in the base are damaged and replaced, the steps are operated in reverse, the base and the cap are disassembled, the infrared optical sensitive element and the electronic device which are damaged in the base are replaced, so that the base and the cover cap are conveniently disassembled after the sensor is assembled, and the problem that the infrared optical sensitive element and the electronic device which are damaged in the base are inconvenient to replace due to the fact that the base and the cover cap are fixed through glue is solved.
Drawings
Fig. 1 is a cross-sectional view of a package structure of a chip pyroelectric infrared sensor according to the present invention;
FIG. 2 is a view of the base and cap of the present invention;
fig. 3 is an enlarged view of the utility model at a in fig. 1.
In the figure, 1, a base; 101. a support pillar; 102. an infrared optical sensing element; 103. an electronic device; 2. capping; 201. an infrared optical filter; 3. an annular inserting plate; 301. a first threaded hole; 302. blind holes; 303. an annular slot; 304. a second threaded hole; 4. a screw; 5. a seal ring; 501. and (4) flow guide holes.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the utility model and are not intended to limit the utility model.
In the description of the present invention, it is to be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships illustrated in the drawings, and are used merely for convenience in describing the present invention and for simplicity in description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, are not to be construed as limiting the present invention. Further, in the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
Referring to fig. 1-3, an encapsulation structure of a chip pyroelectric infrared sensor includes a base 1 and a cap 2, two electronic devices 103 are installed at the bottom inside the base 1, a support pillar 101 is installed inside the base 1, an infrared optical sensing element 102 is installed on the upper end surface of the support pillar 101, an infrared optical filter 201 is installed in an opening of the upper end surface of the cap 2, a ring-shaped insert plate 3 is fixedly connected to the lower end surface of the cap 2, a plurality of ring-shaped first threaded holes 301 distributed in parallel are formed in the outer side wall of the ring-shaped insert plate 3, a ring-shaped slot 303 is formed in the upper end surface of the base 1, a plurality of second threaded holes 304 matched with the first threaded holes 301 are connected to the outer side wall of the base 1 in a penetrating manner, one ends of the plurality of second threaded holes 304 close to the ring-shaped slot 303 are all communicated with the ring-shaped slot 303, and a plurality of screws 4 matched with the first threaded holes 301 and the second threaded holes 304 are arranged on the outer side wall of the base 1.
In this embodiment: when the sensor is assembled, the annular insert plate 3 at the lower end of the cap 2 is gradually inserted into the annular slot 303 at the upper end of the base 1, the plurality of first threaded holes 301 are aligned with the plurality of second threaded holes 304, then screws 4 are screwed into the aligned holes respectively, so as to fix the annular inserting plate 3 in the annular inserting groove 303, and then the assembly of the base 1 and the cap 2 is completed, when the infrared optical sensing element 102 and the electronic device 103 in the base 1 are damaged and replaced, the steps are reversed, the base 1 and the cap 2 are disassembled, replacement of the damaged infrared optical sensing element 102 and the electronic device 103 in the base 1 is performed, therefore, the sensor is convenient to disassemble the base 1 and the cap 2 after being assembled, and the problem that the infrared optical sensitive element 102 and the electronic device 103 in the base 1 are inconvenient to replace when the base 1 and the cap 2 are fixed by glue at present is solved.
As a technical optimization scheme of the utility model, the upper end of the outer side wall of the base 1 is fixedly connected with a sealing ring 5, and the upper end of the sealing ring 5 extends to the upper part of the base 1.
In this embodiment: when the base 1 is attached to the cap 2, the seal ring 5 seals a gap between the base 1 and the cap 2.
As a technical optimization scheme of the utility model, the outer side wall of the sealing ring 5 is arc-shaped.
In this embodiment: the lateral wall through sealing ring 5 is the arc form, and then when outside moisture dropped to 5 outer walls of sealing ring, 5's cambered surface conveniently will drop to the moisture guide on sealing ring 5 and fall.
As a technical optimization scheme of the utility model, a plurality of flow guide holes 501 are formed through the lower end surface of the sealing ring 5, and the flow guide holes 501 are all inclined and are distributed in a staggered manner.
In this embodiment: when water enters the gap between the cap 2 and the sealing ring 5, the water entering the gap between the cap 2 and the sealing ring 5 is conveniently discharged through the plurality of flow guide holes 501.
As a technical optimization scheme of the utility model, the outer side wall of the base 1 is provided with a plurality of blind holes 302 matched with the second threaded holes 304, and the plurality of blind holes 302 are respectively communicated with the outer side walls of the plurality of second threaded holes 304.
In this embodiment: when the plurality of screws 4 are screwed into the base 1, the heads of the screws 4 are hidden in the blind holes 302, so that the attractiveness of the sensor after installation is improved.
The working principle and the using process of the utility model are as follows: when the sensor is assembled, the annular inserting plate 3 at the lower end of the cap 2 is gradually inserted into the annular inserting groove 303 at the upper end of the base 1, the first threaded holes 301 are aligned with the second threaded holes 304, when the base 1 is attached to the cap 2, the sealing ring 5 seals a gap between the base 1 and the cap 2, then the screws 4 are screwed into the aligned holes respectively, the annular inserting plate 3 is positioned in the annular inserting groove 303 to be fixed, the assembly of the base 1 and the cap 2 is further completed, when the infrared optical sensitive element 102 and the electronic device 103 in the base 1 are damaged and replaced, the steps are reversely operated, the base 1 and the cap 2 are disassembled, and the damaged infrared optical sensitive element 102 and the damaged electronic device 103 in the base 1 are replaced.
The present invention is not limited to the above preferred embodiments, and any modifications, equivalent substitutions and improvements made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (5)
1. The utility model provides a SMD pyroelectric infrared sensor's packaging structure, includes base (1) and block (2), two electron device (103) are installed to the inside bottom of base (1), the internally mounted of base (1) has support column (101), infrared optical sensing element (102) are installed to the up end of support column (101), install infrared optical filter (201), its characterized in that in the up end opening of block (2): lower terminal surface fixedly connected with annular picture peg (3) of lid (2), the lateral wall of annular picture peg (3) runs through and sets up first screw hole (301) that a plurality of rings distribute side by side, annular slot (303) have been seted up to the up end of base (1), the lateral wall through connection of base (1) has a plurality of and first screw hole (301) assorted second screw hole (304), and is a plurality of second screw hole (304) are close to the one end of annular slot (303) and all communicate with annular slot (303), the lateral wall of base (1) is provided with a plurality ofly and first screw hole (301) and second screw hole (304) assorted screw (4).
2. The package structure of the patch pyroelectric infrared sensor as claimed in claim 1, wherein: the outer side wall upper end fixedly connected with sealing ring (5) of base (1), the upper end of sealing ring (5) extends to the top of base (1).
3. The package structure of the patch pyroelectric infrared sensor as recited in claim 2, wherein: the outer side wall of the sealing ring (5) is arc-shaped.
4. The package structure of the patch pyroelectric infrared sensor as recited in claim 2, wherein: the lower terminal surface of sealing ring (5) runs through and has seted up a plurality of water conservancy diversion holes (501), and is a plurality of water conservancy diversion hole (501) all are the slope form and are the staggered distribution.
5. The package structure of the patch pyroelectric infrared sensor as claimed in claim 1, wherein: the outer side wall of the base (1) is provided with a plurality of blind holes (302) matched with the second threaded holes (304), and the blind holes (302) are respectively communicated with the outer side walls of the second threaded holes (304).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122009185.0U CN215678810U (en) | 2021-08-25 | 2021-08-25 | Packaging structure of SMD pyroelectric infrared sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122009185.0U CN215678810U (en) | 2021-08-25 | 2021-08-25 | Packaging structure of SMD pyroelectric infrared sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215678810U true CN215678810U (en) | 2022-01-28 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122009185.0U Active CN215678810U (en) | 2021-08-25 | 2021-08-25 | Packaging structure of SMD pyroelectric infrared sensor |
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| Country | Link |
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| CN (1) | CN215678810U (en) |
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2021
- 2021-08-25 CN CN202122009185.0U patent/CN215678810U/en active Active
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Effective date of registration: 20230917 Address after: No. 27 Wanghong Road, Hongshan Street, Wuxi City, Jiangsu Province, 214000 Patentee after: Wuxi Ziliang Sensing Technology Co.,Ltd. Address before: No. 27-1, wanghong Road, Hongshan street, Xinwu District, Wuxi City, Jiangsu Province, 214000 Patentee before: Wuxi Liangrui Intelligent Sensing Technology Co.,Ltd. |