CN215678134U - Defect detecting device - Google Patents

Abstract

In the defect detection device, the illumination module comprises a light source, a light splitting assembly, a first controllable light-transmitting plate and a second controllable light-transmitting plate, the light splitting assembly splits a light beam provided by the light source into a first incident light beam and a second incident light beam, the first incident light beam is projected onto the first controllable light-transmitting plate, the second incident light beam is projected onto the second controllable light-transmitting plate, and when one of the first controllable light-transmitting plate and the second controllable light-transmitting plate is opened, the other one is closed; the objective module comprises a switchable metallographic objective and a DIC objective, the metallographic objective is used for imaging a first incident beam to the surface of a workpiece to be detected, the DIC objective is used for imaging a second incident beam to the surface of the workpiece to be detected, the first incident beam and the second incident beam are also used for receiving a reflected beam to form an image of the surface of the workpiece to be detected, and the detection module processes the image of the surface of the workpiece to be detected to form a detection image. Therefore, when the objective lens is switched, only the corresponding controllable light-transmitting plate is required to be opened, repeated adjustment and correction are not required, and the use efficiency of the defect detection device is improved.

Description

Defect detecting device

Technical Field

The utility model relates to the technical field of semiconductor manufacturing, in particular to a defect detection device.

Background

In semiconductor processing, due to process problems, some material (e.g., photoresist residue) may remain on the substrate surface that otherwise needs to be removed and needs to be inspected. If the residual materials cannot be identified in time during the inspection, defects such as electrical short circuit and the like are easily caused in the subsequent process, and the whole device is even scrapped seriously. Moreover, some residual materials are typically thin (even up to 100nm or less), nearly transparent, and have low contrast in the inspection image that is difficult to identify.

In order to improve the identification capability and detection capability of the surface defects (especially transparent defects) of the substrate, two sets of objective systems, namely a metallographic objective and a micro-interference phase contrast objective (DIC objective), are simultaneously used in one conventional defect detection device, and the metallographic objective and the DIC objective are selectively switched according to the characteristics of the material to be detected so as to perform defect detection under different objective systems. However, since the image plane positions of the metallurgical objective lens and the DIC objective lens are different from each other, the conventional defect detecting apparatus inevitably causes positional deviation of the image plane of the objective lens every time the objective lens is switched, and it is necessary to precisely measure and correct the positional deviation and compensate the positional deviation, so that defect detection can be performed. Particularly, when the metallographic objective and the DIC objective need to be switched repeatedly, adjustment and correction need to be performed repeatedly to compensate for the positional deviation of the image plane of the objective, which is a complicated process and reduces the use efficiency of the defect detection apparatus.

SUMMERY OF THE UTILITY MODEL

The utility model provides a defect detection device, which does not need to repeatedly adjust and correct when a metallographic objective and a DIC objective are switched, and can improve the service efficiency of the defect detection device.

In order to achieve the above object, the present invention provides a defect detecting apparatus. The defect detection device comprises an illumination module, an objective lens module and a detection module. The illumination module is used for providing an incident beam and comprises a light source, a light splitting assembly, a first controllable light-transmitting plate and a second controllable light-transmitting plate, wherein the light beam provided by the light source is split by the light splitting assembly to form a first incident beam and a second incident beam, the first incident beam is projected on the first controllable light-transmitting plate, and the second incident beam is projected on the second controllable light-transmitting plate; wherein, when one of the first controllable light-transmitting plate and the second controllable light-transmitting plate is opened, the other one is closed. The objective module comprises a switchable metallographic objective and a DIC objective, wherein the metallographic objective is used for imaging a first incident beam penetrating through the first controllable light-transmitting plate to the surface of a workpiece to be measured and receiving a reflected light beam to form an image of the surface of the workpiece to be measured, and the DIC objective is used for imaging a second incident beam penetrating through the second controllable light-transmitting plate to the surface of the workpiece to be measured and receiving the reflected light beam to form the image of the surface of the workpiece to be measured. And the detection module is used for processing the image of the surface of the workpiece to be detected to form a detection image.

Optionally, the illumination module includes a first relay lens group, and the first relay lens group is disposed between the first controllable light-transmitting plate and the objective lens module.

Optionally, the lighting module comprises a variable focal length lens, and the variable focal length lens is disposed between the second controllable optically transparent plate and the objective lens module.

Optionally, the lighting module further includes a second relay lens group, and the second relay lens group is disposed between the second controllable light-transmitting plate and the variable focal length lens.

Optionally, the light splitting component is a light splitting prism, and the light splitting prism splits the light beam provided by the light source and outputs a reflected light beam and a transmitted light beam; the first incident light beam is one of the reflected light beam or the transmitted light beam and the second incident light beam is the other of the reflected light beam or the transmitted light beam.

Optionally, the lighting module further includes a filter assembly disposed between the light source and the light splitting assembly.

Optionally, the objective module further comprises an objective converter, the objective converter is connected with the metallographic objective and the DIC objective, and the objective converter is rotated to switch between the metallographic objective and the DIC objective.

Optionally, the objective lens module further includes a first light splitting plate and a second light splitting plate, and the second light splitting plate is connected to the objective lens converter; the first light splitting plate is used for reflecting the first incident light beam transmitted by the first controllable light transmitting plate to the second light splitting plate; the second light splitting plate is used for transmitting the light beam reflected by the first light splitting plate into the objective lens converter and reflecting the second incident light beam penetrating through the second controllable light transmitting plate into the objective lens converter.

Optionally, the detection module includes an imaging lens group and a detector; the imaging lens group amplifies the image of the surface of the workpiece to be detected; and the detector acquires the amplified image of the surface of the workpiece to be detected to form the detection image.

Optionally, the illumination module further comprises a removable polarizer, and the detection module further comprises a removable analyzer.

The defect detection device comprises an illumination module, an objective lens module and a detection module; the light beam provided by the light source in the lighting module is split by the light splitting assembly to form a first incident light beam and a second incident light beam, the first incident light beam is projected onto a first controllable light-transmitting plate, the second incident light beam is projected onto a second controllable light-transmitting plate, and when one of the first controllable light-transmitting plate and the second controllable light-transmitting plate is opened, the other one is closed; the objective module comprises a metallographic objective and a DIC objective, the metallographic objective is used for imaging a first incident beam penetrating through the first controllable light-transmitting plate to the surface of a workpiece to be measured and receiving a reflected light beam to form an image of the surface of the workpiece to be measured, the DIC objective is used for imaging a second incident beam penetrating through the second controllable light-transmitting plate to the surface of the workpiece to be measured and receiving the reflected light beam to form an image of the surface of the workpiece to be measured; the detection module is used for processing the image of the surface of the workpiece to be detected to form a detection image. In the defect detection device, the light splitting component splits a light beam provided by the light source and outputs a first incident light beam and a second incident light beam, the first incident light beam penetrating through the first controllable light-transmitting plate is imaged on the surface of a workpiece to be detected after passing through the metallographic objective, and the second incident light beam penetrating through the second controllable light-transmitting plate is imaged on the surface of the workpiece to be detected after passing through the DIC objective, so that when the metallographic objective and the DIC objective are switched, corresponding metallographic detection or DIC detection can be carried out as long as one of the first controllable light-transmitting plate and the second controllable light-transmitting plate is correspondingly opened and the other one is closed, and the position deviation of the image surface of the objective is not required to be repeatedly adjusted and corrected, thereby being beneficial to improving the use efficiency and the detection precision of the defect detection device.

Drawings

Fig. 1 is a schematic diagram of a kohler lighting configuration.

Fig. 2 is a schematic structural diagram of a defect detection apparatus according to an embodiment of the utility model.

Fig. 3 is a schematic structural diagram of a defect detection apparatus according to another embodiment of the utility model.

Description of reference numerals: (reference in fig. 1) 11-light source; 12-illuminating the front group; 13-a mirror; 14-lighting rear group; 15-a beam splitting prism;

(the label legend of fig. 2 and 3) 100 — a lighting module; 101-a light source; 102-a collimated beam expander; 103-a filtering component; 104-polarizer; 105-a light splitting component; 106-mirror; 107 a-a first controllable light-transmitting panel; 107 b-a second controllable, light-transmitting panel; 108 a-a first relay lens group; 108 b-a second relay lens group; 109-variable focal length lens; 200-objective lens module; 201-metallographic objective lens; 202-DIC objective lens; 203-objective lens changer; 204-a first light splitter; 205-a second dichroic sheet; 300-a detection module; 301-a set of imaging mirrors; 302-an analyzer; 303-a detector; 400-a workpiece to be tested; 500-workpiece stage.

Detailed Description

The defect detection apparatus of the present invention will be described in detail with reference to the accompanying drawings and specific embodiments. Where used, the designations left, right, front, back, up, down, positive, negative, clockwise, and counterclockwise are used for descriptive purposes only and do not imply any particular fixed orientation; in fact, they are used to reflect the relative position and/or orientation between the various parts of the object. The advantages and features of the present invention will become more apparent from the following description. It is to be noted that the drawings are in a very simplified form and are not to precise scale, which is merely for the purpose of facilitating and distinctly claiming the embodiments of the present invention.

Before describing the defect detection apparatus of the present invention, kohler illumination will be described. Fig. 1 is a schematic diagram of a kohler lighting configuration. As shown in fig. 1, in the kohler illumination optical path, after the light beam emitted by the light source 11 passes through the front illumination group 12, the reflecting mirror 13, the rear illumination group 14 and the beam splitter prism 15, an image is formed on the surface of the workpiece 16 to be measured, that is, kohler illumination is formed on the surface of the workpiece 16 to be measured, so that the surface of the workpiece 16 to be measured can be uniformly illuminated by the light source, which is helpful for solving the problem of low contrast of the transparent defect.

In order to increase the contrast of the transparent defect in the inspection image, the conventional defect inspection apparatus not only adopts a kohler illumination mode (i.e. the surface of the workpiece to be inspected is located on the back focal plane of the objective lens and the light beam provided by the light source is imaged on the back focal plane of the objective lens, or the light beam provided by the light source is imaged on the surface of the workpiece to be inspected), but also uses a metallographic objective lens with a small focal length and a large reflected light intensity and a DIC objective lens with a large imaging height. Because the axial positions of the back focal planes of the metallographic objective and the DIC objective are different, when the metallographic objective and the DIC objective are switched, the same illumination light path cannot ensure that a light source is imaged on the back focal plane of the objective (namely the metallographic objective and the DIC objective are collectively called), so that Kohler illumination is difficult to realize, and the illumination uniformity of the surface of a workpiece to be measured is reduced. Therefore, after the metallographic objective and the DIC objective are switched with each other, the defect detection device needs to be adjusted and corrected to compensate for the deviation of the image plane position of the objective, the process is complicated, and the service efficiency of the defect detection device is reduced.

Example one

In order to improve the use efficiency of the defect detecting apparatus without repeatedly adjusting and correcting the objective lens when the metallographic objective lens and the DIC objective lens are switched, the present embodiment provides a defect detecting apparatus.

Fig. 2 is a schematic structural diagram of a defect detection apparatus according to an embodiment of the utility model. As shown in fig. 2, the defect detecting apparatus of the present embodiment includes an illumination module 100, an objective lens module 200, and a detection module 300.

The illumination module 100 is used to provide an incident light beam. In particular, the lighting module 100 comprises a light source 101, a light splitting assembly 105, a first controllable light-transmitting panel 107a and a second controllable light-transmitting panel 107 b. For example, the light source 101 and the light splitting assembly 105 may be sequentially disposed along the Y-axis direction in fig. 2. The light beam provided by the light source 101 is split by the light splitting assembly 105 to form a first incident light beam and a second incident light beam, the first incident light beam is projected onto the first controllable transparent plate 107a, and the second incident light beam is projected onto the second controllable transparent plate 107 b; wherein when one of the first and second controllable light-transmitting panels 107a, 107b is open, the other is closed.

It should be noted that the first controllable light-transmitting panel 107a and the second controllable light-transmitting panel 107b can be opened and closed. When the first controllable transparent plate 107a is opened, the first incident light beam can penetrate through; when the first transparent controllable plate 107a is closed, the first incident light beam is blocked and cannot pass through. When the second controllable transparent plate 107b is opened, the second incident light beam can penetrate through; when the second controllably transparent plate 107b is closed, the second incident light beam is blocked from passing through. In the defect detecting apparatus, only one of the first and second controllable transparent plates 107a and 107b is opened and the other is closed, so that one of the first and second incident light beams is transmitted and the other is blocked and cannot be transmitted.

As shown in fig. 2, the illumination module 100 may further include a collimating and beam expanding device 102, and the collimating and beam expanding device 102 may be disposed between the light source 101 and the light splitting assembly 105, and is configured to collimate and expand the light beam emitted from the light source 101.

The illumination module 100 may further comprise a filtering component 103, and the filtering component 103 may be disposed between the light source 101 and the light splitting component 105. More specifically, the filter assembly 103 is located between the collimated beam expander 102 and the light splitting assembly 105, for example, and the filter assembly 103 may be configured to filter the light beam emitted from the light source 101 to obtain a light beam with a set wavelength. The filter assembly 103 is arranged to improve the detection accuracy of the defect detection device. Filter assembly 103 can include different filter plates of polylith and a planar support, the different filter plates of polylith are in arrange in the planar support, rotate the planar support and can switch different filter plates. But not limited thereto, the filtering component 103 may also be a filtering component known in the art.

In this embodiment, the light splitting assembly 105 may be a light splitting prism. But not limited thereto, the light splitting assembly 105 may also be other light splitting assemblies known in the art, such as a light splitter.

The following description will be given taking the spectroscopic unit 105 as a spectroscopic prism as an example. The light splitting assembly 105 may split the light beam provided by the light source 101 and output a reflected light beam (e.g., propagating in the Z-axis direction in fig. 2) and a transmitted light beam (e.g., propagating in the Y-axis direction in fig. 2). In this embodiment, the first incident light beam may be a reflected light beam output by the optical splitter 105, and the second incident light beam may be a transmitted light beam output by the optical splitter 105.

The illumination module 100 may further comprise a first relay lens group 108a, and the first relay lens group 108a may be disposed between the first controllable transparent plate 107a and the objective lens module 200. The first relay lens group 108a may be configured to adjust an imaging position of the first incident light beam after passing through the objective lens module 200 (specifically, the metallographic objective lens 201). In another embodiment, the first relay lens group 108a may also be located between the light splitting assembly 105 and the first controllable transparent plate 107 a.

In this embodiment, the illumination module may further include a reflector 106, and the first incident light beam reflected by the light splitting assembly 105 is reflected by the reflector 106 and then projected onto the first controllable transparent plate 107 a.

The illumination module 100 may further comprise a variable focal length lens 109, and the variable focal length lens 109 may be disposed between the second controllably transparent plate 107b and the objective lens module 200. The variable focal length lens 109 may be used to adjust the imaging position of the second incident beam after passing through the objective module 200 (in particular, the DIC objective 202). In another embodiment, the variable focal length lens 109 may also be disposed between the light splitting assembly 105 and the second controllable transparent plate 107 b.

The illumination module 100 may further include a second relay lens group 108b, the second relay lens group 108b may be disposed between the second controllable transparent plate 107b and the variable focal length lens 109, and the second relay lens group 108b and the variable focal length lens 109 may be used as a combination to adjust an imaging position of the second incident light beam.

In this embodiment, the workpiece 400 to be measured may be placed on the workpiece stage 500, and the surface of the workpiece 400 to be measured may be parallel to the XY plane. The objective lens module 200 irradiates the incident light beam emitted from the illumination module 100 onto the surface of the workpiece 400 to be measured, and receives the light beam reflected by the workpiece 400 to form an image of the surface of the workpiece to be measured. Specifically, as shown in fig. 2, the objective module includes a metallographic objective 201 and a DIC objective 202, the metallographic objective 201 is configured to image a first incident beam transmitted through the first controllable light-transmitting plate 107a onto a surface of a workpiece 400 to be measured and receive a reflected beam to form an image of the surface of the workpiece to be measured, and the DIC objective 202 is configured to image a second incident beam transmitted through the second controllable light-transmitting plate 107b onto the surface of the workpiece 400 to be measured and receive the reflected beam to form an image of the surface of the workpiece to be measured.

It should be noted that, in this embodiment, the first incident light beam passing through the first controllable transparent plate 107a corresponds to the metallographic objective 201, and the first incident light beam passes through the metallographic objective 201 and then is imaged on the back focal plane of the metallographic objective 201; during metallographic detection, the first controllable transparent plate 107a is opened, the second controllable transparent plate 107b is closed, and kohler illumination can be formed on the surface of the workpiece 400 to be detected by arranging the surface of the workpiece 400 to be detected at the back focal plane position of the metallographic objective 201. The second incident beam passing through the second controllable transparent plate 107b corresponds to the DIC objective lens 202, and the second incident beam passes through the DIC objective lens 202 and then is imaged on the back focal plane of the DIC objective lens 202; when the DIC detection is performed, the second transparent controllable plate 107b is opened and the first transparent controllable plate 107a is closed, and the surface of the workpiece 400 is set at the back focal plane position of the DIC objective lens 202, so that kohler illumination can be formed on the surface of the workpiece 400.

The following describes a method for adjusting kohler illumination when the first incident light beam and the second incident light beam are both irradiated on the surface of the workpiece 400 to be measured.

On the optical path of the first incident light beam, the focal length of the first relay lens group 108a is f1, the magnification is M, the object distance is L1, and the back focal plane image distance of the metallographic objective lens 201 is L2. On the optical path of the second incident light beam, the focal length obtained by combining the second relay lens group 108b and the variable focal length lens 109 is f2 (when only the variable focal length lens 109 is used, the focal length of the variable focal length lens 109 is f2), the magnification is M, and the back focal plane image distance of the DIC objective lens 202 is L2+ Δ L (Δ L is the deviation of the axial positions of the back focal planes of the DIC objective lens and the metallographic objective lens), according to the gaussian formula:

and M-L2/L1, yielding L2-f 1 (M +1), and similarly L2+ Δ L-f 2, then:

ΔL＝(M+1)(f2-f1) (2)；

f2＝f1+ΔL/(M+1) (3)。

adjusting the first relay lens group 107a according to a formula (1), calibrating the back focal plane position of the metallographic objective 201, enabling a first incident beam to pass through the imaging position behind the metallographic objective 201 on the back focal plane of the metallographic objective 201, and placing the surface of the workpiece 400 to be measured at the back focal plane position (at the moment, the light source imaging position) of the metallographic objective 201, so that corresponding Kohler illumination can be realized. The focal length of the variable focal length lens 109 is adjusted according to the formula (2) or the formula (3), the imaging position of the second incident beam passing through the DIC objective lens 202 is on the back focal plane of the DIC objective lens 202, and the surface of the workpiece 400 to be measured is placed at the back focal plane position of the DIC objective lens 202 (at this time, the imaging position of the light source), so that the corresponding kohler illumination can be realized.

Therefore, in the defect detection apparatus of this embodiment, after the imaging positions of the first incident light beam and the second incident light beam are adjusted (i.e. after the positions of the first relay lens group 108a, the second relay lens group 108b, and the zoom lens 109 are adjusted), when the metallographic objective 201 and the DIC objective 202 are switched, as long as the corresponding controllable transparent plate is opened to let the corresponding incident light beam pass through, the corresponding kohler illumination can be formed on the workpiece 400 to be detected, which is beneficial to improving the contrast of the transparent defect in the detected image, improving the detection rate and the detection accuracy of the transparent defect, and when the metallographic objective 201 and the DIC objective 202 are switched, the correction is not required to be repeatedly adjusted to compensate the axial position deviation of the focal plane behind the objective, which is beneficial to improving the use efficiency of the defect detection apparatus.

In this embodiment, the objective module 200 may further include an objective converter 203, the objective converter 203 is connected to the metallurgical objective 201 and the DIC objective 202, and the objective converter 203 is rotated to switch between the metallurgical objective 201 and the DIC objective 202. It should be noted that, when the metallographic detection is adopted, the optical axis of the metallographic objective 201 enters the optical axis position of the objective converter 203; when DIC detection is employed, the optical axis of the DIC objective lens 202 enters the optical axis position of the objective lens changer 203.

The objective lens module 200 may further include a first light splitting plate 204 and a second light splitting plate 205, and the second light splitting plate 205 is connected to the objective lens changer 203. In this embodiment, the first light splitting plate 204 may be configured to reflect the first incident light beam transmitted through the first controllable light transmitting plate 107a to the second light splitting plate 205; the second light-splitting plate 205 may be configured to pass the light beam reflected by the first light-splitting plate 204 into the objective lens converter 203 and to reflect the second incident light beam transmitted through the second controllable light-transmitting plate 107b into the objective lens converter 203.

In this embodiment, the first incident beam or the second incident beam irradiates the surface of the workpiece 400 to be tested after passing through the objective lens module 200, and the light beam formed by reflection of the workpiece 400 forms an image of the surface of the workpiece to be tested before the detection module 300 (specifically, for example, before the detection module 300 after the first light splitting plate 204) after passing through the objective lens module 200.

In this embodiment, the defect detecting apparatus further includes a detecting module 300. The detection module 300 is used for processing the image of the surface of the workpiece to be detected to form a detection image.

Specifically, as shown in fig. 2, the detection module 300 may include an imaging lens group 301 and a detector 303. The imaging lens group 301 can enlarge the image of the surface of the workpiece to be tested. The detector 303 can acquire an enlarged image of the surface of the workpiece to be detected to form the detection image. Whether the surface of the workpiece 400 to be detected has the transparent defect, the position information of the transparent defect, and the like can be obtained by detecting the detection image. The imaging lens group 301 of the present embodiment may employ an imaging lens group known in the art. The detector 303 of the present embodiment may employ an image detector known in the art, such as a CCD camera.

It should be noted that, in the case of detection using the DIC objective lens 202, the light beam provided by the light source 101 is polarized light, and in the case of detection using the metallographic objective lens 201, the light beam provided by the light source 101 may be unpolarized light (i.e., ordinary illumination light). In order to improve the detection effect, in this embodiment, the illumination module 100 may further include a removable polarizer 104, and the polarizer 104 may be disposed between the collimated beam expander 102 and the filter assembly 103, and may be configured to filter the light beam provided by the light source 101 and output polarized light with a set polarization direction. The detection module 300 may further include a removable analyzer 302, and the analyzer 302 may be disposed between the imaging lens assembly 301 and the detector 303, and may be configured to perform polarization filtering on the light beam output by the imaging lens assembly 301 to remove stray light. When the DIC objective lens 202 is used, the polarizer 104 and the analyzer 302 are arranged in an optical path; when the metallographic objective 201 is used, the polarizer 104 and the analyzer 302 can move out of the optical path.

The following describes specific steps of defect detection using the defect detection apparatus of the present embodiment.

Before starting the test, a test preparation is first performed. Specifically, first, whether polarized light is used is judged; when polarized light is required, the polarizer 104 and the analyzer 302 are arranged in the light path; when polarized light is not required, the polarizer 104 and the analyzer 302 can be moved out of the optical path. Then, adjusting the first relay lens 108a according to the formula (1) to enable the first incident beam to pass through the metallographic objective 201 and then be imaged on the back focal plane of the metallographic objective 201, and calibrating the position of the back focal plane of the metallographic objective 201; and then, adjusting the focal length (or magnification) of the variable focal length lens 109 according to the formula (2) or the formula (3) to enable the second incident beam to form an image on the back focal plane of the DIC objective lens 202 after passing through the DIC objective lens 202, and calibrating the position of the back focal plane of the DIC objective lens 202.

After the detection preparation is finished, normal detection can be performed. Specifically, whether metallographic detection is adopted or not is confirmed. When metallographic detection is adopted, the optical axis of the metallographic objective 201 is moved into the optical axis position of the objective converter 203, the first controllable light-transmitting plate 107a is opened (at this time, the reflected light beam output by the light splitting assembly 105 is selected), the first incident light beam irradiates the workpiece 400 to be detected through the first controllable light-transmitting plate 107a and is reflected, the light beam reflected by the workpiece 400 to be detected forms an image of the surface of the workpiece to be detected before the detection module 300 after being processed by the metallographic objective 201, the detection module 300 processes the image of the surface of the workpiece to be detected to form a detection image, and the detection image is processed and detected to obtain the information of the transparent defects on the workpiece 400 to be detected. When the DIC detection is performed, the optical axis of the DIC objective lens 202 is moved into the optical axis position of the objective lens converter 203, the second controllable transparent plate is opened (at this time, the transmitted light beam output by the light splitting assembly 105 is selected), the second incident light beam is irradiated onto the workpiece 400 to be detected through the second controllable transparent plate 107b and reflected, the light beam reflected by the workpiece 400 to be detected is processed by the DIC objective lens 202 and then forms an image of the surface of the workpiece to be detected in front of the detection module 300, the detection module 300 processes the image of the surface of the workpiece to be detected to form a detection image, and the detection image is processed and detected to obtain the information of the transparent defect on the workpiece 400 to be detected. Then, judging whether the detection is finished or not; when the detection is finished, the detection is finished; and when the detection is not finished, continuing imaging and carrying out detection processing.

The defect detecting apparatus of the present invention includes an illumination module 100, an objective lens module 200, and a detection module 300; a light beam provided by a light source in the illumination module 100 is split by the light splitting assembly 105 to form a first incident light beam and a second incident light beam, the first incident light beam is projected onto a first controllable transparent plate 107a, and the second incident light beam is projected onto a second controllable transparent plate 107b, wherein when one of the first controllable transparent plate 107a and the second controllable transparent plate 107b is turned on, the other is turned off; the objective module 200 comprises a metallographic objective 201 and a DIC objective 202, wherein the metallographic objective 202 is used for imaging a first incident light beam transmitted through the first controllable light-transmitting plate 107a onto a surface of a workpiece to be measured and receiving a reflected light beam to form an image of the surface of the workpiece to be measured, and the DIC objective 202 is used for imaging a second incident light beam transmitted through the second controllable light-transmitting plate 107b onto the surface of the workpiece to be measured and receiving the reflected light beam to form an image of the surface of the workpiece to be measured; the detection module 300 is used for processing the image of the surface of the workpiece to be detected to form a detection image. In the defect detecting apparatus, the light splitting assembly 105 splits the light beam provided by the light source 101 and outputs a first incident light beam and a second incident light beam, the first incident light beam transmitted through the first controllable transparent plate 107a is imaged on the surface of the workpiece to be detected after passing through the metallographic objective 201, the second incident light beam transmitted through the second controllable transparent plate 107b is imaged on the surface of the workpiece to be detected after passing through the DIC objective 202, that is, after the imaging positions of the first incident beam and the second incident beam are adjusted, when the metallographic objective 201 and the DIC objective 202 are switched, as long as one of the first and second controllable light-transmitting panels 107a and 107b is correspondingly opened and the other is closed, corresponding metallographic detection or DIC detection can be carried out without repeatedly adjusting and correcting to compensate the position deviation of the objective lens image surface, and the use efficiency and the detection precision of the defect detection device are improved.

Example two

The defect detection apparatus provided in this embodiment is different from the first embodiment in that the first incident beam is a transmitted beam of the light splitting assembly, the second incident beam is a reflected beam of the light splitting assembly, and accordingly, in the illumination module, positions of the first controllable light splitting plate and the first relay lens group are interchanged with positions of the second controllable light-transmitting plate, the second relay lens group and the zoom lens, the first incident beam is imaged on the surface of the workpiece to be detected through the metallic objective, and the second incident beam is imaged on the surface of the workpiece to be detected through the DIC objective; for the same points, refer to the description of the first embodiment, which is not repeated herein.

Fig. 3 is a schematic structural diagram of a defect detection apparatus according to another embodiment of the utility model. Specifically, as shown in fig. 3, in the defect detecting apparatus of the present embodiment, the light splitting component 105 (e.g., a light splitting prism) splits the light beam provided by the light source 101 and outputs a reflected light beam (e.g., propagating along the Z-axis direction in fig. 3) and a transmitted light beam (e.g., propagating along the Y-axis direction in fig. 3). The first incident beam is the transmitted beam of the light splitting assembly 105. A first incident light beam may be projected onto the first controllable light-transmitting plate 107 a. The second incident light beam is a reflected light beam of the light splitting assembly 105, and the second incident light beam can be projected onto the second controllable transparent plate 107 b.

The first relay lens group 108a in the illumination module 100 may be disposed between the first controllably transparent plate 107a and the objective lens module 200. The first relay lens group 108a can be used to adjust the imaging position of the first incident light beam after passing through the objective lens module 200.

As shown in fig. 3, the illumination module may further include a reflector 106, and the second incident light beam reflected by the light splitting assembly 105 is reflected by the reflector 106 and then projected onto the second controllable transparent plate 107 b.

The variable focal length lens 109 in the illumination module 100 may be arranged between the second controllably transparent plate 107b and the objective lens module 200. The variable focal length lens 109 may be configured to adjust an imaging position of the second incident light beam after passing through the objective lens module 200.

The illumination module 100 may further include a second relay lens group 108b, the second relay lens group 108b may be disposed between the second controllable transparent plate 107b and the variable focal length lens 109, and the second relay lens group 108b and the variable focal length lens 109 may be used as a combination to jointly adjust an imaging position of the second incident light beam.

In this embodiment, the objective module 200 includes a metallographic objective 201 and a DIC objective 202, the metallographic objective 201 is configured to image a first incident beam passing through the first controllable transparent plate 107a onto a surface of the workpiece 400 to be measured (for example, parallel to an XY plane) and receive a reflected beam to form an image of the surface of the workpiece to be measured, and the DIC objective 202 is configured to image a second incident beam passing through the second controllable transparent plate 107b onto the surface of the workpiece 400 to be measured and receive the reflected beam to form an image of the surface of the workpiece to be measured.

It should be noted that, in this embodiment, the first relay lens group 108a is still disposed on the light path of the first incident light beam, and the second relay lens group 108b and the variable focal length lens 109 are still disposed on the light path of the second incident light beam, when adjusting the first relay lens group 108a, the second relay lens group 108b and the variable focal length lens 109, the formula (1), the formula (2) and the formula (3) in the first embodiment may also be used, and the adjustment manner is similar to that of the first embodiment, and the first embodiment may be referred to specifically, and is not described herein again. After the positions of the first relay lens group 108a, the second relay lens group 108b and the variable focal length lens 109 are adjusted, the first incident light beam and the second incident light beam can form an image on the surface of the workpiece 400 after passing through the objective lens module 200.

As shown in fig. 3, in the objective module 200, the objective changer 203 is connected to the objective 201 and the DIC objective 202, and the objective changer 203 is rotated to switch between the objective 201 and the DIC objective 202.

The objective lens module 200 may further include a first light splitting plate 204 and a second light splitting plate 205, and the second light splitting plate 205 is connected to the objective lens switcher 203. The first light-splitting plate 204 may be used to reflect the second incident light beam transmitted through the second controllable light-transmitting plate 107b onto the second light-splitting plate 205; the second light-splitting plate 205 may be used to pass the light beam reflected by the first light-splitting plate 204 to the DIC objective 202 under the objective changer 203 and to reflect the first incident light beam transmitted through the first controllable light-splitting plate 107a to the metallographic objective 201 under the objective changer 203.

In this embodiment, the first incident beam or the second incident beam irradiates the surface of the workpiece 400 to be tested after passing through the objective lens module 200, and the light beam formed by reflection of the workpiece 400 to be tested forms an image of the surface of the workpiece 400 to be tested before the detection module 300 (specifically, for example, before the detection module 300 after the first light splitting plate 204) after passing through the objective lens module 200.

The detection module 300 processes the image of the surface of the workpiece 400 to form a detection image. Whether the transparent defect exists on the surface of the workpiece 400 to be detected, the position information of the transparent defect and the like can be obtained by detecting the detection image.

When the defect detection device of the embodiment is used for detection, when metallographic detection is performed, the optical axis of the metallographic objective 201 is moved into the optical axis position of the objective converter 203, the first controllable light-transmitting plate 107a is opened (at this time, the transmission light beam output by the light splitting assembly 105 is selected), and the second controllable light-transmitting plate 107b is closed; when the DIC detection is performed, the optical axis of the DIC objective lens 202 is moved into the optical axis position of the objective lens converter 203, and the second transparent controllable plate 107b is opened (the reflected beam output by the beam splitting assembly 105 is selected at this time) and the first transparent controllable plate 107a is closed. That is, after the imaging positions of the first incident beam and the second incident beam in the defect detecting apparatus are adjusted, when the metallographic objective 201 and the DIC objective 202 are switched, corresponding metallographic detection or DIC detection can be performed as long as one of the first controllable transparent plate 107a and the second controllable transparent plate 107b is correspondingly opened and the other is closed, without repeatedly adjusting and correcting to compensate for the positional deviation of the image plane of the objective, which is helpful for improving the use efficiency and detection accuracy of the defect detecting apparatus.

It should be noted that the present specification is described in a progressive manner, and the following description focuses on differences from the preceding description, and the same and similar parts may be referred to each other.

It should also be understood that the terms "first," "second," "third," and the like in the description are used for distinguishing between various components, elements, and the like in the description and are not intended to imply a logical or sequential relationship between the various components, elements, and the like unless otherwise specified or indicated.

The above description is only for the purpose of describing the preferred embodiments of the present invention and is not intended to limit the scope of the claims of the present invention, and any person skilled in the art can make possible the variations and modifications of the technical solutions of the present invention using the methods and technical contents disclosed above without departing from the spirit and scope of the present invention, and therefore, any simple modification, equivalent change and modification made to the above embodiments according to the technical essence of the present invention belong to the protection scope of the technical solutions of the present invention.

Claims (10)

1. A defect detection apparatus, comprising:

the illumination module is used for providing an incident beam and comprises a light source, a light splitting assembly, a first controllable light-transmitting plate and a second controllable light-transmitting plate, wherein the light beam provided by the light source is split by the light splitting assembly to form a first incident beam and a second incident beam, the first incident beam is projected on the first controllable light-transmitting plate, and the second incident beam is projected on the second controllable light-transmitting plate; wherein one of the first and second controllable light-transmitting panels is open and the other is closed;

the objective module comprises a switchable metallographic objective and a DIC objective, wherein the metallographic objective is used for imaging a first incident light beam penetrating through the first controllable light-transmitting plate to the surface of a workpiece to be measured and receiving a reflected light beam to form an image of the surface of the workpiece to be measured, and the DIC objective is used for imaging a second incident light beam penetrating through the second controllable light-transmitting plate to the surface of the workpiece to be measured and receiving the reflected light beam to form an image of the surface of the workpiece to be measured; and

and the detection module is used for processing the image of the surface of the workpiece to be detected to form a detection image.

2. The defect detection apparatus of claim 1, wherein the illumination module comprises a first set of relay lenses disposed between the first controllable optically transparent plate and the objective lens module.

3. The defect detection apparatus of claim 1, wherein the illumination module comprises a variable focal length lens disposed between the second controllably transparent plate and the objective lens module.

4. The defect detection apparatus of claim 3, wherein the illumination module further comprises a second set of relay lenses disposed between the second controllable light-transmissive plate and the variable focal length lens.

5. The defect detection apparatus of claim 1, wherein the beam splitting assembly is a beam splitting prism that splits the beam provided by the light source and outputs a reflected beam and a transmitted beam; the first incident light beam is one of the reflected light beam or the transmitted light beam and the second incident light beam is the other of the reflected light beam or the transmitted light beam.

6. The defect detection apparatus of claim 1, wherein the illumination module further comprises a filter assembly disposed between the light source and the light splitting assembly.

7. The apparatus of claim 1, wherein the objective module further comprises an objective changer, the objective changer being coupled to the metallographic objective and the DIC objective, wherein rotating the objective changer switches between the metallographic objective and the DIC objective.

8. The defect detection device of claim 7, wherein the objective module further comprises a first light-splitting plate and a second light-splitting plate, the second light-splitting plate being connected to the objective changer; the first light splitting plate is used for reflecting the first incident light beam transmitted by the first controllable light transmitting plate to the second light splitting plate; the second light splitting plate is used for transmitting the light beam reflected by the first light splitting plate into the objective lens converter and reflecting the second incident light beam penetrating through the second controllable light transmitting plate into the objective lens converter.

9. The defect detection apparatus of claim 1, wherein the detection module comprises an imaging lens group and a detector; the imaging lens group amplifies the image of the surface of the workpiece to be detected; and the detector acquires the amplified image of the surface of the workpiece to be detected to form the detection image.

10. The defect detection apparatus of claim 1, wherein the illumination module further comprises a removable polarizer, and the detection module further comprises a removable analyzer.

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