CN215677143U - Structural health monitoring system - Google Patents
Structural health monitoring system Download PDFInfo
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- CN215677143U CN215677143U CN202122005550.0U CN202122005550U CN215677143U CN 215677143 U CN215677143 U CN 215677143U CN 202122005550 U CN202122005550 U CN 202122005550U CN 215677143 U CN215677143 U CN 215677143U
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Abstract
A structure health monitoring system belongs to the technical field of structure health monitoring, wherein a certain area structure is monitored by a measuring point module in the device, information such as temperature, vibration and the like of a measuring point is acquired and collected through a sensor, then a measuring signal is converted into a digital signal and sent to a communication transceiver through a bus, the communication transceiver consists of a main module and a plurality of standby modules which are deployed at different positions, and when a communication line is damaged, the measuring point for interrupting communication can be reduced and breakpoints can be identified through the combined use of the plurality of communication transceiver modules. The upper computer performs data acquisition and analysis and gives an alarm to the control system. The device has the characteristics of wide monitoring range, low cost, damage resistance and high reliability. Avoiding the conditions of fracture, falling off and the like, causing serious accidents and property loss.
Description
Technical Field
The utility model relates to the technical field of structural health monitoring, in particular to a structural health monitoring system.
Background
As is known, large structures such as wind generating sets, bridges, petrochemical pipelines and the like are in external environments, the forms of severe environments are various, and the problems of failure such as surface cracking and the like easily occur; therefore, the health state of the structure cannot be accurately controlled for the large-scale structure, and the maintenance personnel cannot find cracks immediately, so that the influence is further enlarged. The device has the advantages that serious accidents and property loss are caused by the conditions of later-stage breakage, falling and the like, the operation of the device is not affected a little, and great harm is brought to lives and properties. For a high-density structure, such as a vehicle battery pack or a large energy storage power station, the temperature of each energy storage module needs to be monitored, and the problems of failure or uneven charging and discharging, such as narrow space of a submarine or a ship cabin, severe environment and large workload of manual detection, are avoided. A solution that supports a large number of stations, is convenient to connect, and is low in cost is needed.
SUMMERY OF THE UTILITY MODEL
In order to solve the technical problems that the existing monitoring system in the market has defects and is not beneficial to judgment and timely maintenance and repair of operation and maintenance personnel, the utility model adopts the following technical scheme:
a structural health monitoring system comprises at least one measuring point module, at least one communication transceiver and an upper computer; the measuring point module comprises at least one sensor, a program control switch, an amplifier, a signal converter, an MCU chip and a communication element; the program control switch, the signal converter, the amplifier, the MCU chip and the communication element are fixedly packaged on the PCB; at least one sensor is connected in parallel, one end of each sensor is connected with the negative input end of the amplifier, the other end of each sensor is connected with the positive input end of the amplifier, a programmable switch is arranged and connected on a channel connected with the positive input end of the amplifier, the output end of the amplifier is connected with the signal input end of the signal converter, the signal output end of the signal converter is connected with the MCU chip, the MCU chip is connected with the communication element, the MCU chip is also electrically connected with the programmable switch and the signal converter, a communication interface is arranged on the PCB, and the communication interface is connected with the communication element; the at least one communication transceiver, the upper computer and the at least one measuring point module are connected in series through a communication bus.
Specifically, the sensor may be any one of a resistor grid, a temperature sensor, an accelerometer sensor, a humidity sensor, an air pressure sensor, a humidity sensor, and a MEMS sensor.
Specifically, the PCB is sealed by sealant and is fixedly arranged in the metal shell.
Specifically, the communication element is in communication connection with the communication transceiver through any one of CAN, RS485 and I2C protocols.
Specifically, the converter of the signal is an ADC chip.
Specifically, the communication element is in communication connection with the MCU chip through an I2C protocol.
As can be seen from the above description, the device has the following advantages: the measuring point module of the utility model adopts I2C communication and can be packaged into a low-power consumption micro module. Protocols such as CAN, RS485 and the like are adopted between the measuring point module and the communication transceiver, so that the anti-interference capability is strong, and the method is suitable for industrial environment. And hardware cost is reduced by adopting a polling mode and characteristic value monitoring. The combination of multiple communication transceivers and communication buses enhances the system's resistance to damage. The system has the characteristics of low cost, large range, multiple measuring points and damage resistance, and is suitable for structural health monitoring in severe environment.
Drawings
FIG. 1 is a schematic diagram of a structural health monitoring system;
FIG. 2 is a data transmission flow of a monitoring system provided by a structural health monitoring system;
FIG. 3 is a schematic structural diagram of a measurement point module provided in a structural health monitoring system;
FIG. 4 illustrates a connection between a measurement point module and a communication transceiver provided in a structural health monitoring system;
FIG. 5 is a schematic view of a measurement point module of a packaged resistor grid provided by a structural health monitoring system;
FIG. 6 illustrates a communication recovery and breakpoint identification principle provided by a structural health monitoring system when a communication breakpoint occurs;
FIG. 7 is a schematic diagram of a structural principle of a measurement point module provided in a structural health monitoring system;
Detailed Description
Example 1:
the structure monitoring system is used for monitoring the cracking of the wind turbine blade as an example, and the utility model is further described with reference to fig. 1.
A structural health monitoring system comprises a measuring point module, a communication transceiver and an upper computer.
(1) The measuring point module comprises at least one sensor, and the sensors are the same in type, a program control switch, an amplifier, an ADC (analog to digital converter), an MCU (micro control unit) chip and a communication element. The program control switch, the analog-to-digital conversion chip ADC, the amplifier, the MCU chip and the communication element are packaged on the PCB, and all the elements are electrically connected.
The sensors are connected in parallel, one end of each sensor is connected with the negative input end of the amplifier, the other end of each sensor is connected with the positive input end of the amplifier, a program-controlled switch is arranged and connected on a path connected with the positive input end of the amplifier, and the program-controlled switch controls the on-off of the resistor grid. The programmable switch is connected with the amplifier, the amplifier is connected with the analog-to-digital conversion chip ADC, so that the resistor grid amplifies the acquired analog signals and then converts the analog signals into digital signals through the analog-to-digital conversion chip ADC, the analog-to-digital conversion chip ADC is connected with pins of the MCU chip, and the digital signals are transmitted to the MCU chip for data processing. The MCU chip is connected with the communication element, and is in communication connection by adopting an I2C protocol, and the processed data is transmitted to the communication element. The MCU chip is also electrically connected with the program control switch and the analog-to-digital conversion chip ADC to control the on-off of the program control switch and the conversion on-off of the analog signal and the digital signal. In order to improve the sealing performance of the measuring point module, prevent the measuring point module from being damaged and ensure the electromagnetic shielding function of the measuring point module, the PCB is sealed by resin and a waterproof adhesive tape and then placed in the metal shell. Two connecting ports are arranged on the PCB, and the two communication interfaces are connected with the communication element. In order to realize polling monitoring of a plurality of sensors, the following method is adopted: when the programmable switch of the first sensor is closed, the programmable switches of the other sensors are opened, the state is kept for 10min, and the 10s sampling frequency is used for monitoring for 10 min. When the programmable switch of the first sensor is closed, the programmable switches of the other sensors are opened, the state is kept for 10min, and the 10min is monitored in a 10s sampling period, so that the operation is repeated in the past, and all the sensors are subjected to polling detection operation.
In order to comprehensively and carefully monitor whether the fan blade has cracks, a plurality of measuring point modules are arranged near the cross section, wherein the measuring point modules comprise a resistance grid measuring point module, an acceleration sensor measuring point module and a temperature sensor measuring point module. The three measuring point modules are connected in series on each blade through a communication bus connecting communication interface. In the resistance grid measuring point module, 1 resistance grid is arranged at intervals of two meters at the front edge and the rear edge of the fan blade, and 6 resistance grids are arranged in total, and in the acceleration sensor measuring point module and the temperature sensor measuring point module, 2 acceleration sensors and 1 temperature sensor are arranged at the length of the fan blade 1/3 respectively.
(2) The communication transceiver includes a primary communication transceiver and a backup communication transceiver. The communication transceiver provides a required power supply for the measuring point module through a communication cable, and the required power supply is a 5V direct-current power supply. The communication transceiver and the two backup communication transceivers are arranged in the hub. The communication transceiver is in communication connection with the communication element of the measuring point module through CAN, RS485 and other protocols, receives measured data, is connected with the upper computer through a communication bus and uploads the measured data to the upper computer.
(3) The upper computer is used for storing, analyzing and collecting data, controlling monitoring parameters, controlling the communication transceiver to communicate with a control system or a monitoring center. The host computer is arranged in the wheel hub.
In this embodiment, the resistance grid measuring point module, the acceleration sensor measuring point module, and the temperature sensor measuring point module measure structural information in the blade in a polling manner. When the structure changes, partial grids are broken, so that the resistance value of one resistor grid changes, the communication unit uploads the minimum resistance value serving as a characteristic value to the main communication transceiver, the main communication transceiver sends the characteristic value to the upper computer, and the detection personnel check the upper computer to identify the cracking position and the cracking length. The detection personnel can quickly identify the cracking point by checking the nearby part through the corresponding measuring point module position. Usually, a main communication transceiver polls a point module to acquire data, and a standby communication transceiver is in a standby state, but when a communication network has a breakpoint and the standby communication transceiver cannot acquire messages of the main communication transceiver through a cable bus, the standby communication transceiver can start to acquire point module data on the side of the breakpoint standby communication transceiver and upload the point module data to a workstation, so that the standby communication transceiver is arranged to improve the damage resistance of the system.
As can be seen from the above description, the device has the following advantages: the measuring point module of the utility model adopts I2C communication and can be packaged into a low-power consumption micro module. Protocols such as CAN, RS485 and the like are adopted between the measuring point module and the communication transceiver, so that the anti-interference capability is strong, and the method is suitable for industrial environment. And hardware cost is reduced by adopting a polling mode and characteristic value monitoring. The combination of multiple communication transceivers and communication buses enhances the system's resistance to damage. The system has the characteristics of low cost, large range, multiple measuring points and damage resistance, and is suitable for structural health monitoring in severe environment.
Example 2:
the structure monitoring system is exemplified by a large-sized electric vehicle battery pack, and the utility model will be further described with reference to fig. 1 to 6.
A structural health monitoring system comprises a measuring point module, a communication transceiver and an upper computer.
(1) The measuring point module comprises at least one sensor, and the sensors are the same in type, a program control switch, an amplifier, an ADC (analog to digital converter), an MCU (micro control unit) chip and a communication element. The program control switch, the analog-to-digital conversion chip ADC, the amplifier, the MCU chip and the communication element are packaged on the PCB, and all the elements are electrically connected.
The sensors are connected in parallel, one end of each sensor is connected with the negative input end of the amplifier, the other end of each sensor is connected with the positive input end of the amplifier, a program-controlled switch is arranged and connected on a path connected with the positive input end of the amplifier, and the program-controlled switch controls the on-off of the resistor grid. The programmable switch is connected with the amplifier, the amplifier is connected with the analog-to-digital conversion chip ADC, so that the resistor grid amplifies the acquired analog signals and then converts the analog signals into digital signals through the analog-to-digital conversion chip ADC, the analog-to-digital conversion chip ADC is connected with pins of the MCU chip, and the digital signals are transmitted to the MCU chip for data processing. The MCU chip is connected with the communication element, and is in communication connection by adopting an I2C protocol, and the processed data is transmitted to the communication element. The MCU chip is also electrically connected with the program control switch and the analog-to-digital conversion chip ADC to control the on-off of the program control switch and the conversion on-off of the analog signal and the digital signal. In order to improve the sealing performance of the measuring point module, prevent the measuring point module from being damaged and ensure the electromagnetic shielding function of the measuring point module, the PCB is sealed by resin and a waterproof adhesive tape and then placed in the metal shell. Two connecting ports are arranged on the PCB, and the two communication interfaces are connected with the communication element. In order to realize polling monitoring of a plurality of sensors, the following method is adopted: when the programmable switch of the first sensor is closed, the programmable switches of the other sensors are opened, the state is kept for 10min, and the 10s sampling frequency is used for monitoring for 10 min. When the programmable switch of the first sensor is closed, the programmable switches of the other sensors are opened, the state is kept for 10min, the sampling frequency is 10s, the monitoring is carried out for 10min, and therefore the operation is repeated in the past, and all the sensors are subjected to polling detection operation.
In order to comprehensively and carefully monitor the structural safety of the large-scale electric vehicle battery pack, a current measuring point module, a voltage measuring point module, an air pressure measuring point module, a humidity measuring point module, an acceleration measuring point module and a humidity measuring point module are arranged in the battery pack. The sensors of the current measuring point module and the voltage measuring point module are bus wires of components in the battery pack. For the temperature measuring point module, a temperature sensor is respectively arranged in the electric core group, on the surface of the battery pack and at the front end and the rear end of the heat dissipation channel. And for the air pressure measuring point module and the humidity measuring point module, an air pressure sensor and a humidity sensor are arranged in the measuring environment and on the outer surface close to the battery pack. For the acceleration measuring point module, an acceleration sensor is arranged near the centroid of the battery pack.
(2) The communication transceiver comprises a main communication transceiver and a standby communication transceiver, and the main communication transceiver and the standby communication transceiver are both arranged on the surface of the battery pack. The communication transceiver provides a required power supply for the measuring point module through a communication cable, and the required power supply is a 5V direct-current power supply. The communication transceiver is in communication connection with the communication element of the measuring point module through CAN, RS485 and other protocols, receives measured data, is connected with the upper computer through a communication bus and uploads the measured data to the upper computer.
(3) The upper computer is used for storing, analyzing and collecting data, controlling monitoring parameters, controlling the communication transceiver to communicate with a control system or a monitoring center. The host computer is arranged in the wheel hub.
In this embodiment, a current measuring point module, a voltage measuring point module, an air pressure measuring point module, a humidity measuring point module, an acceleration measuring point module, and a humidity measuring point module are disposed in the battery pack, and structural information in the battery pack is measured in a polling manner. When the structure changes, the temperature measuring point module polls the thermometers at the multiple battery cores of the assembly, and transmits the highest temperature of the thermometers as channel data to be uploaded according to monitoring requirements. The acceleration measuring point module collects acceleration values at high frequency, and transmits one channel of data of a maximum peak value or a root mean square value in a section of time sequence data to upload according to monitoring requirements. The main communication transceiver is sent to the upper computer again, and thus the detection personnel look over the upper computer and discern fracture position and crack length. The detection personnel can quickly identify the abnormal part by checking the nearby part through the corresponding measuring point module position. Usually, a main communication transceiver polls a point module to acquire data, and a standby communication transceiver is in a standby state, but when a communication network has a breakpoint and the standby communication transceiver cannot acquire messages of the main communication transceiver through a cable bus, the standby communication transceiver can start to acquire point module data on the side of the breakpoint standby communication transceiver and upload the point module data to a workstation, so that the standby communication transceiver is arranged to improve the damage resistance of the system.
As can be seen from the above description, the device has the following advantages: the measuring point module of the utility model adopts I2C communication and can be packaged into a low-power consumption micro module. Protocols such as CAN, RS485 and the like are adopted between the measuring point module and the communication transceiver, so that the anti-interference capability is strong, and the method is suitable for industrial environment. And hardware cost is reduced by adopting a polling mode and characteristic value monitoring. The combination of multiple communication transceivers and communication buses enhances the system's resistance to damage. The system has the characteristics of low cost, large range, multiple measuring points and damage resistance, and is suitable for structural health monitoring in severe environment.
It should be understood that the detailed description of the utility model is merely illustrative of the utility model and is not intended to limit the utility model to the specific embodiments described. It will be appreciated by those skilled in the art that the present invention may be modified or substituted equally as well to achieve the same technical result; as long as the use requirements are met, the method is within the protection scope of the utility model.
Claims (6)
1. A structural health monitoring system is characterized by comprising at least one measuring point module, at least one communication transceiver and an upper computer;
the measuring point module comprises at least one sensor, a program control switch, an amplifier, a signal converter, an MCU chip and a communication element; the program control switch, the signal converter, the amplifier, the MCU chip and the communication element are fixedly packaged on the PCB;
the at least one sensor is connected in parallel, one end of each sensor is connected with the negative input end of the amplifier, the other end of each sensor is connected with the positive input end of the amplifier, a program-controlled switch is arranged and connected on a channel connected with the positive input end of the amplifier, the output end of the amplifier is connected with the signal input end of the signal converter, the signal output end of the signal converter is connected with the MCU chip, the MCU chip is connected with the communication element, the MCU chip is also electrically connected with the program-controlled switch and the signal converter, a communication interface is arranged on the PCB, and the communication interface is connected with the communication element;
the communication transceivers, the upper computer and the communication interfaces of the measuring point modules are connected in series through a communication bus.
2. A structural health monitoring system as claimed in claim 1 wherein the sensor is any one of a resistive grid, a temperature sensor, an accelerometer sensor, a humidity sensor, an air pressure sensor, a humidity sensor, a MEMS sensor.
3. The structural health monitoring system of claim 1, further comprising a metal housing, wherein the PCB board is sealed by a sealant and is fixedly mounted in the metal housing.
4. A structural health monitoring system as claimed in claim 1 wherein the communication element is communicatively coupled to the communication transceiver via any one of CAN, RS485, I2C protocols.
5. A structural health monitoring system according to claim 1 wherein the signal converter is an ADC chip.
6. A structural health monitoring system according to claim 1 wherein the communication element is communicatively coupled to the MCU chip via the I2C protocol.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122005550.0U CN215677143U (en) | 2021-08-24 | 2021-08-24 | Structural health monitoring system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122005550.0U CN215677143U (en) | 2021-08-24 | 2021-08-24 | Structural health monitoring system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215677143U true CN215677143U (en) | 2022-01-28 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122005550.0U Active CN215677143U (en) | 2021-08-24 | 2021-08-24 | Structural health monitoring system |
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| CN (1) | CN215677143U (en) |
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2021
- 2021-08-24 CN CN202122005550.0U patent/CN215677143U/en active Active
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