CN215661547U - Stress buffer piece die - Google Patents

Abstract

The application discloses stress buffer spare mould includes: the fixed die assembly comprises a fixed die plate, a fixed die groove part which is recessed from one side of the fixed die plate to the inside of the fixed die plate, and a fixed die core accommodated in the fixed die groove part, wherein the fixed die core is provided with a first groove and a second groove; the movable die assembly comprises a movable die plate, a movable die groove part is recessed in one side of the automatic movable die plate and further comprises a movable die core accommodated in the movable die groove part, a third groove is formed in the movable die core, and the first groove and the second groove in the fixed die core are matched with the third groove in the movable die core to form a molding cavity; through the cooperation of first recess, second recess, third recess in order forming the shaping die cavity, simple structure can simplify mould processing technology flow, improves the efficiency of mould processing.

Description

Stress buffer piece die

Technical Field

The application relates to the technical field of molds, in particular to a stress buffer piece mold.

Background

At present, stress buffer piece molds used by domestic manufacturers are complex in structure, difficult to form, low in service life and high in cost. Accordingly, there is a need for improvements in the art that overcome the deficiencies in the prior art.

SUMMERY OF THE UTILITY MODEL

The application provides a stress buffering piece mould, can solve current pipe seat mould structure complicacy, the shaping difficulty, life is low, problem with high costs. The application provides the following technical scheme:

a stress buffer mold, comprising:

the fixed die assembly comprises a fixed die base plate and a fixed die plate fixedly connected with the fixed die base plate, wherein a positioning ring penetrating through the fixed die base plate is arranged at the central position of the fixed die base plate, a sprue corresponding to the central position of the positioning ring and a fixed die groove part sunken from one side of the fixed die plate to the inside of the fixed die plate are arranged on the fixed die plate, the fixed die assembly further comprises a fixed die core accommodated in the fixed die groove part, the fixed die core is fixed in the fixed die plate, and a first groove and a second groove are formed in the fixed die core;

the movable mould subassembly, include the movable mould bedplate, correspond and set up perpendicularly the cushion and the fixed connection of movable mould bedplate both sides the movable mould board of cushion, two the cushion with the movable mould bedplate the movable mould board encloses jointly and establishes into an accommodating space, the movable mould board is automatic movable mould board lateral the sunken movable mould concave part in inside of movable mould board, the movable mould subassembly still including accept in accommodating space's ejecting unit and accept in the movable mould benevolence of movable mould concave part, the last third recess that has of movable mould benevolence, on the fixed mould benevolence first recess the second recess with on the movable mould benevolence the cooperation of third recess is in order to form the molding cavity.

Optionally, the molding cavities include a main cavity and auxiliary cavities disposed in pairs on two sides of the main cavity.

Optionally, the second groove penetrates through the cavity insert vertically, the third groove includes a groove main body portion, the second groove is perpendicular to the groove main body portion, and the second groove and the groove main body portion form the main cavity.

Optionally, each of the auxiliary cavities includes an auxiliary cavity main body and two triangular cavities respectively located at two sides of the auxiliary cavity main body, and the two triangular cavities are arranged opposite to each other.

Optionally, the third groove further includes two groove lateral parts respectively located at two sides of the groove main body part, and the groove lateral parts and the fixed mold core form the auxiliary cavity main body.

Optionally, the first groove includes four triangular grooves, and each triangular groove and the movable die core form the triangular cavity.

Optionally, the second groove is of a cylindrical structure, and the inner diameter of the second groove is sequentially increased from top to bottom.

Optionally, the third groove further includes a groove support portion, and the groove support portion is formed with a support cavity located at the bottom of the main cavity and used for supporting the main cavity.

Optionally, the number of the support cavities is three, and the three support cavities are respectively located at two ends and the middle of the main cavity.

Optionally, the ejection unit includes an ejector pin push plate disposed close to the moving mold base plate, a push plate fixing plate fixedly connected to the ejector pin push plate, and an ejector pin penetrating through the push plate fixing plate and facing the fixed mold assembly

The beneficial effect of this application lies in: through the cooperation of first recess, second recess, third recess in order forming the shaping die cavity, simple structure can simplify mould processing technology flow, improves the efficiency of mould processing.

The foregoing description is only an overview of the technical solutions of the present application, and in order to make the technical solutions of the present application more clear and clear, and to implement the technical solutions according to the content of the description, the following detailed description is made with reference to the preferred embodiments of the present application and the accompanying drawings.

Drawings

FIG. 1 is an overall view of a stress buffer mold provided in one embodiment of the present application;

FIG. 2 is a top view of a stress buffer mold provided in accordance with an embodiment of the present application;

FIG. 3 is a cross-sectional view of a stress buffer mold provided in accordance with one embodiment of the present application;

FIG. 4 is a schematic view of a portion of a stress buffer mold according to an embodiment of the present application;

fig. 5 is a schematic structural diagram of a cavity insert according to an embodiment of the present disclosure;

fig. 6 is a schematic structural view of a cavity insert according to an embodiment of the present disclosure;

fig. 7 is a schematic structural diagram of a stress buffering member according to an embodiment of the present application.

Wherein: 100-stress buffer mold, 1-fixed mold assembly, 11-fixed mold seat plate, 12-fixed mold plate, 13-positioning ring, 14-gate, 15-fixed mold core, 151-first groove, 1511-triangular groove, 152-second groove, 2-movable mold assembly, 21-movable mold seat plate, 22-spacer, 23-movable mold plate, 24-housing space, 25-support rod, 26-movable mold core, 261-third groove, 2611-groove body part, 2612-groove side part, 2613-groove support part, 27-ejection unit, 271-ejector pin and push plate, 272-push plate fixing plate, 273-ejector pin, 28-reset unit, 281-reset rod, 282-spring, 3-fixed assembly, 31-fixed strip, 32-bolt, 4-guide component, 41-guide column, 42-guide sleeve, 5-stress buffer component, 51-buffer main body part, 511-first rod body, 512-second rod body, 52-buffer side part, 521-side body, 522-lug, 53-support column, 6-forming die cavity, 61-main die cavity, 62-auxiliary die cavity, 621-auxiliary die cavity body, 622-triangular die cavity and 63-support die cavity.

Detailed Description

The technical solutions of the present application will be described clearly and completely with reference to the accompanying drawings, and it should be understood that the described embodiments are only some embodiments of the present application, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

In the description of the present application, it is to be understood that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in the orientation or positional relationship indicated in the drawings for convenience in describing the present application and for simplicity in description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed in a particular orientation, and be operated in a particular manner, and are not to be considered limiting of the scope of the present application. Furthermore, the terms "first", "second", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first," "second," etc. may explicitly or implicitly include one or more of that feature. In the description of the invention of the present application, the meaning of "a plurality" is two or more unless otherwise specified.

In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art through specific situations.

The stress buffering piece is used for dispersing external force applied to the object after the external force is applied to the object by a foreign object, so that the object is prevented from being damaged due to the fact that the external force is too concentrated. As shown in fig. 7, the stress buffer 5 generally includes a buffer main body 51 and buffer side portions 52 located on both sides of the buffer main body 51. The buffer body 51 is composed of a first rod 511 and a second rod 512 perpendicular to each other. The buffering side portion 52 includes a side portion main body 521 and two protrusions 522 located at two sides of the side portion main body, and the side portion main body 521 is a long strip structure and perpendicular to the second rod 512. The bumps 522 are triangular structures, and the two bumps 522 are disposed oppositely. In addition, the stress buffering member 5 further includes a supporting pillar 53 located at the bottom of the second rod 512, and the supporting pillar 53 plays a supporting role. The three support columns 53 are respectively located at two ends and the middle part of the second rod body 512, so that the support stability of the stress buffer 5 is ensured.

Referring to fig. 1 to 7, a preferred embodiment of the present application provides a stress buffer mold. As shown in the figure, the stress buffer mold 100 at least comprises a fixed mold component 1, a movable mold component 2, a fixed component 3 and a guide component 4. The fixed die component 1 is opposite to the movable die component 2 in position and is used for matching and forming the stress buffering member 5. The guide assembly 4 is used for guiding the relative position of the movable mold assembly 2 and the fixed mold assembly 1, and ensures that no deviation occurs during mold closing so as to ensure the quality of the stress buffering member 5. When the stress buffer die 100 is used for manufacturing a product, the fixed die assembly 1 and the movable die assembly 2 are fixed through the fixing assembly 3, so that the fixed die assembly 1 and the movable die assembly 2 are mutually closed, and the internal original element of the stress buffer die 100 can be prevented from being damaged while the assembling precision of the stress buffer 5 is ensured.

Specifically, the stationary mold assembly 1 includes a stationary mold base plate 11 and a stationary mold plate 12 located below the stationary mold base plate 11. A positioning ring 13 penetrating through the fixed mold base plate 11 is arranged at the center of the fixed mold base plate 11, a sprue 14 corresponding to the positioning ring 13 and a fixed mold groove portion (not shown) recessed inwards from one side of the fixed mold plate 12 are arranged on the fixed mold plate 12, and the positioning ring 13 corresponds to a gun platform position on an injection molding machine (not shown) and is used for guiding the gun platform so that the injection molding machine can accurately inject rubber into the mold 100. The gate 14 is used to guide the injection molding compound into the interior of the mold 100.

The fixed die assembly 1 further comprises a fixed die core 15 accommodated in the groove part of the fixed die, and the fixed die core 15 is fixed in the fixed die plate 12. The cavity insert 15 has a first groove 151 and a second groove 152. The first groove 151 is located on a side facing the movable mold assembly 2, and the second groove 152 penetrates the core insert 15 up and down. In the embodiment, the second groove 152 is a cylindrical structure, and the inner diameter of the second groove 152 increases from top to bottom. The first groove 151 and the second groove 152 cooperate with the movable mold assembly 2 to form the molding cavity 6.

The movable mold assembly 2 comprises a movable mold base plate 21, cushion blocks 22 vertically arranged on two sides of the movable mold base plate 21 correspondingly, and a movable mold plate 23 fixedly connected with the cushion blocks 22, wherein the two cushion blocks 22, the movable mold base plate 21 and the movable mold plate 23 enclose a containing space 24 together. The movable die plate 23 has a movable die recess portion (not shown) recessed toward the inside of the movable die plate 23 from the side of the movable die plate 23.

In order to prevent the movable die plate 23 from deforming to affect the final product, in one embodiment, the movable die assembly 2 further includes four support rods 25 received in the receiving space 24 and used for supporting the movable die plate 23, and the four support rods 25 are respectively located on four corners of the receiving space 24.

The movable mold assembly 2 further comprises a movable mold core 26 accommodated in the groove portion of the movable mold. The movable mold core 26 has a third groove 261. The first groove 151 and the second groove 152 of the core insert 15 cooperate with the third groove 261 of the core insert 26 to form a molding cavity 6. Specifically, the molding cavity 6 includes a main cavity 61, sub-cavities 62 disposed in pairs on both sides of the main cavity 61, and a support cavity 63 at the bottom of the main cavity 61. Each secondary cavity 62 includes a secondary cavity main body 621 and two triangular cavities 622 respectively located at two sides of the secondary cavity main body 621, and the two triangular cavities 622 are disposed opposite to each other. The first groove 151 includes four triangular grooves 1511, and the four triangular grooves 1511 are arranged in a rectangular shape. The second groove 152 penetrates the cavity block 15 up and down. The third groove 261 includes a groove main body portion 2611 and two groove side portions 2612 respectively located at two sides of the groove main body portion 2611, the second groove 152 is perpendicular to the groove main body portion 2611, and the second groove 152 and the groove main body portion 2611 form a main cavity 61. The groove side portion 2612 and the fixed mold core 15 form the sub-cavity main body 621. Each triangular groove 1511 and the movable die core 26 form a triangular cavity 622.

In addition, the third groove 261 further includes a groove support part 2613, and the groove support part 2613 is formed with a support cavity 63 located at the bottom of the main cavity 61 and used to support the main cavity 61, the support cavity 63 being used to mold the support column 53 of the product. In order to improve the stability of the molded product, in the present embodiment, there are three supporting columns 53 respectively located at two ends and a middle portion of the product, and correspondingly, there are three supporting cavities 63, and the three supporting cavities 63 are respectively located at two ends and a middle portion of the main cavity 61.

It should be noted that the movable mold base plate 21, the cushion block 22 and the movable mold plate 23 are sequentially arranged from bottom to top, and the fixed mold base plate 11 and the fixed mold plate 12 are sequentially arranged from top to bottom, so that the fixed mold assembly 1 and the movable mold assembly 2 can be relatively matched.

The movable mold assembly 2 further includes an ejector unit 27 accommodated in the accommodating space 24. The ejector unit 27 includes an ejector plate 271 provided near the movable mold base plate 21, a plate fixing plate 272 fixedly connected to the ejector plate 271, and an ejector 273 provided through the plate fixing plate 272 and facing the stationary mold assembly 1. The injection molding machine is provided with ejector rods (not shown), the movable mold base plate 21 is provided with ejector rod through holes (not shown) matched with the ejector rods, and the ejector rods penetrate through the ejector rod through holes to be abutted against the ejector pin push plate 271, so that when the injection molding machine pushes the ejector rods, the ejector rods are pushed to sequentially push the ejector pin push plate 271 and the push plate fixing plate 272 to move along the movement direction of the ejector rods together. The ejector plate fixing plate 272 and the ejector plate 271 also define an end of the ejector 273 so that the ejector 273 can be pushed by the ejector rod to move toward the die assembly 1. The ejector pin 273 is engaged with the stress-inducing buffer 5 to be injected, so that the stress buffer 5 can be ejected from the cavity 26 after the mold 100 is opened.

The movable mold assembly 2 further comprises a reset unit 28, the reset unit 28 comprises a reset rod 281 and springs 282 sleeved on the reset rod 281, and the number of the reset rod 281 and the number of the springs 282 are four and are uniformly distributed on four corners of the push plate fixing plate 272. One end of the reset rod 281 is limited between the push plate fixing plate 272 and the thimble push plate 271, the other end can freely penetrate through the movable die plate 23 and abut against the fixed die plate 12, and the reset rod 281 is arranged around the thimble 273, so that the reset rod 281 can guide the push plate fixing plate 272, the thimble push plate 271 and the thimble 273, and the thimble 273 is prevented from moving obliquely and being damaged. The reset lever 281 may assist in pushing the stationary platen 12 when the ejector pins 273 push the product. When the mold 100 is opened, the ejector 273 is pushed out by the ejector pins of the injection molding machine, the product is taken out, the ejector pins retract, the ejector unit 27 can be reset by the elastic force of the spring 282, and the mold 100 is closed. However, when the spring 282 fails or the reset fails due to an external reason, the mold 100 is clamped, and the reset rod 281 can directly abut against the fixed mold plate 12, so as to prevent the ejector pin 273 from being directly acted by the clamping force, and further protect the ejector pin 273 from being damaged.

The guiding assembly 4 includes a guiding post 41 and a guiding sleeve 42 sleeved on the guiding post 41. The guide posts 41 are arranged to be four, are uniformly distributed at four corners of the fixed die base plate 11 and are limited between the fixed die base plate 11 and the movable die base plate 21. One end of the guide post 41 is engaged with the fixed mold base plate 11, and the other end thereof is freely inserted into the pad 22. The fixed die assembly 1 and the movable die assembly 2 are both provided with guide sleeves 42, and the guide sleeves 42 are correspondingly matched with the guide columns 41 and are uniformly distributed on 4 corners of the fixed die plate 12 and the movable die plate 23. When the mold 100 is opened, the guide posts 41 are separated from the guide sleeves 42 in the movable mold plate 23, the movable mold assembly 2 is far away from the fixed mold assembly 1, and when the mold 100 is closed, the guide posts 41 penetrate into the guide sleeves 42 in the movable mold plate 22.

The fixed assembly 3 comprises a fixed strip 31, fixing holes are formed in two ends of the fixed strip 31, and the bolt 32 fixes the fixed strip 31 on the fixed die plate 12 and the movable die plate 23 through the two fixing holes, so that the relative position of the fixed die assembly 1 and the movable die assembly 2 is unchanged.

The beneficial effect of this application lies in: through the cooperation of first recess, second recess, third recess in order forming the shaping die cavity, simple structure can simplify mould processing technology flow, improves the efficiency of mould processing.

The technical features of the above embodiments can be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the above embodiments are not described, but should be considered as the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the scope of the present application. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims (10)

1. A stress buffer mold, comprising:

the fixed die assembly comprises a fixed die base plate and a fixed die plate fixedly connected with the fixed die base plate, wherein a positioning ring penetrating through the fixed die base plate is arranged at the central position of the fixed die base plate, a sprue corresponding to the central position of the positioning ring and a fixed die groove part sunken from one side of the fixed die plate to the inside of the fixed die plate are arranged on the fixed die plate, the fixed die assembly further comprises a fixed die core accommodated in the fixed die groove part, the fixed die core is fixed in the fixed die plate, and a first groove and a second groove are formed in the fixed die core;

the movable mould subassembly, include the movable mould bedplate, correspond and set up perpendicularly the cushion and the fixed connection of movable mould bedplate both sides the movable mould board of cushion, two the cushion with the movable mould bedplate the movable mould board encloses jointly and establishes into an accommodating space, the movable mould board is automatic movable mould board lateral the inside of movable mould board is sunken to have the movable mould concave part, the movable mould subassembly still including accept in accommodating space's ejecting unit and accept in the movable mould benevolence of movable mould concave part, the movable mould has the third recess on the benevolence, on the fixed mould benevolence first recess the second recess with on the movable mould benevolence the cooperation of third recess is in order to form the molding cavity.

2. The stress buffer mold of claim 1, wherein the molding cavities comprise a primary cavity and a secondary cavity disposed in pairs on either side of the primary cavity.

3. The stress buffer mold of claim 2, wherein the second groove extends vertically through the cavity insert, the third groove includes a groove body, the second groove is perpendicular to the groove body, and the second groove and the groove body form the primary cavity.

4. The stress buffer mold of claim 3, wherein each of the secondary cavities comprises a secondary cavity body and two triangular cavities respectively located on opposite sides of the secondary cavity body, the two triangular cavities being disposed opposite each other.

5. The stress buffer mold of claim 4, wherein the third recess further comprises two recess lateral portions on either side of the recess body portion, the recess lateral portions and the stationary mold core forming the secondary cavity body.

6. The stress buffer mold of claim 5, wherein the first recess comprises four triangular recesses, each of the triangular recesses and the cavity insert forming the triangular cavity.

7. The stress buffer mold of claim 1, wherein the second groove is cylindrical and has an inner diameter that increases from top to bottom.

8. The stress buffer mold of claim 2, wherein the third groove further comprises a groove support portion formed with a support cavity at the bottom of the primary cavity for supporting the primary cavity.

9. The stress buffer mold of claim 8, wherein there are three support cavities, three support cavities being located at each end and in the middle of the primary cavity.

10. The stress buffer mold of claim 1, wherein the ejection unit comprises an ejector pin push plate disposed adjacent to the movable mold base plate, a push plate fixing plate fixedly connected to the ejector pin push plate, and an ejector pin penetrating the push plate fixing plate and disposed toward the fixed mold assembly.

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