CN215644969U

CN215644969U - Broadband filtering type chip antenna

Info

Publication number: CN215644969U
Application number: CN202121620287.XU
Authority: CN
Inventors: 庄肇堂; 赖浩宇
Original assignee: Walsin Technology Corp
Current assignee: Walsin Technology Corp
Priority date: 2021-07-16
Filing date: 2021-07-16
Publication date: 2022-01-25
Anticipated expiration: 2031-07-16

Abstract

A broadband filtering chip antenna is characterized in that a high-frequency module which feeds a signal into a chip is arranged on a substrate and is electrically connected among a high-frequency signal contact, a grounding contact and a high-frequency contact of the chip; when the signal passes through a first capacitor and a first inductor of a first-stage unit in the high-frequency module and a high-frequency capacitor and a high-frequency inductor electrically connected with the high-frequency contact, the signal forms resonance of the signal between a first-stage resonance circuit and a last-stage resonance circuit, so that the antenna can radiate broadband radio waves; the utility model changes the circuit design of the high-frequency module of the chip antenna to increase the bandwidth without increasing the size of the substrate due to the resonance circuit of multiple levels.

Description

Broadband filtering type chip antenna

Technical Field

A chip antenna, especially a broadband filtering chip antenna.

Background

The antenna is an indispensable component in modern wireless communication technologies, radio waves are communicated and transmitted through various types of antennas, and the design of the antenna on a circuit board affects the efficiency of a network connector for receiving a wireless network.

Wireless local area networks (Wi-Fi) are subject to the IEEE 802.11 standard specification, which has evolved in recent years from IEEE 802.11ac (Wi-Fi 5) to IEEE 802.11ax (Wi-Fi 6E). The frequency range of Wi-Fi 6E is increased by a high-frequency range of 5.15 to 7.125GHz in addition to 2.4GHz and 5GHz, so that the bandwidth is increased to improve the data transmission rate, and the efficiency of the networking electric appliance for connecting a wireless network is also improved.

However, as Wi-Fi upgrades, an existing antenna design on a circuit board may need to increase in size as bandwidth increases. The antenna on the conventional circuit board has a bandwidth that is not wide enough to transmit signals, for example, the antenna on the conventional circuit board can receive and transmit signals in a frequency band of about 5.15 to 5.85GHz, but cannot transmit signals in a high frequency band of about 5.85 to 7.125 GHz. In addition, the relative bandwidth of the Wi-Fi 6E high frequency specification exceeds 30%, and the relative bandwidth on the conventional circuit board for transmission in the frequency band of about 5.15 to 5.85GHz is about 13%, so that the antenna on the conventional circuit board has difficulty in achieving the broadband response.

A conventional antenna circuit includes a resonant circuit, which is a circuit that resonates in an LC circuit including an inductor and a capacitor. The resonance between an inductor and a capacitor is caused because a current which induces electromotive force is generated in the coil of the inductor when the magnetic field of the inductor disappears to charge the capacitor, the capacitor discharges because the capacitor is fully charged when the magnetic field of the inductor disappears, the discharged current causes the magnetic field of the inductor to store energy, and the magnetic field of the inductor repeats the action between the inductor and the capacitor along with the lapse of time when the discharged current ends to form resonance. The one-step number of the resonant circuit means that, when one more step number is added to increase a set of inductance and capacitance in the resonant circuit, the resonant frequency will be changed due to different inductance and capacitance combinations of the resonant element, and the resonant bandwidth will also be affected.

In order to increase the bandwidth, the antenna design on the conventional circuit board must extend the order of the resonant circuit in a resonant circuit structure to achieve a broadband response. As the order of the resonant circuit increases, the size of the resonant circuit increases, affecting the space available on the circuit board. In other words, to accommodate Wi-Fi upgrades, the antenna design on the existing circuit board forces the circuit board to increase in size to accommodate the next more resonant circuit order. However, the size of the circuit board is fixed after production, and the size change caused by the increase of the bandwidth is not convenient.

As shown in fig. 12, for example, in a conventional Wi-Fi 5 dual-band chip antenna equivalent circuit, a signal is fed from a signal feeding terminal F, and then a low-frequency signal is formed through a low-frequency line LB and output to a low-frequency load R_L1The signal will also pass through a high frequency line HB to form a high frequency signal, and output to a high frequency load R_H1. The low-frequency circuit LB comprises a low-frequency capacitor C connected in series_L1And a low frequency inductor L_L1The high-frequency circuit HB comprises a high-frequency capacitor C connected in series_H1And a high-frequency inductor L_H1. When the conventional Wi-Fi 5 dual-band chip antenna equivalent circuit is used to solve the problem that the high-frequency bandwidth is not wide enough, the number of high-frequency capacitors and high-frequency inductors in the high-frequency line HB needs to be increased to achieve broadband response. Therefore, the high-frequency line HB is forced to increase in size due to the additional high-frequency capacitance and high-frequency inductance.

In general, the high-frequency capacitor C_L1And a high-frequency capacitor C_H1The equivalent circuit of the traditional Wi-Fi 5 dual-frequency chip antenna is arranged on a Low Temperature Co-fired Ceramic (LTCC) chip. At present, although a part of circuit space is saved, the method is only limited to a first-order resonant circuit. But to fit Wi-Fi 6E broadband specifications, first orderThe resonant circuit of (a) has to be upgraded to a resonant type antenna of order N. Under the condition that the size and the circuit of the LTCC chip are not changed, the area of a capacitor and an inductor of a corresponding order of a resonant circuit is required to be greatly increased outside the LTCC chip, so that the size of the high-frequency circuit HB of the circuit board is forced to be increased.

SUMMERY OF THE UTILITY MODEL

In view of the above problems, the present invention provides a broadband filtering chip antenna, which can increase the order of the resonant circuit to achieve broadband response in conjunction with the upgrade of wireless local area network (Wi-Fi) without increasing the size of a substrate.

The broadband filtering chip antenna is a chip arranged on a substrate. The utility model discloses a broadband filtering chip antenna, which comprises a high-frequency module and a low-frequency module, wherein the low-frequency module comprises a low-frequency capacitor, the low-frequency capacitor is electrically connected between a low-frequency signal contact and a low-frequency contact, and the high-frequency module is electrically connected between a high-frequency signal contact, a grounding contact and a high-frequency contact.

Preferably, the broadband filtering chip antenna as described above, wherein the high frequency module includes:

a first stage unit electrically connected to the high frequency signal contact;

one end of the high-frequency capacitor is electrically connected with the grounding contact, and the other end of the high-frequency capacitor is electrically connected with the high-frequency contact and the first stage unit.

Preferably, as mentioned above, the wideband filtering chip antenna, wherein the first stage unit of the high frequency module includes a first capacitor and a first inductor connected in series in sequence;

wherein, one end of the first capacitor is connected with the first inductor, and the other end is connected with the high-frequency signal contact;

wherein, the connection point of the high-frequency capacitor and the high-frequency contact is further connected with the first inductor.

Preferably, the broadband filtering chip antenna as described above, wherein the high frequency module further comprises:

the second-order unit comprises a second capacitor and a second inductor which are arranged in parallel, and a third capacitor and a third inductor which are sequentially connected in series;

one end of the third capacitor is connected with the first inductor, and the other end of the third capacitor is connected with the third inductor; one end of the third inductor is connected with the third capacitor, and the other end of the third inductor is electrically connected with a connection point of the high-frequency capacitor and the high-frequency contact;

the second capacitor and the second inductor after being connected in parallel are electrically connected between the connection point of the first inductor and the third capacitor and the grounding contact.

Preferably, the wideband filtering chip antenna as described above, wherein the first stage unit of the high frequency module includes:

a first capacitor; and

the first inductor is connected with the first capacitor in parallel, and the first capacitor and the first inductor which are connected in parallel are electrically connected between the high-frequency signal contact and the grounding contact;

a first admittance transformer;

wherein the connection point of the high-frequency capacitor and the high-frequency contact is connected to the connection point of the first capacitor, the first inductor and the high-frequency signal contact after being connected in parallel through the first admittance converter.

the second-order unit comprises a second capacitor, a second inductor and a second admittance converter which are arranged in parallel;

one end of the second admittance converter is connected with the first admittance converter, and the other end of the second admittance converter is electrically connected with a connection point of the high-frequency capacitor and the high-frequency contact;

the second capacitor and the second inductor which are connected in parallel are electrically connected between the connection point of the first admittance converter and the second admittance converter and the grounding contact.

Preferably, the broadband filtering chip antenna as described above, wherein the high frequency signal contact receives a high frequency signal through an antenna;

wherein the first stage unit comprises:

a transmission line, and the length of the transmission line is less than or equal to 1/2 of a wavelength of the high frequency signal; wherein the transmission line is electrically connected between the high-frequency signal contact and the ground contact;

an admittance converter; wherein the connection point of the high-frequency capacitor and the high-frequency contact is connected to the connection point of the transmission line and the high-frequency signal contact through the admittance converter.

a first stage unit electrically connected to the high frequency signal contact and the ground contact;

one end of the high-frequency capacitor is electrically connected with the first stage unit, and the other end of the high-frequency capacitor is electrically connected with the high-frequency contact.

a first capacitor; and

wherein the connection point of the first capacitor and the first inductor connected in parallel and the high-frequency signal contact is further electrically connected to the high-frequency capacitor.

the second-order unit comprises a second capacitor and a second inductor which are sequentially connected in series, and a third capacitor and a third inductor which are arranged in parallel;

wherein, one end of the second capacitor is connected with the second inductor, and the other end is connected with the high-frequency signal contact; one end of the second inductor is connected with the second capacitor, and the other end of the second inductor is connected with the third capacitor and the third inductor;

the third capacitor and the third inductor which are connected in parallel are electrically connected between the second inductor and the grounding contact;

and the third capacitor and the connection point of the third inductor and the second inductor after parallel connection are further electrically connected to the high-frequency capacitor.

Preferably, the wideband filtering chip antenna as described above, wherein the first stage unit of the high frequency module includes a first capacitor, a first inductor, and a first impedance transformer connected in series in sequence;

one end of the first impedance converter is connected with the first inductor, and the other end of the first impedance converter is connected with the grounding contact;

wherein, the connection point of the first inductor and the first impedance transformer is further connected to the high-frequency capacitor.

the second-stage unit comprises a second capacitor, a second inductor and a second impedance converter which are sequentially connected in series;

one end of the second capacitor is connected between the first inductor and the first impedance converter, and the other end of the second capacitor is connected with the second inductor;

one end of the second impedance converter is connected with the second inductor, and the other end of the second impedance converter is connected with the grounding contact;

wherein, the connection point of the second impedance transformer and the second inductor is further electrically connected to the high-frequency capacitor.

wherein the first stage unit comprises a transmission line, and the length of the transmission line is less than or equal to 1/2 of a wavelength of the high frequency signal;

wherein the transmission line is electrically connected between the high-frequency signal contact and the ground contact;

wherein the connection point of the transmission line and the high-frequency signal contact is further electrically connected to the high-frequency capacitor.

The broadband filtering chip antenna has the advantages that the high-frequency module comprises a first-order unit and a high-frequency capacitor, compared with a traditional Wi-Fi 5 double-frequency chip antenna equivalent circuit, the broadband filtering chip antenna comprises a resonance type antenna equivalent circuit with at least two orders, the bandwidth of broadband radio waves is increased on the chip, and the trouble of increasing the size of the substrate is reduced.

Drawings

Fig. 1 is a plan view of a substrate according to a preferred embodiment of the present invention.

Fig. 2 is a block diagram of a wideband filtering chip antenna according to the present invention.

Fig. 3 is a diagram of an actual circuit structure of the wideband filter chip antenna according to the preferred embodiment of the present invention.

FIG. 4 is an equivalent circuit diagram of the broadband filtering chip antenna according to the preferred embodiment of the present invention.

FIG. 5 is a graph showing a simulated Return loss (Return loss) response according to the preferred embodiment of the present invention.

Fig. 6A is an equivalent circuit diagram of the high frequency module according to the preferred embodiment of the utility model.

Fig. 6B is an equivalent circuit diagram of the high frequency module according to the first embodiment of the utility model.

Fig. 7A is an equivalent circuit diagram of the high frequency module according to a second embodiment of the utility model.

Fig. 7B is an equivalent circuit diagram of a high frequency module according to a third embodiment of the utility model.

Fig. 8A is an equivalent circuit diagram of a high frequency module according to a fourth embodiment of the utility model.

Fig. 8B is an equivalent circuit diagram of the high frequency module according to a fifth embodiment of the utility model.

Fig. 8C is an equivalent circuit diagram of a high frequency module according to a sixth embodiment of the utility model.

Fig. 8D is an equivalent circuit diagram of a high frequency module according to a seventh embodiment of the utility model.

Fig. 9A is an equivalent circuit diagram of a high frequency module according to an eighth embodiment of the utility model.

Fig. 9B is an equivalent circuit diagram of a high frequency module according to a ninth embodiment of the utility model.

Fig. 10A is an equivalent circuit diagram of a high frequency module according to a tenth embodiment of the utility model.

Fig. 10B is an equivalent circuit diagram of a high frequency module according to an eleventh embodiment of the utility model.

Fig. 11A is an equivalent circuit diagram of a high frequency module according to a twelfth embodiment of the utility model.

Fig. 11B is an equivalent circuit diagram of a high frequency module according to a thirteenth embodiment of the utility model.

Fig. 11C is an equivalent circuit diagram of a high frequency module according to a fourteenth embodiment of the utility model.

Fig. 11D is an equivalent circuit diagram of a high frequency module according to a fifteenth embodiment of the utility model.

FIG. 12 is an equivalent circuit diagram of a conventional Wi-Fi 5 dual band chip antenna.

Detailed Description

The technical means adopted by the utility model to achieve the predetermined purpose of the utility model will be further described below with reference to the drawings and preferred embodiments of the utility model.

Referring to fig. 1, the present invention is a wideband filter chip antenna, which is a chip 2. The chip 2 is disposed on a substrate 1, and in a preferred embodiment of the present invention, the substrate 1 is as shown in fig. 1.

Referring to fig. 2 to 4, the wideband filter chip antenna of the present invention includes a high frequency module 30 and a low frequency module 40, where the low frequency module 40 includes a low frequency capacitor C_LAnd the low frequency capacitor C_LThe high frequency module 30 is electrically connected between a low frequency signal contact 203 and a low frequency contact 233, and the high frequency module is electrically connected between a high frequency signal contact 201, a ground contact 222 and a high frequency contact 211. In the preferred embodiment, the high frequency signal contact 201 and the low frequency signal contact 203 are common, i.e. the feed point of the antenna signal.

The above-mentioned contact points are the key points for the high frequency module 30 and the low frequency module 40 on the chip 2 to be connected to the substrate 1 to radiate radio waves. In detail, in the preferred embodiment, the substrate 1 includes a signal feed line 10, a high frequency signal line 11, a low frequency signal line 12, a ground terminal 22, a first ground block 14, and a second ground block 15.

The signal feed-in line 10 is electrically connected to the high frequency module 30 and the low frequency module 40 of the chip 2 at a feed-in terminal 20 through the low frequency signal contact 203 and the high frequency signal contact 201. The high frequency signal line 11 is electrically connected to the high frequency module 30 at a high frequency terminal 21 through the high frequency contact 211. The low frequency signal line 12 is electrically connected to the low frequency module 40 at a low frequency end 23 through the low frequency contact 233. The ground terminal 22 is electrically connected to the ground contact 222, and the ground contact 222 is electrically connected to a ground of a chip.

In addition, in the preferred embodiment, the high frequency signal line 11 further passes through a high frequency inductor L_HElectrically connected to the first ground block 14, and the low-frequency signal line 12 further passes through a low-frequency inductor L_LElectrically connected to the second ground block 15.

The substrate 1 transmits a signal 4 to the chip 2 through a signal feed-in line 10. The signal 4 forms a low frequency signal through the low frequency module 40, and the low frequency signal is generated in the low frequency module 40, the low frequency signal line 12, and the low frequency inductor L_LAnd the second ground block 15, and output to a low frequency load R_L. In contrast, the signal 4 forms a high frequency signal via the high frequency module 30, and the high frequency signal is generated in the high frequency module 30, the high frequency signal line 11, and the high frequency inductor L_HAnd the first ground block 14, and output to a high frequency load R_H。

The low frequency signal and the high frequency signal will generate a low frequency and a high frequency of a radio wave respectively when oscillating. In the preferred embodiment, the radio waves are radio waves of a wireless local area network (Wi-Fi), and the low frequency is in a frequency band of about 2.4GHz and the high frequency is in a frequency band above 5 GHz. The efficacy of the present invention in the preferred embodiment will be discussed later in the specification.

As shown in fig. 1, the chip 2 forms an antenna clearance 16 on the substrate 1, and maintaining a clearance length L and a clearance width W of the antenna clearance 16 does not change to one of the advantages of the present invention. Since the conventional antenna chip needs to increase the order of the resonant circuit on the substrate 1 to increase the bandwidth by increasing the length L of the clearance area to put the increased order of the resonant circuit into the substrate 1, the present invention can increase the order of the resonant circuit without changing the size of the substrate 1. The order of the resonant circuit is, as described in the prior art, increased by one order, an inductance and a capacitance of a resonance, and the bandwidth is increased because the resonance mode is changed, so that the resonance frequency and the bandwidth are changed due to the matching change of the capacitance and the inductance of the resonance structure. When the order of the resonant circuit is increased, the conventional antenna chip needs to increase at least one capacitor and at least one inductor so as to extend the distance between the high-frequency signal line 11 and the first ground block 14. When the order of the resonance circuit is increased, the chip 2 is only updated, and the size of the substrate 1 is not required to be increased.

Fig. 2 is a block diagram of the wideband filter chip antenna according to the present invention, which is only schematic, and fig. 3 is a diagram of an actual circuit structure of the wideband filter chip antenna, which is electrically connected to the substrate 1 of fig. 1 through a contact.

FIG. 4 is an equivalent circuit diagram of FIG. 3. in the preferred embodiment, the high frequency module 30 further includes a first stage unit 301 and a high frequency capacitor C_H. The first stage unit 301 is electrically connected to the high frequency signal contact 201 and the high frequency capacitor C_HOne end of the first stage unit is electrically connected to the ground contact 222, and the other end is electrically connected to the high frequency contact 211 and the first stage unit 301.

In detail, in the preferred embodiment, the first stage unit 301 further comprises a first capacitor C connected in series in sequence₁And a first inductor L₁. Wherein the first capacitor C₁One end of the first capacitor is connected to the high frequency signal contact 201 and the first capacitor C₁Is connected with the first inductor L at the other end₁The first inductor L₁One end of which is connected with the first capacitor C₁The first inductor L₁The other end of the high-frequency capacitor C is connected with_HAnd a connection point with the high frequency contact 211.

In comparison with the prior art of FIG. 12, the present invention provides the first capacitor C connected in series in the first stage unit 301 of the high frequency module 30 in FIG. 4₁And the first inductor L₁And the high-frequency capacitor C connected in parallel_HAnd the high-frequency inductor L_HThe electrical connection forms a second-order resonant circuit, and the present invention can make embodiment changes of different circuit designs in the high-frequency module 30 on the chip 2, so that the present invention can form more than two-order resonant circuits. The conventional resonant antenna cannot be retrofitted to the chip 2, so that the conventional technique of fig. 12 cannot easily make circuit design changes, and the substrate 1 needs to be increased in size as described above.

Under the condition that the society pursues network efficiency nowadays, Wi-Fi is subject to the specification of IEEE 802.11 standard, and the frequency is increased from IEEE 802.11ac (Wi-Fi 5) to IEEE 802.11ax (Wi-Fi 6E). The Wi-Fi 6E also adds a high-frequency band range of 5.15 to 7.125GHz in addition to 2.4GHz and 5 GHz. The high frequency of the broadband radio wave represents the greater amount of data that the broadband radio wave can transmit per unit time, so the high frequency portion of the broadband radio wave represents the most significant performance of a chip antenna.

Referring to fig. 5, fig. 5 is a graph showing a simulated Return loss (Return loss) response of the preferred embodiment of the present invention, which can verify the performance of the present invention. The dotted line portion in fig. 5 represents the return loss response of each frequency of the conventional resonant antenna, and the solid line portion represents the return loss response of the preferred embodiment of the present invention. The fold return loss is the value of the incident power divided by the reflected power on a logarithmic scale (log scale). If-6 decibel (dB) is used as a comparison standard, when the return loss is less than-6 dB, it represents that the frequency band can be used as Wi-Fi, because the less loss represents that Wi-Fi can be used with stronger signal. As shown in fig. 4, the conventional resonant antenna and the preferred embodiment of the present invention have almost the same return loss response at 2.4GHz, but above 5GHz, the frequency band of less than-6 db of the conventional resonant antenna is about 5.15 to 5.85GHz, and the frequency band of less than-6 db of the preferred embodiment of the present invention is about 5.15 to 7.2 GHz. This means that the present invention enjoys a wider high frequency bandwidth, with a foldback loss of less than-6 db for use by Wi-Fi.

Comparing the conventional resonant antenna with the preferred embodiment of the present invention, the fractional bandwidth can also be used to calculate the performance of the antenna above 5 GHz. The proportional bandwidth is also called relative bandwidth, and the calculation method of the proportional bandwidth is as follows:

ratio bandwidth ═ (highest frequency of band-lowest frequency of band)/(central frequency of band)

And the center frequencies used are:

the center frequency of a band (highest frequency of the band + lowest frequency of the band)/2

Applying the information of fig. 5 to this, the conventional first-order resonance type antenna:

the proportional bandwidth is (5.85GHz-5.15GHz)/((5.85GHz +5.15GHz)/2) ≈ 12.73%

The preferred embodiment of the present invention:

the ratio bandwidth is (7.2GHz-5.15GHz)/((7.2GHz +5.15GHz)/2) ≈ 33.20%

Therefore, the relative bandwidth of the preferred embodiment of the present invention is greater than 30% and greater than about 13% of the relative bandwidth of the conventional resonant antenna, so the performance of the preferred embodiment of the present invention is better. This demonstrates that the present invention provides at least a second order resonant circuit in the high frequency module 30 of the chip 2 with a performance that meets design goals for use with Wi-Fi 6E.

Referring to FIG. 6A, FIG. 6A is a circuit diagram of the high frequency signal according to the preferred embodiment of the present invention, which is the focus of the present invention. The present invention has at least a second-order resonance circuit because the high-frequency capacitor C in the high-frequency module 30 is a first-order resonance circuit in addition to the first-order unit 301_HAnd the high-frequency inductor L outside the high-frequency module 30_HTo another orderA resonant circuit. That is, in the preferred embodiment, the first stage unit 301 is a first stage resonant circuit and is electrically connected to the high frequency capacitor C of the high frequency contact 211_HAnd the high-frequency inductor L_HI.e. a last-order resonant circuit, the present invention has at least a second-order resonant circuit. The high-frequency inductor L_HIs provided on the substrate 1 because of this convenience by adjusting the high-frequency inductance L_HThe frequency of the high frequency is adjusted. The low frequency inductor L_LThe reason why it is disposed on the substrate 1 is that it is convenient to adjust the low frequency inductor L_LThe frequency of the low frequency is adjusted. In addition, the high-frequency inductor L_HAnd the high-frequency load R_HIn parallel between the high frequency contact 211 and a ground. The ground is different from the ground of the chip 2 electrically connected to the ground contact 222 because the ground is located outside the chip 2. Theoretically, the ground and the ground contact 222 should be electrically connected together to form a total ground, but in practice, the ground and the ground contact 222 are not necessarily electrically connected together, so the present specification will distinguish between the two.

In addition to the preferred embodiment, the present invention can also be used to make a series of the first stage unit 301 and the high frequency capacitor C in the high frequency module 30_HIs changed in form to fit the high-frequency inductor L_HAnd the high-frequency load R_HThe form of (a) varies. The following first to fifteenth embodiments are the first stage unit 301 and the high-frequency capacitor C in the high-frequency module 30 according to the present invention_HThe variation pattern of (2).

Referring to fig. 6B, in a first embodiment of the present invention, the circuit of fig. 6A is added to a circuit including a plurality of cells, i.e., a resonant circuit of more than two orders. Fig. 6B shows only a second level cell 302 as a representative of the newly added cells, since the newly added cells will be identical in form to the second level cell 302.

In the first embodiment, the second stage unit 302 includes a second capacitor C connected in parallel₂And a second inductor L₂And a third capacitor C connected in series₃And aThird inductance L₃. Wherein the third capacitor C₃One end of which is connected with the first inductor L₁The third capacitor C₃Is connected with the third inductor L₃And the third inductance L₃One end of which is connected with the third capacitor C₃The third inductor L₃The other end of the capacitor is electrically connected with the high-frequency capacitor C_HAnd a connection point with the high frequency contact 211. In addition, the second capacitor C after being connected in parallel₂And the second inductor L₂Electrically connected to the first inductor L₁And the third capacitor C₃And the ground contact 222.

Referring to FIG. 7A, in a second embodiment of the present invention, the first stage unit 301 is also electrically connected to the high frequency signal contact 201, and the high frequency capacitor C_HOne end of the high-frequency capacitor C is also electrically connected to the ground contact 222_HThe other end of the first stage unit 301 is also electrically connected to the high frequency contact 211.

In the second embodiment, the first stage unit 301 of the high frequency module 30 includes the first capacitor C₁And the first inductor L₁The first capacitors C are arranged in parallel₁And the first inductor L₁Electrically connected between the high frequency signal contact 201 and the ground contact 222. The first stage unit 301 further comprises a first admittance converter (J-Inverter) J₁For converting the subsequent series-parallel resonance, wherein the high-frequency capacitor C_HThe connection point with the high frequency junction 211 is via the first admittance transformer J₁Is connected to the first capacitor C after being connected in parallel₁And the first inductor L₁A connection point with the high frequency signal contact 201.

Referring to FIG. 7B, in a third embodiment of the present invention, the circuit of the second embodiment of FIG. 7A is added to a circuit including a plurality of cells. Fig. 7B shows only a second level cell 302 as a representative of the newly added cells, since the newly added cells will be identical in form to the second level cell 302.

In the third embodiment, the high frequency module further includes the firstA second-stage unit 302, wherein the second-stage unit 302 includes the second capacitor C arranged in parallel₂And the second inductor L₂And a second admittance converter J₂. Wherein the second admittance converter J₂Is connected to the first admittance transformer J₁The second admittance converter J₂The other end of the capacitor is electrically connected with the high-frequency capacitor C_HAnd a connection point with the high frequency contact 211. The second capacitor C connected in parallel₂And the second inductor L₂Electrically connected to the first admittance transformer J₁And the second admittance converter J₂And the ground contact 222. In the second embodiment and the third embodiment, an admittance converter is equivalent to a capacitor in an equivalent circuit.

Referring to fig. 8A to 8D, in a fourth to seventh embodiments of the present invention, the first stage unit 301 is electrically connected to the high frequency signal contact 201, and the high frequency capacitor C_HOne end of the high-frequency capacitor C is electrically connected to the ground contact 222_HThe other end of the first stage unit 301 is electrically connected to the high frequency contact 211. The resonant circuit of the present invention is not limited to a circuit composed of an inductor and a capacitor, but also can be composed of a section of transmission line, so the resonant circuit is generally called as a resonant circuit.

In the fourth embodiment of fig. 8A, the first stage unit 301 of the high frequency module 30 includes a transmission line and the first admittance transformer J₁. The transmission line is a variation of a parallel resonant structure, and the admittance converter is used to convert the subsequent series-parallel resonance as described above. Wherein the transmission line is electrically connected between the high frequency signal contact 201 and the ground contact 222. The high-frequency capacitor C_HThe connection point with the high frequency junction 211 is via the first admittance transformer J₁Is connected to the connection point of the transmission line and the high frequency signal contact 201. Wherein the length of the transmission line is 1/4 of a wavelength of the high frequency signal.

In a fifth embodiment of fig. 8B, the first stage unit 301 of the high frequency module 30 comprises a transmission line, a capacitor C and the first admittance transformer J₁. And the transmissionOne end of the wire is electrically connected to the high frequency signal contact 201 and the first admittance transformer J₁And the other end of the transmission line is connected to the ground connection 222 through the capacitor C, which effectively shortens the length of the resonant transmission line. The high-frequency capacitor C_HThe connection point with the high frequency junction 211 is via the first admittance transformer J₁Is connected to the connection point of the transmission line and the high frequency signal contact 201. Wherein the length of the transmission line is less than 1/4 of the wavelength of the high-frequency signal.

In a sixth embodiment of fig. 8C, the first stage unit 301 comprises a transmission line and the first admittance transformer J₁. One end of the transmission line is electrically connected to the high-frequency signal contact 201 and the first admittance transformer J₁The other end of the transmission line is open-circuited between the connection points. The high-frequency capacitor C_HThe connection point with the high frequency junction 211 is via the first admittance transformer J₁Is connected to the connection point of the transmission line and the high frequency signal contact 201. Wherein the length of the transmission line is 1/2 of the wavelength of the high frequency signal.

In the seventh embodiment of fig. 8D, the first stage unit 301 of the high frequency module 30 includes a transmission line, the capacitor C and the first admittance transformer J₁. One end of the transmission line is electrically connected to the high-frequency signal contact 201 and the first admittance converter J via the capacitor C₁And the other end of the transmission line is open. The high-frequency capacitor C_HThe connection point with the high frequency junction 211 is via the first admittance transformer J₁Is connected to the connection point of the transmission line and the high frequency signal contact 201. Wherein the length of the transmission line is less than 1/4 of the wavelength of the high-frequency signal.

Referring to fig. 9A, in the eighth embodiment of the present invention, the first stage unit 301 is electrically connected to the high frequency signal contact 201 and the ground contact 222, and the high frequency capacitor C_HOne end of the first stage unit 301 is electrically connected to the high-frequency capacitor C_HAnd the other end thereof is electrically connected to the high frequency contact 211.

The first order of the high frequency module 30Element 301 comprises the first capacitance C₁And the first inductor L₁The first capacitors C are arranged in parallel₁And the first inductor L₁Electrically connected between the high frequency signal contact 201 and the ground contact 222. In addition, the first capacitor C after being connected in parallel₁And the first inductor L₁The connection point with the high frequency signal contact 201 is further electrically connected to the high frequency capacitor C_H. The high-frequency capacitor C_HElectrically connected to the high-frequency contact 211, and the high-frequency contact 211 is sequentially connected in series with the high-frequency inductor L_HAnd the high-frequency load R_HTo the ground. As described above, the ground is the ground of the substrate 1, and is not necessarily the ground of the ground contact 222.

Referring to fig. 9B, in a ninth embodiment of the present invention, the circuit of the eighth embodiment of fig. 9A is added to a circuit including a plurality of cells. Fig. 9B shows only a second level cell 302 as representative of the newly added cells, since the newly added cells will be of the same form as the second level cell 302. The second stage unit 302 includes the second capacitor C connected in series₂And the second inductor L₂And comprising the third capacitor C arranged in parallel₃And the third inductor L₃. Wherein the second capacitor C₂One end of which is connected with the second inductor L₂The second capacitor C₂The other end of the second inductor L is connected to the high frequency signal contact₂One end of which is connected with the second capacitor C₂The second inductance L₂Is connected with the third capacitor C at the other end₃And the third inductor L₃. In addition, the third capacitor C after being connected in parallel₃And the third inductor L₃Electrically connected to the second inductor L₂And the third capacitor C connected in parallel between the ground contact 222₃And the third inductor L₃And the second inductor L₂Is further electrically connected to the high-frequency capacitor C_H。

Referring to fig. 10A, in a tenth embodiment of the present invention, the first stage unit 301 is also electrically connected to the high frequency signal contact 201 and the ground contact 222, and the high frequency capacitor C_HOne end of the first stage unit 301 is electrically connected to the high-frequency capacitor C_HAnd the other end thereof is also electrically connected to the high frequency contact 211.

The first stage unit 301 of the high frequency module 30 comprises the first capacitors C connected in series₁The first inductor L₁A first impedance converter (K-Inverter) K₁The impedance transformer is used for converting the following series-parallel resonance. Wherein the first capacitor C₁One end of which is connected with the first inductor L₁The first capacitor C₁The other end is connected to the high frequency signal contact 201. The first impedance converter K₁One end of which is connected with the first inductor L₁The first impedance converter K₁And the other end thereof is connected to the ground contact 222. The first inductor L₁And the first impedance converter K₁Is further connected to the high-frequency capacitor C_H。

Referring to fig. 10B, in an eleventh embodiment of the present invention, the circuit of the tenth embodiment shown in fig. 10A is added to a circuit including a plurality of cells. FIG. 10B shows only a second level cell 302 as representative of the newly added cells, since the newly added cells will be identical in form to the second level cell 302.

In the eleventh embodiment, the high frequency module 30 further includes the second stage unit 302, and the second stage unit 302 includes the second capacitor C connected in series in sequence₂And the second inductor L₂And a second impedance converter K₂. Wherein the second capacitor C₂One end of which is connected to the first inductor C₁And the first impedance converter K₁Between, a second capacitance C₂Is connected with the second inductor L at the other end₂. The second impedance converter K₂One end of which is connected with the second inductor L₂The second impedance converter K₂And the other end thereof is connected to the ground contact 222. The second impedance converter K₂And the second inductor L₂Is further electrically connected to the high-frequency capacitor C_H. Wherein an impedance transformer of the tenth and eleventh embodiments is equal toThe effective circuit is equivalent to an inductor.

Referring to fig. 11A and 11B, in a twelfth embodiment and a thirteenth embodiment of the utility model, the first stage unit 301 is electrically connected to the high-frequency signal contact 201 and the ground contact 222, and the high-frequency capacitor C_HOne end of the first stage unit 301 is electrically connected to the high-frequency capacitor C_HAnd the other end thereof is electrically connected to the high frequency contact 211.

In the twelfth embodiment of fig. 11A, the first stage unit 301 is a transmission line, which is a modification of a parallel resonant structure. The length of the transmission line is 1/4 of the wavelength of the high-frequency signal.

In the thirteenth embodiment of fig. 11B, the first stage unit 301 is a transmission line and the capacitor C. One end of the transmission line is connected to the high-frequency signal contact 201 and the high-frequency capacitor C_HThe other end of the transmission line is electrically connected to the ground contact 222 through the capacitor C. Wherein, the length of the transmission line is less than 1/4 of the wavelength of the high frequency signal because the capacitor C can effectively shorten the length required by the transmission line.

Referring to fig. 11C to 11D, in a fourteenth embodiment and a fifteenth embodiment of the present invention, the first stage unit 301 is electrically connected to the high frequency signal contact 201 only, and the high frequency capacitor C_HOne end of the first stage unit 301 is electrically connected to the high-frequency capacitor C_HAnd the other end thereof is electrically connected to the high frequency contact 211.

In the fourteenth embodiment of fig. 11C, the first stage unit 301 is an open transmission line. The length of the transmission line is 1/2 of the wavelength of the high-frequency signal, and one end of the transmission line is electrically connected to the high-frequency signal contact 201 and the high-frequency capacitor C_HThe other end of the transmission line is open.

In the fifteenth embodiment of fig. 11D, the first stage unit 301 is a transmission line and the capacitor C. Because the capacitor C can effectively shorten the length of the transmission line, the length of the transmission line is less than 1/2 of the wavelength of the high-frequency signal, and one end of the transmission line is electrically connected with the high-frequency signal contact 201 and the high-frequency signal through the capacitor CCapacitor C_HThe other end of the transmission line is open.

In the above embodiments, when one end of the transmission line is open, the transmission lines are each an end of an electronic oscillation path in the antenna, that is, when electrons oscillate back and forth in the antenna to generate radio waves, the electrons stop moving and flow back when the electrons move to the open circuit of the transmission line.

Although the present invention has been described with reference to the preferred embodiments, it should be understood that various changes, substitutions and alterations can be made herein without departing from the spirit and scope of the utility model as defined by the appended claims.

Claims

1. A broadband filtering chip antenna, comprising:

a high frequency signal contact;

a ground contact;

a high frequency contact;

a high frequency module electrically connected among the high frequency signal contact, the ground contact and the high frequency contact;

a low frequency signal contact;

a low frequency contact;

and the low-frequency module comprises a low-frequency capacitor, and the low-frequency capacitor is electrically connected between the low-frequency signal contact and the low-frequency contact.

2. The wideband filtered chip antenna according to claim 1, wherein the high frequency module comprises:

a first stage unit electrically connected to the high frequency signal contact;

3. The wideband filtered chip antenna according to claim 2, wherein the first stage unit of the high frequency module comprises a first capacitor and a first inductor connected in series in sequence;

4. The wideband filtered chip antenna according to claim 3, wherein the high frequency module further comprises:

5. The wideband filtered chip antenna according to claim 2, wherein the first stage unit of the high frequency module comprises:

a first capacitor; and

a first admittance transformer;

6. The wideband filtered chip antenna according to claim 5, wherein the high frequency module further comprises:

7. The wideband filtering chip antenna according to claim 2, wherein the high frequency signal contact receives a high frequency signal through an antenna;

wherein the first stage unit comprises:

8. The wideband filtered chip antenna according to claim 1, wherein the high frequency module comprises:

9. The wideband filtered chip antenna according to claim 8, wherein the first stage unit of the high frequency module comprises:

a first capacitor; and

10. The wideband filtered chip antenna according to claim 9, wherein the high frequency module further comprises:

11. The wideband filtered chip antenna as claimed in claim 8, wherein the first stage unit of the high frequency module comprises a first capacitor, a first inductor, a first impedance transformer connected in series in sequence;

12. The wideband filtered chip antenna according to claim 11, wherein the high frequency module further comprises:

13. The wideband filtered chip antenna as claimed in claim 8, wherein the high frequency signal contact receives a high frequency signal through an antenna;