CN215644486U - Photoelectric sensor - Google Patents
Photoelectric sensor Download PDFInfo
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- CN215644486U CN215644486U CN202122101124.7U CN202122101124U CN215644486U CN 215644486 U CN215644486 U CN 215644486U CN 202122101124 U CN202122101124 U CN 202122101124U CN 215644486 U CN215644486 U CN 215644486U
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Abstract
The present invention relates to a photoelectric sensor. The photoelectric sensor includes: the light-emitting device comprises a printed circuit board, a photosensitive chip, a conductive adhesive and a light-emitting piece; the photosensitive chip is positioned on the printed circuit board; wherein the photosensitive chip is formed with a photosensitive area and a non-photosensitive area; the photosensitive chip comprises a first substrate, a first bonding pad and a conductive bump, wherein the first substrate is positioned on the printed circuit board, the first bonding pad is positioned on one side of the first substrate, which is back to the printed circuit board, and the conductive bump is positioned on one side of the first bonding pad, which is back to the first substrate; the first bonding pad and the conductive bump are positioned in the non-photosensitive area; the conductive adhesive is positioned on one side of the first bonding pad, which is opposite to the first substrate, and covers the conductive bump; the light-emitting piece is positioned on the conductive adhesive and positioned on one side of the conductive adhesive back to the first bonding pad, and the light-emitting piece is electrically connected with the photosensitive chip through the conductive adhesive, the conductive bump and the first bonding pad. According to the embodiment of the present invention, the size of the photosensor is reduced.
Description
Technical Field
The application relates to the technical field of sensors, in particular to a photoelectric sensor.
Background
In the related art, the photoelectric sensor includes a circuit adapter plate, a light-emitting chip and a photosensitive chip, wherein the light-emitting chip and the photosensitive chip are respectively located on the circuit adapter plate, and a certain distance exists between the light-emitting chip and the photosensitive chip. The photoelectric sensor of this structure is limited in product size reduction and cannot meet the demand for miniaturization.
SUMMERY OF THE UTILITY MODEL
The present invention provides a photoelectric sensor to solve the disadvantages of the related art.
According to a first aspect of embodiments of the present invention, there is provided a photosensor including:
a printed circuit board;
the photosensitive chip is positioned on the printed circuit board; the photosensitive chip is provided with a photosensitive area and a non-photosensitive area; the photosensitive chip comprises a first substrate, a first bonding pad and a conductive bump, wherein the first substrate is positioned on the printed circuit board, the first bonding pad is positioned on one side of the first substrate, which is back to the printed circuit board, and the conductive bump is positioned on one side of the first bonding pad, which is back to the first substrate; the first bonding pad and the conductive bump are positioned in the non-photosensitive area;
the conductive adhesive is positioned on one side, back to the first substrate, of the first bonding pad and covers the conductive bump;
and the light-emitting piece is positioned on the conductive adhesive and positioned on one side of the conductive adhesive, which is back to the first bonding pad, and the light-emitting piece is electrically connected with the photosensitive chip through the conductive adhesive, the conductive bump and the first bonding pad.
In one embodiment, the conductive bump is a metal bump.
In one embodiment, the material of the conductive bump is gold.
In one embodiment, the conductive bump includes a bump structure and a plating layer, the plating layer covers the bump structure, the bump structure is made of copper, and the plating layer is made of gold.
In one embodiment, the conductive adhesive is a cured silver paste.
In one embodiment, the silver paste includes a liquid binder and silver particles.
In one embodiment, the material of the first bonding pad is aluminum or gold or copper.
In one embodiment, the light emitting member includes a second substrate and a first electrode between the conductive adhesive and the second substrate;
the material of the second substrate is gallium arsenide.
In one embodiment, the photoelectric sensor further comprises a transparent packaging layer, wherein the transparent packaging layer is located on the printed circuit board and wraps the photosensitive chip, the conductive adhesive and the light emitting piece.
In one embodiment, the photoelectric sensor further comprises a light shielding body located on a side of the photosensitive chip opposite to the printed circuit board, and a projection of at least part of the light shielding body on the photosensitive chip is located between the photosensitive area and a projection of the light emitting element on the photosensitive chip.
According to the above embodiments, the size of the photosensor can be reduced by stacking the light emitting member on the non-photosensitive region of the photosensitive chip. The photosensitive chip comprises a first substrate, a first bonding pad and a conductive bump, the first substrate is positioned on the printed circuit board, the first bonding pad is positioned on one side of the first substrate, which faces away from the printed circuit board, the conductive bump is positioned on one side of the first bonding pad, which faces away from the first substrate, the first bonding pad and the conductive bump are positioned in a non-photosensitive area, the conductive adhesive is positioned on one side of the first bonding pad, which faces away from the first substrate, and coats the conductive bump, the luminescent part is positioned on the conductive adhesive and is positioned on one side of the conductive adhesive, which faces away from the first bonding pad, and the luminescent part is electrically connected with the photosensitive chip through the conductive adhesive, the conductive bump and the first bonding pad. The photoelectric sensor can be packaged by adopting an injection molding packaging process, and has high reliability and good conductivity. Moreover, the conductive bump is prepared without high-temperature equipment, and mass production can be realized by adopting equipment of a common bonding wire process.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the utility model, as claimed.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the utility model and together with the description, serve to explain the principles of the utility model.
FIG. 1 is a schematic diagram of a photosensor according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of another photosensor according to an embodiment of the present invention.
Detailed Description
Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present invention. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the utility model, as detailed in the appended claims.
Fig. 1 is a diagram illustrating a photosensor according to an embodiment of the present invention. As shown in fig. 1, the photosensor includes: a Printed Circuit Board (PCB)11, a photo sensor 12, a conductive adhesive 13, a light emitting element 14, a transparent encapsulation layer 15 and a light shielding body 16.
In the present embodiment, as shown in fig. 1, the photosensitive chip 12 is located on the printed circuit board 11. The photosensitive chip 12 is formed with a photosensitive area a and a non-photosensitive area B. The photo sensor chip 12 includes a first substrate 121, a first circuit (not shown), a first pad 122 and a conductive bump 123, the first substrate 121 is disposed on the printed circuit board 11, and the first substrate 121 may be disposed in the photo-sensing area a and the non-photo-sensing area B. The first pads 122 are located on a side of the first substrate 121 facing away from the printed circuit board 11 and connected to the first circuit, and the conductive bumps 123 are located on a side of the first pads 122 facing away from the first substrate 121. The first pads 122 and the conductive bumps 123 are located in the non-photosensitive region B.
In the present embodiment, the material of the first pad 122 is aluminum. Of course, the material of the first pad 122 may also be an aluminum-copper alloy, in which aluminum accounts for 95%, copper accounts for 3%, and the rest is 2%. The material of the first pad 122 may also be gold or copper or other metals.
In the present embodiment, the conductive bump 123 is a metal bump. The metal bumps have good conductivity, which is beneficial to improving the conductivity of the light-emitting element 14 and the light-sensing chip 12.
In this embodiment, the material of the conductive bump is gold. Since gold has a relatively good conductivity, it is beneficial to improve the conductivity of the light emitting element 14 and the light sensing chip 12. In other embodiments, the conductive bump may include a bump structure and a plating layer, the plating layer covers the bump structure, the material of the bump structure is copper, and the material of the plating layer is gold.
In the present embodiment, the conductive adhesive 13 is located on a side of the first pad 122 opposite to the first substrate 121, and covers the conductive bump 123. The conductive adhesive 13 may be an epoxy conductive adhesive, but is not limited thereto.
In the present embodiment, the conductive adhesive 13 is a cured silver paste. The silver paste comprises a liquid adhesive and silver particles. Because the adhesive force between the silver paste and the conductive salient points made of gold is larger, the stress of the plastic package body caused by expansion with heat and contraction with cold can be resisted, and therefore the photoelectric sensor can be packaged by adopting an injection molding packaging process, and the photoelectric sensor is high in reliability and good in conductivity. Moreover, the conductive bump is prepared without high-temperature equipment, mass production can be realized by adopting equipment of a common bonding wire process, and the conductive bump is particularly suitable for injection molding packaging with limited size.
It should be noted that, in the technical field, a technical solution for adhering two chips by using silver paste and conductive bumps has not yet appeared. Because the direct bonding force between the silver paste and the aluminum pad hardly meets the reliability requirement above the international standard MSL3, the technical scheme for bonding the two chips by matching the silver paste with the conductive bumps provided by the embodiment of the utility model is the first technical scheme provided in the field.
In the present embodiment, the light emitting element 14 is located in the non-photosensitive region of the photosensitive chip 12, and the light emitting element 14 is located on the conductive adhesive 13 and located on a side of the conductive adhesive 13 opposite to the first pad 122. By stacking the light emitting member on the non-photosensitive region of the photosensitive chip, the size of the photosensor can be reduced.
In the present embodiment, the light emitting member 14 may be a light emitting chip. The light emitting element 14 includes a second substrate, a second circuit, a first electrode and a second electrode, the first electrode is located between the conductive adhesive 13 and the second substrate, the second circuit is located on the second substrate, the second electrode is located on a side of the second substrate facing away from the conductive adhesive 13, and the first electrode and the second electrode are respectively connected to the second circuit. Wherein the material of the second substrate is gallium arsenide. The material of the second electrode may be gold, but is not limited thereto. The first electrode is positioned on the conductive adhesive 13 and is in contact with the conductive adhesive 13 to achieve electrical connection.
In the present embodiment, the light emitting member 14 is electrically connected to the photosensitive chip 12 through the conductive adhesive 13, the conductive bump 123, and the first pad 122.
In the present embodiment, the transparent encapsulation layer 15 is disposed on the printed circuit board 11 and wraps the photo sensor chip 12, the conductive adhesive 13 and the light emitting element 14.
In this embodiment, the transparent encapsulating layer 15 may be obtained by an injection molding encapsulating process, and the material of the transparent encapsulating layer 15 may be, for example, epoxy resin, which may allow light to transmit therethrough. The material of the transparent encapsulating layer 15 may be doped with a specific element so that the optical signal for device operation can be transmitted through the transparent encapsulating layer 15 and other optical signals cannot be transmitted.
Moreover, since the first pad 122 is made of aluminum and the adhesion force between aluminum and silver paste is poor, the aluminum and the conductive bump are bonded better by ultrasonic welding, and the bonding force between the silver paste and the conductive bump is higher. Therefore, the silver paste is used to electrically connect the first pad 122, the conductive bump 123 and the light emitting element 14, so as to improve the reliability of the electrical connection between the light emitting element 14 and the light sensing chip 12.
In the present embodiment, as shown in fig. 1, the light shielding body 16 is located on a side of the photosensitive chip 12 opposite to the printed circuit board 11, and a projection of a portion of the light shielding body 16 on the photosensitive chip 12 is located between the photosensitive area a and a projection of the light emitting member 14 on the photosensitive chip 12. For example, as shown in fig. 1, the light-shielding body 16 includes a retaining wall 161 and a light-shielding cover 162, the retaining wall 161 and the light-shielding cover 162 are integrally formed, a projection of the retaining wall 161 on the photo-sensing chip 12 is located between the photo-sensing area a and a projection of the light-emitting member 14 on the photo-sensing chip 12, and a bottom surface of the retaining wall 161 close to the photo-sensing chip 12 is closer to a surface of the photo-sensing chip 12 opposite to the printed circuit board 11 than a light-emitting surface of the light-emitting member 14. Since the light emitting surface of the light emitting member 14 can emit the light signal, the probability of the light signal emitted from the light emitting member 14 passing through the gap between the retaining wall 161 and the photo sensor 12 can be reduced, especially when the light emitting member 14 can provide a light beam with good collimation.
In the present embodiment, as shown in fig. 1, the light shielding cover 162 covers the transparent encapsulation layer 15, the light shielding cover 162 includes a first light transmission opening W1 and a second light transmission opening W2, a projection of the first light transmission opening W1 on the photo sensor 12 is located in the photo sensing area a, and a projection of the second light transmission opening W2 on the photo sensor 12 is located in a projection of the light emitting device 14 on the photo sensor 12. The first light-transmitting opening W1 and the second light-transmitting opening W2 are solid openings, but are not limited thereto.
Of course, in another embodiment, as shown in fig. 2, the light shielding body 16 may include a retaining wall 161 and a light shielding layer 163, the retaining wall 161 and the light shielding layer 163 are integrally formed, and the light shielding layer 163 is located on the surface of the transparent encapsulating layer 15 opposite to the printed circuit board 11. The light-shielding layer 163 includes a first light-transmitting opening W1 and a second light-transmitting opening W2. Of course, in other embodiments, the light shielding body 16 may be only a wall located on a side of the photo sensor 12 opposite to the printed circuit board 11, and a projection of the wall on the photo sensor 12 is located between the photosensitive area a and a projection of the light emitting element 14 on the photo sensor 12.
In the embodiment of the utility model, the light-emitting part is stacked on the non-photosensitive area on the photosensitive chip, so that the size of the photoelectric sensor can be reduced. The photosensitive chip comprises a first substrate, a first bonding pad and a conductive bump, the first substrate is positioned on the printed circuit board, the first bonding pad is positioned on one side of the first substrate, which faces away from the printed circuit board, the conductive bump is positioned on one side of the first bonding pad, which faces away from the first substrate, the first bonding pad and the conductive bump are positioned in a non-photosensitive area, the conductive adhesive is positioned on one side of the first bonding pad, which faces away from the first substrate, and coats the conductive bump, the luminescent part is positioned on the conductive adhesive and is positioned on one side of the conductive adhesive, which faces away from the first bonding pad, and the luminescent part is electrically connected with the photosensitive chip through the conductive adhesive, the conductive bump and the first bonding pad. The photoelectric sensor can be packaged by adopting an injection molding packaging process, and has high reliability and good conductivity. Moreover, the conductive bump is prepared without high-temperature equipment, and mass production can be realized by adopting equipment of a common bonding wire process.
The technical scheme provided by the embodiment of the utility model can realize firm electrical conduction, the injection molding packaging reliability can reach the international industrial standard, and stable mass injection molding production and application can be realized. Moreover, mass production can be realized on a common packaging production line.
In addition, the technical scheme of bonding the two chips by using the silver paste provided by the embodiment of the utility model is not only suitable for minimizing the packaging size of the photoelectric sensor by adopting an injection molding packaging process, and meets the requirement of market miniaturization application development, but also suitable for an injection molding packaging process and a non-injection molding packaging process of non-photoelectric sensor products. For example, of the two stacked chips, the chip located above may also be a Vertical Cavity Surface Emitting Laser (VCSEL) die having a back electrode or a MOSFET die having a back electrode.
It is noted that in the drawings, the sizes of layers and regions may be exaggerated for clarity of illustration. Also, it will be understood that when an element or layer is referred to as being "on" another element or layer, it can be directly on the other element or layer or intervening layers may also be present. In addition, it will be understood that when an element or layer is referred to as being "under" another element or layer, it can be directly under the other element or intervening layers or elements may also be present. In addition, it will also be understood that when a layer or element is referred to as being "between" two layers or elements, it can be the only layer between the two layers or elements, or more than one intermediate layer or element may also be present. Like reference numerals refer to like elements throughout.
In the present invention, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. The term "plurality" means two or more unless expressly limited otherwise.
Other embodiments of the utility model will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure disclosed herein. This invention is intended to cover any variations, uses, or adaptations of the utility model following, in general, the principles of the utility model and including such departures from the present disclosure as come within known or customary practice within the art to which the utility model pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the utility model being indicated by the following claims.
It will be understood that the utility model is not limited to the precise arrangements described above and shown in the drawings and that various modifications and changes may be made without departing from the scope thereof. The scope of the utility model is limited only by the appended claims.
Claims (10)
1. A photosensor, comprising:
a printed circuit board;
the photosensitive chip is positioned on the printed circuit board; the photosensitive chip is provided with a photosensitive area and a non-photosensitive area; the photosensitive chip comprises a first substrate, a first bonding pad and a conductive bump, wherein the first substrate is positioned on the printed circuit board, the first bonding pad is positioned on one side of the first substrate, which is back to the printed circuit board, and the conductive bump is positioned on one side of the first bonding pad, which is back to the first substrate; the first bonding pad and the conductive bump are positioned in the non-photosensitive area;
the conductive adhesive is positioned on one side, back to the first substrate, of the first bonding pad and covers the conductive bump;
and the light-emitting piece is positioned on the conductive adhesive and positioned on one side of the conductive adhesive, which is back to the first bonding pad, and the light-emitting piece is electrically connected with the photosensitive chip through the conductive adhesive, the conductive bump and the first bonding pad.
2. The photosensor of claim 1, wherein the conductive bump is a metal bump.
3. The photosensor of claim 2, wherein the conductive bump is gold.
4. The sensor of claim 2, wherein the conductive bump comprises a bump structure and a plating layer, the plating layer covers the bump structure, the bump structure is made of copper, and the plating layer is made of gold.
5. The photosensor of any of claims 1-4, wherein the conductive adhesive is a cured silver paste.
6. The photosensor of claim 5, wherein the silver paste comprises a liquid binder and silver particles.
7. The photosensor of claim 1, wherein the material of the first pad is aluminum or gold or copper.
8. The photosensor of claim 1, wherein the light emitter comprises a second substrate and a first electrode, the first electrode being located between the conductive adhesive and the second substrate;
the material of the second substrate is gallium arsenide.
9. The photosensor of claim 1 further comprising a transparent encapsulant layer on the printed circuit board and encapsulating the photo-sensing die, the conductive adhesive and the light emitter.
10. The photosensor assembly of claim 1, further comprising a light-shielding body disposed on a side of the photosensitive chip facing away from the printed circuit board, wherein a projection of at least a portion of the light-shielding body on the photosensitive chip is located between the photosensitive region and a projection of the light-emitting element on the photosensitive chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122101124.7U CN215644486U (en) | 2021-08-31 | 2021-08-31 | Photoelectric sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122101124.7U CN215644486U (en) | 2021-08-31 | 2021-08-31 | Photoelectric sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215644486U true CN215644486U (en) | 2022-01-25 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122101124.7U Active CN215644486U (en) | 2021-08-31 | 2021-08-31 | Photoelectric sensor |
Country Status (1)
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| CN (1) | CN215644486U (en) |
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2021
- 2021-08-31 CN CN202122101124.7U patent/CN215644486U/en active Active
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