CN215644389U

CN215644389U - Electronic component manufacturing device

Info

Publication number: CN215644389U
Application number: CN202121986713.1U
Authority: CN
Inventors: 苗晓明
Original assignee: Shaoxing Shangyu Youbang Electric Appliance Co ltd
Current assignee: Shaoxing Shangyu Youbang Electric Appliance Co ltd
Priority date: 2021-08-23
Filing date: 2021-08-23
Publication date: 2022-01-25
Anticipated expiration: 2031-08-23

Abstract

The utility model discloses an electronic element manufacturing device which comprises a device support, wherein a working lower mechanism is movably arranged on the upper side surface of the device support and comprises a transmission belt, a movable lower plate, a positioning slot, a packaging lower groove, a pin lower groove, a sealing strip, a packaging block and a connecting pin, the working lower mechanism is movably connected with the working upper mechanism, the working upper mechanism comprises a lifting upper plate, a lifting column, a material injection pipe, a material injection port, a material distribution chamber, a positioning column, a packaging upper groove, a sealing groove, a foot pressing block and a pin upper groove, the packaging upper groove is formed in the bottom side surface of the lifting upper plate, the sealing groove is formed in the notch of the packaging upper groove, the foot pressing block is formed in one side of the packaging upper groove, and the lower end of the foot pressing block is connected with the pin upper groove. The electronic element manufacturing device can simultaneously produce a plurality of packaging parts, effectively improve the production efficiency, and quickly supply raw materials and send out finished products.

Description

Electronic component manufacturing device

Technical Field

The present invention relates to the field of electronic device manufacturing, and more particularly, to an electronic device manufacturing apparatus.

Background

The utility model relates to an electronic element, which is a basic element in an electronic circuit, is usually packaged individually and is provided with two or more leads or metal contacts, and the electronic elements are mutually connected to form the electronic circuit with a specific function; the existing electronic component manufacturing device has certain disadvantages when in use, most of the electronic components can only be produced by one or a small number of electronic components, and the production efficiency needs to be improved.

SUMMERY OF THE UTILITY MODEL

The present invention is directed to an electronic component manufacturing apparatus, which can effectively solve the problems of the related art.

In order to achieve the purpose, the utility model adopts the technical scheme that:

the utility model provides an electronic component manufacturing installation, includes the device support, device support upside surface movable mounting has work lower structure, work lower structure includes the transmission band, removes hypoplastron, positioning slot, encapsulation lower groove, stitch lower groove, sealing strip, encapsulation piece and connects the stitch, work lower structure top swing joint has work upper structure, work upper structure includes lift upper plate, lift post, notes material pipe, material filling opening, divides material room, reference column, encapsulation upper groove, seal groove, presser foot piece and stitch upper groove.

Preferably, the device support includes workstation, support foot post, activity rail post and work groove, workstation bottom side four corners fixed welding installs the support foot post, workstation upside surface four corners fixed welding installs the activity rail post, the work groove has been seted up to workstation upside surface.

Preferably, surface mounting has the removal hypoplastron on the transmission band upside, remove hypoplastron upside surface four corners department and seted up positioning slot, remove hypoplastron upside surface and seted up the encapsulation lower groove, the needle foot lower groove has been seted up to encapsulation lower groove one side, encapsulation lower groove edge fixed welding installs the sealing strip, the encapsulation piece has been placed in the activity of encapsulation lower groove, needle foot lower groove department activity has placed the connection stitch.

Preferably, lifting column is installed in the fixed welding of lifting upper plate upside surface, the fixed welding in lifting column welding department one side has the notes material pipe, the sprue has been seted up to notes material pipe below, the switch-on of sprue lower extreme has the branch material room, lifting upper plate bottom surface four corners department fixed welding installs the reference column.

Preferably, the bottom surface of the lifting upper plate is provided with an upper packaging groove, a sealing groove is formed in the notch of the upper packaging groove, one side of the upper packaging groove is provided with a presser foot block, the lower end of the presser foot block is connected with an upper packaging groove, and the bottom side of the distribution chamber is communicated with the upper packaging groove through a thin tube.

Preferably, a transmission belt is movably mounted in the working groove, and the movable rail column is movably connected with four corners of the lifting upper plate.

Compared with the prior art, the utility model has the following beneficial effects:

in the utility model, the movable lower plate with the connecting pins placed in the pin lower grooves is conveyed to the lower part of the working upper structure by the conveying belt, the material injection pipe is communicated with the raw material supply structure through an external pipeline, the lifting upper plate is lowered by utilizing the lifting column, the positioning work is carried out through the positioning slot and the positioning column, the connecting pin is clamped by the pin lower groove and the pin upper groove, the sealing strip is inserted into the sealing groove, the packaging lower groove and the packaging upper groove form a complete packaging groove, the packaging raw materials are injected into the material distribution chamber through the material injection pipe and the material injection port and are injected into each packaging groove to carry out packaging work to form a complete packaging block, after the production is finished, the lifting column lifts the lifting upper plate, the conveyor belt conveys the moving lower plate provided with the produced packaging piece into the next production mechanism, a large number of electronic elements can be produced at one time, the production efficiency is effectively improved, while a new connection pin can be supplied quickly and the produced package can be sent to the next processing component.

Drawings

FIG. 1 is a schematic view of an overall structure of an apparatus for manufacturing electronic components according to the present invention;

FIG. 2 is a schematic view of a device holder of an electronic device manufacturing apparatus according to the present invention;

FIG. 3 is a schematic view of an electronic device manufacturing apparatus according to the present invention;

FIG. 4 is a schematic diagram of an apparatus for manufacturing electronic components according to the present invention;

FIG. 5 is an enlarged view of a portion A of the apparatus for manufacturing electronic components of the present invention shown in FIG. 3;

fig. 6 is an enlarged view of fig. 4 at B of an apparatus for manufacturing an electronic component according to the present invention.

In the figure: 1. a device holder; 101. a work table; 102. a support leg; 103. a movable rail column; 104. a working groove; 2. working and constructing; 201. a conveyor belt; 202. moving the lower plate; 203. positioning the slot; 204. packaging the lower groove; 205. a pin lower groove; 206. a sealing strip; 207. packaging the block; 208. connecting pins; 3. working and constructing; 301. lifting the upper plate; 302. a lifting column; 303. a material injection pipe; 304. a material injection port; 305. a material distribution chamber; 306. a positioning column; 307. packaging the upper groove; 308. a sealing groove; 309. a foot pressing block; 310. the pin goes up the groove.

Detailed Description

In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the utility model easy to understand, the utility model is further described with the specific embodiments.

As shown in fig. 1 to 6, an electronic component manufacturing apparatus includes an apparatus support 1, a work lower mechanism 2 is movably mounted on an upper side surface of the apparatus support 1, the work lower mechanism 2 includes a conveyor 201, a movable lower plate 202, a positioning slot 203, a packaging lower slot 204, a pin lower slot 205, a sealing strip 206, a packaging block 207 and a connecting pin 208, a work upper mechanism 3 is movably connected above the work lower mechanism 2, the work upper mechanism 3 includes a lifting upper plate 301, a lifting column 302, a material injection pipe 303, a material injection port 304, a material distribution chamber 305, a positioning column 306, a packaging upper slot 307, a sealing groove 308, a presser foot block 309 and a pin upper slot 310;

the device support 1 comprises a workbench 101, supporting foot columns 102, movable rail columns 103 and a working groove 104, wherein the supporting foot columns 102 are fixedly welded and installed at four corners of the bottom side of the workbench 101, the movable rail columns 103 are fixedly welded and installed at four corners of the upper side surface of the workbench 101, and the working groove 104 is formed in the upper side surface of the workbench 101; a movable lower plate 202 is arranged on the surface of the upper side of the transmission belt 201, positioning slots 203 are formed in four corners of the surface of the upper side of the movable lower plate 202, a packaging lower groove 204 is formed in the surface of the upper side of the movable lower plate 202, a pin lower groove 205 is formed in one side of the packaging lower groove 204, a sealing strip 206 is fixedly welded and arranged at the edge of the packaging lower groove 204, a packaging block 207 is movably placed in the packaging lower groove 204, and a connecting pin 208 is movably placed at the pin lower groove 205; the upper side surface of the lifting upper plate 301 is fixedly welded with a lifting column 302, one side of the welding position of the lifting column 302 is fixedly welded with a material injection pipe 303, a material injection port 304 is formed below the material injection pipe 303, the lower end of the material injection port 304 is communicated with a material distribution chamber 305, and four corners of the bottom side surface of the lifting upper plate 301 are fixedly welded with positioning columns 306; an upper packaging groove 307 is formed in the surface of the bottom side of the lifting upper plate 301, a sealing groove 308 is formed in the notch of the upper packaging groove 307, a pin pressing block 309 is formed in one side of the upper packaging groove 307, the lower end of the pin pressing block 309 is connected with an upper pin groove 310, and the bottom side of the material distribution chamber 305 is communicated with the upper packaging groove 307 through a thin tube; a transmission belt 201 is movably installed in the working groove 104, the movable rail column 103 is movably connected with four corners of the lifting upper plate 301, the movable lower plate 202 with connecting pins 208 placed in the pin lower groove 205 is conveyed to the lower portion of the working upper structure 3 through the transmission belt 201, the material injection pipe 303 is communicated with a raw material supply structure through an external pipeline, the lifting upper plate 301 is lowered through the lifting column 302, positioning work is carried out through the positioning slot 203 and the positioning column 306, the connecting pins 208 are clamped through the pin lower groove 205 and the pin upper groove 310, the sealing strip 206 is inserted into the sealing groove 308, the packaging lower groove 204 and the packaging upper groove 307 form a complete packaging groove, packaging raw materials are injected into the material distribution chamber 305 through the material injection pipe 303 and the material injection port 304 and are injected into each packaging groove, and packaging work is carried out.

It should be noted that, when the electronic component manufacturing apparatus of the present invention is used, the moving lower board 202 with the connecting pins 208 placed in the pin lower slots 205 is transported to the lower side of the working upper mechanism 3 by the transporting belt 201, the material feeding pipe 303 is connected to the raw material supply structure through the external pipe, the lifting upper board 301 is lowered by the lifting column 302, the positioning work is performed by the positioning slots 203 and the positioning posts 306, the connecting pins 208 are held by the pin lower slots 205 and the pin upper slots 310, the sealing strip 206 is inserted into the sealing slot 308, the packaging lower slots 204 and the packaging upper slots 307 form a complete packaging slot, the packaging raw material is injected into the material distribution chamber 305 through the material feeding pipe 303 and the material feeding port 304 and is injected into each packaging slot to perform the packaging work, so as to form a complete packaging block 207, after the production is completed, the lifting upper board 301 is lifted by the lifting column 302, the transporting belt 201 transports the moving lower board 202 with the produced packages to the next production mechanism, a large number of electronic components can be produced at one time, the production efficiency is effectively improved, and simultaneously new connecting pins 208 can be quickly supplied and the produced packages can be sent to the next processing component.

The foregoing shows and describes the general principles and broad features of the present invention and advantages thereof. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the utility model as claimed. The scope of the utility model is defined by the appended claims and equivalents thereof.

Claims

1. An electronic component manufacturing apparatus, characterized in that: including device support (1), device support (1) upside surface movable mounting has work lower structure (2), work lower structure (2) includes transmission band (201), removal hypoplastron (202), location slot (203), encapsulation lower groove (204), stitch lower groove (205), sealing strip (206), encapsulation piece (207) and connects stitch (208), work lower structure (2) top swing joint has work upper structure (3), work upper structure (3) is including going up and down upper plate (301), lift post (302), notes material pipe (303), sprue (304), branch material room (305), reference column (306), encapsulation upper groove (307), seal groove (308), presser foot piece (309) and stitch upper groove (310).

2. An electronic component manufacturing apparatus according to claim 1, wherein: the device support (1) comprises a workbench (101), supporting foot columns (102), movable rail columns (103) and a working groove (104), the supporting foot columns (102) are fixedly welded at four corners of the bottom side of the workbench (101), the movable rail columns (103) are fixedly welded at four corners of the upper side surface of the workbench (101), and the working groove (104) is formed in the upper side surface of the workbench (101).

3. An electronic component manufacturing apparatus according to claim 2, wherein: conveyer belt (201) upside surface mounting has and removes hypoplastron (202), it has seted up positioning slot (203) to remove hypoplastron (202) upside surface four corners department, it has seted up encapsulation lower groove (204) to remove hypoplastron (202) upside surface, needle foot lower groove (205) have been seted up to encapsulation lower groove (204) one side, encapsulation lower groove (204) edge fixed welding installs sealing strip (206), encapsulation lower groove (204) activity has been placed encapsulation piece (207), needle foot lower groove (205) department activity has been placed and has been connected stitch (208).

4. An electronic component manufacturing apparatus according to claim 3, wherein: lifting column (302) is installed in lifting upper plate (301) upside fixed surface welding, lifting column (302) welding department one side fixed welding has injection pipe (303), injection hole (304) have been seted up to injection pipe (303) below, injection hole (304) lower extreme switch-on has branch material room (305), lifting upper plate (301) bottom side surface four corners department fixed welding installs reference column (306).

5. An electronic component manufacturing apparatus according to claim 4, wherein: the lifting upper plate (301) is characterized in that a packaging upper groove (307) is formed in the surface of the bottom side of the lifting upper plate (301), a sealing groove (308) is formed in the notch of the packaging upper groove (307), a foot pressing block (309) is formed in one side of the packaging upper groove (307), the lower end of the foot pressing block (309) is connected with a foot upper groove (310), and the bottom side of the distribution chamber (305) is communicated with the packaging upper groove (307) through a thin tube.

6. An electronic component manufacturing apparatus according to claim 5, wherein: a conveying belt (201) is movably mounted in the working groove (104), and the movable rail column (103) is movably connected with four corners of the lifting upper plate (301).