CN215642682U - Combined PCIE module free of tool installation - Google Patents

Abstract

The utility model discloses a tool-free assembled PCIE module, which comprises a shell, a sealing cover and a supporting plate, wherein two sides of the inner wall of the shell are both provided with sliding grooves, sliding blocks are arranged inside the two sliding grooves in a sliding manner, a PCIE card assembly is fixedly arranged between the two sliding blocks, the inner sides of the two sliding grooves are both provided with mounting holes, and telescopic springs are fixedly arranged in the two mounting holes, the module carries out tool-free installation on the PCIE card component through the cooperative matching of the limiting block, the supporting plate and the supporting plate, is more convenient to disassemble and assemble, has the characteristics of stability and reliability, wherein the two slide blocks are respectively limited and fixed by the two limiting blocks, so as to limit and fix the PCIE card assembly, and the PCIE card assembly is supported by the supporting plate under the action of the buffer spring, so that the phenomenon that the PCIE card assembly shakes to cause the connection part with the PCIE card connector to loosen and fall off in the use process is avoided.

Description

Combined PCIE module free of tool installation

Technical Field

The utility model relates to the field of PCIE modules, in particular to a tool-free combined PCIE module.

Background

The PCIE card is used as an indispensable expansion function card of a server product, has a wider use scene due to the characteristic of unique plug and play, supports more and more PCIE cards by a single server, and becomes an important requirement for the PCIE module by quickly replacing the PCIE card and the PCIE module without tools, and the module is a short name for a one-dimensional bar code scanning module and a two-dimensional bar code scanning module in the field of automatic identification. The module is one of key parts for secondary development, has a complete and independent scanning function, and can be embedded into equipment in various industries such as mobile phones, computers, printers, assembly lines and the like. Along with the rise of the internet of things, modules are gradually used in various industries, wherein the modules under the science and technology flags are widely used in a distant view. However, the existing PCIE module needs to be installed by a tool, which causes inconvenience in disassembly and assembly.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a tool-free assembled PCIE module, which is used for solving the problem that the existing PCIE module provided in the background technology is inconvenient to assemble and disassemble due to the fact that the existing PCIE module needs to be assembled through a tool.

In order to achieve the purpose, the utility model provides the following technical scheme: a combined PCIE module free of tool installation comprises a shell, a sealing cover and a supporting plate, wherein two sides of the inner wall of the shell are both provided with sliding grooves, sliding blocks are arranged inside the two sliding grooves in a sliding manner, a PCIE card assembly is fixedly arranged between the two sliding blocks, the inner sides of the two sliding grooves are both provided with mounting holes, telescopic springs are fixedly arranged in the two mounting holes, the ends, far away from the mounting holes, of the two telescopic springs are both fixedly connected with limiting blocks, the connecting parts of the two limiting blocks and the two telescopic springs are both fixedly connected with pull ropes, the ends, far away from the limiting blocks, of the two pull ropes both extend to the outside and are fixedly connected with pull rings, the back surface of the shell is provided with two clamping grooves, clamping columns are clamped inside the two clamping grooves, and the ends, far away from the clamping grooves, of the two clamping columns are both fixedly arranged on the sealing cover, the middle part of the inner side of the sealing cover is fixedly connected with a plurality of telescopic rods, the surface of each telescopic rod is sleeved with a buffer spring, the end, far away from the sealing cover, of each telescopic rod is fixedly arranged on the supporting plate, and the bottom of the inner side of the sealing cover is fixedly provided with a supporting plate.

As a preferable technical solution of the present invention, a handle is fixedly provided at an outer side of the sealing cover.

As a preferred technical scheme of the utility model, one side of each of the two clamping grooves is provided with a mounting groove, elastic pieces are fixedly arranged in the mounting grooves, and the two elastic pieces are respectively connected with the limiting grooves arranged on one sides of the two clamping columns in a clamping manner.

As a preferred technical scheme of the utility model, the supporting plate and the supporting plate are both arranged corresponding to the PCIE card assembly, and a protection pad is fixedly arranged on one side of the supporting plate, which is close to and away from the telescopic rod.

As a preferred technical scheme of the utility model, a plurality of heat dissipation holes are formed in both sides of the shell, and dust separation nets are fixedly arranged inside the heat dissipation holes.

As a preferable technical scheme of the utility model, the front surface of the shell is provided with a plurality of interfaces, and the surface of the shell is fixedly provided with a protective sleeve.

As a preferred technical solution of the present invention, a PCIE card connector is fixedly mounted at one end of the inner wall of the housing, and the PCIE card connector is connected to the PCIE card assembly in a snap-fit manner.

Compared with the prior art, the utility model has the beneficial effects that: this module passes through the stopper, the cooperation of layer board and backup pad is in order exempting from the instrument installation to PCIE card subassembly, and the dismouting is more convenient, it is firm reliable characteristic simultaneously concurrently, wherein carry out spacing fixed to two sliders respectively through two stoppers, and then carry out spacing fixed to PCIE card subassembly, and support PCIE card subassembly under buffer spring's effect through the backup pad, avoid in the use PCIE card subassembly appear rocking lead to with the junction of PCIE card connector not hard up drop, through the pulling pull ring, shrink into the mounting hole with the stopper in, make it no longer spacing to PCIE card subassembly, and then be convenient for dismantle PCIE card subassembly.

Drawings

FIG. 1 is a perspective view of the present invention;

FIG. 2 is a top cross-sectional view of the present invention;

FIG. 3 is a front cross-sectional view of the present invention;

FIG. 4 is a side cross-sectional view of the present invention;

FIG. 5 is an enlarged view of portion A of the present invention;

FIG. 6 is an enlarged view of portion B of the present invention;

fig. 7 is an enlarged view of a portion C of the present invention.

In the figure: 1. a housing; 2. an interface; 3. a sealing cover; 4. heat dissipation holes; 5. a slider; 6. a chute; 7. a PCIE card component; 8. a PCIE card connector; 9. a protective sleeve; 10. a handle; 11. a support plate; 12. a tension spring; 13. a limiting block; 14. pulling a rope; 15. a pull ring; 16. clamping the column; 17. a card slot; 18. a spring plate; 19. a limiting groove; 20. a telescopic rod; 21. a buffer spring; 22. a support plate; 23. and (6) a protective pad.

Detailed Description

The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.

Referring to fig. 1-7, the utility model provides a tool-mount-free combined PCIE module, which comprises a housing 1, a sealing cover 3 and a supporting plate 22, wherein sliding grooves 6 are formed on both sides of the inner wall of the housing 1, sliding blocks 5 are slidably arranged inside the two sliding grooves 6, a PCIE clip assembly 7 is fixedly arranged between the two sliding blocks 5, mounting holes are formed on the inner sides of the two sliding grooves 6, telescopic springs 12 are fixedly arranged in the two mounting holes, limiting blocks 13 are fixedly connected to the ends of the two telescopic springs 12 far away from the mounting holes, pull ropes 14 are fixedly connected to the joints of the two limiting blocks 13 and the two telescopic springs 12 respectively, the ends of the two pull ropes 14 far away from the limiting blocks 13 extend to the outside and are fixedly connected with pull rings 15, two clamping grooves 17 are formed on the back surface of the housing 1, clamping columns 16 are clamped inside the two clamping grooves 17, and the ends of the two clamping columns 16 far away from the clamping grooves 17 are fixedly arranged on the sealing cover 3, the inboard middle part fixedly connected with a plurality of telescopic link 20 of sealed lid 3, the surface of a plurality of telescopic link 20 all overlaps and is equipped with buffer spring 21, the one end that sealed lid 3 was kept away from to a plurality of telescopic link 20 is all fixed to be set up in backup pad 22, support PCIE card subassembly 7 under buffer spring 21's effect through backup pad 22, avoid PCIE card subassembly 7 appear rocking in the use and lead to becoming flexible with the junction of PCIE card connector 8 and drop, the fixed layer board 11 that is provided with in the inboard bottom of sealed lid 3.

Preferably, a handle 10 is fixedly arranged on the outer side of the sealing cover 3, and the handle 10 is arranged to facilitate the detachment of the sealing cover 3.

Preferably, the mounting groove has all been seted up to one side of two draw-in grooves 17, and the inside of two mounting grooves is all fixed and is provided with shell fragment 18, and two shell fragments 18 are connected with the 19 blocks in the spacing groove of seting up in two calorie of posts 16 one side respectively, and spacing fixed is carried out to sealed lid 3 through the spacing block of shell fragment 18 with spacing groove 19, avoids the sealed lid 3 of in-process that uses to drop.

Preferably, layer board 11 and backup pad 22 all correspond the setting with PCIE card subassembly 7, and backup pad 22 is close to the fixed protection pad 23 that is provided with in one side of keeping away from telescopic link 20, and the setting of protection pad 23 can play the guard action to PCIE card subassembly 7.

Preferably, a plurality of louvre 4 has all been seted up to the both sides of shell 1, and the inside of a plurality of louvre 4 is all fixed and is provided with the dust separation net, and the setting of a plurality of louvre 4 is convenient for dispel the heat to the module.

Preferably, a plurality of interface 2 has been seted up on the front of shell 1, and the fixed surface of shell 1 is provided with lag 9, and the setting of lag 9 can improve preventing of module and fall the performance.

Preferably, a PCIE card connector 8 is fixedly mounted at one end of the inner wall of the housing 1, and the PCIE card connector 8 is connected to the PCIE card assembly 7 in a snap-fit manner.

When the tool-free combined PCIE module is used in particular, an operator slides in the sliding blocks 5 on the two sides of the PCIE card assembly 7 respectively along the sliding grooves 6, the sliding blocks 5 can press the limiting blocks 13 into the mounting holes in the sliding process until the PCIE card assembly 7 is connected with the PCIE card connector 8 in a clamping manner, the two limiting blocks 13 are popped out at the moment, the two sliding blocks 5 are respectively limited and fixed through the two limiting blocks 13, the PCIE card assembly 7 is further limited and fixed, the clamping columns 16 on the two sides of the inner side of the sealing cover 3 are respectively inserted into the two clamping grooves 17, the sealing cover 3 is limited and fixed through the limiting clamping combination of the elastic sheets 18 and the limiting grooves 19, the sealing cover 3 is prevented from falling off in the using process, the supporting plate 22 supports the PCIE card assembly 7 under the action of the buffer springs 21, and the phenomenon that the connection part of the PCIE card assembly 7 and the PCIE card connector 8 is loosened and falls off due to shaking in the using process is avoided, the elastic action of shell fragment 18 is greater than the elastic action of a plurality of buffer spring 21, when needing to dismantle the maintenance to PCIE card subassembly 7, takes off sealed lid 3, through pulling pull ring 15, contracts stopper 13 into the mounting hole, makes it no longer spacing to PCIE card subassembly 7, and then is convenient for dismantle PCIE card subassembly 7.

Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that various changes in the embodiments and/or modifications of the utility model can be made, and equivalents and modifications of some features of the utility model can be made without departing from the spirit and scope of the utility model.

Claims (7)

1. The utility model provides a combination formula PCIE module of instrument installation exempts from, includes shell (1), sealed lid (3) and backup pad (22), its characterized in that: the two sides of the inner wall of the shell (1) are both provided with sliding grooves (6), sliding blocks (5) are arranged inside the two sliding grooves (6) in a sliding manner, a PCIE card assembly (7) is fixedly arranged between the two sliding blocks (5), the inner sides of the two sliding grooves (6) are both provided with mounting holes, telescopic springs (12) are fixedly arranged in the two mounting holes, one ends, far away from the mounting holes, of the two telescopic springs (12) are both fixedly connected with limiting blocks (13), pull ropes (14) are respectively and fixedly connected with the connecting parts of the two limiting blocks (13) and the two telescopic springs (12), one ends, far away from the limiting blocks (13), of the two pull ropes (14) extend to the outside and are fixedly connected with pull rings (15), the back of the shell (1) is provided with two clamping grooves (17), and clamping columns (16) are respectively clamped inside the two clamping grooves (17), two the one end that draw-in groove (17) was kept away from in card post (16) is all fixed to be set up on sealed lid (3), a plurality of telescopic link (20), a plurality of fixedly connected with in the middle part of sealed lid (3) inboard the surface of telescopic link (20) all overlaps and is equipped with buffer spring (21), a plurality of the one end that sealed lid (3) were kept away from in telescopic link (20) is all fixed to be set up in backup pad (22), the fixed layer board (11) that is provided with in the bottom of sealed lid (3) inboard.

2. The tool-less mount combined PCIE module according to claim 1, wherein: a handle (10) is fixedly arranged on the outer side of the sealing cover (3).

3. The tool-less mount combined PCIE module according to claim 1, wherein: mounting grooves are formed in one sides of the two clamping grooves (17), elastic pieces (18) are fixedly arranged in the mounting grooves, and the elastic pieces (18) are clamped and connected with limiting grooves (19) formed in one sides of the two clamping columns (16) respectively.

4. The tool-less mount combined PCIE module according to claim 1, wherein: layer board (11) and backup pad (22) all correspond the setting with PCIE card subassembly (7), backup pad (22) are close to the fixed protection pad (23) that is provided with in one side of keeping away from telescopic link (20).

5. The tool-less mount combined PCIE module according to claim 1, wherein: a plurality of heat dissipation holes (4) are formed in the two sides of the shell (1), and dust isolating nets are fixedly arranged inside the heat dissipation holes (4).

6. The tool-less mount combined PCIE module according to claim 1, wherein: the front surface of the shell (1) is provided with a plurality of interfaces (2), and a protective sleeve (9) is fixedly arranged on the surface of the shell (1).

7. The tool-less mount combined PCIE module according to claim 1, wherein: one end of the inner wall of the shell (1) is fixedly provided with a PCIE card connector (8), and the PCIE card connector (8) is connected with the PCIE card assembly (7) in a clamping manner.

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