CN215642457U

CN215642457U - Power supply framework of high-density server

Info

Publication number: CN215642457U
Application number: CN202121733124.2U
Authority: CN
Inventors: 欧阳浩
Original assignee: Shenzhen Haoyuan Nuoxin Technology Co ltd
Current assignee: Shenzhen Haoyuan Nuoxin Technology Co ltd
Priority date: 2021-07-28
Filing date: 2021-07-28
Publication date: 2022-01-25
Anticipated expiration: 2031-07-28

Abstract

The utility model discloses a power supply framework of a high-density server, which comprises a device main body, wherein when the high-density server is used, a support column is fixedly connected inside the device main body and penetrates through an upper bayonet and a lower bayonet, so that the internal structure of the device main body is more stable, the device main body is not easy to damage due to slight vibration and pulling, heat dissipation fans and heat dissipation plates are arranged on two sides inside the device main body, heat generated when a mainboard works can be discharged through the joint action of the heat dissipation fans and the heat dissipation plates, a hinge is rotated to open the heat dissipation plates so as to clean internal dust, the damage rate of the device main body is reduced, the mainboard is connected with a connecting block through a conveying line, and a DCDC power supply module is arranged inside the connecting block, so that the voltage transmitted to each power supply module by the mainboard is changed, and the phenomenon that the device main body cannot work normally due to inconsistent power supply voltage is avoided, the working efficiency of the device main body is improved.

Description

Power supply framework of high-density server

Technical Field

The utility model relates to the technical field of power supply architectures, in particular to a power supply architecture of a high-density server.

Background

With the development of technology, the amount of data calculated by a user via a computer is increasing, and therefore, a single processing chip or a central processing unit cannot meet the increasing amount of data, and a related company must assemble a high-density computer server.

When the existing computer server works, a mainboard can be burnt out due to heat dissipation in work, the service life of the server is shortened, and the cost of a centralized power supply framework is high.

Therefore, how to design a power architecture of a high-density server becomes a problem to be solved at present.

Disclosure of Invention

The utility model aims to solve the defects in the prior art, and provides a power architecture of a high-density server.

In order to achieve the purpose, the utility model adopts the following technical scheme:

the utility model provides a power architecture of high density server, includes the device main part, the bottom of device main part is fixed with the support column, and the support column passes through last bayonet socket and lower bayonet socket fixed connection in the inside of device main part, the internally mounted of device main part has the mainboard, radiator fan is installed to the both sides of mainboard, radiator fan's the outside sets up the heating panel that even has last air vent, and installs the hinge in one side of heating panel, set screw is installed to the upper and lower both sides of device main part.

Preferably, the support column is fixed inside the device body through the upper bayonet and the lower bayonet, so that the device body is prevented from being damaged by vibration.

Preferably, the heat dissipation fans are fixedly connected to two sides of the device main body, the heat dissipation fans are connected with an external power supply through a circuit, the heat dissipation plates are installed on the outer sides of the heat dissipation fans, and the heat dissipation fans and the heat dissipation plates jointly act to effectively discharge heat inside the device main body.

Preferably, one side of the heat dissipation plate is provided with a hinge for rotating and opening the heat dissipation plate to clean internal parts.

Preferably, transport lines are arranged on two sides of the main board, a connector is arranged in each transport line, and the connector is electrically connected with an internal interface of the connecting block.

The utility model has the beneficial effects that:

when using this high density server, support column fixed connection is in the inside of device main part, run through bayonet socket and lower bayonet socket, make the inner structure of device main part more stable, be difficult for dragging because of slight vibrations and lead to the damage, and the inside both sides of device main part install radiator fan and heating panel, heat accessible radiator fan and the heating panel combined action that produce when the mainboard is at the during operation are discharged, thereby it clears up inside dust to rotate the hinge and can open the heating panel, reduce the spoilage of device main part, the mainboard passes through the transportation circuit and is connected with the connecting block, and the inside setting of connecting block installs DCDC power module, thereby the voltage size that transmits the mainboard to each power module changes, avoid leading to the device main part can not normally work because of mains voltage does not accord, the work efficiency of device main part has been improved.

Drawings

FIG. 1 is a cross-sectional view of a power architecture of a high-density server according to the present invention;

FIG. 2 is a left side view of a power architecture of a high density server according to the present invention;

fig. 3 is a schematic structural diagram of a motherboard of a power architecture of a high-density server according to the present invention.

In the figure: 1. a device main body; 2. mounting a bayonet; 3. a lower bayonet; 4. a support pillar; 5. a heat radiation fan; 6. a fixed block; 7. connecting blocks; 8. a main board; 9. a transportation line; 10. a connecting port; 11. a heat dissipation plate; 12. a hinge; 13. and fixing the screw.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.

Referring to fig. 1-3, a power architecture of a high-density server, including a device body 1, characterized in that a support column 4 is fixed at the bottom of the device body 1, and the support column 4 is fixedly connected to the inside of the device body 1 through an upper bayonet 2 and a lower bayonet 3, a motherboard 8 is installed inside the device body 1, heat dissipation fans 5 are installed at both sides of the motherboard 8, a heat dissipation plate 11 connected with an upper vent hole is arranged at the outer side of the heat dissipation fan 5, a hinge 12 is installed at one side of the heat dissipation plate 11, fixing screws 13 are installed at both upper and lower sides of the device body 1, when using the high-density server, power is obtained from the motherboard 8, a transportation line 9 is connected with a connection block 7 through a connection port 10, power in the motherboard 8 is transmitted to each power supply module through the connection block 7, and a DCDC power supply module is installed inside each connection block 7 due to different power supply voltages required in each module, therefore, the voltage transmitted from the mainboard 8 to each power supply module is changed, and the power supply framework only needs one isolated power supply module, so that the area of the PCB can be effectively saved, and the cost of equipment is reduced;

support column 3 is fixed in the inside of device main part 1 through last bayonet socket 2 and lower bayonet socket 3, prevent that device main part 1 from receiving vibrations and damaging, 5 fixed connection of radiator fan is in the both sides of device main part 1, and radiator fan 5 passes through the circuit and is connected with external power source, radiator plate 11 is installed in radiator fan 5's the outside, radiator fan 5 and 11 combined action of radiator plate, effectively discharge the heat of device main part 1 inside, one side of radiator plate 11 is provided with hinge 12, be used for rotating to open 11 clearance internals of radiator plate, motherboard 8's both sides are provided with transportation circuit 9, the inside connector 10 that is provided with of transportation circuit 9, connector 10 and connecting block 7's internal interface electric connection.

The working principle is as follows: when the high-density server is used, the support column 4 is fixedly connected inside the device main body 1, penetrates through the upper bayonet 2 and the lower bayonet 3, so that the internal structure of the device main body 1 is more stable and is not easy to be damaged due to slight vibration and pulling, and the two sides of the interior of the device main body 1 are provided with the heat radiation fans 5 and the heat radiation plates 11, when the mainboard 8 works, the heat generated by the mainboard 8 can be discharged through the combined action of the cooling fan 5 and the cooling plate 11, the cooling plate 11 can be opened by rotating the hinge 12 so as to clean the internal dust and reduce the damage rate of the device main body 1, the mainboard 8 is connected with the connecting block 7 through the conveying line 9, and the DCDC power supply module is arranged and installed in the connecting block 7, therefore, the voltage transmitted to each power supply module by the mainboard 8 is changed, the phenomenon that the device body 1 cannot work normally due to the fact that the power supply voltage is inconsistent is avoided, and the working efficiency of the device body 1 is improved.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like, indicate orientations and positional relationships based on those shown in the drawings, and are used only for convenience of description and simplicity of description, and do not indicate or imply that the equipment or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be considered as limiting the present invention. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.

The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and equivalent alternatives or modifications according to the technical solution of the present invention and the inventive concept thereof should be covered by the scope of the present invention.

Claims

1. The utility model provides a power architecture of high density server, includes device main part (1), its characterized in that, the bottom of device main part (1) is fixed with support column (4), and support column (4) through last bayonet socket (2) and bayonet socket (3) fixed connection down in the inside of device main part (1), the internally mounted of device main part (1) has mainboard (8), radiator fan (5) are installed to the both sides of mainboard (8), radiator fan's (5) outside sets up even has radiator plate (11) of last air vent, and installs hinge (12) in one side of radiator plate (11), set screw (13) are installed to the upper and lower both sides of device main part (1).

2. The power architecture of a high-density server according to claim 1, wherein the support column (3) is fixed inside the device body (1) through the upper bayonet (2) and the lower bayonet (3), so as to prevent the device body (1) from being damaged by vibration.

3. The power architecture of a high-density server according to claim 1, wherein the heat dissipation fans (5) are fixedly connected to two sides of the device body (1), the heat dissipation fans (5) are connected to an external power source through a circuit, a heat dissipation plate (11) is installed on the outer side of each heat dissipation fan (5), and the heat dissipation fans (5) and the heat dissipation plate (11) work together to effectively discharge heat inside the device body (1).

4. The power architecture of a high-density server according to claim 1, characterized in that one side of the heat sink (11) is provided with a hinge (12) for rotating the heat sink (11) to clean the internal parts.

5. The power architecture of a high-density server according to claim 1, wherein transport lines (9) are disposed on two sides of the motherboard (8), a connector (10) is disposed inside the transport lines (9), and the connector (10) is electrically connected to the internal interface of the connecting block (7).