CN215639867U

CN215639867U - Pressure detection module and electronic equipment

Info

Publication number: CN215639867U
Application number: CN202121913697.3U
Authority: CN
Inventors: 郭壮举; 王朋; 刘武
Original assignee: Shenzhen Goodix Technology Co Ltd
Current assignee: Shenzhen Goodix Technology Co Ltd
Priority date: 2021-08-16
Filing date: 2021-08-16
Publication date: 2022-01-25
Anticipated expiration: 2031-08-16

Abstract

The embodiment of the utility model provides a pressure detection module and electronic equipment. The pressure detection module includes: the first electrode, the second electrode, the first circuit board, the second circuit board, the first welding part and the second welding part. The first electrode and the second electrode form a capacitor. The second electrode is electrically connected with the second welding part, the second welding part is electrically connected with a driving circuit for driving the second electrode, the first welding part is positioned between the second welding part and the first electrode, and the first welding part is grounded. The stress area of the equipment shell drives the first electrode to move towards the second electrode according to the received external pressure, so that the capacitance value between the first electrode and the second electrode is changed, and the pressure detection result of the external pressure is determined. According to the embodiment of the utility model, the electric interference in pressure detection of the external pressure is reduced, the accuracy of the pressure detection is ensured, and the structure of the pressure detection module is simpler.

Description

Pressure detection module and electronic equipment

Technical Field

The embodiment of the utility model relates to the technical field of electronics, in particular to a pressure detection module and electronic equipment.

Background

Currently, pressure detection modules using capacitive pressure sensing technology are increasingly used in terminal devices such as earphones.

The new generation of earphones can detect whether they are pressed or not by the internally installed pressure detection module, thereby performing operation control corresponding to the pressing. For example, whether the earphone is pressed is judged by a pressure detection module arranged in the earphone, so that the playing of music in the earphone is controlled.

Under the trend of terminal equipment miniaturization and low cost, the pressure detection accuracy of the pressure detection module is very important.

SUMMERY OF THE UTILITY MODEL

In view of the above, an object of the present invention is to provide a pressure detecting module and an electronic device.

According to a first aspect of the embodiments of the present invention, there is provided a pressure detection module, including: the first electrode, the second electrode, the first circuit board, the second circuit board, the first welding part and the second welding part. The first surface of the first circuit board is arranged on the inner surface of the stressed area of the equipment shell, and the first surface of the first electrode is arranged on the second surface of the first circuit board. The second surface of the second electrode is arranged on the first surface of the second circuit board. The first welding part and the second welding part are arranged between the second surface of the first circuit board and the first surface of the second circuit board. The second surface of the first electrode is opposite to the first surface of the second electrode, so that the first electrode and the second electrode form capacitance. The second electrode is electrically connected with the second welding part, the second welding part is electrically connected with a driving circuit for driving the second electrode, the first welding part is positioned between the second welding part and the first electrode, and the first welding part is grounded. And the stress area of the equipment shell drives the first electrode to move towards the second electrode according to the received external pressure, so that the capacitance value between the first electrode and the second electrode is changed, and the pressure detection result of the external pressure is determined.

In other implementations, the pressure detection module further includes a third weld. The first welding part and the second welding part are both positioned on one side of the capacitor, and the third welding part is positioned on the other side opposite to one side of the capacitor.

In some implementations, the pressure detection module further includes a fourth solder portion located on another side opposite to the one side of the capacitor, and the fourth solder portion is grounded.

In other implementations, the first and third welds are symmetrically disposed about the capacitance, and the second and fourth welds are symmetrically disposed about the capacitance.

In other implementations, the area of the first electrode is smaller than the area of the second electrode, and a projection of the first electrode on the second electrode is recessed compared to the second electrode.

In other implementations, a projection of the first electrode on the second electrode is recessed by 0.1 mm to 0.3 mm compared to the second electrode.

In other implementations, a projection of the first electrode on the second electrode is recessed by 0.2 millimeters from the second electrode.

In other implementations, the first circuit board is a rigid printed circuit board or a flexible circuit board with a stiffener, and the second circuit board is a rigid printed circuit board or a flexible circuit board with a stiffener.

In other implementations, the pressure detection module further includes: a transient diode having one end connected to the second bonding part and the other end grounded.

In other implementations, the pressure detection module further includes: and the double-sided adhesive layer is attached between the first surface of the first circuit board and the inner surface of the stress area of the equipment shell.

In other implementations, the pressure detection module further includes: and the first grounding electrode is arranged on the second surface of the second circuit board.

In other implementations, an electronic device with the device housing includes an antenna and a circuit board. The first ground electrode is disposed between the antenna and the second surface of the second circuit board, or the first ground electrode is disposed between the circuit board and the second surface of the second circuit board.

In other implementations, the pressure detection module further includes at least one touch sensor disposed on the first surface of the first circuit board, and configured to detect a touch operation of a user on the device housing.

In other implementations, when the pressure detection module performs pressure detection, the at least one touch sensor is grounded to form a second grounded electrode.

In other implementations, the first and second welds are both solder.

According to a second aspect of embodiments of the present invention, there is provided an electronic apparatus, including: a pressure sensing module and an equipment housing as described in the first aspect. The pressure detection module is arranged on the inner surface of the equipment shell.

In other implementations, the electronic device is a headset or smart glasses, and the force-receiving area of the device housing is located at a pull rod of the headset or smart glasses.

In the scheme of the embodiment of the utility model, the grounding of the first welding part can reduce or avoid the capacitance formed between the first electrode and the second welding part electrically connected to the second electrode, reduce the electrical interference when the pressure detection is carried out on the external pressure, and ensure the accuracy of the pressure detection. In addition, the second electrode of connecting drive circuit department takes place electrostatic discharge easily, through the second weld part of electric connection to the second electrode, is favorable to leading the static of second electrode department to the second weld part, has further reduced and has carried out electric interference when pressure measurement to ambient pressure, has guaranteed pressure measurement's accuracy. In addition, first welding part and second welding part set up between first circuit board and second circuit board for can form the mechanical support between first electrode and the second electrode when pressure measurement, need not to increase other support piece, make the structure of pressure measurement module simpler.

Drawings

Some specific embodiments of the present invention will be described in detail hereinafter, by way of illustration and not limitation, with reference to the accompanying drawings. The same reference numbers in the drawings identify the same or similar elements or components. Those skilled in the art will appreciate that the drawings are not necessarily drawn to scale. In the drawings:

FIG. 1 is a schematic diagram of a pressure detection module according to an embodiment of the utility model;

FIG. 2 is a schematic diagram of a pressure detection module according to another embodiment of the present invention;

FIG. 3 is a schematic diagram of a pressure detection module according to another embodiment of the present invention;

fig. 4A is a bottom view of a first circuit board of a pressure detecting module according to another embodiment of the utility model;

FIG. 4B is a top view of the first circuit board of FIG. 4A;

fig. 5A is a bottom view of a second circuit board of a pressure detecting module according to another embodiment of the utility model;

FIG. 5B is a top view of the second circuit board of FIG. 5A;

FIG. 6 is a schematic diagram of an electronic device according to another embodiment of the utility model; and

fig. 7 is a schematic diagram of a headset according to another embodiment of the utility model.

Detailed Description

The following further describes specific implementation of the embodiments of the present invention with reference to the drawings.

The pressure detection module of the embodiment of the utility model can be applied to various electronic devices, including but not limited to mobile communication devices, ultra-mobile personal computer devices, portable entertainment devices and other electronic devices with data interaction functions. Mobile communication devices are equipped with mobile communication functions and are primarily targeted for providing voice, data communications. Such terminals include: smart phones (e.g., i Phone), multimedia phones, functional phones, and low-end phones, etc. The ultra-mobile personal computer equipment has the functions of calculation and processing, and generally has the characteristic of mobile internet access. Such terminals include: PDA, M ID, and UMPC devices, etc., such as ipad. The portable entertainment device may display and play multimedia content. This type of device comprises: audio, video players (e.g., i Pod), handheld game consoles, electronic books, and smart toys and portable car navigation devices.

Fig. 1 is a schematic diagram of a pressure detection module according to an embodiment of the utility model. The pressure detection module of fig. 1 may be disposed inside an equipment enclosure 150 of an electronic device. The pressure detection module of fig. 1 includes:

the first electrode 111, the second electrode 121, the first circuit board 110, the second circuit board 120, the first soldering portion 130, and the second soldering portion 170.

The first surface of the first circuit board 110 is disposed on the inner surface of the force-receiving area of the device housing 150, and the first surface of the first electrode 111 is disposed on the second surface of the first circuit board 110.

The second surface of the second electrode 121 is disposed on the first surface of the second circuit board 120.

It should be understood that the first surface of the first circuit board (the upper circuit board) may be secured (e.g., glued or soldered) to the inner surface of the force receiving area of the device housing. A first surface of the first electrode (in the illustration, an upper surface of the first electrode) may be secured (e.g., glued or soldered) to a second surface of the first circuit board (in the illustration, a lower surface of the first electrode). The portion of the first circuit board on which the first electrode is provided is between both end sides of the second surface of the first circuit board.

It is also understood that the second surface (upper surface) of the second electrode may be secured (e.g., glued or soldered) to the first surface of the second circuit board.

It should also be understood that although the two end sides are shown as left and right sides, this should not be construed as limiting the direction of the end sides.

It is also understood that the shape of the first circuit board and the surface shape of the first electrode may be any shape such as circular, oval, square, etc.

The second surface of the first electrode 111 is opposite to the first surface of the second electrode 121, so that the first electrode 111 and the second electrode 121 form a capacitor.

It should be understood that the first electrode and the second electrode form a capacitor, and when the force-bearing area of the device housing is subjected to an external pressure (e.g., a pressing force from a user), the first electrode and the second electrode deform, so that a capacitance value of the capacitor changes.

It is also understood that the second surface of the first electrode and the first surface of the second electrode may correspond in the direction of the electric field lines between the first electrode and the second electrode such that the area of the second surface of the first electrode and the area of the first surface of the second electrode are both plate areas of the capacitor. The second surface of the first electrode and the first surface of the second electrode may also partially correspond in the direction of the electric field lines between the first electrode and the second electrode, for example, a projection of the first electrode on the first surface of the second electrode along the direction of the electric field lines is within the first surface of the second electrode, and for example, a projection of the second electrode on the second surface of the first electrode along the direction of the electric field lines is within the second surface of the first electrode.

The second electrode 121 is electrically connected to the second soldering portion 170, the second soldering portion 170 is electrically connected to a driving circuit for driving the second electrode 121, the first soldering portion 130 is located between the second soldering portion 170 and the first electrode 111, and the first soldering portion 130 is grounded.

It should be understood that the second electrode 121 is connected to a driving circuit, and may be used as an emitting electrode; the first electrode 111 may serve as a receiving electrode. The second soldering part 170 may be directly grounded or electrically connected to other grounded members.

Specifically, the first soldering part 130 may be soldered between a ground pad provided on the second surface of the first circuit board 110 and a ground pad provided on the first surface of the second circuit board. The second soldering part 170 may be soldered between the emitter electrode pad provided on the second surface of the first circuit board 110 and the emitter electrode pad provided on the first surface of the second circuit board 120. On the second surface of the first circuit board, a ground pad may be disposed between the transmitting electrode pad and the receiving electrode, and on the first surface of the second circuit board, the ground pad may be disposed between the transmitting electrode pad and the transmitting electrode.

The stressed area of the device housing 150 drives the first electrode 111 to move toward the second electrode 121 according to the received external pressure, so that the capacitance value of the capacitor changes, and the external pressure is detected.

It should be understood that the first soldering portion 130 and the second soldering portion 170 are disposed between the first circuit board 110 and the second circuit board 120, and can support the first circuit board 110 and the second circuit board 120 on two sides when the stress area of the device housing 150 receives the external pressure, so as to be beneficial to obtain an accurate capacitance value change between the first electrode 111 and the second electrode 121 according to the reliable deformation between the first electrode 111 disposed on the first circuit board 110 and the second electrode 121 disposed on the second circuit board 120, and further obtain a reliable and accurate pressure detection result.

It should also be understood that the force-bearing area of the device housing may be any shape area, and the outside of the device housing may be provided with any indicia to indicate that a user may apply a pressing force (ambient pressure) to the force-bearing area. The position of the stressed area corresponds to the position of the first electrode 111, so that the user drives the first electrode 111 to move towards the second electrode 121 by the external pressure applied by the stressed area.

It is also understood that the first soldering part 130 and the second soldering part 170 may be formed as solder, and the first soldering part 130 and the second soldering part 170 may also be formed in various shapes, for example, may be formed as solder balls. The first welding part 130 and the second welding part 170 are provided to clarify the relative positional relationship between the different welding parts and the first electrode 111 or the second electrode 121, and should not be construed as limiting the number of welding parts. In other words, the number of the first welding parts 130 and the second welding parts 170 may be arbitrary, and the number of the first welding parts 130 may be the same as or different from the number of the second welding parts 170.

In addition, the second electrode far away from the equipment shell is a transmitting electrode, the first electrode close to the equipment shell is a receiving electrode, and when the capacitance value between the transmitting electrode and the receiving electrode changes, the transmitting electrode is less prone to be subjected to external electrical interference compared with the receiving electrode. In other words, the static electricity at the transmitting electrode is guided to the second welding portion, further avoiding the influence of the static electricity on the receiving electrode. In addition, the pressure detection module is arranged on the inner surface of the equipment shell, other circuits or devices of the electronic equipment with the equipment shell (for example, a main circuit board of the electronic equipment or a power transmitting device such as an antenna) can be arranged on one side of the second circuit board, which is far away from the inner surface of the equipment shell, and interference of the power transmitting device such as a main board or an antenna of the electronic equipment can be directly coupled to the transmitting electrode, so that the second welding part connected with the transmitting electrode avoids the influence of the power transmitting device such as the main board or the antenna of the electronic equipment on pressure detection. In addition, a shielding electrode can be arranged below the transmitting electrode, so that the mutual influence between the transmitting electrode and the antenna is further shielded. Therefore, the pressure detection module provided by the utility model effectively reduces the interference and influence of other circuits or devices on the pressure detection process. Especially when the electronic equipment comprises a power transmitting device such as an antenna, the embodiment of the utility model can still ensure the pressure detection accuracy under the condition that each device including the pressure detection module is compactly arranged in the electronic equipment.

In other embodiments, the area of the first electrode is smaller than the area of the second electrode, and the projection of the first electrode on the second electrode is recessed compared to the second electrode. Therefore, compared with the condition that the area of the first square is the same as that of the second square, the influence of assembly tolerance on the actual electrode plate area between the first electrode and the second electrode which are not aligned is reduced, and the pressure detection of the external pressure is further ensured.

Specifically, the projection of the first electrode on the second electrode is retracted 0.1 mm to 0.3 mm in comparison to the second electrode. In other words, even when the assembly tolerance reaches 0.1 mm, the actual plate area of the capacitor in the embodiment of the utility model is still not affected, the problem that the effective plate area is too small due to too large size difference between the receiving electrode and the transmitting electrode is avoided, and the utilization rate of the electrode surface is ensured. More specifically, the projection of the first electrode on the second electrode is retracted 0.2 mm compared to the second electrode, further reducing the effect of assembly tolerances on the actual pad area between the misaligned first and second electrodes and further ensuring the utilization of the electrode surface.

As one example, the second surface of the first electrode as the receiving electrode is formed in a first square shape having a first side length and a third side length, and the first surface of the second electrode as the transmitting electrode is formed in a second square shape having a second side length and a fourth side length. The first side length corresponds to a second side length of the second square, and the third side length corresponds to a fourth side length. The first side length is less than the second side length, the third side length is less than the fourth side length, a difference between the first side length and the second side length is between 0.1 millimeter and 0.3 millimeter (e.g., 0.2 millimeter), and a difference between the third side length and the fourth side length is between 0.1 millimeter and 0.3 millimeter (e.g., 0.2 millimeter). As a specific example, the first square and the second square are squares, i.e., the first side length is equal to the third side length and the second side length is equal to the fourth side length.

As another example, the second surface of the first electrode as the receiving electrode is formed in a first circle, the first surface of the second electrode as the transmitting electrode is formed in a second circle, and a difference between a radius of the first circle and a radius of the second circle is between 0.1 mm and 0.3 mm (e.g., 0.2 mm).

Fig. 2 is a schematic diagram of a pressure detection module according to another embodiment of the utility model. The pressure sensing module of fig. 2 may be disposed on an inner surface of the device case 250, and include a receiving electrode 211, a transmitting electrode 221, a first circuit board 210, a second circuit board 220, a first soldering part 230, a second soldering part 270, and a third soldering part 240. The receiving electrode 211, the transmitting electrode 221, the first circuit board 210, the second circuit board 220, the first soldering portion 230, and the second soldering portion 270 may respectively correspond to the receiving electrode 111, the transmitting electrode 121, the first circuit board 110, the second circuit board 120, the first soldering portion 130, and the second soldering portion 170 in fig. 1, and similar descriptions and explanations are omitted here.

As an example, the first and second soldering parts 230 and 270 are located at one side of the capacitor, and the third soldering part 340 is located at the other side opposite to the one side of the capacitor, thereby realizing support of the first and second circuit boards at both sides of the capacitor. In addition, the second welding portion 270 and the third welding portion 240 may be symmetrical with respect to capacitance, which is beneficial to increase the respective plate areas of the receiving electrode 211 and the transmitting electrode 221 constituting the capacitance, and improve the reliability of the deformation response of the receiving electrode 211 and the transmitting electrode 221.

As another example, the pressure detection module may further include a fourth welding part. It is understood that the third soldering portion 240 and the fourth soldering portion may be both grounded, the first soldering portion 230 and the second soldering portion 270 are both located at one side of the capacitor, and the third soldering portion 340 and the fourth soldering portion are both located at the other side opposite to one side of the capacitor. More specifically, the first and third soldering parts 230 and 240 may be symmetrically disposed about capacitance, and the second and

fourth soldering parts

270 and 270, respectively, are symmetrically disposed about capacitance. Therefore, more balanced support is realized between the first circuit board 210 and the second circuit board 220, and the position of deformation is more close to the center of the electrode when the receiving electrode 211 and the transmitting electrode 221 deform, so that the detection accuracy of pressure detection is improved.

Further, the first surface of the first circuit board 210 is disposed at the inner surface of the force receiving area of the device case 250, and the first surface of the receiving electrode 211 is disposed at the second surface of the first circuit board 210 between the first end side and the second end side of the second surface of the first circuit board 210.

Further, the second surface of the emitter electrode 221 is disposed on the first surface of the second circuit board 220 and is located between both end sides (i.e., the first end side and the second end side) of the first surface of the second circuit board 220. The second surface of the receiving electrode 211 is opposite to the first surface of the transmitting electrode 221, so that the receiving electrode 211 forms a capacitance with the transmitting electrode 221.

In addition, the first soldering part 230 is soldered between the ground pad 231 provided at the first end side of the second surface of the first circuit board 210 and the ground pad 232 provided at the first end side of the first surface of the second circuit board 220, and the third soldering part 240 is soldered between the ground pad 241 provided at the second end side of the second surface of the first circuit board 210 and the ground pad 242 provided at the second end side of the first surface of the second circuit board 220. The second soldering portion 270 is soldered to the transmitting electrode pad 271 disposed on the second surface of the first circuit board 210 and the transmitting electrode pad 272 disposed on the first surface of the second circuit board 220, and the transmitting electrode pad 272 is electrically connected to the transmitting electrode 221 via the wiring of the second circuit board 220. On the first surface of the second circuit board 220, the ground pad 232 is disposed between the emitter electrode pad 272 and the emitter electrode 221.

It should be understood that the stressed area of the device housing 250 may drive the receiving electrode 211 to move toward the transmitting electrode 221 through the support of the first welding portion 230, the second welding portion 270, and the third welding portion 240 according to the received external pressure, so as to change the capacitance value of the capacitor, so as to perform pressure detection on the external pressure.

Fig. 3 is a schematic diagram of a pressure detection module according to another embodiment of the utility model. The pressure detection module of fig. 3 may be disposed on an interior surface of the equipment enclosure 350. The receiving electrode 311, the transmitting electrode 321, the first circuit board 310, the second circuit board 320, the first soldering portion 330, the second soldering portion 370 and the third soldering portion 340 of the pressure detecting module in fig. 3 may be respectively connected to the receiving electrode 211, the transmitting electrode 221, the first circuit board 210, the second circuit board 220, the first soldering portion 230, the second soldering portion 270 and the third soldering portion 240 in fig. 2, and are not repeated herein.

The receiving electrode 311 and the transmitting electrode 321 of the pressure detection module of fig. 3 are respectively disposed on the first circuit board 310 and the second circuit board 320. The first, second, and

third solder parts

330, 370, and 340 are disposed between the first and

second circuit boards

310 and 320, and the second solder part 370 connects the emitter electrodes 321. The first welding portion 330 surrounded by the dotted line in fig. 3 is disposed between the second welding portion 370 and the receiving electrode 311, so that a parasitic capacitance formed between the second welding portion 370 and the receiving electrode 311 is avoided, and the detection accuracy of the pressure detection is facilitated.

In the present embodiment, the solder points of the respective solder parts on the respective circuit boards are not shown, but it is to be understood that the respective solder parts may be soldered to corresponding positions in the surfaces of the respective first and second circuit boards.

In addition, the first circuit board 310 is a flexible circuit board, the second circuit board 320 is a flexible circuit board, the first reinforcing plate 371 is disposed on the first surface of the first circuit board 310, and the second reinforcing plate 372 is disposed on the second surface of the second circuit board 320, so that the rigidity of the circuit board is improved, and soldering of each solder to a corresponding solder joint on the circuit board is facilitated.

In addition, the pressure detection module further includes a double-sided adhesive layer 380 attached between the first surface of the first circuit board 310 and the inner surface of the force-receiving area of the device housing 350, so as to fix the first circuit board 310 on the inner wall of the device housing 350. The double-sided adhesive layer 380 reliably transmits the external pressure from the stressed area of the device shell 350 to the first circuit board 310 and the second circuit board 320, so that the receiving electrode 311 and the transmitting electrode 321 generate reliable deformation response, and the pressure detection accuracy is ensured. In addition, the double-sided adhesive layer 380 reliably adheres the device housing 350 and the first circuit board 310 together, so that the structure of the pressure detection module is firmer, and the effect is particularly remarkable particularly when the thickness of the double-sided adhesive layer 380 is not more than 0.15 mm.

In addition, the pressure detection module may further include a first ground electrode 361 disposed on the second surface of the second circuit board 320, in other words, in the pressure detection module shown in fig. 3, the first ground electrode 361 is disposed below the second circuit board 320 where the emitter electrode 321 is disposed, which is beneficial to electrically isolating the emitter electrode 321.

In addition, the first surface of the first circuit board 310 is provided with at least one touch sensor 362 for detecting a touch position of the external pressure on the device case. The at least one touch sensor 362 can be at least one capacitive sensor. At least one touch sensor 362 can be grounded when the pressure detection module performs pressure detection, for example, at least one touch sensor 362 is controlled to be in a grounded mode. As an example, at least one capacitive sensor 362 as the at least one touch sensor 362 may be grounded to form a second ground electrode when the pressure detection module performs pressure detection. Thus, when the external pressure generated by a conductor such as a human body (for example, a finger) is detected, the at least one touch sensor 362 forms the second grounding electrode, which is beneficial to shielding the electric interference from the conductor and ensures the accuracy of the pressure detection of the external pressure. Due to the presence of the first and

second ground electrodes

361 and 362, external electrical isolation of the capacitance (formed by the receiving electrode 311 and the transmitting electrode 321) is achieved together with the grounded first and

third welds

330 and 340, shielding most of the electrical interference including static and parasitic capacitances, etc.

In addition, the pressure detection module may further include a transient diode, one end of the transient diode is electrically connected to the second soldering portion 370, and the other end of the transient diode is grounded. For example, two poles of the transient diode are electrically connected to the first bonding part 330 and the second bonding part 370, respectively. Specifically, two poles of the transient diode may be electrically connected to the ground pad and the emitter pad on the second surface of the first circuit board 310, respectively. With this arrangement, the transient diode is not provided in the detection channel of the capacitance as the pressure detection, further reducing the influence of the electrostatic interference on the capacitance. Since static electricity is more likely to flow through a path having a smaller resistance, it is more advantageous to shield the static electricity interference by connecting the transient diode between the ground terminal and the second soldering part 370 connected to the emitter electrode. In addition, the parasitic capacitance of the transient diode can possibly change during pressure detection, and the arrangement mode ensures that a detection channel of the capacitor cannot be subjected to electrical interference caused by the changed parasitic capacitance in the transient diode through the electrical isolation effect of the first welding part.

Fig. 4A shows a bottom view of the first circuit board of the pressure detection module of another embodiment, and fig. 4B shows a top view of the first circuit board.

As shown in fig. 4A, RX is a receiving electrode disposed on the first circuit board, GND is a ground pad, and two ground pads are disposed on both sides of the receiving electrode, each ground pad being used for soldering (e.g., soldering) solder. The shaded area around each ground pad represents pad windowing, exposing metal such as copper, which is beneficial for reducing ground impedance at the ground pad. In general, static electricity is more easily guided to a position where the ground resistance is small, thereby more effectively shielding the capacitance from static electricity and improving the pressure detection accuracy. In fig. 4A, the areas of the solder joint windowing of the two grounding solder joints on each side are different, the area of the solder joint windowing on the outer side is smaller than that of the solder joint windowing on the inner side, so that the inner side which affects the pressure detection result more easily shields more electrostatic interference, and the area of the solder joint windowing on the outer side is smaller, so that the short circuit risk of circuit board wiring caused by the excessively large solder joint windowing area is avoided while the effect of shielding the electrostatic interference is ensured.

Further, as shown in fig. 4B, the touch sensors TK0, TK1, and TK2 constitute at least one touch sensor, and a ground electrode may be disposed between the respective touch sensors of the at least one touch sensor to reduce electrical interference during touch position recognition of the at least one touch sensor. It is to be understood that the shaded portion of fig. 4B corresponds to the solder joint windowed portion in fig. 4A.

Fig. 5A shows a bottom view of the second circuit board of the pressure detection module of another embodiment, and fig. 5B shows a top view of the second circuit board.

As shown in fig. 5A, TX denotes a transmission electrode, which is provided in the second circuit board. On the surface of the second circuit board, one side of the emitter electrode is provided with two ground pads, and the other side is provided with a ground pad for welding the first welding part and an emitter electrode pad for welding the third welding part. Wherein, on the other side, the emitter electrode pad is electrically connected with the emitter electrode through a wire. The ground pad is located between the emitter electrode pad and the emitter electrode in a positional relationship. From the connection, the transmitting electrode welding spot and the transmitting electrode are not electrically connected with the grounding welding spot, so that when the third welding part welded to the transmitting electrode welding spot shields the electrical interference, the capacitance between the receiving electrode and the soldering tin welded to the transmitting electrode welding spot is avoided due to the existence of the first welding part, and the detection passage for pressure detection is prevented from being subjected to the electrical interference. In addition, the shaded area around each ground pad represents pad windowing, exposing metal such as copper, which is beneficial for reducing ground impedance at the ground pad. In general, static electricity is more easily guided to a position where the ground resistance is small, thereby more effectively shielding the capacitance from static electricity and improving the pressure detection accuracy.

As shown in fig. 5B, the shaded portion of fig. 5B corresponds to the spot-weld windowed portion of fig. 5A. The ground electrode shown in fig. 5B may be electrically connected to a ground pad of the second circuit board.

Fig. 6 is a schematic diagram of an electronic device according to another embodiment of the utility model. The electronic device of fig. 6 includes a device housing 610 and a pressure detection module 620. The pressure detection module may be the pressure detection module described in the above embodiments. As one example, the electronic device is a headset or smart glasses, and the force-receiving area of the device housing may be located at a pull rod of the headset or smart glasses.

In other examples, a first ground electrode, an antenna, and a circuit board are provided in the electronic device. The first grounding electrode is arranged between the antenna and the pressure detection module or between the circuit main board and the pressure detection module.

The first grounding electrode can be used as a shielding electrode to shield the mutual influence between the second electrode used as the emitting electrode and the antenna and the circuit main board of the electronic equipment, so that the pressure detection accuracy can still be ensured under the condition that all devices including the pressure detection module are compactly arranged in the electronic equipment.

In one example, the pressure detection module 620 is electrically connected to a main control chip 630 of the electronic device, and the main control chip 630 executes control of the electronic device based on a pressure detection result of the pressure detection module 620.

Fig. 7 is a schematic diagram of a headset according to another embodiment of the utility model. The headset of fig. 7 comprises: pressure detection module 10, equipment housing 20 and pull rod 40. The pressure detection module 10 is detachably disposed in the pull rod 40. The pressure detection module 10 may be the pressure detection module described in the above embodiments.

In an example, the force bearing area of the device housing 20 of the earphone may be an area of any shape, the outer side of the device housing 20 may adopt any mark to indicate that a user may apply a pressing force on the force bearing area, and the pressure detection module may perform pressure detection on the pressing force to perform control corresponding to the pressure detection result on the earphone.

Thus, particular embodiments of the present subject matter have been described. Other embodiments are within the scope of the following claims. In some cases, the actions recited in the claims can be performed in a different order and still achieve desirable results. In addition, the processes depicted in the accompanying figures do not necessarily require the particular order shown, or sequential order, to achieve desirable results. In some embodiments, multitasking and parallel processing may be advantageous.

It should also be noted that the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.

As will be appreciated by one skilled in the art, embodiments of the present invention may be provided as a method, system, or computer program product. Accordingly, the present invention may take the form of an entirely hardware embodiment, an entirely software embodiment or an embodiment combining software and hardware aspects. Furthermore, the present invention may take the form of a computer program product embodied on one or more computer-usable storage media (including, but not limited to, disk storage, CD-ROM, optical storage, and the like) having computer-usable program code embodied therein.

The utility model may be described in the general context of computer-executable instructions, such as program modules, being executed by a computer. Generally, program modules include routines, programs, objects, components, data structures, etc. that perform particular transactions or implement particular abstract data types. The utility model may also be practiced in distributed computing environments where transactions are performed by remote processing devices that are linked through a communications network. In a distributed computing environment, program modules may be located in both local and remote computer storage media including memory storage devices.

The embodiments in the present specification are described in a progressive manner, and the same and similar parts among the embodiments are referred to each other, and each embodiment focuses on the differences from the other embodiments. In particular, for the system embodiment, since it is substantially similar to the method embodiment, the description is simple, and for the relevant points, reference may be made to the partial description of the method embodiment.

The above description is only an example of the present invention, and is not intended to limit the present invention. Various modifications and alterations to this invention will become apparent to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the scope of the claims of the present invention.

Claims

1. A pressure detection module, comprising:

a first electrode, a second electrode, a first circuit board, a second circuit board, a first soldering portion and a second soldering portion,

wherein the first surface of the first circuit board is arranged on the inner surface of the stressed area of the equipment shell, the first surface of the first electrode is arranged on the second surface of the first circuit board,

the second surface of the second electrode is arranged on the first surface of the second circuit board,

the first welding part and the second welding part are arranged between the second surface of the first circuit board and the first surface of the second circuit board,

the second surface of the first electrode is opposite to the first surface of the second electrode, so that the first electrode and the second electrode form capacitance,

the second electrode is electrically connected to the second soldering portion, the second soldering portion is electrically connected to a driving circuit for driving the second electrode, the first soldering portion is located between the second soldering portion and the first electrode, and the first soldering portion is grounded,

the stress area of the equipment shell drives the first electrode to move towards the second electrode according to the received external pressure, so that the capacitance value between the first electrode and the second electrode is changed, and the pressure detection result of the external pressure is determined.

2. The pressure sensing module of claim 1, further comprising: and the third welding part is positioned on the other side opposite to one side of the capacitor.

3. The pressure sensing module of claim 2, further comprising: and the fourth welding part is positioned on the other side opposite to one side of the capacitor, and the fourth welding part is grounded.

4. The pressure sensing module of claim 3, wherein the first bond and the third bond are symmetrically disposed about the capacitance, and the second bond and the fourth bond are symmetrically disposed about the capacitance.

5. The pressure detection module of claim 1, wherein the area of the first electrode is smaller than the area of the second electrode, and the projection of the first electrode on the second electrode is recessed compared to the second electrode.

6. The pressure detection module of claim 5, wherein the projection of the first electrode on the second electrode is recessed by 0.1 mm to 0.3 mm compared to the second electrode.

7. The pressure detection module of claim 6, wherein the projection of the first electrode on the second electrode is retracted 0.2 mm compared to the second electrode.

8. The pressure detection module of any one of claims 1-7, wherein the first circuit board is a rigid printed circuit board or a flexible circuit board with a stiffener, and the second circuit board is a rigid printed circuit board or a flexible circuit board with a stiffener.

9. The pressure detection module of any one of claims 1-7, further comprising: a transient diode having one end connected to the second bonding part and the other end grounded.

10. The pressure detection module of any one of claims 1-7, further comprising:

and the double-sided adhesive layer is attached between the first surface of the first circuit board and the inner surface of the stress area of the equipment shell.

11. The pressure detection module of any one of claims 1-7, further comprising:

and the first grounding electrode is arranged on the second surface of the second circuit board.

12. The pressure detection module of claim 11, wherein the electronic device having the device housing comprises an antenna and a circuit board, wherein the first ground electrode is disposed between the antenna and the second surface of the second circuit board or the first ground electrode is disposed between the circuit board and the second surface of the second circuit board.

13. The pressure detection module of any one of claims 1-7, further comprising: the touch control circuit comprises at least one touch sensor, wherein the at least one touch sensor is arranged on the first surface of the first circuit board and used for detecting touch operation of a user on the device shell.

14. The pressure detection module of claim 13, wherein the at least one touch sensor is grounded to form a second ground electrode when the pressure detection module performs pressure detection.

15. The pressure sensing module of any of claims 1-7, wherein the first and second welds are both solder.

16. An electronic device, comprising:

the pressure detection module of any one of claims 1-15;

the pressure detection module is arranged on the inner surface of the equipment shell.

17. The electronic device of claim 16, wherein the electronic device is a headset or smart glasses, and wherein the force-receiving area of the device housing is located at a pull rod of the headset or smart glasses.