CN215623150U - General type high frequency heat-sealing machine module - Google Patents
General type high frequency heat-sealing machine module Download PDFInfo
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- CN215623150U CN215623150U CN202121594922.1U CN202121594922U CN215623150U CN 215623150 U CN215623150 U CN 215623150U CN 202121594922 U CN202121594922 U CN 202121594922U CN 215623150 U CN215623150 U CN 215623150U
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Abstract
The utility model provides a general high-frequency heat sealing machine module, which comprises an MCU control panel, a radio frequency panel, a filter panel, a heat sealing head and a power supply unit, wherein the MCU control panel is connected with the radio frequency panel; the MCU control board sends a signal to the radio frequency board, the radio frequency board receives the signal and then transmits the signal to the filter board, the filter board sends a signal to the heat sealing head, and the heat sealing head receives the signal and carries out heat sealing treatment on pipelines to be heat sealed, which are arranged at two ends of the chuck; the power supply unit is used for providing power supply voltage required by the signal transmission process. The general high-frequency heat sealing machine module can be used for quickly gathering heat through the adopted high-frequency electric field, is high in efficiency, can automatically identify pipelines with different specifications, automatically adjusts heat sealing power, adjusts heat sealing width, and is high in adaptability and compatibility.
Description
Technical Field
The utility model belongs to the technical field of medical instruments, particularly relates to an instrument article for heat sealing of blood pipelines made of plastic materials and the like, and further relates to a universal high-frequency heat sealing machine module.
Background
At present, in clinical practice, units such as hospitals, blood stations, biological products and the like store blood and plasma by using special plastic soft bags for conveying and collecting blood and plasma, PVC blood conveying tubes are connected to the special plastic soft bags for plasma, and the blood and the plasma enter the soft bags through the blood conveying tubes or flow out of the soft bags. After the blood or the blood plasma enters the soft bag, the PVC blood transfusion tube is sealed by a heat sealing machine.
However, when the existing heat sealing machine seals the blood bag by the heat sealing machine, the problem that the heat sealing speed is low and the efficiency is low due to improper heat sealing time is often encountered, and when the heat sealing width of different specifications is encountered, the width of the heat sealing surface of the heat sealing machine cannot be adjusted, so that on one hand, the compatibility of a heat sealing object is poor, and on the other hand, the problem that the self-adjusting heat sealing power performance of the heat sealing machine is poor and the adaptability is poor is substantially caused. When the heat seal speed is increased, the untight of the heat seal joint part is easy to occur, and the control of the convenient and accurate sealing heat seal time and the consumption of the heat seal machine for each heat seal are needed.
Disclosure of Invention
The technical scheme is as follows: in order to solve the technical problems, the general high-frequency heat sealing machine module provided by the utility model can quickly collect heat through the adopted high-frequency electric field, has high efficiency, can automatically identify pipelines with different specifications, automatically adjust heat sealing power and adjust heat sealing width, and has large adaptability and compatibility, and the specific technical contents are as follows:
the device comprises an MCU control panel, a radio frequency panel, a filter panel, a thermal connection head and a power supply unit; the MCU control board sends a signal to the radio frequency board, the radio frequency board receives the signal and then transmits the signal to the filter board, the filter board sends a signal to the heat sealing head, and the heat sealing head receives the signal and carries out heat sealing treatment on pipelines to be heat sealed, which are arranged at two ends of the chuck; the power supply unit is used for providing power supply voltage required by the signal transmission process.
As an improvement, the MCU control panel comprises an electromagnetic coil control unit, a sensor unit and a radio frequency control unit; the electromagnetic coil control unit is used for adjusting a working circuit of the electromagnetic coil; the sensor units are provided with at least two groups, one group is used for transmitting information whether heat sealing of the heat sealing head is finished, and the other group is used for transmitting information whether human-computer interaction is triggered; the radio frequency control unit is electrically connected with the radio frequency board and used for transmitting radio frequency signals.
As an improvement, the system also comprises a timer unit and a FAN driving unit; the timer unit is used for receiving and transmitting a timer signal; one end of the FAN driving unit is connected with external cooling and ventilating equipment and used for driving the external cooling and ventilating equipment.
As an improvement, the radio frequency board comprises a clock unit and a radio frequency power amplifier unit; the clock unit is electrically connected with the radio frequency control unit and transmits a signal to the radio frequency power amplification unit; the filter plate comprises a filter unit and a radio frequency coil; the radio frequency power amplification unit transmits a signal to the filtering unit; the radio frequency coil is electrically connected with the filtering unit and transmits signals to the heat sealing head.
As a refinement, the radio frequency board further comprises a radio frequency source, wherein the radio frequency source is provided in a high frequency transistor structure.
As an improvement, the diameter of a pipeline for heat sealing of the heat sealing head is set to be 2-6mm, and the heat sealing time is set to be 0.5-3 s.
Has the advantages that: the utility model provides a general high-frequency heat sealing machine module, which utilizes a high-frequency electric field to act on a workpiece to be heat sealed in the electric field, such as a blood bag made of plastic materials, so that the workpiece to be heat sealed generates a molecular polarization phenomenon, and the polarized molecules are arranged forcibly according to the direction of the electric field. The rapid change of the high-frequency electric field makes the molecules follow the change at the same extremely fast speed, so that the dielectric material generates a large amount of heat due to dielectric loss, and the heat is accumulated and accumulated to form high temperature, and finally the high-frequency electric field is melted.
The general high-frequency heat sealing machine module has the working frequency of less than or equal to 40.68Hz and the sealing Radio Frequency (RF) power of more than or equal to 30W, can be used on various devices, can automatically identify pipelines with different sections and thicknesses, can automatically adjust the heat sealing power, and can also manually adjust the width of a heat sealing surface according to special requirements.
Drawings
FIG. 1 is an electrical schematic diagram of a general high-frequency heat sealing machine module according to the present invention.
FIG. 2 is a schematic view showing the internal connection of the high-frequency heat sealing machine module according to the present invention.
FIG. 3 is a perspective view of the high frequency heat sealing machine module of the present invention.
Detailed Description
The following examples are given to further illustrate the embodiments of the present invention. The following examples are intended to illustrate the utility model but are not intended to limit the scope of the utility model.
The general high-frequency heat sealing machine module comprises an MCU control panel, a radio frequency panel, a filter panel, a heat sealing head and a power supply unit; the MCU control board sends a signal to the radio frequency board, the radio frequency board receives the signal and then transmits the signal to the filter board, the filter board sends a signal to the heat sealing head, and the heat sealing head receives the signal and carries out heat sealing treatment on pipelines to be heat sealed, which are arranged at two ends of the chuck; the power supply unit is used for providing power supply voltage required by the signal transmission process.
As a specific embodiment of the utility model, the radio frequency board is used for outputting radio frequency signals and is used by a heating junction.
The MCU control board is a microcontroller, the model can be (the model: TS-I, TS-II, TS-III, TS-IV and TS-V), but the MCU control board is not limited to the model, and the microcontroller only can realize the technical content of the utility model and belongs to the protection scope of the utility model.
The MCU control panel comprises an electromagnetic coil control unit, a sensor unit and a radio frequency control unit; the electromagnetic coil control unit is used for adjusting a working circuit of the electromagnetic coil; the sensor units are provided with at least two groups, one group is used for transmitting information whether heat sealing of the heat sealing head is finished, and the other group is used for transmitting information whether human-computer interaction is triggered; the radio frequency control unit is electrically connected with the radio frequency board and used for transmitting radio frequency signals.
The device also comprises a timer unit and a FAN driving unit; the timer unit is used for receiving and transmitting a timer signal; one end of the FAN driving unit is connected with external cooling and ventilating equipment and used for driving the external cooling and ventilating equipment.
The radio frequency board comprises a clock unit and a radio frequency power amplifier unit; the clock unit is electrically connected with the radio frequency control unit and transmits a signal to the radio frequency power amplification unit; the filter plate comprises a filter unit and a radio frequency coil; the radio frequency power amplification unit transmits a signal to the filtering unit; the radio frequency coil is electrically connected with the filtering unit and transmits signals to the heat sealing head.
The radio frequency board further comprises a radio frequency source, wherein the radio frequency source is arranged in a high-frequency transistor structure.
The diameter of a pipeline for heat sealing of the heat sealing head is set to be 2-6mm, and the heat sealing time is set to be 0.5-3 s.
The working principle is as follows: inside the heat-sealing machine equipment is installed to general type high frequency heat-sealing machine module, the circular telegram back, put into heat-sealing head department to the blood bag, when triggering the micro-gap switch that the switch is connected, through the control panel (drive module inside solenoid valve push rod push forward push heat-sealing head 1 be close to heat-sealing head 2) → radio frequency board (send energy signal heat-sealing) → filter board (can safe heat-sealing to the signal filtration of enlargeing), the heat-sealing head merges, carries out the heat-sealing, the end work.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the utility model. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (6)
1. The utility model provides a general type high frequency heat-sealing machine module which characterized in that: the device comprises an MCU control panel, a radio frequency panel, a filter panel, a thermal connection head and a power supply unit; the MCU control board sends a signal to the radio frequency board, the radio frequency board receives the signal and then transmits the signal to the filter board, the filter board sends a signal to the heat sealing head, and the heat sealing head receives the signal and carries out heat sealing treatment on pipelines to be heat sealed, which are arranged at two ends of the chuck; the power supply unit is used for providing power supply voltage required by the signal transmission process.
2. The general-purpose high-frequency heat sealing machine module according to claim 1, wherein: the MCU control panel comprises an electromagnetic coil control unit, a sensor unit and a radio frequency control unit; the electromagnetic coil control unit is used for adjusting a working circuit of the electromagnetic coil; the sensor units are provided with at least two groups, one group is used for transmitting information whether heat sealing of the heat sealing head is finished, and the other group is used for transmitting information whether human-computer interaction is triggered; the radio frequency control unit is electrically connected with the radio frequency board and used for transmitting radio frequency signals.
3. The general-purpose high-frequency heat sealing machine module according to claim 2, wherein: the device also comprises a timer unit and a FAN driving unit; the timer unit is used for receiving and transmitting a timer signal; one end of the FAN driving unit is connected with external cooling and ventilating equipment and used for driving the external cooling and ventilating equipment.
4. The general-purpose high-frequency heat sealing machine module according to claim 1, wherein: the radio frequency board comprises a clock unit and a radio frequency power amplifier unit; the clock unit is electrically connected with the radio frequency control unit and transmits a signal to the radio frequency power amplification unit; the filter plate comprises a filter unit and a radio frequency coil; the radio frequency power amplification unit transmits a signal to the filtering unit; the radio frequency coil is electrically connected with the filtering unit and transmits signals to the heat sealing head.
5. The general-purpose high-frequency heat sealing machine module according to claim 1, wherein: the radio frequency board further comprises a radio frequency source, wherein the radio frequency source is arranged in a high-frequency transistor structure.
6. The general-purpose high-frequency heat sealing machine module according to claim 1, wherein: the diameter of a pipeline for heat sealing of the heat sealing head is set to be 2-6mm, and the heat sealing time is set to be 0.5-3 s.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121594922.1U CN215623150U (en) | 2021-07-13 | 2021-07-13 | General type high frequency heat-sealing machine module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121594922.1U CN215623150U (en) | 2021-07-13 | 2021-07-13 | General type high frequency heat-sealing machine module |
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| Publication Number | Publication Date |
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| CN215623150U true CN215623150U (en) | 2022-01-25 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121594922.1U Active CN215623150U (en) | 2021-07-13 | 2021-07-13 | General type high frequency heat-sealing machine module |
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| CN (1) | CN215623150U (en) |
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2021
- 2021-07-13 CN CN202121594922.1U patent/CN215623150U/en active Active
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