CN215600387U - Double-insertion silicon wafer top clamping structure - Google Patents

Double-insertion silicon wafer top clamping structure Download PDF

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Publication number
CN215600387U
CN215600387U CN202122243168.3U CN202122243168U CN215600387U CN 215600387 U CN215600387 U CN 215600387U CN 202122243168 U CN202122243168 U CN 202122243168U CN 215600387 U CN215600387 U CN 215600387U
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cover plate
silicon
rod
apron
flange
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CN202122243168.3U
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Chinese (zh)
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陈庆敏
孙志宇
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Wuxi Songyu Technology Co ltd
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Wuxi Songyu Technology Co ltd
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

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Abstract

The utility model discloses a top clamping structure of a double-inserted silicon wafer, which comprises a cover plate, wherein the cover plate is of a frame structure and comprises cover plate flanges and cover plate ribs, the cover plate flanges are arranged in parallel from left to right, the cover plate ribs are vertically arranged between the cover plate flanges, a plurality of groups of top groove rods are also arranged between the cover plate flanges, each group of top groove rods at least comprises one top groove rod, the lower surface of each top groove rod is provided with continuous groove teeth, a compression spring is embedded into the first end of each top groove rod, the second end rod end of each top groove rod outwards penetrates through the cover plate flange, and the clamping and the loosening of the top groove rods are realized through adjusting bolts or automatic clamping jaws. The utility model ensures that the whole attaching degree of the silicon chip is better, the process gas is not easy to enter the attaching surface, and the quality of the silicon chip is improved.

Description

Double-insertion silicon wafer top clamping structure
Technical Field
The utility model relates to the field of solar cell manufacturing equipment, in particular to a top clamping structure of a double-insertion silicon wafer.
Background
At present, in ALD atomic layer deposition equipment for coating the surfaces of solar cell silicon wafers in the industry, when a double-silicon-wafer-insertion single-side coating process is carried out, two silicon wafers are inserted into the same groove tooth of an aluminum boat, the two silicon wafers are clamped and tightly attached together through a clamping mechanism arranged in the middle of the aluminum boat, process gas cannot pass through an attaching surface after the two silicon wafers are attached, and therefore the purposes that only the outer side surfaces of the two silicon wafers are coated with a film, and the attaching surfaces of the two silicon wafers are not coated with the film are achieved. In the process of practical application, the bottom and the side of the silicon wafer are both provided with groove rods, the clamping rods are arranged between the bottom groove rods and the side groove rods, the groove rods are not arranged at the top of the silicon wafer, after the silicon wafer is clamped by the clamping rods positioned in the middle, the top positions of the two silicon wafers cannot be completely attached together, a certain gap exists, process gas can enter the gap in the process of carrying out a process, and the quality of the silicon wafer is influenced by coating on the surface of the silicon wafer without coating.
SUMMERY OF THE UTILITY MODEL
The applicant aims at the defects that the top positions of two silicon wafers cannot be completely attached and a certain gap exists in the existing double-insertion silicon wafer clamping mechanism, so that process gas enters the gap to coat the silicon wafer attachment surface, the quality of the silicon wafers is affected, and the like.
The technical scheme adopted by the utility model is as follows:
the utility model provides a tight structure of two silicon chip tops that insert, the main part is a apron, the apron is frame construction, constitute by apron flange and apron rib, parallel arrangement about the apron flange, the apron rib sets up perpendicularly between the apron flange, still set up a plurality of groups top groove pole between the apron flange, every group top groove pole comprises a top groove pole at least, continuous groove tooth has been seted up to the lower surface of every top groove pole, the embedded compression spring of first end of top groove pole, the second of top groove pole holds the end of the rod and outwards passes the apron flange, realize through adjusting bolt or automatic clamping jaw that the clamp of top groove pole is tight and loosen.
As a further improvement of the above technical solution:
each group of top groove rods consists of two parallel top groove rods.
At least one cover plate rib is arranged between every two adjacent groups of top groove rods.
The lower surface of the cover plate flange is provided with a positioning pin which is matched with the aluminum boat for loading the silicon wafers.
The end parts of the cover plate ribs are respectively connected with the flanges of the two cover plates.
The slot teeth of the top slot rod are opened towards two sides to form angles, and the angles are matched with the edges of the double-inserted silicon wafers.
The first end department of apron flange correspondence top groove pole is equipped with the accommodation hole, and the accommodation hole outside is equipped with the spring roof, places in the accommodation hole compression spring.
The cover plate flange is provided with a groove rod top plate corresponding to the second end of the top groove rod, and the groove rod top plate is provided with an adjusting bolt.
The grooved bar top plate is located on the outer side of the cover plate flange and adopts a U-shaped structure, the head of the adjusting bolt is located on the outer side of the grooved bar top plate, and the bar part is in contact with the bar end after being screwed into the grooved bar top plate from the outer side.
The rod end is directly pressed and loosened by an external automatic clamping jaw, and the automatic clamping function of the top groove rod is realized.
The utility model has the following beneficial effects:
according to the double-insertion silicon wafer top clamping structure, the problem of poor top lamination of the silicon wafers is solved by adding the clamping structure at the top of the silicon wafer, so that the double-insertion two silicon wafers are better laminated. When the equipment carries out a double-insertion single-side coating process, the tops of two double-insertion silicon wafers are clamped, so that the integral attaching degree of the silicon wafers is better, process gas is not easy to enter an attaching surface in the process, the film growth of a non-coating surface is effectively reduced, the disturbance degree defective rate of the silicon wafers is reduced, and the quality of the silicon wafers is improved.
The utility model adopts the top groove rod to realize the compression of the double-inserted silicon wafer, the compression spring is embedded in the first end of the top groove rod, the second end rod end of the top groove rod outwards penetrates through the flange of the cover plate, the top groove rod is pushed to one side by the elasticity of the spring, and the advance and retreat of the top groove rod are adjusted, thereby realizing the clamping of the silicon wafer. The utility model realizes the compatibility of two control modes of manual and automatic, and has good practicability. The cover plate and the aluminum boat are accurately positioned through the positioning pin, so that the problems of silicon chip breakage and the like caused by inaccurate positioning are avoided.
Drawings
Fig. 1 is an installation drawing of the present invention.
Fig. 2 is a perspective view of the present invention.
Fig. 3 is a bottom view of the present invention.
Fig. 4 is a top view of the present invention.
Fig. 5 is a sectional view of section a-a in fig. 4.
In the figure: 1. cover plate ribs; 2. a cover plate flange; 3. a top channel bar; 4. positioning pins; 5. groove teeth; 6. a compression spring; 7. a spring top plate; 8. a rod end; 9. a slot bar top plate; 10. and adjusting the bolt.
Detailed Description
The following describes embodiments of the present invention with reference to the drawings.
As shown in fig. 1 to 5, the main body of the double silicon wafer top clamping structure of the present invention is a cover plate, the cover plate is a frame structure and is composed of two cover plate flanges 2 and two cover plate ribs 1, the two cover plate flanges 2 are arranged in parallel from left to right, and the two cover plate ribs 1 are vertically arranged between the two cover plate flanges 2 and are respectively connected with the end portions of the two cover plate flanges 2. The lower surfaces of the two cover plate flanges 2 are respectively provided with at least one positioning pin 4, and the positioning pins 4 are matched with an aluminum boat for loading silicon wafers, so that the cover plates are accurately positioned at the top of the aluminum boat. Still set up a plurality of groups top groove pole 3 between two apron flanges 2, every group top groove pole 3 comprises a top groove pole 3 at least, and multiplicable setting at least one apron rib 1 between adjacent every group top groove pole 3 also can not increase and set up apron rib 1. The lower surface of each top groove rod 3 is provided with continuous groove teeth 5, and the groove teeth 5 are opened towards two sides to form angles for being matched with the edges of the double-insertion silicon chips to clamp the upper edges of the double-insertion silicon chips.
The embedded compression spring 6 of the first end of top groove pole 3, the apron flange 2 correspond the first end department of top groove pole 3 and are equipped with the accommodation hole, and the accommodation hole outside is equipped with spring roof 7, places in the accommodation hole compression spring 6, compression spring 6 support to the outside and lean on spring roof 7, extrude top groove pole 3 to the inboard.
The second end of the top groove rod 3 is a rod end 8, and the rod end 8 penetrates through the cover plate flange 2 outwards. As an implementation mode, a groove rod top plate 9 is arranged at the position, corresponding to the second end of the top groove rod 3, of the cover plate rib 2, and the groove rod top plate 9 is located on the outer side of the cover plate rib 2 and is of a U-shaped structure. An adjusting bolt 10 is arranged on the grooved bar top plate 9, the head of the adjusting bolt 10 is positioned on the outer side of the grooved bar top plate 9, the bar part is screwed into the grooved bar top plate 9 from the outer side and then is in collinear connection with the outer end of the bar end 8, and the advance and retreat of the top grooved bar 3 are adjusted through the spiral process of the adjusting bolt 10. As another embodiment, the rod end 8 penetrates through the cover plate rib 2 outwards, and the rod end 8 can be directly pressed by an external automatic clamping jaw, so that the top groove rod 3 is automatically clamped.
When the aluminum boat inserting device is implemented, firstly, the aluminum boat with the inserted sheet is conveyed to a specified position, the adjusting bolt 10 on the corresponding groove rod top plate 9 on the outer side of the top groove rod 3 is manually screwed to apply pressure to the top groove rod 3, or the automatic clamping jaw presses the rod end 8 of the top groove rod 3 to apply pressure, the top groove rod 3 is pushed to a positioning side, the cover plate is covered on the aluminum boat, and the cover plate is accurately positioned between the positioning pin 4 and the aluminum boat. When the cover plate is placed, the groove teeth 5 on the lower surface of the top groove rod 3 correspond to the upper edges of the double-insertion silicon wafers to form clamping fit. After the cover plate is placed, the adjusting bolt 10 is loosened manually or the automatic clamping jaw is loosened, the top groove rod 3 is pushed to the original side by means of the elasticity of the compression spring 6, and the clamping of the top of the double-insertion silicon wafer is achieved.
The foregoing description is illustrative of the present invention and is not to be construed as limiting thereof, as the utility model may be modified in any manner without departing from the spirit thereof.

Claims (10)

1. The utility model provides a two silicon chip tops of inserting press from both sides tight structure which characterized in that: the main part is a apron, the apron is frame construction, constitute by apron flange (2) and apron rib (1), parallel arrangement about apron flange (2), apron rib (1) sets up perpendicularly between apron flange (2), still set up a plurality of groups top grooved bar (3) between apron flange (2), every group top grooved bar (3) comprise a top grooved bar (3) at least, continuous groove tooth (5) have been seted up to the lower surface of every top grooved bar (3), embedded one compression spring (6) of first end of top grooved bar (3), the second holds the end rod (8) of top grooved bar (3) and outwards passes apron flange (2), realize pressing from both sides tightly and loosen of top grooved bar through adjusting bolt (10) or automatic clamping jaw.
2. The dual-silicon-on-plug top clamping structure of claim 1, wherein: each group of top grooved bars (3) consists of two parallel top grooved bars (3).
3. The dual-silicon-on-plug top clamping structure of claim 1, wherein: at least one cover plate rib (1) is arranged between every two adjacent groups of top groove rods (3).
4. The dual-silicon-on-plug top clamping structure of claim 1, wherein: the lower surface of the cover plate flange (2) is provided with a positioning pin (4), and the positioning pin (4) is matched with an aluminum boat for loading silicon wafers.
5. The dual-silicon-on-plug top clamping structure of claim 1, wherein: the end parts of the cover plate ribs (1) are respectively connected with the two cover plate flanges (2).
6. The dual-silicon-on-plug top clamping structure of claim 1, wherein: the slot teeth (5) of the top slot rod (3) are opened towards two sides to form angles, and are matched with the edges of the double silicon insertion wafers.
7. The dual-silicon-on-plug top clamping structure of claim 1, wherein: the cover plate flange (2) is provided with a containing hole corresponding to the first end of the top groove rod (3), a spring top plate (7) is arranged on the outer side of the containing hole, and the compression spring (6) is placed in the containing hole.
8. The dual-silicon-on-plug top clamping structure of claim 1, wherein: the cover plate flange (2) is provided with a groove rod top plate (9) corresponding to the second end of the top groove rod (3), and the groove rod top plate (9) is provided with an adjusting bolt (10).
9. The dual-silicon-on-plug top clamping structure of claim 8, wherein: the grooved bar top plate (9) is positioned on the outer side of the cover plate flange (2) and is of a U-shaped structure, the head of the adjusting bolt (10) is positioned on the outer side of the grooved bar top plate (9), and the bar part is screwed into the grooved bar top plate (9) from the outer side and then is contacted with the bar end (8).
10. The dual-silicon-on-plug top clamping structure of claim 1, wherein: the rod end (8) is directly pressed and loosened by an external automatic clamping jaw, and the automatic clamping function of the top groove rod (3) is realized.
CN202122243168.3U 2021-09-15 2021-09-15 Double-insertion silicon wafer top clamping structure Active CN215600387U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202122243168.3U CN215600387U (en) 2021-09-15 2021-09-15 Double-insertion silicon wafer top clamping structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202122243168.3U CN215600387U (en) 2021-09-15 2021-09-15 Double-insertion silicon wafer top clamping structure

Publications (1)

Publication Number Publication Date
CN215600387U true CN215600387U (en) 2022-01-21

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116682893A (en) * 2023-07-28 2023-09-01 无锡松煜科技有限公司 Al with different thicknesses on front and back of silicon wafer 2 O 3 Method for producing film

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116682893A (en) * 2023-07-28 2023-09-01 无锡松煜科技有限公司 Al with different thicknesses on front and back of silicon wafer 2 O 3 Method for producing film
CN116682893B (en) * 2023-07-28 2023-10-13 无锡松煜科技有限公司 Al with different thicknesses on front and back of silicon wafer 2 O 3 Method for producing film

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