CN215600333U - Plastic packaging device for producing glass-sealed diode - Google Patents

Plastic packaging device for producing glass-sealed diode Download PDF

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Publication number
CN215600333U
CN215600333U CN202121211359.5U CN202121211359U CN215600333U CN 215600333 U CN215600333 U CN 215600333U CN 202121211359 U CN202121211359 U CN 202121211359U CN 215600333 U CN215600333 U CN 215600333U
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CN
China
Prior art keywords
plastic packaging
cooling
packaging device
collection box
glass
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN202121211359.5U
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Chinese (zh)
Inventor
蓝蜀元
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sichuan Shulun Xin Electronic Co Ltd
Original Assignee
Sichuan Shulun Xin Electronic Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sichuan Shulun Xin Electronic Co Ltd filed Critical Sichuan Shulun Xin Electronic Co Ltd
Priority to CN202121211359.5U priority Critical patent/CN215600333U/en
Application granted granted Critical
Publication of CN215600333U publication Critical patent/CN215600333U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model belongs to the technical field of diode production, and particularly relates to a plastic package device for glass-sealed diode production. The diode collecting box is reasonable in structural design, the diodes in the collecting box can be conveniently and comprehensively cooled by blowing without dead angles through the matching of the motor, the fan blades, the worm wheel, the wide-mouth mask, the hollow tube, the blowing nozzle, the rack, the gear, the transverse plate and the driving rod, so that the cooling is more comprehensive and uniform, the bonding condition of the local diodes is avoided, the diodes are conveniently protected through the matching of the collecting box, the cushion pad, the moving wheel and the groove, and meanwhile, the diodes are conveniently taken out.

Description

Plastic packaging device for producing glass-sealed diode
Technical Field
The utility model relates to the technical field of diode production, in particular to a plastic package device for producing a glass-sealed diode.
Background
The diode needs to be sealed in a plastic package during production, so that the diode is isolated from the outside, most of plastic package materials use epoxy resin, and the epoxy resin has the advantages of heat resistance, oxidation resistance, insulativity and the like, can effectively avoid faults such as short circuit and the like of a circuit, and can better protect the safety of the circuit. After retrieval: the plastic packaging device for diode production with the authorized publication number of CN210123718U can be used for reinforcing and radiating the vacuum pump, so that the vacuum pump can stably perform vacuum pumping on the plastic packaging device, and the plastic packaging device for diode production is convenient.
However, the fan in the plastic package device for producing the diodes is fixed, and only the diodes which are well plastic-packaged on the left side in the collecting frame can be cooled, the diodes on the right side in the collecting frame are poor in cooling effect, so that the diodes are unevenly and comprehensively cooled, and the situation that local diodes are bonded is easy to occur, so that the plastic package device for producing the glass-packaged diodes is provided for solving the problems.
SUMMERY OF THE UTILITY MODEL
The utility model aims to solve the defects that the existing plastic packaging device for producing a glass-sealed diode cannot uniformly and comprehensively cool the plastic-packaged diode and is easy to cause the condition of local diode bonding.
In order to achieve the purpose, the utility model adopts the following technical scheme:
a plastic packaging device for producing glass-sealed diodes comprises a plastic packaging device body, wherein a plastic packaging material feeding cylinder is fixedly arranged at the top of the plastic packaging device body, a cooling collecting box is fixedly arranged at the bottom of the plastic packaging device body, a vacuum pump is fixedly arranged at the top of the cooling collecting box, a suction end of the vacuum pump is communicated with one side of the plastic packaging device body, a sealing cover is fixedly arranged at one side of the cooling collecting box, a motor is fixedly arranged on the inner wall of one side of the sealing cover, a worm is fixedly arranged on an output shaft of the motor, fan blades are fixedly sleeved at the outer side of the worm, a worm wheel is rotatably arranged on the inner wall of the top of the sealing cover, the worm is meshed with the worm wheel, a driving rod is fixedly arranged at the front side of the worm wheel, a transverse plate is sleeved at the outer side of the driving rod in a sliding manner, a vertical rod is fixedly arranged at the bottom of the transverse plate, the utility model discloses a cooling device, including montant, cooling collecting box, fixed intercommunication, reset spring, rack, wide gauze mask, reset spring, cooling collecting box internalization is provided with the collection box, the bottom fixed mounting of montant has the rack, it installs same hollow tube to rotate on the both sides inner wall of cooling collecting box, the fixed intercommunication in bottom of hollow tube has a plurality of blowing nozzles, the fixed cup joint in the outside of hollow tube has the gear, the rack meshes with the gear mutually, the fixed intercommunication in one end of hollow tube has wide gauze mask, the bottom fixed mounting of rack has reset spring, reset spring keeps away from the one end fixed mounting of rack on the bottom inner wall of sealed cowling, the activity is provided with the collection box in the cooling collecting box, fixed mounting has the blotter on the bottom inner wall of collection box.
Preferably, two air inlets are formed in one side of the sealing cover, and filter screens are fixedly mounted in the two air inlets.
Preferably, the rear side of the worm wheel is rotatably provided with a support frame, and the support frame is fixedly arranged on the inner wall of the top of the sealing cover.
Preferably, the front side of diaphragm is opened and is equipped with the guiding hole, the actuating lever slides and cup joints in the guiding hole.
Preferably, one side of the cooling collection box is provided with a sliding groove, and the transverse plate is sleeved in the sliding groove in a sliding manner.
Preferably, two grooves are formed in the inner wall of the bottom of the cooling collecting box, four moving wheels are rotatably mounted at the bottom of the collecting box and are respectively connected in the corresponding grooves in a rolling mode, a sliding groove hole is formed in the front side of the cooling collecting box, and the collecting box is sleeved in the sliding hole in a sliding mode.
According to the plastic package device for producing the glass-sealed diode, the diode can be subjected to vacuum plastic package through the matching of the vacuum pump, the plastic package device body and the plastic package material feeding cylinder, the diode is conveniently protected through the matching of the collecting box, the cushion pad, the moving wheel and the groove, and meanwhile, the diode is conveniently taken out;
according to the plastic packaging device for producing the glass-sealed diode, the diode in the collecting box can be conveniently and comprehensively cooled by blowing without dead angles through the matching of the motor, the fan blades, the worm gear, the wide-mouth mask, the hollow pipe, the blowing nozzle, the rack, the gear, the transverse plate and the driving rod, so that the cooling is more comprehensive and uniform, and the condition that local diodes are bonded is avoided;
the diode collecting box is reasonable in structural design, the diodes in the collecting box can be conveniently and comprehensively cooled by blowing without dead angles through the matching of the motor, the fan blades, the worm wheel, the wide-mouth mask, the hollow tube, the blowing nozzle, the rack, the gear, the transverse plate and the driving rod, so that the cooling is more comprehensive and uniform, the bonding condition of the local diodes is avoided, the diodes are conveniently protected through the matching of the collecting box, the cushion pad, the moving wheel and the groove, and meanwhile, the diodes are conveniently taken out.
Drawings
Fig. 1 is a schematic structural diagram of a plastic packaging device for producing a glass-sealed diode according to the present invention;
FIG. 2 is a cross-sectional view of a plastic package device for producing a glass-sealed diode according to the present invention;
fig. 3 is a schematic structural diagram of a portion a of a plastic package device for producing a glass-sealed diode according to the present invention;
fig. 4 is a schematic structural diagram of a part B of a plastic packaging device for producing a glass-sealed diode according to the present invention.
In the figure: 1. a plastic packaging device body; 2. a plastic packaging material feeding cylinder; 3. a vacuum pump; 4. a cooling collection box; 5. a hollow tube; 6. a blowing nozzle; 7. a collection box; 8. a cushion pad; 9. a moving wheel; 10. a groove; 11. a sealing cover; 12. a filter screen; 13. a motor; 14. a worm; 15. a fan blade; 16. wide mouth mask; 17. a gear; 18. a rack; 19. a return spring; 20. a support frame; 21. a worm gear; 22. a transverse plate; 23. a chute; 24. a vertical rod; 25. a drive rod; 26. and (4) a guide hole.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
Referring to fig. 1-4, a plastic packaging device for producing a glass-sealed diode comprises a plastic packaging device body 1, a plastic packaging material feeding cylinder 2 is fixedly arranged at the top of the plastic packaging device body 1, a cooling collection box 4 is fixedly arranged at the bottom of the plastic packaging device body 1, a vacuum pump 3 is fixedly arranged at the top of the cooling collection box 4, the air suction end of the vacuum pump 3 is communicated with one side of the plastic packaging device body 1, the diode can be subjected to vacuum plastic packaging through the cooperation of the vacuum pump 3, the plastic packaging device body 1 and the plastic packaging material feeding cylinder 2, a sealing cover 11 is fixedly arranged at one side of the cooling collection box 4, a motor 13 is fixedly arranged on the inner wall at one side of the sealing cover 11, a worm 14 is fixedly arranged on the output shaft of the motor 13, fan blades 15 are fixedly sleeved at the outer side of the worm 14, a worm wheel 21 is rotatably arranged on the inner wall at the top of the sealing cover 11, and the worm 14 is meshed with the worm wheel 21, a driving rod 25 is fixedly installed on the front side of the worm wheel 21, a transverse plate 22 is sleeved on the outer side of the driving rod 25 in a sliding mode, a vertical rod 24 is fixedly installed at the bottom of the transverse plate 22, a rack 18 is fixedly installed at the bottom end of the vertical rod 24, the same hollow pipe 5 is installed on the inner walls of the two sides of the cooling collection box 4 in a rotating mode, the bottom of the hollow pipe 5 is fixedly communicated with a plurality of air blowing nozzles 6, a gear 17 is fixedly sleeved on the outer side of the hollow pipe 5, the rack 18 is meshed with the gear 17, a wide mouth cover 16 is fixedly communicated with one end of the hollow pipe 5, the motor 13 is started, an output shaft of the motor 13 drives the worm 14 and the fan blades 15 to rotate, the fan blades 15 can rotate to form air, the air enters the hollow pipe 5 from the wide mouth cover 16 and is blown out of the air blowing nozzles 6, air can be used for cooling diodes in the collection box 7 in a whole in a blowing mode, meanwhile, the worm 14 drives the worm wheel 21 and the driving rod 25 to rotate, the transverse plate 22 and the driving rod 25, Montant 24 and rack 18 reciprocate, rack 18 has driven gear 17, hollow tube 5 and blowing nozzle 6's reciprocating rotation all around, thereby can be comprehensive not have the dead angle carry out the cooling of blowing to the diode in collecting box 7, make the cooling more even comprehensive, avoid appearing local cooling can not, lead to the diode to take place the condition that bonds, rack 18's bottom fixed mounting has reset spring 19, the one end fixed mounting that rack 18 was kept away from to reset spring 19 is on the bottom inner wall of sealed cowling 11, through reset spring 19, make more stable smooth and easy of rack 18 motion, avoid appearing the dead condition of card, cooling collecting box 4 internalization is provided with collects box 7, fixed mounting has blotter 8 on the bottom inner wall of collecting box 7, through blotter 8, can carry out buffer protection to the diode.
In the utility model, two air inlets are formed in one side of the sealing cover 11, and the filter screens 12 are fixedly arranged in the two air inlets, so that air can enter conveniently, and meanwhile, dust is prevented from entering and polluting the diodes.
In the utility model, the rear side of the worm wheel 21 is rotatably provided with the support frame 20, and the support frame 20 is fixedly arranged on the inner wall of the top part of the sealing cover 11, so that the worm wheel 21 is conveniently and stably supported and rotates more stably.
In the utility model, the guide hole 26 is arranged at the front side of the transverse plate 22, the driving rod 25 is sleeved in the guide hole 26 in a sliding manner, so that the driving rod 25 is convenient to rotate and can drive the transverse plate 22 to move up and down by the driving rod 25.
In the utility model, one side of the cooling collection box 4 is provided with the chute 23, and the transverse plate 22 is slidably sleeved in the chute 23, so that the transverse plate 22 is conveniently guided, and the rotation of the transverse plate is more stable.
According to the utility model, two grooves 10 are formed in the inner wall of the bottom of the cooling collection box 4, four movable wheels 9 are rotatably mounted at the bottom of the collection box 7, the four movable wheels 9 are respectively connected in the corresponding grooves 10 in a rolling manner, a sliding slot hole is formed in the front side of the cooling collection box 4, the collection box 7 is sleeved in the sliding hole in a sliding manner, the collection box 7 is pulled forwards, and the movable wheels 9 roll in the grooves 10, so that the collection box 7 can be easily pulled out, and the diode can be conveniently taken out.
In the utility model, when in use, the diode can be subjected to vacuum plastic package through the matching of the vacuum pump 3, the plastic package device body 1 and the plastic package material feeding cylinder 2, the diode which is subjected to the plastic package falls into the collection box 7, the diode can be subjected to buffer protection through the buffer cushion 8, the motor 13 is started at the same time, the output shaft of the motor 13 drives the worm 14 and the fan blades 15 to rotate, the fan blades 15 can rotate to form air blow, the air blow enters the hollow tube 5 from the wide-mouth cover 16 and then is blown out from the plurality of air blowing nozzles 6, so that the diodes in the whole collection box 7 can be subjected to air blow cooling, the worm 14 drives the worm wheel 21 and the driving rod 25 to rotate, the driving rod 25 drives the transverse plate 22 to move up and down, the transverse plate 22 drives the vertical rod 24 and the rack 18 to move up and down, the rack 18 is more smoothly moved through the return spring 19, and the blocking condition is avoided, rack 18 has driven gear 17, hollow tube 5 and blowing nozzle 6's reciprocating rotation all around, thereby can be comprehensive not have the dead angle carry out the cooling of blowing to the diode in collecting box 7, make the cooling more even comprehensive, avoid appearing local cooling and can't, lead to the diode to take place the condition that bonds, when needing to take out the diode in collecting box 7, box 7 is collected in the forward pulling, movable wheel 9 rolls in recess 10, thereby can relax pull out and collect box 7, make things convenient for taking out of diode.

Claims (6)

1. The plastic packaging device for producing the glass-sealed diode comprises a plastic packaging device body (1) and is characterized in that a plastic packaging material feeding cylinder (2) is fixedly arranged at the top of the plastic packaging device body (1), a cooling collecting box (4) is fixedly arranged at the bottom of the plastic packaging device body (1), a vacuum pump (3) is fixedly arranged at the top of the cooling collecting box (4), the air suction end of the vacuum pump (3) is communicated with one side of the plastic packaging device body (1), a sealing cover (11) is fixedly arranged at one side of the cooling collecting box (4), a motor (13) is fixedly arranged on the inner wall of one side of the sealing cover (11), a worm (14) is fixedly arranged on the output shaft of the motor (13), fan blades (15) are fixedly sleeved at the outer side of the worm (14), and a worm wheel (21) is rotatably arranged on the inner wall of the top of the sealing cover (11), the worm (14) is meshed with the worm wheel (21), the driving rod (25) is fixedly mounted on the front side of the worm wheel (21), the transverse plate (22) is sleeved on the outer side of the driving rod (25) in a sliding mode, the vertical rod (24) is fixedly mounted at the bottom of the transverse plate (22), the rack (18) is fixedly mounted at the bottom of the vertical rod (24), the same hollow pipe (5) is installed on the inner walls of the two sides of the cooling collecting box (4) in a rotating mode, the bottom of the hollow pipe (5) is fixedly communicated with the plurality of blowing nozzles (6), the gear (17) is fixedly sleeved on the outer side of the hollow pipe (5), the rack (18) is meshed with the gear (17), the wide mouth cover (16) is fixedly communicated with one end of the hollow pipe (5), the reset spring (19) is fixedly mounted at the bottom of the rack (18), and the reset spring (19) is fixedly mounted on the inner wall of the bottom of the sealing cover (11), the cooling collection box (4) is internally and movably provided with a collection box (7), and a cushion pad (8) is fixedly arranged on the inner wall of the bottom of the collection box (7).
2. The plastic packaging device for producing the glass-sealed diode according to claim 1, wherein two air inlets are formed in one side of the sealing cover (11), and filter screens (12) are fixedly mounted in the two air inlets.
3. The plastic package device for producing the glass-sealed diode according to claim 1, wherein a support frame (20) is rotatably mounted at the rear side of the worm wheel (21), and the support frame (20) is fixedly mounted on the inner wall of the top of the sealing cover (11).
4. The plastic packaging device for producing the glass-packaged diode according to claim 1, wherein a guide hole (26) is formed in the front side of the transverse plate (22), and the driving rod (25) is slidably sleeved in the guide hole (26).
5. The plastic package device for producing the glass-sealed diode according to claim 1, wherein a sliding groove (23) is formed in one side of the cooling collection box (4), and the transverse plate (22) is slidably sleeved in the sliding groove (23).
6. The plastic package device for producing the glass-sealed diode according to claim 1, wherein two grooves (10) are formed in the inner wall of the bottom of the cooling collection box (4), four moving wheels (9) are rotatably mounted at the bottom of the collection box (7), the four moving wheels (9) are respectively connected in the corresponding grooves (10) in a rolling manner, a slotted hole is formed in the front side of the cooling collection box (4), and the collection box (7) is sleeved in the slotted hole in a sliding manner.
CN202121211359.5U 2021-06-01 2021-06-01 Plastic packaging device for producing glass-sealed diode Expired - Fee Related CN215600333U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202121211359.5U CN215600333U (en) 2021-06-01 2021-06-01 Plastic packaging device for producing glass-sealed diode

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202121211359.5U CN215600333U (en) 2021-06-01 2021-06-01 Plastic packaging device for producing glass-sealed diode

Publications (1)

Publication Number Publication Date
CN215600333U true CN215600333U (en) 2022-01-21

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Application Number Title Priority Date Filing Date
CN202121211359.5U Expired - Fee Related CN215600333U (en) 2021-06-01 2021-06-01 Plastic packaging device for producing glass-sealed diode

Country Status (1)

Country Link
CN (1) CN215600333U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114935234A (en) * 2022-07-26 2022-08-23 山东沂光集成电路有限公司 Cooling device for integrated circuit semiconductor processing

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114935234A (en) * 2022-07-26 2022-08-23 山东沂光集成电路有限公司 Cooling device for integrated circuit semiconductor processing
CN114935234B (en) * 2022-07-26 2022-10-21 山东沂光集成电路有限公司 Cooling device for integrated circuit semiconductor processing

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CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20220121

CF01 Termination of patent right due to non-payment of annual fee