CN215581929U - Reflow oven for heating and curing FPC (flexible printed circuit) covering film - Google Patents
Reflow oven for heating and curing FPC (flexible printed circuit) covering film Download PDFInfo
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- CN215581929U CN215581929U CN202121328336.2U CN202121328336U CN215581929U CN 215581929 U CN215581929 U CN 215581929U CN 202121328336 U CN202121328336 U CN 202121328336U CN 215581929 U CN215581929 U CN 215581929U
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Abstract
The utility model provides a reflow oven for heating and curing an FPC (flexible printed circuit) covering film, which comprises a conveying device, a control box, a cooling module and a plurality of heating modules, wherein the conveying device is used for conveying a product to sequentially penetrate through the heating modules and the cooling module along the horizontal direction, the control box is respectively in signal connection with the conveying device, the cooling module and the heating modules, each heating module comprises a heating unit and an exhaust unit, the heating units are used for increasing the temperature in the heating modules, and the exhaust units are used for dissipating heat of the heating modules; the cooling module comprises a number of cooling fans for reducing the temperature in the cooling module. Through placing a plurality of heating module level series connection, utilize conveyer with the product along the horizontal direction, pass different heating module in proper order, make it obtain the heating solidification of different warm areas, cool off in cooling module at last to utilize the control box to control heating module and cooling module respectively, equipment utilization is high, and production efficiency is high.
Description
Technical Field
The utility model belongs to the technical field of production and manufacturing of printed circuit boards, and particularly relates to a reflow oven for heating and curing an FPC (flexible printed circuit) cover film.
Background
The FPC circuit board is called as a flexible circuit board, can be freely bent, wound and folded, has the advantages of small volume, light weight, good heat dissipation and weldability, lower comprehensive cost and the like, has certain market advantages compared with a hard board, and is more and more widely applied.
In the prior art, a vertical oven board baking mode is usually adopted for heating and curing the FPC covering film, so that the mode is low in production efficiency, large in occupied space and low in equipment utilization rate, and the requirement for high yield cannot be met.
SUMMERY OF THE UTILITY MODEL
The utility model aims to overcome the defects in the prior art, provides the reflow oven for heating and curing the FPC covering film, solves the defects that the heating and curing are performed through a vertical oven in the prior art, and solves the defect that the high-yield requirement cannot be met.
The utility model provides a reflow oven for heating and curing an FPC (flexible printed circuit) covering film, which comprises a conveying device, a control box, a cooling module and a plurality of heating modules, wherein the conveying device is used for conveying a product to sequentially pass through the heating modules and the cooling module along the horizontal direction, the control box is respectively in signal connection with the conveying device, the cooling module and the heating modules, each heating module comprises a heating unit and an exhaust unit, the heating units are used for increasing the temperature in the heating modules, and the exhaust units are used for dissipating heat of the heating modules; the cooling module comprises a plurality of cooling fans for reducing the temperature in the cooling module.
In some embodiments, the heating unit includes an electric heating wire and a fan that blows heat generated by the electric heating wire into the heating module.
In some embodiments, the control box is provided with a plurality of heating control modules, each heating control module is correspondingly connected with the heating module in a signal mode, and the plurality of heating modules are controlled independently.
In some embodiments, the heating control module comprises an ammeter, a temperature control unit and a fan control unit, wherein the ammeter is used for displaying a current value, the temperature control unit is used for controlling the input current of the electric heating wire, and the fan control unit is used for controlling the operation of the fan.
In some embodiments, the heating control module further comprises a throttle unit for controlling the transmission speed of the conveyor.
In some embodiments, the number of heating modules is 7.
In some embodiments, the number of cooling fans is 8.
The utility model has the beneficial effects that:
therefore, according to the embodiment of the disclosure, the plurality of heating modules are horizontally connected in series, the product sequentially passes through different heating modules along the horizontal direction by using the conveying device, is heated and solidified by different temperature zones, and is finally cooled in the cooling module, and the heating module and the cooling module are respectively controlled by using the control box.
Drawings
The utility model is further illustrated by means of the attached drawings, but the embodiments in the drawings do not constitute any limitation to the utility model, and for a person skilled in the art, other drawings can be obtained on the basis of the following drawings without inventive effort.
FIG. 1 is a schematic view of the overall structure of a reflow oven for heating and curing an FPC coverlay.
FIG. 2 is a schematic structural diagram of a heating module of a reflow oven for heating and curing an FPC coverlay.
FIG. 3 is a schematic structural diagram of a cooling module of a reflow oven for heating and curing an FPC coverlay.
FIG. 4 is a schematic structural diagram of a control box of a reflow oven for heating and curing an FPC coverlay.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the accompanying drawings, and it should be understood that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, when it is described that a specific device is located between a first device and a second device, there may or may not be an intervening device between the specific device and the first device or the second device. When a particular device is described as being coupled to other devices, that particular device may be directly coupled to the other devices without intervening devices or may be directly coupled to the other devices with intervening devices.
Techniques, methods, and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail but are intended to be part of the specification where appropriate.
The applicant researches and discovers that:
in the prior art, a vertical oven board baking mode is usually adopted for heating and curing the FPC covering film, so that the mode is low in production efficiency, large in occupied space and low in equipment utilization rate, and the requirement for high yield cannot be met.
In view of the above, referring to fig. 1 to 4, in the present disclosure, there is provided a reflow oven for heating and curing an FPC cover film, including a conveyor 1, a control box 2, a cooling module 3, and a plurality of heating modules 4, where the conveyor 1 is used to convey a product to sequentially pass through the plurality of heating modules 4 and the cooling module 3 along a horizontal direction, the control box 2 is respectively in signal connection with the conveyor 1, the cooling module 3, and the plurality of heating modules 4, the heating module 4 includes a heating unit 41 and an exhaust unit 42, the heating unit 41 is used to raise the temperature in the heating module 4, and the exhaust unit 42 is used to dissipate heat of the heating module 4; the cooling module 3 comprises several cooling fans 31, the cooling fans 31 being used to reduce the temperature in the cooling module 3.
It should be noted that, a plurality of heating modules 4 and cooling modules 3 are sequentially placed in the horizontal direction, wherein material conveying channels are respectively arranged in the heating modules 4 and the cooling modules 3, the conveying device 1 is erected on the material conveying channels to convey products along the material conveying channels, the products are effectively heated and solidified after passing through the heating modules 4 with different temperature zones, and then are cooled in the cooling modules 3 to prevent the products from scalding workers; in addition, the control box 2 controls the heating modules 4 and the cooling modules 3 respectively, the operation of the modules is not interfered with each other, the operation parameters and the opening state of the modules are independently controlled, the modular production is improved, the corresponding number of the heating modules 4 can be set, and the device has the characteristics of simple and reliable control, high equipment utilization rate, stable product production quality and high production efficiency.
In this embodiment, the heating unit 41 includes an electric heating wire and a fan, a heating space is provided in the heating module 4, and the fan blows heat generated by the electric heating wire to the heating space of the heating module 4 to realize temperature adjustment.
In this embodiment, control box 2 is equipped with a plurality of heating control module, every heating control module correspondingly with heating module 4 signal connection, mutual independent control between a plurality of heating module 4, the electric heating wire who controls heating module 4 through heating control module opens and closes, electric heating wire's heating power, the switching and the power of fan, and each mutual noninterference between each heating module 4, the convenience increases and decreases heating module 4 in this reflow oven.
The heating control module comprises an ammeter 21, a temperature control unit 22 and a fan control unit 23;
more specifically, each heating module 4 corresponds to a heating control module, and an ammeter 21 in the heating control module is used for displaying the current value in the current heating module 4; the temperature control unit 22 is used for controlling the input current of the electric heating wire so as to control the heating speed; the fan control unit 23 is used for controlling the operation of the fan, including the operation gear and the operation on/off of the fan; and the working state of the corresponding load can be displayed in a light mode by matching with the corresponding indicator lamp.
The heating control module further comprises a speed regulating unit 24, the speed regulating unit 24 is used for controlling the transmission speed of the conveying device 1, the speed of products passing through the reflow oven is controlled, different products can be guaranteed to be produced at different speeds, a variable frequency motor is arranged in the conveying device 1, and a variable frequency control mode is adopted.
In the present embodiment, the number of heating modules 4 is 7, and the number of cooling fans 31 is 8.
Compared with the prior art, the reflow furnace for heating and curing the FPC covering film is characterized in that a plurality of heating modules 4 are horizontally arranged in series, a product sequentially penetrates through different heating modules 4 along the horizontal direction by using a conveying device 1 to obtain heating and curing in different temperature areas, the product is cooled in a cooling module 3, and the heating modules 4 and the cooling module 3 are respectively controlled by using a control box 2.
Finally, it should be emphasized that the present invention is not limited to the above-described embodiments, but only the preferred embodiments of the utility model have been described above, and the present invention is not limited to the above-described embodiments, and any modifications, equivalent substitutions, improvements, etc. within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (7)
1. A reflow oven for heating and curing an FPC (flexible printed circuit) covering film is characterized by comprising a conveying device, a control box, a cooling module and a plurality of heating modules, wherein the conveying device is used for conveying a product to sequentially penetrate through the heating modules and the cooling module along the horizontal direction, the control box is respectively in signal connection with the conveying device, the cooling module and the heating modules, each heating module comprises a heating unit and an exhaust unit, the heating unit is used for increasing the temperature in the heating module, and the exhaust unit is used for dissipating heat of the heating module; the cooling module comprises a plurality of cooling fans for reducing the temperature in the cooling module.
2. A reflow oven for heat curing of FPC coverlay according to claim 1, wherein the heating unit includes an electric heating wire and a fan blowing heat generated by the electric heating wire into the heating module.
3. A reflow oven for heat curing of FPC coverlay according to claim 2, wherein the control box is provided with a plurality of heating control modules, each of the heating control modules is in signal connection with the heating module correspondingly, and the plurality of heating modules are controlled independently of each other.
4. A reflow oven for heat curing of FPC coverlay according to claim 3, wherein the heating control module comprises an ammeter for displaying a current value, a temperature control unit for controlling an input current of the electric heating wire, and a fan control unit for controlling an operation of the fan.
5. A reflow oven for heat curing of FPC coverlay according to claim 4, wherein the heating control module further comprises a speed regulating unit for controlling the transport speed of the transport device.
6. A reflow oven for heating and curing of FPC coverlay according to any one of claims 1 to 5, characterized in that the number of the heating modules is 7.
7. A reflow oven for heat curing of FPC coverlay according to claim 6, wherein the number of the cooling fans is 8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121328336.2U CN215581929U (en) | 2021-06-15 | 2021-06-15 | Reflow oven for heating and curing FPC (flexible printed circuit) covering film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121328336.2U CN215581929U (en) | 2021-06-15 | 2021-06-15 | Reflow oven for heating and curing FPC (flexible printed circuit) covering film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215581929U true CN215581929U (en) | 2022-01-18 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121328336.2U Active CN215581929U (en) | 2021-06-15 | 2021-06-15 | Reflow oven for heating and curing FPC (flexible printed circuit) covering film |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215581929U (en) |
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2021
- 2021-06-15 CN CN202121328336.2U patent/CN215581929U/en active Active
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