CN215581907U

CN215581907U - Improve power component welding and pass through tin soldering dish structure

Info

Publication number: CN215581907U
Application number: CN202121699626.8U
Authority: CN
Inventors: 高可; 梅贤林
Original assignee: Shenzhen Bestlink Technology Co ltd
Current assignee: Shenzhen Bestlink Technology Co ltd
Priority date: 2021-07-26
Filing date: 2021-07-26
Publication date: 2022-01-18
Anticipated expiration: 2031-07-26

Abstract

The utility model discloses a soldering tin-permeable welding pad structure for improving power element soldering, which comprises a plurality of welding pads arranged on a circuit board, wherein inner tubes are arranged in the welding pads, the inner ring surfaces of the inner tubes are all sunken to form grooves of annular structures, soldering tin layers are arranged in the grooves, the top surfaces of the inner tubes are all outwards bent to form flanges of annular structures, a plurality of arc-shaped grooves are arranged on the top surfaces of the flanges, a plurality of clamping balls are arranged at the lower ends of the inner tubes, the clamping balls are all uniformly distributed in an annular structure, elastic sheets are arranged on the outer side surfaces of the clamping balls, and the other ends of the elastic sheets are all arranged on the welding pads. The soldering tin layer is arranged on the inner tube, the inner tube is arranged on the outer side of the inner tube, the inner tube is provided with a flange, the flange is arranged on the inner side of the inner tube, the inner tube is provided with a through hole, the through hole is arranged on the inner side of the flange, the through hole is arranged on the outer side of the flange, the through hole is arranged on the inner side of the flange, the pin is inserted into the pin, the pin can be clamped with the ball, the stability of the element before welding is increased, an electric soldering iron for welding can be pressed against the arc-shaped groove, the heat of the inner tube through the flange and the heat of the electric soldering iron can be transferred to enable the melted soldering tin layer to be directly contacted with the melted solder, the melted solder layer, and the melted solder layer can be directly contacted with the melted solder, and the melted solder layer, and the melted solder can be directly contacted with the melted solder layer, and the melted solder can be contacted with the melted solder, and the melted solder layer can be contacted with the melted solder, and the melted solder layer can be contacted with the melted solder, and the melted solder layer, and the melted solder can be contacted with the melted solder, and the melted solder can be contacted with the pin, and the melted solder can be contacted with the melted solder, and the pin, and the melted solder can be contacted with the pin, and can be capable of the melted solder can be rotated, and the pin, and can be contacted with.

Description

Improve power component welding and pass through tin soldering dish structure

Technical Field

The utility model relates to the technical field of bonding pads, in particular to a structure for improving the welding of a power element through tin bonding pad.

Background

The land, the basic building block of the surface mount assembly, is used to form the land pattern of the circuit board, i.e., various land combinations designed for specific component types.

At present, after a pin on a power element passes through a pad, a gap between the pin and the pad is small, so that in the process of soldering tin, the melted soldering tin cannot enter the gap between the pin and the pad or the entering amount is small, and the firmness of pin welding is influenced.

Disclosure of Invention

The utility model provides a structure for improving the power element soldering tin-penetrating bonding pad, which aims to solve the problems in the background technology.

The utility model is realized by the following technical scheme: the utility model provides an improve power component welding and lead to tin pad structure, is including installing a plurality of pads on the circuit board, the inside inner tube that all is equipped with of pad, all sunken recess that forms annular structure on the inner circle face of inner tube, all install the soldering tin layer in the recess, the equal outside bending type of top surface of inner tube forms the turn-ups of annular structure, all is equipped with a plurality of arcs on the turn-ups top surface, the inner tube lower extreme all is equipped with a plurality of tight balls of clamp, the tight ball of clamp all is annular structure evenly distributed, all install the flexure strip on the lateral surface of the tight ball of clamp, the flexure strip other end is all installed on the pad.

As the preferred technical scheme, all be equipped with the constant head tank of annular structure on the inner circle face of pad, the inner tube just all projects the location portion that forms annular structure to constant head tank department, and location portion all inserts in the constant head tank to all closely contact with the constant head tank.

According to the preferred technical scheme, the soldering tin layer and the inner wall surface of the inner pipe are arranged in a flush mode, and the inner diameters of the soldering tin layer and the inner pipe are the same as the diameter of the pin on the component.

As a preferred technical scheme, the diameter between the clamping balls is smaller than that of the inner tube, and the elastic pieces are made of spring steel.

Preferably, the inner tube is made of brass.

The utility model has the beneficial effects that: the soldering iron is simple in structure, the inserted pins can clamp the ball, the stability of the element before welding is improved, the electric soldering iron for welding can be abutted against the arc-shaped groove, the heat of the electric soldering iron can be transferred to the soldering tin layer through the flanging and the inner tube, the melted soldering tin layer in the inner tube can be directly contacted with the pins, the inner tube can rotate, the melted soldering tin can be comprehensively contacted with the pins at 360 degrees, and the welding firmness of the pins is ensured.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

FIG. 1 is a schematic view of the overall structure of the present invention;

fig. 2 is a top view of the inner tube of the present invention.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.

In the description of the present invention, it is to be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present invention.

In the description of the present invention, it should be noted that unless otherwise explicitly stated or limited, the terms "mounted," "connected," and "disposed" are to be construed broadly and can, for example, be fixedly connected, disposed, detachably connected, disposed, or integrally connected and disposed. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

As shown in fig. 1 and 2, the soldering tin-penetrating pad structure for improving power component soldering of the utility model comprises a plurality of pads 2 mounted on a circuit board 1, inner tubes 3 are respectively arranged inside the pads 2, grooves of an annular structure are formed by all the inner ring surfaces of the inner tubes 3 in a sunken mode, soldering tin layers 5 are respectively mounted in the grooves, the top surfaces of the inner tubes 3 are all outwards bent to form flanges 6 of an annular structure, a plurality of arc-shaped grooves 7 are respectively arranged on the top surfaces of the flanges 6, a plurality of clamping balls 9 are respectively arranged at the lower ends of the inner tubes 3, the clamping balls 9 are all uniformly distributed in an annular structure, elastic pieces 8 are respectively mounted on the outer side surfaces of the clamping balls 9, and the other ends of the elastic pieces 8 are respectively mounted on the pads 2.

In this embodiment, the inner ring surface of the bonding pad 2 is provided with a positioning groove with an annular structure, the inner tube 3 protrudes from the positioning groove to form a positioning portion 4 with an annular structure, and the positioning portion 4 is inserted into the positioning groove and contacts with the positioning groove tightly.

In this embodiment, the solder layer 5 and the inner wall surface of the inner tube 3 are flush with each other, and the inner diameters of the solder layer 5 and the inner tube 3 are the same as the diameter of the pin on the component, so that the inserted pin can be in close contact with the inner tube.

In this embodiment, the diameter between the clamping balls 9 is smaller than the diameter of the inner tube 3, and the elastic pieces 8 are made of spring steel.

In this embodiment, the inner tube 3 is made of brass material, so that the inner tube has good conductivity without affecting the conduction between the inner tube and the bonding pad.

When the device is used, the pins on the element are inserted into the inner tube, before the pins are inserted, the pins can prop open the clamping balls, the pins are clamped inwards by the clamping balls through the rebounding of the elastic sheets, and the stability of the element before welding is ensured;

and because the diameter of the pin is the same as the inner diameter of the soldering tin layer, when welding, the head of the electric soldering iron can be abutted against the arc-shaped groove, so that the heat on the electric soldering iron can be transferred to the inner pipe along the flanging, the soldering tin layer on the inner pipe can be melted, the melted soldering tin layer can be directly adhered to the pin, the flanging can be pushed by the electric soldering iron, the inner pipe is driven by the rotation of the flanging, the soldering tin on the inner pipe can be in full contact with the pin by 360 degrees, the firmness of pin installation is ensured, after the completion, the pin can be conventionally welded, and the firmness of the pin is ensured.

The above description is only an embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that are not thought of through the inventive work should be included in the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope defined by the claims.

Claims

1. The utility model provides an improve power component welding tin pad structure that passes through which characterized in that: including installing a plurality of pads (2) on circuit board (1), inside inner tube (3) all being equipped with of pad (2), all sunken formation ring structure's recess on the inner circle face of inner tube (3), all install soldering tin layer (5) in the recess, the equal outside bending type of top surface of inner tube (3) becomes turn-ups (6) that the loop structure was become, all be equipped with a plurality of arcs (7) on the top surface of turn-ups (6), inner tube (3) lower extreme all is equipped with a plurality of tight balls (9) of clamp, it all is ring structure evenly distributed to press from both sides tight ball (9), all install flexure strip (8) on the lateral surface of pressing from both sides tight ball (9), flexure strip (8) other end is all installed on pad (2).

2. The structure of claim 1, wherein: the inner ring surface of the bonding pad (2) is provided with a positioning groove with an annular structure, the inner tube (3) is just opposite to the positioning groove and protrudes to form a positioning part (4) with an annular structure, and the positioning part (4) is inserted into the positioning groove and is tightly contacted with the positioning groove.

3. The structure of claim 1, wherein: the inner wall surfaces of the soldering tin layer (5) and the inner pipe (3) are arranged in a flush manner, and the inner diameters of the soldering tin layer (5) and the inner pipe (3) are the same as the diameters of the pins on the element.

4. The structure of claim 1, wherein: the diameter between the clamping balls (9) is smaller than that of the inner tube (3), and the elastic pieces (8) are made of spring steel.

5. The structure of claim 1, wherein: the inner tube (3) is made of brass material.