CN215578528U

CN215578528U - High-efficient thermal-insulated type high life semiconductor chip

Info

Publication number: CN215578528U
Application number: CN202121890306.0U
Authority: CN
Inventors: 薛敬伟
Original assignee: Binhai Yirun Electronics Co ltd
Current assignee: Binhai Yirun Electronics Co ltd
Priority date: 2021-08-13
Filing date: 2021-08-13
Publication date: 2022-01-18
Anticipated expiration: 2031-08-13

Abstract

The utility model discloses a high-efficiency heat-insulation long-life semiconductor chip, which relates to the technical field of semiconductors and comprises a metal box and a semiconductor chip, wherein metal bonding wires are arranged on two sides of the upper surface of the semiconductor chip, through holes I for two pins to penetrate through and be fixedly connected with the two sides of the metal box are respectively arranged on the two sides of the metal box, the end parts of the two metal bonding wires are respectively connected with the surfaces of the two pins, a packaging cover is hinged on the surface of the metal box, a heat dissipation rod is fixedly connected inside the metal box, a plastic packaging layer is fixedly connected on the surface of the metal box, the plastic packaging layer is resin, a heat dissipation mechanism for dissipating heat of the semiconductor chip is arranged on the upper surface of the metal box, and the semiconductor chip also comprises two clamping parts for clamping the semiconductor chip, single heat dissipation, low heat dissipation efficiency and short service life.

Description

High-efficient thermal-insulated type high life semiconductor chip

Technical Field

The utility model relates to the technical field of semiconductors, in particular to a high-efficiency heat-insulation type long-service-life semiconductor chip.

Background

When a packaged semiconductor chip is operated, a large amount of heat is generated, and the generated heat is dissipated in time, so that the temperature inside the semiconductor package is continuously increased, and the excessive temperature causes the performance of the semiconductor chip to be attenuated or the service life of the semiconductor chip to be shortened, and even causes permanent damage.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide an efficient heat insulation type long-service-life semiconductor chip, which has the effects of timely discharging heat on the surface of the semiconductor chip and prolonging the service life, and solves the problems of single heat dissipation, low heat dissipation efficiency and short service life of the semiconductor chip.

In order to achieve the purpose, the utility model provides the following technical scheme: the utility model provides a high-efficient thermal-insulated type high life semiconductor chip, includes metal box and semiconductor chip, the both sides of semiconductor chip upper surface all are provided with the metal bonding wire, the through-hole that is used for two pins to pass and fixed connection with it is first, two is offered respectively to the both sides of metal box the tip of metal bonding wire respectively with two the surface connection of pin, the surface of metal box articulates there is the encapsulation lid, the inside fixedly connected with heat dissipation stick of metal box, the fixed surface of metal box is connected with the plastic envelope layer, the plastic envelope layer is the resin, the upper surface of metal box is provided with and is used for giving semiconductor chip radiating heat dissipation mechanism still including two be used for right semiconductor chip carries out the clamping part of centre gripping.

Optionally, the clamping part is including seting up the spout of metal box inner wall, the inner wall sliding connection of spout has the slide bar, the tip fixedly connected with clamp splice of slide bar, the surface of clamp splice with the common fixedly connected with spring of inner wall of metal box.

Optionally, the heat dissipation mechanism includes heat dissipation fins, and the heat dissipation fins are respectively and fixedly connected to the upper side and the lower side of the metal box.

Optionally, the lower surface of the packaging cover is fixedly connected with heat-conducting silicone grease, and a second through hole is formed in the surface of the packaging cover.

Optionally, the surfaces of the two metal welding wires are sleeved with shielding sleeves.

Optionally, two mounting panels are fixedly connected to two sides of the metal box, and an internal thread hole is formed in the surface of each mounting panel.

Compared with the prior art, the utility model has the following beneficial effects:

firstly, the packaging cover is opened, the clamping blocks are opened by hands, then the semiconductor chip is placed between the two clamping blocks, the two clamping blocks are loosened, the semiconductor chip is clamped by the two clamping blocks, and when the metal box slightly shakes, the semiconductor chip has a certain damping effect under the action of the spring due to the fact that the sliding rod slides in the sliding groove.

When the semiconductor chip works, the generated heat is timely dissipated to the bottom of the metal box through the heat dissipation rod and is timely exhausted through the action of the heat dissipation fins, so that the temperature of the semiconductor chip in the metal box is reduced, the effect of isolating the internal temperature of the metal box from the external temperature is achieved, and the temperature of the semiconductor chip is kept constant.

When the semiconductor chip works, the heat generated by the semiconductor chip can be timely discharged to the position of the radiating fin above the metal box through the heat conducting silicone grease on the lower surface of the packaging cover, and can be timely discharged through the heat radiation of the radiating fin, so that the temperature of the semiconductor chip is further kept constant.

Drawings

FIG. 1 is an isometric view of a structure of the present invention;

FIG. 2 is a front cross-sectional view of the metal box structure of the present invention;

fig. 3 is an enlarged view of the structure of fig. 2 according to the present invention at a.

In the figure: 1. a metal case; 2. a semiconductor chip; 3. a metal bonding wire; 4. a pin; 5. a package cover; 6. a slide bar; 7. a clamping block; 8. a spring; 9. a shielding sleeve; 10. a heat dissipation rod; 11. a plastic packaging layer; 12. a heat dissipating fin; 13. mounting a plate; 14. an internally threaded bore; 15. and (3) heat-conducting silicone grease.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1 to 3, the present invention provides a technical solution: a high-efficiency heat-insulation long-life semiconductor chip comprises a metal box 1 and a semiconductor chip 2, wherein metal bonding wires 3 are arranged on two sides of the upper surface of the semiconductor chip 2, first through holes which are used for two pins 4 to penetrate through and be fixedly connected with the two sides of the metal box 1 are respectively arranged on the two sides of the upper surface of the semiconductor chip, the end parts of the two metal bonding wires 3 are respectively connected with the surfaces of the two pins 4, a packaging cover 5 is hinged on the surface of the metal box 1, a heat dissipation rod 10 is fixedly connected inside the metal box 1, a plastic packaging layer 11 is fixedly connected on the surface of the metal box 1, the plastic packaging layer 11 is made of resin, a heat dissipation mechanism used for dissipating heat of the semiconductor chip 2 is arranged on the upper surface of the metal box 1, the high-efficiency heat-insulation long-life semiconductor chip also comprises two clamping components used for clamping the semiconductor chip 2, and the semiconductor chip 2 is placed in the clamping components by opening the packaging cover 5, so that the semiconductor chip has a certain shock absorption effect, through the effect of heat dissipation mechanism, keep semiconductor chip's constancy of temperature with the effect that metal box 1 internal temperature keeps apart with external temperature, through at metal box 1's outside plastic envelope layer 11 that adds, can be so that semiconductor chip 2 has good shockproof effect, has improved semiconductor chip 2's life.

In order to make the semiconductor chip have certain shock attenuation effect, furthermore, the centre gripping part is including seting up the spout at metal box 1 inner wall, the inner wall sliding connection of spout has slide bar 6, the tip fixedly connected with clamp splice 7 of slide bar 6, the common fixedly connected with spring 8 of inner wall of clamp splice 7 and metal box 1, through opening encapsulation lid 5, prop open clamp splice 7 with the hand, drive two clamp splice 7 back of the body motion, spring 8 becomes compression state by free state this moment, put into between two clamp splice 7 with semiconductor chip 2 afterwards, loosen two clamp splice 7, make two clamp splice 7 centre gripping semiconductor chip, and when metal box 1 took place slightly to rock, because slide bar 6 slides in the spout, under the effect of spring 8, make semiconductor chip have certain shock attenuation effect.

In order to timely discharge the heat generated by the semiconductor chip 2, the heat dissipation mechanism further includes heat dissipation fins 12, the heat dissipation fins 12 are respectively and fixedly connected to the upper and lower sides of the metal box 1, and the heat generated by the semiconductor chip 2 can be timely discharged by the heat dissipation fins 12.

In order to discharge the heat generated by the semiconductor chip 2 from the upper part in time, furthermore, the lower surface of the packaging cover 5 is fixedly connected with heat-conducting silicone grease 15, a second through hole is formed in the surface of the packaging cover 5, when the semiconductor chip works, the generated heat is timely dissipated to the bottom of the metal box 1 through the heat dissipation rod 10, and the heat is timely discharged through the effect of the heat dissipation fins 12, so that the temperature of the semiconductor chip in the metal box 1 is reduced, namely, the effect of isolating the internal temperature and the external temperature of the metal box 1 is achieved, and the temperature constancy of the semiconductor chip is kept.

In order to avoid mutual electromagnetic interference between the metal welding lines 3, further, the surfaces of the two metal welding lines 3 are sleeved with shielding sleeves 9.

In order to conveniently install the semiconductor chip 2, furthermore, two mounting plates 13 are fixedly connected to two sides of the metal box 1, internal thread holes 14 are formed in the surfaces of the four mounting plates 13, and the semiconductor chip can be quickly installed and detached through the internal thread holes 14 through bolts.

The working principle is as follows: when the high-efficiency heat-insulation long-life semiconductor chip is used, the packaging cover 5 is opened, the clamping blocks 7 are unfolded by hands, the two clamping blocks 7 are driven to move back and forth, the spring 8 is changed from a free state to a compressed state at the moment, then the semiconductor chip 2 is placed between the two clamping blocks 7, the two clamping blocks 7 are loosened, the semiconductor chip is clamped by the two clamping blocks 7, and when the metal box 1 slightly shakes, the sliding rod 6 slides in the sliding groove, so that the semiconductor chip has a certain damping effect under the action of the spring 8;

when the semiconductor chip works, the generated heat is timely dissipated to the bottom of the metal box 1 through the heat dissipation rod 10 and is timely discharged through the action of the heat dissipation fins 12, so that the temperature of the semiconductor chip in the metal box 1 is reduced, the effect of isolating the internal temperature from the external temperature of the metal box 1 is achieved, and the temperature of the semiconductor chip is kept constant;

when the semiconductor chip works, the generated heat can be timely discharged to the position of the radiating fin 12 above the metal box 1 through the heat conduction silicone grease 15 on the lower surface of the packaging cover 5, and the heat can be timely discharged through the heat dissipation of the radiating fin 12, so that the temperature of the semiconductor chip in the metal box 1 is reduced, the effect of isolating the internal temperature and the external temperature of the metal box 1 is achieved, and the temperature constancy of the semiconductor chip is kept.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a high-efficient thermal-insulated type high life semiconductor chip, includes metal box (1) and semiconductor chip (2), its characterized in that: the semiconductor chip packaging structure is characterized in that metal bonding wires (3) are arranged on two sides of the upper surface of the semiconductor chip (2), a first through hole is formed in each of two sides of the metal box (1) and is used for enabling two pins (4) to penetrate through and fixedly connected with the first through hole, the end portions of the metal bonding wires (3) are connected with the surfaces of the two pins (4), a packaging cover (5) is hinged to the surface of the metal box (1), a heat dissipation rod (10) is fixedly connected to the inside of the metal box (1), a plastic packaging layer (11) is fixedly connected to the surface of the metal box (1), the plastic packaging layer (11) is made of resin, a heat dissipation mechanism used for dissipating heat of the semiconductor chip (2) is arranged on the upper surface of the metal box (1), and the semiconductor chip packaging structure further comprises two clamping components used for clamping the semiconductor chip (2).

2. The high efficiency, thermally insulating, long-life semiconductor chip of claim 1, wherein: the clamping part comprises a sliding groove formed in the inner wall of the metal box (1), a sliding rod (6) is connected to the inner wall of the sliding groove in a sliding mode, a clamping block (7) is fixedly connected to the end portion of the sliding rod (6), and a spring (8) is fixedly connected to the surface of the clamping block (7) and the inner wall of the metal box (1) jointly.

3. The high efficiency, thermally insulating, long-life semiconductor chip of claim 2, wherein: the heat dissipation mechanism comprises heat dissipation fins (12), and the heat dissipation fins (12) are fixedly connected to the upper side and the lower side of the metal box (1) respectively.

4. A high efficiency thermally insulated long life semiconductor chip according to any of claims 2 or 3, characterized in that: the lower surface of the packaging cover (5) is fixedly connected with heat-conducting silicone grease (15), and a second through hole is formed in the surface of the packaging cover (5).

5. The high efficiency, thermally insulating, long-life semiconductor chip of claim 1, wherein: and the surfaces of the two metal welding wires (3) are sleeved with shielding sleeves (9).

6. A high efficiency thermally insulated long life semiconductor chip according to any of claims 1, 2 or 3, characterized in that: two mounting panels (13) of equal fixedly connected with in both sides of metal box (1), four internal thread hole (14) have all been seted up on the surface of mounting panel (13).