CN215578480U - Positioner for semiconductor processing - Google Patents
Positioner for semiconductor processing Download PDFInfo
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- CN215578480U CN215578480U CN202121815831.6U CN202121815831U CN215578480U CN 215578480 U CN215578480 U CN 215578480U CN 202121815831 U CN202121815831 U CN 202121815831U CN 215578480 U CN215578480 U CN 215578480U
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Abstract
The utility model discloses a positioner for semiconductor processing, comprising: the processing table is provided with a full-automatic infrared positioning processing structure; the full-automatic infrared positioning processing structure comprises: the positioning driving assembly, the fixed mounting assembly and the processing assembly are arranged in the processing assembly; one of the pair of positioning driving assemblies comprises: the device comprises a driving box, a mounting cavity, a pair of servo driving motors, a pair of mounting partition plates, a pair of first rotating bearings, a spiral lead screw and a moving block; the utility model relates to the technical field of semiconductor processing equipment, and the beneficial effects of the scheme are as follows: the positioning device solves the problems that the existing positioning device for semiconductor production is simple in structure, needs personnel to manually use tweezers to place and assist in fixing chips, is low in positioning precision, is easy to cause position shifting in processing, causes production failure, increases production cost and affects production efficiency.
Description
Technical Field
The utility model relates to the technical field of semiconductor processing equipment, in particular to a positioner for semiconductor processing.
Background
The semiconductor refers to a material with electric conductivity between a conductor and an insulator at normal temperature, and is applied to the fields of integrated circuits, consumer electronics, communication systems, photovoltaic power generation, illumination, high-power conversion and the like.
SUMMERY OF THE UTILITY MODEL
In order to achieve the purpose, the utility model is realized by the following technical scheme: a positioner for semiconductor processing, comprising: the processing table is provided with a full-automatic infrared positioning processing structure;
the full-automatic infrared positioning processing structure comprises: the positioning driving assembly, the fixed mounting assembly and the processing assembly are arranged in the processing assembly;
one of the pair of positioning driving assemblies comprises: the device comprises a driving box, a mounting cavity, a pair of servo driving motors, a pair of mounting partition plates, a pair of first rotating bearings, a spiral lead screw and a moving block;
the driving box is installed at a position above the machining table, the installation cavity is arranged at the position inside the driving box, the pair of servo driving motors are installed at two sides of the interior of the installation cavity, the pair of installation partition plates are installed at the inner side positions of the pair of servo driving motors, the pair of first rotating bearings are embedded in the middle positions of the pair of installation partition plates, the screw rod is embedded in the pair of first rotating bearings, two ends of the screw rod are connected with the pair of servo driving motors, and the moving block is installed on the screw rod.
Preferably, the fixed mounting assembly comprises: the device comprises a moving seat, an installation box, two pairs of hydraulic cylinders, an adjusting platform, a fixed clamp, two pairs of second rotating bearings, two pairs of adjusting rods and two pairs of fixed pressing plates;
the movable block is installed on the movable block, the installation box is installed above the movable block, the two pairs of hydraulic cylinders are installed on four side wall surfaces in the installation box, the adjusting table is installed above the installation box and connected with the two pairs of hydraulic cylinders, the fixing clamp is installed on the adjusting table, the two pairs of second rotating bearings are embedded on the fixing clamp, the two pairs of adjusting rods are installed on the two pairs of second rotating bearings, and the two pairs of fixing pressing plates are installed on the two pairs of adjusting rods.
Preferably, the processing assembly comprises: the device comprises a first support frame, a chip placer, a second support frame and a semiconductor welding device;
the first support frame is arranged at the left side of the processing table and close to the rear position, the chip placer is arranged on the first support frame, the second support frame is arranged at the right side of the first support frame, and the semiconductor welding device is arranged on the second support frame.
Preferably, the screw is connected with the output end of the servo drive motor through a coupler.
Preferably, the fixed pressing plate is provided with a positioning rod for preventing rotation.
Preferably, an infrared sensor for processing movement positioning is mounted on the adjusting table.
Advantageous effects
The utility model provides a positioner for semiconductor processing, which has the following beneficial effects that a full-automatic infrared positioning processing structure is used in the scheme, the positioning of the semiconductor processing is carried out by using mechanical positioning placement, the positioning precision is ensured, the fixation is ensured to be firm, the production efficiency is increased, and the problems that the existing positioning equipment for semiconductor production is simple in structure, the positioning precision is low, the position shifting phenomenon is easy to occur in the processing due to the fact that personnel manually use tweezers to carry out the placement and auxiliary fixation of chips, the production failure is caused, the production cost is increased, and the production efficiency is influenced are solved.
Drawings
Fig. 1 is a schematic front sectional view of a positioner for semiconductor processing according to the present invention.
Fig. 2 is a schematic diagram of a right-side view of a fixed mounting assembly of the positioner for semiconductor processing according to the present invention.
FIG. 3 is a partially enlarged view of a fixture assembly of the semiconductor processing positioner according to the present invention.
FIG. 4 is a partially enlarged view of a positioning driving assembly of the positioner for semiconductor processing according to the present invention.
In the figure: 1-a processing table; 2-a drive box; 3-installing a cavity; 4-a servo drive motor; 5, installing a partition plate; 6-a first rotational bearing; 7-a screw; 8-moving block; 9-a movable seat; 10-mounting a box; 11-a hydraulic cylinder; 12-a conditioning stage; 13-fixing the clamp; 14-a second rotational bearing; 15-adjusting the rod; 16-a fixed platen; 17-a first support frame; 18-a chip placer; 19-a second support; 20-a semiconductor bonder; 21-a coupler; 22-a positioning rod; 23-Infrared sensor.
Detailed Description
All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example (b): referring to fig. 1-4, the main components of the present invention are: the processing table 1 is provided with a full-automatic infrared positioning processing structure;
in the specific implementation process, the full-automatic infrared positioning processing structure comprises: the positioning driving assembly, the fixed mounting assembly and the processing assembly are arranged in the processing assembly;
one of the pair of positioning driving assemblies comprises: the device comprises a driving box 2, a mounting cavity 3, a pair of servo driving motors 4, a pair of mounting partition plates 5, a pair of first rotating bearings 6, a screw rod 7 and a moving block 8;
the driving box 2 is installed at a position above the processing table 1, the installation cavity 3 is opened at the position inside the driving box 2, the pair of servo driving motors 4 are installed at two side positions inside the installation cavity 3, the pair of installation partition plates 5 are installed at inner side positions of the pair of servo driving motors 4, the pair of first rotating bearings 6 are embedded in the middle positions of the pair of installation partition plates 5, the screw rod 7 is embedded in the pair of first rotating bearings 6, two ends of the screw rod 7 are connected with the pair of servo driving motors 4, and the moving block 8 is installed on the screw rod 7.
It should be noted that, when the positioning driving assembly is used, the device is started by controlling the controller matched with the device, the servo driving motor 4 installed in the driving box 2 is started to rotate, the servo driving motor 4 rotates for a fixed number of turns according to the received fluctuation signal to drive the screw rod 7 connected with the output end of the screw rod through the coupler 21 to rotate, the screw rod 7 rotates in the first rotating bearing 6 to drive the moving block 8 installed on the screw rod to move, and the moving block 8 drives the fixed installation assembly to move, so that the purpose of processing and positioning is achieved.
In the specific implementation process, further, the fixed mounting assembly comprises: the device comprises a moving seat 9, a mounting box 10, two pairs of hydraulic cylinders 11, an adjusting table 12, a fixed clamp 13, two pairs of second rotating bearings 14, two pairs of adjusting rods 15 and two pairs of fixed pressing plates 16;
the movable base 9 is installed on the movable block 8, the installation box 10 is installed above the movable base 9, the two pairs of hydraulic cylinders 11 are installed on four side wall surfaces in the installation box 10, the adjusting table 12 is installed above the installation box 10, the adjusting table 12 is connected with the two pairs of hydraulic cylinders 11, the fixing clamp 13 is installed on the adjusting table 12, the two pairs of second rotating bearings 14 are embedded on the fixing clamp 13, the two pairs of adjusting rods 15 are installed on the two pairs of second rotating bearings 14, and the two pairs of fixing pressing plates 16 are installed on the two pairs of adjusting rods 15.
It should be noted that, when the fixed mounting assembly is used, the moving seat 9 moves through the positioning driving assembly, after the moving is completed, the infrared sensor 23 installed on the adjusting table 12 is used for performing accurate positioning, after the positioning is completed, the device is started, the two pairs of hydraulic cylinders 11 installed in the installation box 10 are controlled in a linkage manner to drive the adjusting table 12 to perform position movement adjustment, the processing assembly is used for performing semiconductor processing, the position fixing is performed through the fixing clamp 13, and the adjusting rod 15 embedded in the second rotary bearing 14 is adjusted to drive the fixing pressing plate 16 to press and fix the semiconductor material downwards.
In the specific implementation process, further, the processing assembly comprises: a first support frame 17, a chip placer 18, a second support frame 19 and a semiconductor bonder 20;
the first support frame 17 is arranged at the left rear position on the processing table 1, the chip placer 18 is arranged on the first support frame 17, the second support frame 19 is arranged at the right position of the first support frame 17, and the semiconductor welding device 20 is arranged on the second support frame 19.
When the processing assembly is used, the semiconductor material is placed on the fixed mounting assembly by the chip placing device 18 mounted on the first support frame 17, and after the semiconductor material is placed, the positioning driving assembly moves to a position below the second support frame 19, and then the semiconductor material is welded by the semiconductor welding device 20 on the second support frame 19.
In the specific implementation process, further, the screw 7 is connected with the output end of the servo drive motor 4 through a coupler 21.
In the implementation, furthermore, a rotation-preventing positioning rod 22 is mounted on the fixed platen 16.
In the implementation process, an infrared sensor 23 for processing movement positioning is further mounted on the adjusting table 12.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. A positioner for semiconductor processing, comprising: the processing table is characterized in that a full-automatic infrared positioning processing structure is arranged on the processing table;
the full-automatic infrared positioning processing structure comprises: the positioning driving assembly, the fixed mounting assembly and the processing assembly are arranged in the processing assembly;
one of the pair of positioning driving assemblies comprises: the device comprises a driving box, a mounting cavity, a pair of servo driving motors, a pair of mounting partition plates, a pair of first rotating bearings, a spiral lead screw and a moving block;
the driving box is installed at a position above the machining table, the installation cavity is arranged at the position inside the driving box, the pair of servo driving motors are installed at two sides of the interior of the installation cavity, the pair of installation partition plates are installed at the inner side positions of the pair of servo driving motors, the pair of first rotating bearings are embedded in the middle positions of the pair of installation partition plates, the screw rod is embedded in the pair of first rotating bearings, two ends of the screw rod are connected with the pair of servo driving motors, and the moving block is installed on the screw rod.
2. The fixture for semiconductor processing according to claim 1, wherein the fixed mounting assembly comprises: the device comprises a moving seat, an installation box, two pairs of hydraulic cylinders, an adjusting platform, a fixed clamp, two pairs of second rotating bearings, two pairs of adjusting rods and two pairs of fixed pressing plates;
the movable block is installed on the movable block, the installation box is installed above the movable block, the two pairs of hydraulic cylinders are installed on four side wall surfaces in the installation box, the adjusting table is installed above the installation box and connected with the two pairs of hydraulic cylinders, the fixing clamp is installed on the adjusting table, the two pairs of second rotating bearings are embedded on the fixing clamp, the two pairs of adjusting rods are installed on the two pairs of second rotating bearings, and the two pairs of fixing pressing plates are installed on the two pairs of adjusting rods.
3. The semiconductor processing fixture of claim 1, wherein the processing assembly comprises: the device comprises a first support frame, a chip placer, a second support frame and a semiconductor welding device;
the first support frame is arranged at the left side of the processing table and close to the rear position, the chip placer is arranged on the first support frame, the second support frame is arranged at the right side of the first support frame, and the semiconductor welding device is arranged on the second support frame.
4. The positioner of claim 1, wherein the screw is coupled to the output of the servo drive motor via a coupling.
5. The semiconductor processing positioner according to claim 2, wherein the fixed platen is provided with a rotation-preventing positioning rod.
6. The positioner for semiconductor processing according to claim 2, wherein an infrared sensor for processing movement positioning is mounted on the adjustment stage.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121815831.6U CN215578480U (en) | 2021-08-04 | 2021-08-04 | Positioner for semiconductor processing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121815831.6U CN215578480U (en) | 2021-08-04 | 2021-08-04 | Positioner for semiconductor processing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215578480U true CN215578480U (en) | 2022-01-18 |
Family
ID=79832707
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121815831.6U Expired - Fee Related CN215578480U (en) | 2021-08-04 | 2021-08-04 | Positioner for semiconductor processing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215578480U (en) |
-
2021
- 2021-08-04 CN CN202121815831.6U patent/CN215578480U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20220118 |