CN215572801U - Thimble contact type distance measuring device for wafer - Google Patents
Thimble contact type distance measuring device for wafer Download PDFInfo
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- CN215572801U CN215572801U CN202121968063.8U CN202121968063U CN215572801U CN 215572801 U CN215572801 U CN 215572801U CN 202121968063 U CN202121968063 U CN 202121968063U CN 215572801 U CN215572801 U CN 215572801U
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Abstract
The utility model relates to a thimble contact type distance measuring device for a wafer, which comprises a Y-direction moving mechanism, and a telescopic thimble unit, a proximity sensor trigger mechanism and a limiting protection mechanism which are respectively arranged on the Y-direction moving mechanism, wherein the telescopic thimble unit is respectively matched with the proximity sensor trigger mechanism and the limiting protection mechanism. Compared with the prior art, the utility model adopts a thimble contact type distance measurement mode, and has strong anti-interference capability and high measurement precision (same motor precision, micron grade) compared with the traditional distance measurement modes such as laser distance measurement, ultrasonic distance measurement and the like; the utility model can utilize the existing structure and components of the wafer related machine, and has the advantages of few newly added components, low cost, high reliability and high cost performance.
Description
Technical Field
The utility model belongs to the technical field of wafer ranging, and relates to a thimble contact type ranging device for a wafer.
Background
The wafer ranging is the distance between the measured wafer and the reference plane. Currently, most wafer ranging methods are laser ranging, ultrasonic ranging, image ranging, and the like. The main problems of these ranging methods are as follows:
1) the traditional distance measurement modes are easily interfered by the environment, such as noise, vibration, floating dust, air temperature, humidity and the like, so that the actual measurement data has larger errors;
2) in the micron-scale range required by the wafer, the price of the traditional distance measurement modes is high, and the application is limited.
Therefore, it is necessary to develop a new wafer ranging technique to solve the above problems.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a thimble contact type distance measuring device for a wafer, which has stronger anti-interference capability and lower cost.
The purpose of the utility model can be realized by the following technical scheme:
the utility model provides a thimble contact range unit for wafer, the device include Y to moving mechanism and set up respectively in Y to telescopic thimble unit, proximity sensor trigger mechanism, the spacing protection mechanism on moving mechanism, telescopic thimble unit respectively with proximity sensor trigger mechanism, spacing protection mechanism looks adaptation.
Preferably, the limit protection mechanism is positioned above the proximity sensor trigger mechanism.
Furthermore, Y to moving mechanism include the tow chain, set up at the tow chain mounting of tow chain one end, set up at the tow chain connecting piece of tow chain other end and the Y that links to each other with the tow chain connecting piece to moving the seat, telescopic thimble unit, proximity sensor trigger mechanism and spacing protection mechanism all set up on Y is to moving the seat.
Furthermore, the retractable thimble unit comprises a Y-direction slide rail mechanism arranged on the Y-direction moving seat, a thimble mechanism movably arranged on the Y-direction slide rail mechanism, and a spring mechanism matched with the thimble mechanism.
Furthermore, the Y-direction slide rail mechanism comprises a slide rail seat arranged on the Y-direction moving seat and a Y-direction slide rail arranged on the slide rail seat, and the ejector pin mechanism is movably arranged on the Y-direction slide rail.
Furthermore, the thimble mechanism comprises a thimble fixing piece movably arranged on the Y-direction slide rail and a thimble arranged at the bottom of the thimble fixing piece along the Y-direction.
Furthermore, the spring mechanism comprises a connecting piece arranged at the top of the thimble fixing piece, a lower spring connecting piece arranged on the connecting piece, an upper spring connecting piece base arranged on the Y-direction moving seat and positioned above the lower spring connecting piece, an upper spring connecting piece arranged on the upper spring connecting piece base, and a spring arranged between the upper spring connecting piece and the lower spring connecting piece.
Further, the proximity sensor trigger mechanism comprises a proximity sensor support arranged on the Y-direction moving seat and a proximity sensor arranged on the proximity sensor support and matched with the connecting piece.
Further, the proximity sensor is positioned below the connecting piece.
Further, spacing protection mechanism including set up photoelectric sensor base and the photoelectric sensor of setting on the photoelectric sensor base on Y is to removing the seat, the connecting piece on be equipped with the photoelectric sensor trigger piece with photoelectric sensor looks adaptation.
Preferably, the photoelectric sensor is a groove-type photoelectric sensor, and the photoelectric sensor trigger comprises a mounting piece arranged on the connecting piece and a blocking piece arranged on the mounting piece along the Y direction and matched with a notch of the groove-type photoelectric sensor.
Further, the photoelectric sensor is positioned above the connecting piece.
The device has the following main components:
photoelectric sensor base: and fixing the photoelectric sensor.
A photoelectric sensor: the protection is triggered by the photoelectric sensor trigger piece so as to stop the movement of the whole device on the Y axis.
Photoelectric sensor trigger piece: to trigger the protection of the photosensor.
Connecting piece base on the spring: and fixing the upper connecting piece of the spring.
Connecting piece on the spring: the upper end of the spring is fixed.
A spring: is connected between the upper spring connecting piece and the lower spring connecting piece and gives an upward force to the lower spring connecting piece.
Proximity sensor support: the proximity sensor is fixed.
A proximity sensor: the device is used for triggering a movement stop signal and a recording position signal when the connecting piece and the proximity sensor reach a certain distance.
The lower connecting piece of the spring: the lower end of the spring is fixed.
Connecting piece: and the lower connecting piece of the fixed spring is connected with the thimble fixing piece.
A thimble fixing piece: and fixing the connecting piece.
Thimble: when the ejector pin is contacted with the wafer, the ejector pin fixing piece fixed on the Y-direction slide rail moves upwards.
A slide rail seat: and fixing the Y-direction slide rail.
Y is to the slide rail: the thimble fixing member is supported so as to be movable in the Y-axis.
Drag chain: and connecting the drag chain connecting piece with the drag chain fixing piece to ensure that the whole device can move on the Y axis.
Drag chain connecting piece: connecting the Y-direction moving seat with the drag chain.
Drag chain mounting: fixed on the wafer machine and connected with the drag chain.
Y-direction moving seat: the fixed photoelectric sensor base, the spring upper connecting piece base, the proximity sensor support piece and the slide rail seat.
The final purpose of the device is distance measurement, namely, the distance of the wafer from a reference surface is measured. When the system works, the Y-direction moving seat performs downward detection, the proximity sensor sends a disconnection signal at the moment when the thimble contacts the wafer, the system records the current Y-axis position information of the Y-direction moving seat through motor data, and the system measures the distance between the wafer and the reference surface through the difference value of the Y-axis position information and the Y-axis position information during the preset homing.
Compared with the prior art, the utility model has the following characteristics:
1) compared with traditional distance measuring modes such as laser distance measuring and ultrasonic distance measuring, the thimble contact type distance measuring method has the advantages of strong anti-interference capability and high measuring precision (same as motor precision, micron level);
2) the utility model can utilize the existing structure and components of the wafer related machine, and has the advantages of few newly added components, low cost, high reliability and high cost performance.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic structural view of a retractable thimble unit, a proximity sensor trigger mechanism and a limit protection mechanism according to the present invention;
the notation in the figure is:
the device comprises a base 1, a photoelectric sensor base, a 2 photoelectric sensor, a 3 photoelectric sensor trigger piece, a 4-spring upper connecting piece base, a 5-spring upper connecting piece, a 6-spring, a 7-proximity sensor support piece, a 8-proximity sensor, a 9-spring lower connecting piece, a 10-connecting piece, a 11-thimble fixing piece, a 12-thimble, a 13-slide rail seat, a 14-Y-direction slide rail, a 15-drag chain, a 16-drag chain connecting piece, a 17-drag chain fixing piece and an 18-Y-direction moving seat.
Detailed Description
The utility model is described in detail below with reference to the figures and specific embodiments. The present embodiment is implemented on the premise of the technical solution of the present invention, and a detailed implementation manner and a specific operation process are given, but the scope of the present invention is not limited to the following embodiments.
Example (b):
as shown in fig. 1 and 2, the thimble contact type distance measuring device for the wafer includes a Y-direction moving mechanism, and a telescopic thimble unit, a proximity sensor trigger mechanism, and a limiting protection mechanism respectively disposed on the Y-direction moving mechanism, wherein the telescopic thimble unit is respectively adapted to the proximity sensor trigger mechanism and the limiting protection mechanism.
The Y-direction moving mechanism comprises a drag chain 15, a drag chain fixing piece 17 arranged at one end of the drag chain 15, a drag chain connecting piece 16 arranged at the other end of the drag chain 15 and a Y-direction moving seat 18 connected with the drag chain connecting piece 16, and the telescopic ejector pin unit, the proximity sensor triggering mechanism and the limiting protection mechanism are all arranged on the Y-direction moving seat 18.
The retractable thimble unit comprises a Y-direction slide rail mechanism arranged on the Y-direction moving seat 18, a thimble mechanism movably arranged on the Y-direction slide rail mechanism and a spring mechanism matched with the thimble mechanism. The Y-direction slide rail mechanism comprises a slide rail seat 13 arranged on the Y-direction moving seat 18 and a Y-direction slide rail 14 arranged on the slide rail seat 13, and the ejector pin mechanism is movably arranged on the Y-direction slide rail 14. The thimble mechanism comprises a thimble fixing piece 11 movably arranged on a Y-direction slide rail 14 and a thimble 12 arranged at the bottom of the thimble fixing piece 11 along the Y direction. The spring mechanism comprises a connecting piece 10 arranged at the top of the thimble fixing piece 11, a lower spring connecting piece 9 arranged on the connecting piece 10, an upper spring connecting piece base 4 arranged on the Y-direction moving seat 18 and positioned above the lower spring connecting piece 9, an upper spring connecting piece 5 arranged on the upper spring connecting piece base 4 and a spring 6 arranged between the upper spring connecting piece 5 and the lower spring connecting piece 9.
The proximity sensor trigger mechanism includes a proximity sensor support 7 provided on the Y-direction moving base 18 and a proximity sensor 8 provided on the proximity sensor support 7 and fitted to the link 10. The proximity sensor 8 is located below the connection 10.
The limiting protection mechanism comprises a photoelectric sensor base 1 arranged on the Y-direction moving seat 18 and a photoelectric sensor 2 arranged on the photoelectric sensor base 1, and a photoelectric sensor trigger 3 matched with the photoelectric sensor 2 is arranged on the connecting piece 10. The photosensor 2 is located above the connecting member 10.
The whole device can move on the Y axis relative to the wafer machine. The connection mode of each part is as follows: the drag chain fixing part 17 is fixedly connected with the wafer machine platform, the drag chain 15 is connected with the drag chain fixing part 17, the drag chain connecting part 16 is connected with the drag chain 15, and the Y-direction moving seat 18 is fixedly connected with the drag chain connecting part 16. The photosensor base 1 is fixed to the Y-direction moving base 18, and the photosensor 2 is fixed to the photosensor base 1. The spring upper connecting piece base 4 is fixed on the Y-direction moving seat 18, and the spring upper connecting piece 5 is fixed on the spring upper connecting piece base 4. The proximity sensor support 7 is fixed to the Y-direction moving base 18, and the proximity sensor 8 is fixed to the proximity sensor support 7. The slide rail base 13 is fixed to the Y-direction moving base 18, the Y-direction slide rail 14 is connected to the slide rail base 13, the needle holder 11 is movable in the Y-axis direction on the Y-direction slide rail 14, and the connecting member 10 is fixed to the needle holder 11. The lower spring connecting piece 9 is fixed on the connecting piece 10, the upper end of the spring 6 is fixed with the upper spring connecting piece 5, and the lower end of the spring 6 is fixed with the lower spring connecting piece 9. The thimble 12 is fixed to the thimble fixing member 11.
The final purpose of the device is distance measurement, namely, the distance of the wafer from a reference surface is measured. When the system works, the Y-direction moving seat 18 performs downward detection, the proximity sensor 8 sends out a disconnection signal at the moment when the thimble 12 contacts with the wafer, the system records the current Y-axis position information of the Y-direction moving seat 18 through motor data, and the system measures the distance between the wafer and a reference surface through the difference value of the Y-axis position information and the Y-axis position information during the preset homing.
Wherein, the Y-direction moving mechanism has the following functions: the movement of the Y-direction moving base 18 along the Y-axis is realized jointly by combining with a motor on the wafer machine.
The telescopic thimble unit has the following functions: when the thimble 12 contacts the wafer, the portion of the retractable thimble unit located on the Y-slide 14 is displaced upward along the Y-slide 14 (i.e., along the Y-axis).
The proximity sensor trigger mechanism functions as: when the corresponding component in the telescopic thimble unit is displaced upwards, a distance is generated between the connecting piece 10 and the proximity sensor 8, and a disconnection signal of the proximity sensor 8 is triggered.
The limiting protection mechanism has the following functions: when the corresponding part in the telescopic thimble unit moves upwards for a certain distance, the photoelectric sensor trigger piece 3 triggers the photoelectric sensor 2, at the moment, the limiting protection is started, and the downward movement of the device is stopped.
The embodiments described above are intended to facilitate the understanding and use of the utility model by those skilled in the art. It will be readily apparent to those skilled in the art that various modifications to these embodiments may be made, and the generic principles described herein may be applied to other embodiments without the use of the inventive faculty. Therefore, the present invention is not limited to the above embodiments, and those skilled in the art should make improvements and modifications within the scope of the present invention based on the disclosure of the present invention.
Claims (10)
1. The utility model provides a thimble contact range unit for wafer which characterized in that, the device includes Y to moving mechanism and set up respectively telescopic thimble unit, proximity sensor trigger mechanism, the spacing protection mechanism on Y is to moving mechanism, telescopic thimble unit respectively with proximity sensor trigger mechanism, spacing protection mechanism looks adaptation.
2. A thimble contact type distance measuring device for a wafer according to claim 1, wherein the Y-direction moving mechanism comprises a drag chain (15), a drag chain fixing member (17) disposed at one end of the drag chain (15), a drag chain connecting member (16) disposed at the other end of the drag chain (15), and a Y-direction moving base (18) connected to the drag chain connecting member (16), and the retractable thimble unit, the proximity sensor triggering mechanism, and the limit protection mechanism are disposed on the Y-direction moving base (18).
3. A thimble contact type distance measuring device for wafer according to claim 2, wherein said retractable thimble unit comprises a Y-direction slide mechanism disposed on a Y-direction moving base (18), a thimble mechanism movably disposed on the Y-direction slide mechanism, and a spring mechanism adapted to the thimble mechanism.
4. A thimble contact type distance measuring device for wafer according to claim 3, wherein the Y-direction slide rail mechanism comprises a slide rail base (13) disposed on the Y-direction moving base (18) and a Y-direction slide rail (14) disposed on the slide rail base (13), and the thimble mechanism is movably disposed on the Y-direction slide rail (14).
5. A thimble contact type distance measuring device for wafer according to claim 4, wherein said thimble mechanism comprises a thimble holder (11) movably disposed on a Y-direction slide rail (14) and a thimble (12) disposed at the bottom of the thimble holder (11) along the Y-direction.
6. A thimble contact type distance measuring device for wafer according to claim 5, wherein said spring mechanism comprises a connecting member (10) disposed on top of the thimble fixing member (11), a lower spring connecting member (9) disposed on the connecting member (10), an upper spring connecting member base (4) disposed on the Y-direction moving base (18) and above the lower spring connecting member (9), an upper spring connecting member (5) disposed on the upper spring connecting member base (4), and a spring (6) disposed between the upper spring connecting member (5) and the lower spring connecting member (9).
7. A thimble contact type distance measuring device for wafer according to claim 6, characterized in that the proximity sensor trigger mechanism comprises a proximity sensor support (7) provided on the Y-direction moving base (18) and a proximity sensor (8) provided on the proximity sensor support (7) and adapted to the connection member (10).
8. A thimble contact type ranging device for wafers according to claim 7, characterized in that the proximity sensor (8) is located below the connection member (10).
9. A thimble contact type distance measuring device for a wafer according to claim 6, characterized in that the limiting protection mechanism comprises a photoelectric sensor base (1) arranged on the Y-direction moving seat (18) and a photoelectric sensor (2) arranged on the photoelectric sensor base (1), and the connecting member (10) is provided with a photoelectric sensor trigger (3) adapted to the photoelectric sensor (2).
10. A thimble contact type distance measuring device for a wafer according to claim 9, wherein said photoelectric sensor (2) is located above the connecting member (10).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121968063.8U CN215572801U (en) | 2021-08-20 | 2021-08-20 | Thimble contact type distance measuring device for wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121968063.8U CN215572801U (en) | 2021-08-20 | 2021-08-20 | Thimble contact type distance measuring device for wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215572801U true CN215572801U (en) | 2022-01-18 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121968063.8U Active CN215572801U (en) | 2021-08-20 | 2021-08-20 | Thimble contact type distance measuring device for wafer |
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| Country | Link |
|---|---|
| CN (1) | CN215572801U (en) |
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2021
- 2021-08-20 CN CN202121968063.8U patent/CN215572801U/en active Active
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