CN215551626U - Be applied to trinity of circuit board production from type membrane - Google Patents
Be applied to trinity of circuit board production from type membrane Download PDFInfo
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- CN215551626U CN215551626U CN202121353574.9U CN202121353574U CN215551626U CN 215551626 U CN215551626 U CN 215551626U CN 202121353574 U CN202121353574 U CN 202121353574U CN 215551626 U CN215551626 U CN 215551626U
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Abstract
The utility model discloses a three-in-one release film applied to circuit board production, which relates to the technical field of protective films and comprises a polyethylene layer, a lower substrate layer and a bulge, and further comprises an anti-impact mechanism for buffering and an adhesive structure for mounting and fastening, wherein the upper substrate layer is arranged above the polyethylene layer, an upper release silicone oil layer is arranged at the top end of the upper substrate layer, the lower substrate layer is arranged below the polyethylene layer, the lower release silicone oil layer is arranged at the bottom end of the lower substrate layer, and the anti-impact mechanism is arranged on the inner side of the polyethylene layer. According to the utility model, the polyethylene layer is arranged, and the first elastic rubber block and the second elastic rubber block which are matched with each other are arranged in the polyethylene layer, so that after the first elastic rubber block and the second elastic rubber block are impacted, the first elastic rubber block and the second elastic rubber block are extruded and deformed, and the bulge and the groove are extruded mutually, so that the impact force is absorbed and buffered, the impact resistance of the release film is improved, and the problem of poor impact resistance is solved.
Description
Technical Field
The utility model relates to the technical field of protective films, in particular to a three-in-one release film applied to circuit board production.
Background
In the circuit board production and processing process, need paste on the circuit board from the type membrane, play above-mentioned aluminium foil and following green silica gel's separating action from the type membrane, make operating personnel can directly take out from the press with the hand and can not scald one's hand, have better high temperature resistance from the type membrane to have the buffer board in inside, play the effect of resistance to compression buffering, guarantee the quality of circuit board, but present more are poor from type membrane anti-impact performance, thereby lead to life weak point.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a three-in-one release film applied to circuit board production, and aims to solve the problem that the existing three-in-one release film applied to circuit board production does not have compression resistance and impact resistance.
In order to achieve the purpose, the utility model provides the following technical scheme: the three-in-one release film applied to circuit board production comprises a polyethylene layer, a lower substrate layer and a bulge, and also comprises an anti-impact mechanism for buffering and a bonding structure for mounting and fastening;
an upper substrate layer is arranged above the polyethylene layer, an upper release silicone oil layer is arranged at the top end of the upper substrate layer, a lower substrate layer is arranged below the polyethylene layer, a lower release silicone oil layer is arranged at the bottom end of the lower substrate layer, and the anti-impact mechanism is arranged on the inner side of the polyethylene layer;
the bonding structure is arranged on the outer walls of the two ends of the polyethylene layer.
Preferably, the outer walls of the polyethylene layers are coated with adhesives, and side patches are arranged on the outer sides of the adhesives.
Preferably, go up from type silicone oil layer, go up the substrate layer, leave type silicone oil layer and substrate layer's area size equals down, and the polyethylene layer is less than the area of last type silicone oil layer, last substrate layer, lower type silicone oil layer and lower substrate layer.
Preferably, bonding structure includes double-sided tape, double-sided tape evenly installs in the both ends outer wall on polyethylene layer, the both ends outer wall on polyethylene layer all is provided with six double-sided tape.
Preferably, the inner sides of the lower substrate layer and the upper substrate layer are both provided with PLA film layers, and a PBAT film layer is arranged below the PLA film layers.
Preferably, the anti striking mechanism includes first elasticity block rubber and second elasticity block rubber, first elasticity block rubber is installed in the inside on polyethylene layer, the second elasticity block rubber is installed to the below of first elasticity block rubber.
Preferably, the bottom of the first elastic rubber block is provided with a bulge, and the top of the second elastic rubber block is provided with a groove matched with the bulge.
Compared with the prior art, the utility model has the beneficial effects that:
(1) the utility model provides a polyethylene layer, a bulge, a groove, a first elastic rubber block and a second elastic rubber block, wherein the polyethylene layer is arranged, and the first elastic rubber block and the second elastic rubber block which are matched with each other are arranged in the polyethylene layer;
(2) the utility model provides a double-sided tape, a polyethylene layer, a lower release silicone oil layer and an upper release silicone oil layer, wherein the upper release silicone oil layer, the polyethylene layer and the lower release silicone oil layer are bonded and fixed together by using the double-sided tape with the temperature resistance of not lower than the temperature, the production efficiency is improved, the middle polyethylene layer can not flow out in the manufacturing process, the molded release film has good smoothness and is firmly bonded and fixed, and the problem of poor bonding is solved.
Drawings
FIG. 1 is a schematic side sectional view of a release film according to the present invention;
FIG. 2 is a schematic view of a top-down structure of the release film of the present invention;
FIG. 3 is a schematic top view of a polyethylene layer according to the present invention;
FIG. 4 is a schematic cross-sectional view of a substrate layer according to the present invention;
fig. 5 is an enlarged schematic view of the structure at a in fig. 1 according to the present invention.
In the figure: 1. a polyethylene layer; 2. loading a release silicon oil layer; 3. an upper substrate layer; 4. double-sided adhesive tape; 5. a binder; 6. side pasting; 7. a lower substrate layer; 8. a release silicon oil layer is arranged; 9. a PLA film layer; 10. a PBAT film layer; 11. an anti-impact mechanism; 1101. a first elastic rubber block; 1102. a second elastic rubber block; 12. a protrusion; 13. and (4) a groove.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1: referring to fig. 1-5, a three-in-one release film for circuit board production includes a polyethylene layer 1, a lower substrate layer 7, a protrusion 12, an impact-resistant mechanism 11 for buffering, and a bonding structure for mounting and fastening;
an upper substrate layer 3 is arranged above the polyethylene layer 1, an upper release silicone oil layer 2 is arranged at the top end of the upper substrate layer 3, a lower substrate layer 7 is arranged below the polyethylene layer 1, a lower release silicone oil layer 8 is arranged at the bottom end of the lower substrate layer 7, and an anti-impact mechanism 11 is arranged on the inner side of the polyethylene layer 1;
the bonding structures are arranged on the outer walls of the two ends of the polyethylene layer 1;
referring to fig. 1-5, the three-in-one release film applied to the production of the circuit board further includes a bonding structure, the bonding structure includes double-sided tapes 4, the double-sided tapes 4 are uniformly installed on the outer walls of the two ends of the polyethylene layer 1, and the outer walls of the two ends of the polyethylene layer 1 are respectively provided with six double-sided tapes 4;
the outer wall of the polyethylene layer 1 is coated with an adhesive 5, and the outer side of the adhesive 5 is provided with a side paster 6;
PLA film layers 9 are arranged on the inner sides of the lower substrate layer 7 and the upper substrate layer 3, and PBAT film layers 10 are arranged below the PLA film layers 9;
the areas of the upper release silicone oil layer 2, the upper substrate layer 3, the lower release silicone oil layer 8 and the lower substrate layer 7 are equal, and the polyethylene layer 1 is smaller than the areas of the upper release silicone oil layer 2, the upper substrate layer 3, the lower release silicone oil layer 8 and the lower substrate layer 7;
specifically, as shown in fig. 1, fig. 2 and fig. 3, when the structure is used, the upper release silicone oil layer 2, the polyethylene layer 1 and the lower release silicone oil layer 8 are bonded and fixed together by using the double-sided adhesive tape 4 which can resist the temperature of not less than 220 ℃, so that the streamlined operation can be realized during the production, the production efficiency is improved, and in the manufacturing process, the middle polyethylene layer 1 cannot flow out, so that the molded release film has good flatness and is firmly bonded and fixed.
Example 2: the anti-collision mechanism 11 comprises a first elastic rubber block 1101 and a second elastic rubber block 1102, wherein the first elastic rubber block 1101 is installed inside the polyethylene layer 1, and the second elastic rubber block 1102 is installed below the first elastic rubber block 1101;
the bottom end of the first elastic rubber block 1101 is provided with a bulge 12, and the top end of the second elastic rubber block 1102 is provided with a groove 13 matched with the bulge 12;
specifically, as shown in fig. 1 and 5, when the structure is used, the polyethylene layer 1 is arranged, the first elastic rubber block 1101 and the second elastic rubber block 1102 which are matched with each other are arranged in the polyethylene layer 1, after the impact, the first elastic rubber block 1101 and the second elastic rubber block 1102 are extruded and deformed, the protrusion 12 and the groove 13 are extruded with each other, the impact force is absorbed and buffered, and the impact resistance of the release film is improved.
The working principle is as follows: when the device is used, firstly, the upper release type silicon oil layer 2 and the lower release type silicon oil layer 8 can bear higher temperature, and the side patches 6 are used for sealing the edges of the polyethylene layer 1 through the adhesive 5;
the first innovation point implementation step:
the first step is as follows: the upper release silicone oil layer 2, the polyethylene layer 1 and the lower release silicone oil layer 8 are bonded and fixed together by adopting a double-sided adhesive tape 4 which can resist the temperature of not less than 220 ℃, six layers are arranged on the upper and lower sides, and corners can be uniformly bonded;
the second step is that: the production process has the advantages that the streamlined operation can be realized during production, the production efficiency is improved, and in the manufacturing process, the middle polyethylene layer 1 cannot flow out, so that the molded release film has good smoothness and is firmly bonded and fixed.
The implementation step of the second innovation point:
through being provided with polyethylene layer 1 to set up first elastic rubber piece 1101 and second elastic rubber piece 1102 of mutually supporting in polyethylene layer 1, receive the striking back, first elastic rubber piece 1101 and second elastic rubber piece 1102 receive extrusion deformation, and protruding 12 extrudees each other with recess 13, absorbs the buffering to the impact force, has promoted the anti impact performance from the type membrane.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. Be applied to trinity from type membrane of circuit board production, including polyethylene layer (1), lower substrate layer (7) and arch (12), its characterized in that: the device also comprises an anti-impact mechanism (11) for buffering action and an adhesive structure for mounting and fastening;
an upper substrate layer (3) is arranged above the polyethylene layer (1), an upper release silicone oil layer (2) is arranged at the top end of the upper substrate layer (3), a lower substrate layer (7) is arranged below the polyethylene layer (1), a lower release silicone oil layer (8) is arranged at the bottom end of the lower substrate layer (7), and the anti-collision mechanism (11) is arranged on the inner side of the polyethylene layer (1);
the bonding structure is arranged on the outer walls of the two ends of the polyethylene layer (1).
2. The three-in-one release film applied to the production of the circuit board as claimed in claim 1, which is characterized in that: the outer wall of the polyethylene layer (1) is coated with an adhesive (5), and a side patch (6) is arranged on the outer side of the adhesive (5).
3. The three-in-one release film applied to the production of the circuit board as claimed in claim 1, which is characterized in that: go up from type silicone oil layer (2), go up substrate layer (3), down from type silicone oil layer (8) and substrate layer (7)'s area size equals, and polyethylene layer (1) is less than the area of last type silicone oil layer (2), last substrate layer (3), lower type silicone oil layer (8) and substrate layer (7) down.
4. The three-in-one release film applied to the production of the circuit board as claimed in claim 1, which is characterized in that: bonding structure includes double-sided tape (4), double-sided tape (4) evenly install in the both ends outer wall on polyethylene layer (1), the both ends outer wall on polyethylene layer (1) all is provided with six double-sided tape (4).
5. The three-in-one release film applied to the production of the circuit board as claimed in claim 1, which is characterized in that: the inboard of lower substrate layer (7) and last substrate layer (3) all is provided with PLA thin layer (9), and the below of PLA thin layer (9) is provided with PBAT thin layer (10).
6. The three-in-one release film applied to the production of the circuit board as claimed in claim 1, which is characterized in that: the anti-collision mechanism (11) comprises a first elastic rubber block (1101) and a second elastic rubber block (1102), wherein the first elastic rubber block (1101) is installed inside the polyethylene layer (1), and the second elastic rubber block (1102) is installed below the first elastic rubber block (1101).
7. The three-in-one release film applied to circuit board production as claimed in claim 6, wherein: the bottom end of the first elastic rubber block (1101) is provided with a bulge (12), and the top end of the second elastic rubber block (1102) is provided with a groove (13) matched with the bulge (12).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121353574.9U CN215551626U (en) | 2021-06-17 | 2021-06-17 | Be applied to trinity of circuit board production from type membrane |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121353574.9U CN215551626U (en) | 2021-06-17 | 2021-06-17 | Be applied to trinity of circuit board production from type membrane |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215551626U true CN215551626U (en) | 2022-01-18 |
Family
ID=79818143
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121353574.9U Active CN215551626U (en) | 2021-06-17 | 2021-06-17 | Be applied to trinity of circuit board production from type membrane |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215551626U (en) |
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2021
- 2021-06-17 CN CN202121353574.9U patent/CN215551626U/en active Active
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