CN215545968U

CN215545968U - A feed mechanism for semiconductor's laser cutting

Info

Publication number: CN215545968U
Application number: CN202122207545.8U
Authority: CN
Inventors: 陈辰; 宋杰; 罗官
Original assignee: Shandong Saifu Electronics Co Ltd
Current assignee: Shandong Saifu Electronics Co Ltd
Priority date: 2021-09-13
Filing date: 2021-09-13
Publication date: 2022-01-18
Anticipated expiration: 2031-09-13

Abstract

The utility model discloses a feeding mechanism for laser cutting of semiconductors, which comprises a conveyor belt and a mechanical claw, and further comprises: the fixing plate is arranged at the end part of the conveying belt; the adjusting part, the adjusting part sets up in the tip of fixed plate, the adjusting part includes first motor, first motor sets up in the one end of fixed plate, the tip of first motor runs through fixed plate and fixedly connected with screw rod, the surface threaded connection of screw rod has the mounting box, the inside sliding connection of mounting box has the slide bar, the side fixed mounting of mounting box has the second motor, the tip fixedly connected with rotor plate of second motor, the below of rotor plate is provided with the regulating plate, the bottom fixedly connected with of regulating plate adjusts the pole, the through-hole has been seted up to the bottom of mounting box, conveniently carries out the regulation of position to the gripper to in order to snatch unqualified semiconductor.

Description

A feed mechanism for semiconductor's laser cutting

Technical Field

The utility model relates to the field of semiconductors, in particular to a feeding mechanism for laser cutting of semiconductors.

Background

The semiconductor refers to a material having a conductivity between a conductor and an insulator at normal temperature.

However, the existing feeding mechanism still has some disadvantages, when semiconductor feeding is carried out, collision may occur between semiconductors in the feeding process, a small amount of semiconductors are damaged, and when the semiconductors are grabbed by using mechanical claws, the semiconductor feeding mechanism is not flexible enough.

SUMMERY OF THE UTILITY MODEL

In order to overcome the defects of the prior art, the utility model provides the feeding mechanism for laser cutting of the semiconductor, which is convenient for adjusting the position of a mechanical claw so as to grab an unqualified semiconductor.

In order to solve the technical problems, the utility model provides the following technical scheme: a feed mechanism for laser cutting of semiconductors, includes conveyer belt and gripper, still includes:

the fixing plate is arranged at the end part of the conveying belt;

and the adjusting assembly is arranged at the end part of the fixing plate.

As a preferred technical scheme of the present invention, the adjusting assembly includes a first motor, the first motor is disposed at one end of the fixing plate, an end of the first motor penetrates through the fixing plate and is fixedly connected with a screw, an outer surface of the screw is in threaded connection with a mounting box, a slide bar is slidably connected inside the mounting box, a second motor is fixedly mounted on a side surface of the mounting box, an end of the second motor is fixedly connected with a rotating plate, an adjusting plate is disposed below the rotating plate, and an adjusting rod is fixedly connected to a bottom of the adjusting plate.

As a preferable technical scheme of the utility model, the bottom of the mounting box is provided with a through hole, and a telescopic spring is arranged between the through hole and the adjusting plate.

As a preferable technical scheme of the utility model, the end part of the mounting box is provided with a threaded hole and a sliding groove in sequence from top to bottom.

As a preferable technical solution of the present invention, the number of the fixing plates is two, and the two fixing plates are arranged symmetrically with respect to a vertical center line of the conveyor belt as an axis.

As a preferable technical scheme of the utility model, the rotating plate is in an oval shape, and the second motor is fixedly connected with the edge of the rotating plate.

As a preferable technical scheme of the utility model, the bottom of the adjusting rod is movably connected with the top of the mechanical claw.

Compared with the prior art, the utility model can achieve the following beneficial effects:

1. through the first motor and the screw rod that set up, when detecting the semiconductor of damage, start first motor, the rotation of first motor drives the screw rod of rotating the connection between two fixed plates and rotates, and the mounting box is owing to the limited action of spout and slide bar for the removal of horizontal direction is to the mounting box along with the rotation of screw rod, thereby drives the gripper and does the removal of horizontal direction, adjusts the position of gripper horizontal direction, can snatch the processing to the broken semiconductor of different horizontal positions.

2. When the rotating plate rotates, the end far away from the output shaft of the second motor extrudes the adjusting plate and presses the adjusting plate downwards, so that the adjusting rod is driven to move downwards, the telescopic spring is extruded and charged, the mechanical claw moves downwards and grabs the damaged semiconductor, when the grabbing is completed, the second motor rotates reversely, the end close to the output shaft of the second motor extrudes the adjusting plate, the telescopic spring releases energy, the adjusting plate and the adjusting rod are pushed upwards, the mechanical claw rises together, the situation that the mechanical claw blocks the transportation of the semiconductor when not in use is prevented, and meanwhile, the adjustment of a plurality of positions of the mechanical claw is realized, so that the flexibility of the device is higher, and the removal of device is comparatively stable, conveniently snatchs unqualified product.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is an enlarged view of the structure at A in FIG. 1 according to the present invention;

FIG. 3 is a view showing a structure of a through hole connection according to the present invention;

fig. 4 is a connection structure view of the extension spring of the present invention.

Wherein: 1. a conveyor belt; 2. a gripper; 3. a fixing plate; 4. a first motor; 5. a screw; 6. mounting a box; 7. a slide bar; 8. a second motor; 9. a rotating plate; 10. an adjusting plate; 11. adjusting a rod; 12. a through hole; 13. a tension spring; 14. a threaded hole; 15. a chute.

Detailed Description

The present invention will be further described with reference to specific embodiments for the purpose of facilitating an understanding of technical means, characteristics of creation, objectives and functions realized by the present invention, but the following embodiments are only preferred embodiments of the present invention, and are not intended to be exhaustive. Based on the embodiments in the implementation, other embodiments obtained by those skilled in the art without any creative efforts belong to the protection scope of the present invention. The experimental methods in the following examples are conventional methods unless otherwise specified, and materials, reagents and the like used in the following examples are commercially available unless otherwise specified.

Example (b):

as shown in fig. 1 to 4, the present invention provides a feeding mechanism for laser cutting of semiconductors, which includes a conveyor belt 1 and a gripper 2, and further includes:

a fixing plate 3, wherein the fixing plate 3 is arranged at the end part of the conveyor belt 1;

and the adjusting assembly is arranged at the end part of the fixing plate 3.

In other embodiments, the adjusting assembly includes a first motor 4, the first motor 4 is disposed at one end of the fixing plate 3, an end of the first motor 4 penetrates through the fixing plate 3 and is fixedly connected with a screw 5, an outer surface of the screw 5 is connected with a mounting box 6 in a threaded manner, a slide bar 7 is slidably connected inside the mounting box 6, a second motor 8 is fixedly mounted on a side surface of the mounting box 6, a rotating plate 9 is fixedly connected to an end of the second motor 8, an adjusting plate 10 is disposed below the rotating plate 9, and an adjusting rod 11 is fixedly connected to a bottom of the adjusting plate 10.

When a damaged semiconductor is detected through the arranged first motor 4 and the screw rod 5, the first motor 4 is started, the first motor 4 rotates to drive the screw rod 5 which is rotatably connected between the two fixing plates 3 to rotate, the mounting box 6 enables the mounting box 6 to move horizontally along with the rotation of the screw rod 5 due to the limiting effect of the sliding groove 15 and the sliding rod 7, so as to drive the mechanical claw 2 to move horizontally, the position of the mechanical claw 2 in the horizontal direction can be adjusted, the broken semiconductors in different horizontal positions can be grabbed and processed, the second motor 8 is started when the mounting box moves above the damaged semiconductor through the arranged second motor 8 and the rotating plate 9, the rotating plate 9 is driven by the rotation of the second motor 8 to rotate, and the rotating plate 9 is arranged in an arc shape, so that when the rotating plate 9 rotates, one end far away from the output shaft of the second motor 8 extrudes the adjusting plate 10, move regulating plate 10 pushing down, thereby it moves regulating rod 11 downstream to drive, and extrude expanding spring 13 and fill the ability, make gripper 2 downstream, and snatch the damaged semiconductor, when snatching the completion, reverse rotation second motor 8, extrude regulating plate 10 apart from the nearer one end of second motor 8 output shaft, expanding spring 13 release energy, upwards promote regulating plate 10 and regulating rod 11, gripper 2 rises in the lump, prevent gripper 2 and block the transportation of semiconductor when not using, the regulation to 2 a plurality of positions of gripper simultaneously, make the device flexibility higher, and the removal of device is comparatively stable, the convenience is snatched unqualified product.

In other embodiments, the bottom of the mounting box 6 is provided with a through hole 12, and a telescopic spring 13 is arranged between the through hole 12 and the adjusting plate 10.

Through the telescopic spring 13, the mechanical claw 2 is convenient to reset when the use is finished, so that the next time of grabbing can be realized.

In other embodiments, the end of the mounting box 6 is provided with a threaded hole 14 and a sliding groove 15 in sequence from top to bottom. Through the installation box 6, the adjusting plate 10 and the adjusting rod 11 are convenient to install.

In other embodiments, the number of the fixing plates 3 is two, and the two fixing plates 3 are arranged symmetrically with respect to the vertical center line of the conveyor belt 1.

Through the fixed plates 3, the screw rods 5 which are rotatably connected between the fixed plates 3 rotate along with the rotation of the first motor 4.

In other embodiments, the rotating plate 9 is disposed in an oval shape, and the second motor 8 is fixedly connected to the edge of the rotating plate 9.

Through the arranged rotating plate 9, due to the arc-shaped arrangement of the rotating plate 9, the extrusion degree of the adjusting plate 10 is different when the rotating plate 9 rotates.

In other embodiments, the bottom of the adjusting lever 11 is movably connected with the top of the gripper 2.

Through the gripper 2 who sets up, the regulation to gripper 2 position is convenient snatchs damaged semiconductor.

In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

The foregoing shows and describes the general principles, essential features, and advantages of the utility model. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, and the preferred embodiments of the present invention are described in the above embodiments and the description, and are not intended to limit the present invention. The scope of the utility model is defined by the appended claims and equivalents thereof.

Claims

1. A feed mechanism for laser cutting of semiconductor, includes conveyer belt (1) and gripper (2), its characterized in that: further comprising:

the fixing plate (3), the said fixing plate (3) is mounted to the end of the conveyer belt (1);

the adjusting component is arranged at the end part of the fixing plate (3).

2. The loading mechanism for laser cutting of semiconductors according to claim 1, characterized in that: the adjusting part comprises a first motor (4), the first motor (4) is arranged at one end of a fixing plate (3), the end part of the first motor (4) penetrates through the fixing plate (3) and a fixedly connected screw (5), the outer surface of the screw (5) is in threaded connection with a mounting box (6), the mounting box (6) is internally and slidably connected with a sliding rod (7), the side fixed mounting of the mounting box (6) is provided with a second motor (8), the end part of the second motor (8) is fixedly connected with a rotating plate (9), an adjusting plate (10) is arranged below the rotating plate (9), and the bottom fixedly connected with of the adjusting plate (10) is provided with an adjusting rod (11).

3. A loading mechanism for laser dicing of a semiconductor according to claim 2, characterized in that: through-hole (12) have been seted up to the bottom of mounting box (6), be provided with expanding spring (13) between through-hole (12) and regulating plate (10).

4. A loading mechanism for laser dicing of a semiconductor according to claim 2, characterized in that: the end part of the mounting box (6) is sequentially provided with a threaded hole (14) and a sliding groove (15) from top to bottom.

5. The loading mechanism for laser cutting of semiconductors according to claim 1, characterized in that: the number of the fixing plates (3) is two, and the two fixing plates (3) are symmetrically arranged by taking the vertical central line of the conveyor belt (1) as an axis.

6. A loading mechanism for laser dicing of a semiconductor according to claim 2, characterized in that: the rotating plate (9) is arranged in an oval shape, and the second motor (8) is fixedly connected with the edge of the rotating plate (9).

7. A loading mechanism for laser dicing of a semiconductor according to claim 2, characterized in that: the bottom of the adjusting rod (11) is movably connected with the top of the mechanical claw (2).