CN215545880U - Laser cutting machine - Google Patents

Abstract

The application relates to the technical field of laser cutting equipment, in particular to a laser cutting machine. The device comprises a rack, a material loading component movably arranged on the rack and used for fixing a workpiece, and a laser component arranged on the rack; the laser assembly comprises a laser, a laser head suspended on the loading assembly, a first light path adjusting assembly connected with the laser and a second light path adjusting assembly connected with the laser head; the second light path adjusting component is movably arranged on the machine frame, and the moving path of the laser head is perpendicular to the moving path of the loading component. The material loading component and the laser head move simultaneously, the processing capacity and the processing efficiency of laser cutting can be improved, the cutting forming quality of workpieces is guaranteed, the position of the second light path adjusting component and the position of the first light path adjusting component can be adjusted, the accuracy of the position of a laser focusing point is improved, the position adjustable range is wide, the processing of workpieces with various overall dimensions is adapted, and the requirement of high-precision production is met.

Description

Laser cutting machine

Technical Field

The application relates to the technical field of laser cutting equipment, in particular to a laser cutting machine.

Background

With the continuous development of laser technology, laser cutting has been developed into a new thermal cutting technology, and in laser processing, laser needs to be accurately focused to a specified position.

The laser cutting head of the most structure as an organic whole of current laser equipment, reflector and focusing mirror are installed in the inside of laser cutting head, and the angle through the reflector of fine setting inside is in order to change the position of laser focusing, and its defect lies in: the relative positions of a plurality of arranged inside are not adjustable, only the angle of the reflector can be adjusted, the focusing structure is simple, the adjustment form is single, the adjustable range of the position of a laser focusing point is small, the laser focusing device is difficult to adapt to the processing of products with various sizes and types and products with irregular shapes, and the requirement of high-precision production is difficult to meet.

In addition, in the laser processing process, the focusing position of the laser and the position of the workpiece determine the processing precision, while most of the existing laser equipment adopts a processing mode of workpiece movement or laser cutting head movement, and the laser cutting equipment still has great limitations in the aspects of improving the processing capacity, the processing efficiency, the quality and the like of laser cutting.

Therefore, a laser cutting machine satisfying the above requirements needs to be designed.

SUMMERY OF THE UTILITY MODEL

In order to solve one of the technical problems, the application provides a laser cutting machine, which comprises a rack, a material loading component movably arranged on the rack and used for fixing a workpiece, and a laser component arranged on the rack; the laser assembly comprises a laser, a laser head suspended on the loading assembly, a first light path adjusting assembly connected with the laser and a second light path adjusting assembly connected with the laser head; the second light path adjusting component is movably arranged on the rack, and the moving path of the laser head is perpendicular to the moving path of the loading component. In the laser processing process, the material loading component and the laser head move simultaneously to improve the processing capacity and the processing efficiency of laser cutting and ensure the cutting and forming quality of workpieces, the position of the second light path adjusting component and the position of the first light path adjusting component can be adjusted, the accuracy of the position of a laser focusing point is improved, the position adjustable range is large to adapt to the processing of workpieces with various overall dimensions, and the requirement of high-precision production is met.

Preferably, the first light path adjusting component comprises a first cavity fixed on the frame and a plurality of light path adjusting seats arranged in the first cavity and used for adjusting the laser path, and the first cavity is connected with the laser and the second light path adjusting component. A through hole for a laser beam to pass through is formed in the side wall of the first cavity, the laser beam penetrates through the through hole to enter the light path adjusting seat, and the laser beam is reflected by a reflector in the light path adjusting seat, so that the path of the laser beam is adjusted.

Preferably, the second light path adjusting part comprises a second cavity and a drive, the second cavity is connected with the laser head and the first light path adjusting part, the second cavity is arranged on the drive part moving on the rack, and a plurality of light path adjusting seats used for adjusting laser paths are arranged in the second cavity. The laser beam is ejected from the laser head towards the material loading component through the light path adjusting seat, and the laser processing of the workpiece on the material loading component is realized.

Preferably, the bottom of the light path adjusting seat is formed with a U-shaped mounting groove, and the light path adjusting seat is adjustably mounted in the first cavity or the second cavity through the U-shaped mounting groove. Each light path adjusting seat is adjustably installed in the first cavity or the second cavity through a U-shaped installation groove, and the laser emitting angle is adjusted by adjusting the angles of the beam combining mirror, the reflecting mirror and the focusing mirror, so that the accuracy of a laser light path is guaranteed, and the high-precision machining of workpieces is guaranteed.

Preferably, still including connecting laser instrument and first light path adjusting part and connecting the protective tube of laser head and second light path adjusting part, telescopic protection casing has been installed between first light path adjusting part and the second light path adjusting part. The laser beam is covered by the protective tube and the protective cover, so that personal injury caused during debugging is avoided, personal safety is guaranteed, and safety is improved.

Preferably, drive assembly is provided with and is used for the installation the slide of second light path adjusting part, the slide is installed and is used for the drive the lift drive assembly of the lift of laser head, and then realizes through lift drive assembly that the laser head moves down towards the material loading subassembly.

Preferably, the light path adjusting seat is provided with an adjusting cover plate for laser penetration, the adjusting cover plate is provided with an adjusting knob for adjusting the laser emitting angle, and the emitting angle of the laser beam is adjusted through the adjusting knob.

Preferably, the material loading assembly comprises a bearing platform for loading the workpiece and a displacement driving assembly for driving the bearing platform to move, and a pressure plate assembly for fixing the workpiece is arranged on the bearing platform. The bearing table is driven to move by the displacement driving assembly, and the moving path is orthogonal to the moving path of the laser head, so that the laser head can carry out laser processing on the workpiece on the bearing table.

Preferably, the pressure plate assembly comprises a pressure plate and a control hand wheel for driving the pressure plate to press down a fixed workpiece. The hand wheel is controlled to drive the pressing plate to press down the workpiece on the fixed bearing table.

Preferably, the bottom of the bearing platform is provided with a dust collecting box body, and the dust collecting box body is connected with a dust removing pipe. Dust debris that produces in the laser beam machining is collected through the dust collection box body of plummer bottom, and the dust debris in the dust collection box body is siphoned away to rethread dust removal pipe.

Compared with the prior art, the beneficial effects of this application are: the laser processing device comprises a rack, a material carrying component and a laser component, wherein the rack is movably provided with the material carrying component and the laser component, the laser component comprises a laser, a laser head, a first light path adjusting component and a second light path adjusting component, the laser is used for emitting laser beams, the laser beams are emitted from the laser head to a workpiece on the material carrying component after being adjusted by light paths of the first light path adjusting component and the second light path adjusting component, the workpiece is further subjected to laser processing, the second light path adjusting component is movably arranged on the rack, the laser head horizontally moves back and forth above the material carrying component, meanwhile, the material carrying component moves on the rack, the moving path is perpendicular to the moving path of the laser head, in the laser processing process, the material carrying component and the laser head move simultaneously, the processing capacity and the processing efficiency of laser cutting can be improved, the cutting and forming quality of the workpiece can be ensured, and the positions of the second light path adjusting component and the first light path adjusting component can be adjusted, the accuracy of the position of a laser focusing point is improved, the position adjustable range is wide so as to adapt to the processing of workpieces with various overall dimensions, and the requirement of high-precision production is met.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the description of the embodiments of the present application or the prior art will be briefly described below. It should be apparent that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained by those skilled in the art without inventive exercise.

Fig. 1 is a schematic structural view of a laser cutting machine according to an embodiment of the present application;

fig. 2 is a schematic structural diagram of a laser assembly of the laser cutting machine according to the embodiment of the present application;

fig. 3 is a schematic structural view of a light path adjusting seat of the laser cutting machine according to the embodiment of the present application.

Reference numerals

10. A frame; 11. a gantry; 20. a laser assembly; 21. a laser; 22. a laser head; 221. a lift drive assembly; 23. a first optical path adjusting member; 231. a first cavity; 232. a light path adjusting base; 233. a red light emitter; 234. adjusting the cover plate; 235. adjusting a knob; 24. a second optical path adjusting member; 241. a second cavity; 25. a drive assembly; 26. a slide plate; 30. a loading assembly; 31. a bearing table; 32. a platen assembly; 321. pressing a plate; 322. a control hand wheel; 33. a displacement drive assembly; 34. a dust removal pipe;

35. a dust collecting box body; 41. a protective tube; 42. a shield.

Detailed Description

In the following description, numerous implementation details are set forth in order to provide a thorough understanding of the present invention. It should be understood, however, that these implementation details should not be used to limit the application. That is, in some embodiments of the present application, such practical details are not necessary. In addition, some conventional structures and components are shown in simplified schematic form in the drawings.

It should be noted that all the directional indications such as up, down, left, right, front and rear … … in the embodiment of the present application are only used to explain the relative positional relationship, movement, etc. between the components in a specific posture as shown in the drawings, and if the specific posture is changed, the directional indication is changed accordingly.

In addition, the descriptions related to "first", "second", etc. in this application are for descriptive purposes only, not specifically referring to the order or sequence, nor are they intended to limit the application, but merely to distinguish components or operations described in the same technical terms, and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present application.

For further understanding of the contents, features and functions of the present invention, the following embodiments are exemplified in conjunction with the accompanying drawings and the following detailed description:

in order to solve the above technical problem, the present embodiment provides a laser cutting machine, as shown in fig. 1, fig. 1 is a schematic structural diagram of the laser cutting machine of the embodiment of the present application, and includes a rack 10, a material loading component 30 for fixing a workpiece, and a laser component 20 disposed on the rack 10, the material loading component 30 is movably disposed on the rack 10, where the laser component 20 includes a laser 21, a laser head 22 suspended on the material loading component 30, a first optical path adjusting component 23 connected to the laser 21, and a second optical path adjusting component 24 connected to the laser head 22, the laser 21 is configured to emit a laser beam, the laser beam is emitted from the laser head 22 toward the workpiece on the material loading component 30 after passing through optical path adjusting effects of the first optical path adjusting component 23 and the second optical path adjusting component 24, and then performs laser processing on the workpiece, where the second optical path adjusting component 24 is movably disposed on the rack 10, and then realize that laser head 22 moves back and forth in the level of year material subassembly 30 top, carry material subassembly 30 to move and the moving path perpendicular to laser head 22 moving path simultaneously in frame 10, in the laser beam machining process, carry material subassembly 30 and laser head 22 to move simultaneously and can realize improving laser cutting's processingability and machining efficiency, guarantee the cutting shaping quality of work piece, and the position of second light path adjusting part 24 and first light path adjusting part 23 is adjustable, realize improving the accuracy of laser focus point position, the position adjustable range is big in order to adapt to the processing of multiple overall dimension work piece, satisfy the demand of high accuracy production.

Specifically, as shown in fig. 2, fig. 2 is a schematic view of a laser assembly structure according to an embodiment of the present disclosure, where the first optical path adjusting assembly 23 includes a first cavity 231 fixed on the frame 10, and a plurality of optical path adjusting seats 232 installed in the first cavity 231 and used for adjusting a laser path, where a beam combining mirror and a reflecting mirror are installed in the optical path adjusting seat 232 in the first cavity 231, the first cavity 231 is connected to the laser 21, a through hole for a laser beam to pass through is formed in a side wall of the first cavity 231, the laser beam passes through the through hole and enters the optical path adjusting seat 232, and the laser beam is reflected by a reflecting mirror in the optical path adjusting seat 232 to adjust the path of the laser beam.

Further, the second optical path adjusting assembly 24 includes a second cavity 241 connecting the laser head 22 and the first optical path adjusting assembly 23, and a driving assembly 25 driving the second cavity 241 to move on the frame 10, a plurality of optical path adjusting seats 232 are installed in the second cavity 241, the second cavity 241 is also provided with a through hole for the laser beam to pass through, the bottom surface of the second cavity 241 is connected with the laser head 22, wherein the second cavity 241 includes the optical path adjusting seats 232 provided with a reflecting mirror and a focusing mirror, the laser beam is emitted from the laser head 22 towards the material loading assembly 30 through the optical path adjusting seats 232, and laser processing of the workpiece on the material loading assembly 30 is realized.

In order to realize that the relative position between the optical path adjusting bases 232 is adjustable, as shown in fig. 3, fig. 3 is a schematic structural view of the optical path adjusting base according to the embodiment of the present application, a U-shaped mounting groove 233 is formed at the bottom of the optical path adjusting base 232, and each optical path adjusting base 232 is adjustably mounted in the first cavity 231 or the second cavity 241 through the U-shaped mounting groove 233. The light path adjusting seat 232 is adjusted to a required position and then penetrates through the U-shaped mounting groove 233 through a bolt to be fixed in the first cavity 231 or the second cavity 241, meanwhile, an adjusting cover plate 234 for laser penetration is arranged on the light path adjusting seat 232, an adjusting knob 235 for adjusting lenses such as an internal beam combining mirror, a reflecting mirror and a focusing mirror is arranged on the adjusting cover plate 234, the laser emitting angle is adjusted by adjusting the angles of the beam combining mirror, the reflecting mirror and the focusing mirror, the accuracy of a laser light path is guaranteed, and high-precision machining of workpieces is guaranteed.

The laser beam emitted by the laser 21 firstly passes through the light path adjusting seat 232 provided with the beam combining mirror, the red light emitter 233 is arranged on the light path adjusting seat 232 provided with the beam combining mirror, the laser emitted by the laser 21 is transmitted through the beam combining mirror, the red light is reflected by the beam combining mirror, and then the laser beam and the red light are combined, when the laser path is debugged, the irradiation path of the laser beam can be judged by observing the path position of the red light, and the path of the laser beam can be intuitively and accurately adjusted.

In order to realize that the second optical path adjusting component 24 and the laser head 22 move above the material loading component 30, the gantry 11 is fixed on the frame 10, a driving component 25 is arranged on the gantry 11 and above the material loading component 30, wherein the driving component 25 can be a linear motor, a sliding plate 26 is arranged on the driving component 25, the second optical path adjusting component 24 and the laser head 22 are installed on the sliding plate 26, a lifting driving component 221 for driving the laser head 22 to lift is installed on the sliding plate 26, and further, the laser head 22 moves downwards towards the material loading component 30 through the lifting driving component 221, further, the processing capacity and the processing efficiency of laser cutting are guaranteed by adjusting the position of the second optical path adjusting component 24 relative to the first optical path adjusting component 23 and adjusting the relative position between the optical path adjusting seats 232.

In order to realize the protection purpose in the laser debugging process, the laser 21 and the first light path adjusting component 23 and the connection laser head 22 and the second light path adjusting component 24 are connected through the protective tube 41, the protective tube 41 covers the laser beam to realize the protection safety of an operator, and the second light path adjusting component 24 can horizontally move relative to the first light path adjusting component 23, so that the telescopic protective cover 42 is arranged between the first light path adjusting component 23 and the second light path adjusting component 24, the protective cover 42 covers the laser beam, the personal injury caused in the debugging process is avoided, the personal safety is ensured, and the safety is improved.

In order to carry and fix the workpiece, a loading assembly 30 is movably arranged on the frame 10, the loading assembly 30 comprises a bearing table 31 for loading the workpiece and a displacement driving assembly 33 for driving the bearing table 31 to move, and a pressure plate assembly 32 for fixing the workpiece is arranged on the bearing table 31. The pressing plate assembly 32 comprises a pressing plate 321 and a control hand wheel 322 for driving the pressing plate 321 to press down and fix the workpiece, the pressing plate 321 is driven to press down and fix the workpiece on the bearing table 31 through the control hand wheel 322, wherein the displacement driving assembly 33 can be a linear motor, the bearing table 31 is installed on the displacement driving assembly 33, the bearing table 31 is driven to move through the displacement driving assembly 33, and the moving path is orthogonal to the moving path of the laser head 22, so that the laser head 22 performs laser processing on the workpiece on the bearing table 31.

Dust debris can be generated in laser processing, for this reason, the bottom of the bearing platform 31 is provided with a dust collection box body 35, the dust collection box body 35 is connected with a dust removal pipe 34, the dust debris generated in the laser processing is collected through the dust collection box body 35 at the bottom of the bearing platform 31, and then the dust debris in the dust collection box body 35 is sucked away through the dust removal pipe 34.

In summary, in one or more embodiments of the present application, a carrier assembly and a laser assembly are movably disposed on a machine frame, the laser assembly includes a laser, a laser head, a first optical path adjusting assembly and a second optical path adjusting assembly, the laser is configured to emit a laser beam, the laser beam is emitted from the laser head toward a workpiece on the carrier assembly after being adjusted by optical paths of the first optical path adjusting assembly and the second optical path adjusting assembly, and then laser processing is performed on the workpiece, the second optical path adjusting assembly is movably disposed on the machine frame, so that the laser head horizontally moves back and forth above the carrier assembly, the carrier assembly moves on the machine frame, and the moving path is perpendicular to the moving path of the laser head, during laser processing, the carrier assembly and the laser head move simultaneously, so as to improve the processing capability and the processing efficiency of laser cutting, the cutting forming quality of the workpiece is guaranteed, the positions of the second light path adjusting component and the first light path adjusting component are adjustable, the accuracy of the position of a laser focusing point is improved, the position adjustable range is large so as to adapt to processing of workpieces with various overall dimensions, and the requirement of high-precision production is met.

The above-described embodiments do not limit the scope of the present invention. Any modification, equivalent replacement, and improvement made within the spirit and principle of the above-described embodiments should be included in the protection scope of the technical solution.

Claims (10)

1. A laser cutting machine is characterized in that: comprises a frame (10), a loading component (30) which is movably arranged on the frame (10) and is used for fixing a workpiece, and a laser component (20) arranged on the frame (10); the laser assembly (20) comprises a laser (21), a laser head (22) suspended on the loading assembly (30), a first light path adjusting assembly (23) connected with the laser (21) and a second light path adjusting assembly (24) connected with the laser head (22); the second light path adjusting component (24) is movably arranged on the rack (10), so that the moving path of the laser head (22) is perpendicular to the moving path of the loading component (30).

2. The laser cutting machine according to claim 1, characterized in that: the first light path adjusting component (23) comprises a first cavity (231) fixed on the frame (10) and a plurality of light path adjusting seats (232) installed in the first cavity (231) and used for adjusting laser paths, and the first cavity (231) is connected with the laser (21) and the second light path adjusting component (24).

3. The laser cutting machine according to claim 2, characterized in that: second light path adjusting part (24) is including connecting second cavity (241) and the drive of laser head (22) and first light path adjusting part (23) second cavity (241) in drive assembly (25) that move on frame (10), install a plurality of in second cavity (241) light path adjusting seat (232).

4. The laser cutting machine according to claim 3, characterized in that: the bottom of the light path adjusting seat (232) is provided with a U-shaped mounting groove (233), and the light path adjusting seat (232) is adjustably mounted in the first cavity (231) or the second cavity (241) through the U-shaped mounting groove (233).

5. The laser cutting machine according to claim 1, characterized in that: still including connecting laser instrument (21) and first light path adjusting part (23) and connecting protective tube (41) of laser head (22) and second light path adjusting part (24), telescopic protection casing (42) have been installed between first light path adjusting part (23) and second light path adjusting part (24).

6. The laser cutting machine according to claim 3, characterized in that: the drive assembly (25) is provided with a sliding plate (26) used for installing the second light path adjusting assembly (24), and the sliding plate (26) is provided with a lifting drive assembly (221) used for driving the lifting of the laser head (22).

7. The laser cutting machine according to claim 4, characterized in that: the light path adjusting seat (232) is provided with an adjusting cover plate (234) for laser penetration, and the adjusting cover plate (234) is provided with an adjusting knob (235) for adjusting the laser emission angle.

8. The laser cutting machine according to claim 1, characterized in that: the loading assembly (30) comprises a bearing table (31) for loading a workpiece and a displacement driving assembly (33) for driving the bearing table (31) to move, and a pressure plate assembly (32) for fixing the workpiece is arranged on the bearing table (31).

9. The laser cutting machine according to claim 8, characterized in that: the pressure plate assembly (32) comprises a pressure plate (321) and a control hand wheel (322) for driving the pressure plate (321) to press down a fixed workpiece.

10. The laser cutting machine according to claim 8, characterized in that: the dust collecting device is characterized in that a dust collecting box body (35) is arranged at the bottom of the bearing table (31), and the dust collecting box body (35) is connected with a dust removing pipe (34).

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