CN215544714U

CN215544714U - Mould equipment is used in waffle dish processing

Info

Publication number: CN215544714U
Application number: CN202121791073.9U
Authority: CN
Inventors: 宋卫坤
Original assignee: Ningbo Yiyu Mould Technology Co ltd
Current assignee: Ningbo Yiyu Mould Technology Co ltd
Priority date: 2021-08-02
Filing date: 2021-08-02
Publication date: 2022-01-18
Anticipated expiration: 2031-08-02

Abstract

The utility model relates to the technical field of die processing equipment, and discloses die equipment for wafer disc processing, which comprises a rack, an upper die holder, a lower die holder and a cooling system for cooling and demolding, wherein the upper die holder is arranged at the top of the rack, the lower die holder is arranged at the bottom of the rack, a guide assembly is arranged between the upper die holder and the lower die holder, and the top of the rack is provided with a driving mechanism for driving the upper die holder to move along the guide assembly towards the direction of the lower die holder; be equipped with mould benevolence in the middle of the bottom of upper die base, be equipped with in the middle of the top of die base and go up the lower mould benevolence of the mutual adaptation of mould benevolence, upper die benevolence surface is formed with the arch that the matrix was arranged, lower mould benevolence surface is formed with the recess with the protruding looks adaptation of upper die benevolence, be formed with the shaping space that is used for holding the molten metal material between arch and the recess, and go up the mould benevolence and the mutual amalgamation of lower mould benevolence and can form the sprue that communicates with the shaping space.

Description

Mould equipment is used in waffle dish processing

Technical Field

The utility model relates to the technical field of die processing equipment, in particular to die equipment for processing a waffle dish.

Background

The waffle is a baked cake originated from Belgium, also called latticed cake and latticed cake, and is baked by a waffle maker with a special baking tray.

The wafer machine in the market generally comprises a wafer baking tray (also called wafer tray), a machine body, a heating tube and the like, wherein the wafer tray is a key component of the whole wafer machine, the existing processing technology mainly applies pressure to a metal material by using a die arranged on a press machine at room temperature through a stamping die so as to deform the metal material to form the baking tray, however, the wafer tray is thick in the whole thickness and the rigidity of the metal material for forming the wafer tray is high, and the wafer tray is easy to break in the stamping process, so that the whole quality and the processing efficiency of products are affected.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide die equipment for processing a waffle dish, and aims to solve the problems that the waffle dish processed by a stamping die in the prior art is easy to break, and the overall quality and the processing efficiency of a product are affected.

In order to achieve the above purpose, the basic scheme of the utility model is as follows: the mould equipment for machining the waffle dish comprises a rack, an upper mould base, a lower mould base and a cooling system for cooling and demoulding, wherein the upper mould base is arranged at the top of the rack, the lower mould base is arranged at the bottom of the rack, a guide assembly is arranged between the upper mould base and the lower mould base, and a driving mechanism for driving the upper mould base to move along the guide assembly towards the direction of the lower mould base is arranged at the top of the rack; be equipped with mould benevolence in the middle of the bottom of upper die base, be equipped with in the middle of the top of die base and go up the lower mould benevolence of the mutual adaptation of mould benevolence, upper die benevolence surface is formed with the arch that the matrix was arranged, lower mould benevolence surface is formed with the recess with the protruding looks adaptation of upper die benevolence, be formed with the shaping space that is used for holding the molten metal material between arch and the recess, and go up the mould benevolence and the mutual amalgamation of lower mould benevolence and can form the sprue that communicates with the shaping space.

Furthermore, the driving mechanism comprises a group of telescopic hydraulic cylinders fixed at the top of the frame, and the output ends of the telescopic hydraulic cylinders are fixedly connected with the top of the upper die base.

Furthermore, the guide assembly comprises a group of positioning columns fixed on the rack, the positioning columns sequentially penetrate through the upper die base and the lower die base, guide sliding chutes in sliding fit with the positioning columns are formed in the upper die base, and the upper die base can slide up and down along the positioning columns.

Furthermore, a buffering assembly is arranged between the upper die base and the lower die base and comprises a spring sleeved on the positioning column, one end of the spring is connected to the upper die base, and the other end of the spring is connected to the lower die base.

Further, cooling system includes water tank and circulating water pump, circulating water pump and water tank interconnect, the cooling water has been filled in the water tank, the internal distribution of lower mould benevolence has water-cooling channel, be connected with first aqueduct between water-cooling channel's the end of intaking and the circulating water pump, be connected with the second aqueduct between water-cooling channel's the end of giving vent to anger and the water tank.

Furthermore, the cooling system also comprises a refrigeration assembly, the refrigeration assembly comprises a cooling box, a condenser and a compressor, condensate is poured into the cooling box, one end of the condenser is connected with the compressor, the other end of the condenser is connected with a condensing pipe, and the condensing pipe extends into the cooling box and is in contact with the condensate; the first water guide pipe penetrates through the cooling box, and the condensate submerges the second water guide pipe.

Furthermore, a rubber base plate is bonded to the bottom of the rack, and the area of the rubber base plate is larger than that of the bottom of the rack.

Compared with the prior art, the scheme has the beneficial effects that:

1. the molten metal material for forming the wafer tray is poured into the forming space through the filling opening, so that the molten metal material forms a pattern of the wafer tray in the forming space, the traditional punch forming processing mode is replaced by the pouring forming mode, the problem that the wafer tray formed by processing the stamping die is broken is solved, and the overall quality and the processing efficiency of the wafer tray can be improved by pouring forming.

2. The intervention of the cooling system can effectively and quickly cool the molten metal material; the wafer tray is formed by rapid cooling, and the cooled wafer tray can be easily demoulded, so that the processing efficiency is improved.

Drawings

FIG. 1 is a schematic view of the overall structure of the present invention;

fig. 2 is a schematic view of the internal structure of the cooling chamber in fig. 1.

Reference numerals in the drawings of the specification include: the cooling device comprises a rack 1, a telescopic hydraulic cylinder 11, a rubber cushion plate 12, an upper die base 2, an upper die core 21, a lower die base 3, a lower die core 31, a positioning column 4, a spring 41, a cooling chamber 5, a water tank 6, a second water guide pipe 61, a connecting pipe 62, a circulating water pump 7, a first water guide pipe 71, a cooling tank 8, a condenser 91 and a compressor 9.

Detailed Description

The utility model will be described in further detail by means of specific embodiments with reference to the accompanying drawings:

example (b):

a mould equipment for wafer disc processing is shown in figure 1 and comprises a rack 1, an upper mould base 2, a lower mould base 3 and a cooling system for cooling and demoulding, wherein a rubber base plate 12 is bonded at the bottom of the rack 1, and the area of the rubber base plate 12 is larger than that of the bottom of the rack 1. The upper die holder 2 is arranged at the top of the rack 1, the lower die holder 3 is arranged at the bottom of the rack 1, a guide assembly is arranged between the upper die holder 2 and the lower die holder 3, the guide assembly comprises a group of positioning columns 4 fixed on the rack 1, the positioning columns 4 sequentially penetrate through the upper die holder 2 and the lower die holder 3, guide chutes in sliding fit with the positioning columns 4 are arranged on the upper die holder 2, and the upper die holder 2 can slide up and down along the positioning columns 4; a buffer component is arranged between the upper die holder 2 and the lower die holder 3, the buffer component comprises a spring 41 sleeved on the positioning column 4, one end of the spring 41 is connected to the upper die holder 2, and the other end of the spring 41 is connected to the lower die holder 3.

As shown in fig. 1, a driving mechanism for driving the upper die holder 2 to move along the positioning column 4 toward the lower die holder 3 is disposed at the top of the frame 1, the driving mechanism includes a set of telescopic hydraulic cylinders 11 fixed at the top of the frame 1, and output ends of the telescopic hydraulic cylinders 11 are fixedly connected to the top of the upper die holder 2.

As shown in fig. 1, be equipped with mould benevolence 21 in the middle of the bottom of upper die base 2, be equipped with in the middle of the top of lower die base 3 with the lower mould benevolence 31 of the mutual adaptation of last mould benevolence 21, the arch that the matrix was arranged is formed on the surface of last mould benevolence 21, the lower mould benevolence 31 surface is formed with the recess with the protruding looks adaptation of last mould benevolence 21, be formed with the shaping space that is used for holding the molten metal material between arch and the recess, and go up the mould benevolence 21 and the mutual amalgamation of lower mould benevolence 31 and can form the sprue that communicates with the shaping space.

As shown in fig. 2, the cooling system includes a cooling chamber 5 arranged on the side of the rack 1, a water tank 6, a circulating water pump 7 and a refrigerating assembly are arranged in the cooling chamber 5, the circulating water pump 7 and the water tank 6 are connected with each other through a connecting pipe 62, cooling water is filled in the water tank 6, a water cooling channel is distributed in the lower mold core 31, a first water guide pipe 71 is connected between the water inlet end of the water cooling channel and the circulating water pump 7, and a second water guide pipe 61 is connected between the water outlet end of the water cooling channel and the water tank 6. The refrigeration assembly comprises a cooling box 8, a condenser 91 and a compressor 9, condensate is filled in the cooling box 8, one end of the condenser 91 is connected with the compressor 9, the other end of the condenser 91 is connected with a condenser pipe, and the condenser pipe extends into the cooling box 8 and is in contact with the condensate; the first water conduit 71 penetrates the cooling tank 8, and the condensate submerges the second water conduit 61.

The specific implementation mode of the scheme is as follows:

the upper die base 2 is driven by the telescopic hydraulic cylinder 11 to move towards the lower die base 3 along the positioning column 4 until the upper die core 21 of the upper die base 2 and the lower die core 31 of the lower die base 3 are mutually spliced together, and then the molten metal material for forming the wafer tray is filled into the forming space through the filling opening, so that the molten metal material forms a pattern of the wafer tray in the forming space.

In order to facilitate rapid cooling and demoulding, a cooling system is involved to rapidly cool the molten metal material; the circulation water pump 7 introduces the cooling water in the water tank 6 into the first water conduit 71 through the connection pipe 62; the condenser pipe cools the condensate in the cooling box 8, so that the condensate is in a low-temperature state for a long time, when cooling water flows through the first water guide pipe 71 and is contained in the part of the cooling box 8, the cooling water is cooled under the action of the condensate, the cooled cooling water continuously flows in the first water guide pipe 71 and flows into a water cooling channel inside the lower mold core 31 under the continuous action of the circulating water pump 7, molten metal materials are rapidly cooled, a wafer disc required by rapid pouring forming is formed, the cooled wafer disc can be demolded more easily, and the processing efficiency is improved.

The foregoing is merely an example of the present invention and common general knowledge of known specific structures and features of the embodiments is not described herein in any greater detail. It should be noted that, for those skilled in the art, without departing from the structure of the present invention, several changes and modifications can be made, which should also be regarded as the protection scope of the present invention, and these will not affect the effect of the implementation of the present invention and the practicability of the patent. The scope of the claims of the present application shall be determined by the contents of the claims, and the description of the embodiments and the like in the specification shall be used to explain the contents of the claims.

Claims

1. The utility model provides a mould equipment is used in waffle dish processing which characterized in that: the cooling device comprises a rack, an upper die holder, a lower die holder and a cooling system for cooling and demolding, wherein the upper die holder is arranged at the top of the rack, the lower die holder is arranged at the bottom of the rack, a guide assembly is arranged between the upper die holder and the lower die holder, and the top of the rack is provided with a driving mechanism for driving the upper die holder to move along the direction of the guide assembly towards the lower die holder; be equipped with mould benevolence in the middle of the bottom of upper die base, be equipped with in the middle of the top of die base and go up the lower mould benevolence of the mutual adaptation of mould benevolence, upper die benevolence surface is formed with the arch that the matrix was arranged, lower mould benevolence surface is formed with the recess with the protruding looks adaptation of upper die benevolence, be formed with the shaping space that is used for holding the molten metal material between arch and the recess, and go up the mould benevolence and the mutual amalgamation of lower mould benevolence and can form the sprue that communicates with the shaping space.

2. The mold apparatus for waffle dish processing according to claim 1, wherein: the driving mechanism comprises a group of telescopic hydraulic cylinders fixed at the top of the frame, and the output ends of the telescopic hydraulic cylinders are fixedly connected with the top of the upper die base.

3. The mold apparatus for waffle dish processing according to claim 1, wherein: the guide assembly comprises a group of positioning columns fixed on the rack, the positioning columns sequentially penetrate through the upper die base and the lower die base, guide sliding chutes in sliding fit with the positioning columns are formed in the upper die base, and the upper die base can slide up and down along the positioning columns.

4. The wafer dish processing die apparatus of claim 3, wherein: a buffer assembly is arranged between the upper die base and the lower die base and comprises a spring sleeved on the positioning column, one end of the spring is connected to the upper die base, and the other end of the spring is connected to the lower die base.

5. The mold apparatus for waffle dish processing according to claim 1, wherein: the cooling system comprises a water tank and a circulating water pump, the circulating water pump is connected with the water tank, cooling water is poured into the water tank, water cooling channels are distributed in the lower die core, a first water guide pipe is connected between the water inlet end of each water cooling channel and the circulating water pump, and a second water guide pipe is connected between the water outlet end of each water cooling channel and the water tank.

6. The wafer dish processing die apparatus of claim 5, wherein: the cooling system further comprises a refrigerating assembly, the refrigerating assembly comprises a cooling box, a condenser and a compressor, condensate is filled in the cooling box, one end of the condenser is connected with the compressor, the other end of the condenser is connected with a condensing pipe, and the condensing pipe extends into the cooling box and is in contact with the condensate; the first water guide pipe penetrates through the cooling box, and the condensate submerges the second water guide pipe.

7. The mold apparatus for waffle dish processing according to claim 1, wherein: the bottom of the frame is bonded with a rubber base plate, and the area of the rubber base plate is larger than that of the bottom of the frame.