CN215529758U - Cooling device and data center with same - Google Patents

Abstract

The present disclosure relates to a cooling device and a data center having the same, and relates to the field of cooling technology, and may be used for (including but not limited to) data centers for applications such as cloud computing, cloud storage, big data computing, deep learning, and image processing. The cooling device includes: the server heat dissipation branch is used for dissipating heat of the server; the first cold source branch is provided with a cold source module, the first cold source branch and the server heat dissipation branch form a circulation loop in a first cooling mode, and the cold source module is used for converting gaseous refrigerants output by the server heat dissipation branch into liquid refrigerants and conveying the liquid refrigerants back to the server heat dissipation branch; and the heat exchange branch is provided with a heat exchanger, and in a second cooling mode, the heat exchange branch and the server heat dissipation branch form a circulation loop, and the heat exchanger works. According to the cooling device disclosed by the invention, the number of the UPS can be reduced, so that the occupied space of the UPS is reduced, and the cost is reduced.

Description

Cooling device and data center with same

Technical Field

The present disclosure relates to the field of cooling technologies, and in particular, to the field of cooling technologies for data centers that use cloud computing, cloud storage, big data computing, deep learning, image processing, and the like.

Background

In the related art, IT is necessary to provide a corresponding cooling system to cool the IT equipment of the data center because the IT equipment such as the server of the data center generates a large amount of heat during operation. However, in order to meet the requirement of IT equipment for Uninterruptible cooling, as shown in fig. 1, all Power equipment of the refrigeration system needs to be configured with an Uninterruptible Power Supply (UPS), which results in an excessively large space occupied by the UPS in the Power distribution room and a high cost.

SUMMERY OF THE UTILITY MODEL

According to an aspect of the present disclosure, there is provided a cooling apparatus including: the server heat dissipation branch is used for dissipating heat of the server; the first cold source branch is provided with a cold source module, the first cold source branch and the server heat dissipation branch form a circulation loop in a first cooling mode, and the cold source module is used for converting gaseous refrigerants output by the server heat dissipation branch into liquid refrigerants and conveying the liquid refrigerants back to the server heat dissipation branch; and the heat exchange branch is provided with a heat exchanger, and in a second cooling mode, the heat exchange branch and the server heat dissipation branch form a circulation loop, and the heat exchanger works.

In one embodiment, the first cold source branch is further provided with a first regulating valve, and the heat exchange branch is further provided with a second regulating valve; in the first cooling mode, the first regulating valve is opened, and the second regulating valve is closed; in the second cooling mode, the second regulating valve is opened and the first regulating valve is closed.

In one embodiment, the cooling device further comprises a second cold source branch, the heat exchanger comprises a first heat exchange tube and a second heat exchange tube, in the second cooling mode, the first heat exchange tube and the server heat dissipation branch form a circulation loop, and the second heat exchange tube and the second cold source branch form a circulation loop.

In one embodiment, the second cold source branch comprises a heat pump unit, and the heat pump unit is used for connecting the heat recovery device.

In one embodiment, the cold source module includes an air pump and a condenser, the air pump is disposed between an output end of the server heat dissipation branch and an input end of the condenser, and an output end of the condenser is connected to an input end of the server heat dissipation branch.

In one embodiment, the air pump is an oil-free air pump.

In one embodiment, the server heat dissipation branch comprises a plurality of chip cold plates, the chip cold plates are respectively attached to a plurality of chips of the server, and liquid refrigerant passes through the chip cold plates and exchanges heat with the chips to be converted into gaseous refrigerant.

In one embodiment, the server heat dissipation branch further comprises: the liquid cooling liquid collecting pipe is used for containing liquid refrigerants, and the output end of the liquid cooling liquid collecting pipe is connected with the input ends of the plurality of chip cold plates respectively; and the liquid cooling gas collecting pipe is used for containing gaseous refrigerants, and the input end of the liquid cooling gas collecting pipe is connected with the output ends of the plurality of chip cold plates respectively.

In one embodiment, the input end of the liquid cooling liquid collecting pipe is provided with a throttling device.

According to another aspect of the present disclosure, there is provided a data center comprising a plurality of servers and a plurality of any of the cooling apparatuses according to the present disclosure.

According to the technical scheme of the embodiment of the disclosure, uninterrupted heat dissipation of the server can be realized, meanwhile, the cold source module can be free from or reduce configuration of the UPS, the occupied space of the UPS in the Power distribution room is effectively reduced, the cooling device can be suitable for the Power distribution room with a relatively small building area, the cost can be reduced, and the Power Usage Efficiency (PUE) value of the whole data center is improved.

It should be understood that what is described in this summary section is not intended to limit key or critical features of the embodiments of the disclosure, nor is it intended to limit the scope of the disclosure. Other features of the present disclosure will become apparent from the following description.

Drawings

The above and other features, advantages and aspects of various embodiments of the present disclosure will become more apparent by referring to the following detailed description when taken in conjunction with the accompanying drawings. In the drawings, like or similar reference characters designate like or similar elements, and wherein:

FIG. 1 is a schematic diagram of the power distribution of a heat sink module in the prior art;

FIG. 2 is a schematic diagram of a cooling device according to an embodiment of the present disclosure;

FIG. 3 is a schematic diagram of a cooling system according to an embodiment of the present disclosure;

fig. 4 is a schematic structural diagram of a liquid-cooled cabinet according to an embodiment of the disclosure;

fig. 5 is a schematic structural diagram of a data center according to an embodiment of the present disclosure.

Reference numerals

100: a cooling device;

110: a server heat dissipation branch; 111: a chip cold plate; 112: a liquid cooling liquid collecting pipe;

113: a throttling device; 114: liquid cooling gas collecting pipes; 115: a liquid pump;

116: an expansion valve; 117: a quick coupling;

11 a: liquid cooling the whole cabinet; 11 b: a wind wall; 11 c: an inter-train air conditioner;

120: a first cold source branch; 121: a cold source module; 1211: an air pump;

1212: a condenser; 122: a first regulating valve;

130: a heat exchange branch; 131: a heat exchanger; 132: a second regulating valve;

140: a second cold source branch; 141: a heat pump unit; 142: a water cold storage tank; 143: a water pump;

200: a data center;

210: a server; 220: a cooling system.

Detailed Description

Exemplary embodiments of the present disclosure are described below with reference to the accompanying drawings, in which various details of the embodiments of the disclosure are included to assist understanding, and which are to be considered as merely exemplary. Accordingly, those of ordinary skill in the art will recognize that various changes and modifications of the embodiments described herein can be made without departing from the scope and spirit of the present disclosure. Also, descriptions of well-known functions and constructions are omitted in the following description for clarity and conciseness.

A cooling device 100 according to an embodiment of the first aspect of the present disclosure is described below with reference to fig. 2-4. The cooling device 100 according to the embodiment of the present disclosure may be used to cool IT equipment such as the server 210 of the data center 200. In the following description of the present disclosure, the cooling device 100 is used to cool the server 210 as an example. The data center 200 can be used in (including but not limited to) the technical fields of cloud computing, cloud storage, big data computing, deep learning, image processing, and the like.

As shown in fig. 2 and 3, the cooling device 100 according to the embodiment of the first aspect of the present disclosure includes a server heat dissipation branch 110, a first cold source branch 120, and a heat exchange branch 130.

Specifically, the server heat dissipation branch 110 is configured to dissipate heat from the server 210, the first cold source branch 120 is provided with a cold source module 121, in the first cooling mode, the first cold source branch 120 and the server heat dissipation branch 110 form a circulation loop, and the cold source module 121 is configured to convert a gaseous refrigerant output by the server heat dissipation branch 110 into a liquid refrigerant and deliver the liquid refrigerant back to the server heat dissipation branch 110. The heat exchange branch 130 is provided with a heat exchanger 131, and in the second cooling mode, the heat exchange branch 130 and the server heat dissipation branch 110 form a circulation loop, and the heat exchanger 131 works.

When the server 210 operates, the plurality of chips on the server 210 generate relatively large heat, and the liquid refrigerant input from the input end of the server heat dissipation branch 110 may exchange heat with the plurality of chips, so as to reduce the temperature of the surfaces of the plurality of chips, and avoid the influence on the normal operation of the server 210 due to the over-high temperature of the chips. The liquid refrigerant is converted into a gaseous refrigerant after exchanging heat with the plurality of chips, and then is output from the output end of the server heat dissipation branch 110.

Referring to fig. 2, in the case that the commercial power is normally supplied and the cold source module 121 is normally operated, the cooling device 100 may operate in the first cooling mode. At this time, the gaseous refrigerant output from the output end of the server heat dissipation branch 110 flows into the cold source module 121 through the input end of the cold source module 121, and is converted into the liquid refrigerant in the cold source module 121, and the liquid refrigerant is output from the output end of the cold source module 121, and then flows back to the server heat dissipation branch 110 from the input end of the server heat dissipation branch 110, so that the cooling cycle is completed, and the uninterrupted heat dissipation of a plurality of chips is realized.

In case of a power failure or a failure of the heat sink module 121, the cooling device 100 is converted from the first cooling mode to the second cooling mode. At this time, the gaseous refrigerant output from the output end of the server heat dissipation branch 110 flows into the heat exchanger 131 through the input end of the heat exchanger 131, and is converted into a liquid refrigerant after heat exchange in the heat exchanger 131, the liquid refrigerant is output from the output end of the heat exchanger 131, and then flows back to the server heat dissipation branch 110 from the input end of the server heat dissipation branch 110, so as to complete a cooling cycle, and heat dissipation of multiple chips can be realized under the condition that the cold source module 121 does not work.

According to the cooling device 100 of the embodiment of the present disclosure, by setting the heat exchanging branch 130, the heat exchanging branch 130 and the server heat dissipating branch 110 form a circulation loop in the second cooling mode, when the utility power fails or the cold source module 121 fails, the gaseous refrigerant can be converted into the liquid refrigerant through the heat exchanger 131, thereby realizing uninterrupted heat dissipation of the server 210, the cold source module 121 does not need or reduces configuration of a UPS, and further effectively reducing the occupied space of the UPS in a power distribution room, so that the cooling device 100 can be applied to a power distribution room with a relatively small building area, and can reduce the cost, and improve the PUE value of the whole data center 200.

In one embodiment, referring to fig. 3, the first cool source branch 120 is further provided with a first regulating valve 122, and the heat exchange branch 130 is further provided with a second regulating valve 132; in the first cooling mode, the first regulating valve 122 is opened, and the second regulating valve 132 is closed; in the second cooling mode, the second regulating valve 132 is opened and the first regulating valve 122 is closed. Therefore, the server heat dissipation branch 110 can be communicated with the first cold source branch 120 or the heat exchange branch 130 through the first regulating valve 122 and the second regulating valve 132, so that the server heat dissipation branch is automatically switched to the first cooling mode under the condition that the mains supply is normally supplied, and is automatically switched to the second cooling mode under the condition that the mains supply is powered off or the cold source module 121 fails, so that the cooling device 100 is more convenient to switch between the first cooling mode and the second cooling mode.

In one example, in conjunction with fig. 3, the first regulating valve 122 may be provided at an input of the cool source module 121, and the second regulating valve 132 may be provided at an input of the heat exchanger 131. For example, in the first cooling mode, the gaseous refrigerant may flow into the cold source module 121 after flowing through the first adjusting valve 122, and since the second adjusting valve 132 is closed at this time, the gaseous refrigerant may not flow into the heat exchanger 131, and compared with the case that the second adjusting valve 132 is disposed at the output end of the heat exchanger 131, the heat exchanger 131 may not need to operate, so that the service life of the heat exchanger 131 may be effectively prolonged. Alternatively, the first and second regulating valves 122, 132 may be electrically operated valves. But is not limited thereto.

Of course, the first and second regulator valves 122, 132 may also be opened simultaneously. At this time, one part of the gaseous refrigerant output from the output end of the server heat dissipation branch 110 may flow into the cold source module 121 through the first adjusting valve 122, the other part of the gaseous refrigerant may flow into the heat exchanger 131 through the second adjusting valve 132, at this time, the cold source module 121 and the heat exchanger 131 work simultaneously, the first cold source branch 120 and the server heat dissipation branch 110 form a circulation loop, and the heat exchange branch 130 and the server heat dissipation branch 110 form a circulation loop, so that the pressure of the first cold source branch 120 and the heat exchange branch 130 is reduced, and at the same time, the heat dissipation effect of the server 210 can be effectively improved.

In one embodiment, as shown in fig. 3, the cooling device 100 further includes a second cold source branch 140, and the heat exchanger 131 includes a first heat exchanging pipe and a second heat exchanging pipe, in the second cooling mode, the first heat exchanging pipe and the server heat dissipation branch 110 form a circulation loop, and the second heat exchanging pipe and the second cold source branch 140 form a circulation loop.

For example, the second cold source branch 140 may include a backup cold source, such as a chilled water storage tank 142 with a cooling capacity at least meeting the cooling capacity requirement of a commercial power outage of 15 min. The gaseous refrigerant is output from the server heat dissipation branch 110, then enters the first heat exchange tube from the input end of the first heat exchange tube, exchanges heat with the flowing working medium (such as water) in the second heat exchange tube, and then is converted into the liquid refrigerant, and the temperature of the flowing working medium in the second heat exchange tube is increased. Because the second heat exchange tube is communicated with the second cold source branch 140, the standby cold source discharges cold, the heat of the heated flowing working medium can be absorbed, the cold energy is provided for the whole cooling device 100, and the heat dissipation effect of the server 210 is ensured.

Therefore, through the arrangement, in the second cooling mode, the flowing working medium in the second heat exchange pipe can exchange heat with the high-temperature gaseous refrigerant in the first heat exchange pipe, so that the gaseous refrigerant can be converted into the liquid refrigerant, the second cold source branch 140 can cool the second heat exchange pipe after warming up, the temperature of the flowing working medium in the second heat exchange pipe can be ensured to be in a lower range, and the uninterrupted heat dissipation of the server 210 can be realized.

Further, referring to fig. 3, the second cold source branch 140 may include a heat pump unit 141, and the heat pump unit 141 is used for connecting the heat recovery device. Therefore, in the second cooling mode, on one hand, the heat pump unit 141 can absorb the heat of a standby cold source, such as the water cold storage tank 142, and provide the cold source for the cooling device 100, so that the gaseous refrigerant can exchange heat with the low-temperature flowing working medium in the second heat exchange pipe to be converted into the liquid refrigerant when flowing through the first heat exchange pipe, and thus the liquid refrigerant flows into the server heat dissipation branch 110 to realize the heat dissipation of the server 210; on the other hand, the heat recovery device can be flexibly started according to actual requirements, and when the heat recovery device is started, the heat pump unit 141 can provide hot water with the temperature of 50 ℃ -90 ℃ (including endpoint values) through collecting heat energy, so that heat energy is provided for the data center 200 (such as a diesel room, a fresh air unit and the like) and external heat users, the heat energy of the data center 200 is effectively recovered, and comprehensive utilization of energy is realized.

In one example, as shown in fig. 3, a heat pump unit 141 is disposed between an output end of the second heat exchanging pipe and an input end of the water heat accumulating tank 142, and an input end of the heat pump unit 141 is provided with a water pump 143 for pumping water to circulate between the second cold source branch 140 and the second heat exchanging pipe.

In one embodiment, referring to fig. 3, the cool source module 121 includes an air pump 1211 and a condenser 1212, the air pump 1211 is disposed between an output end of the server heat dissipation branch 110 and an input end of the condenser 1212, and an output end of the condenser 1212 is connected to an input end of the server heat dissipation branch 110. Wherein, the cool source module 121 may further include a blower. In this way, the air pump 1211 may continuously pump the gaseous refrigerant output from the server heat dissipation branch 110, so as to compress the gaseous refrigerant to a condensing pressure, and then transmit the gaseous refrigerant from the input end of the condenser 1212 to the condenser 1212, and cool and condense the gaseous refrigerant into a liquid refrigerant under the pressure, and the condensed liquid refrigerant flows from the output end of the condenser 1212 to the input end of the server heat dissipation branch 110, so as to dissipate heat of the server 210. Alternatively, the condenser 1212 may be an evaporative condenser, an air-cooled condenser, or a spray air-cooled condenser, among others. But is not limited thereto.

In one example, the air pump 1211 is an oil-free air pump, such as a magnetic levitation compressor, an air levitation compressor, or the like. So set up, cooling device 100 is simpler, can avoid oil film thermal resistance and multistage heat transfer loss to can effectively improve energy efficiency, reduce cost, for example energy efficiency can promote more than 70%, be 10 ten thousand according to server 210 quantity and calculate, can reduce the operation cost about 1 hundred million yuan/year.

Alternatively, referring to fig. 3, the server heat dissipation branch 110 may include a liquid pump 115 and an expansion valve 116, and both the liquid pump 115 and the expansion valve 116 are located at the input end of the server heat dissipation branch 110. As such, in the first cooling mode, the liquid pump 115 may be used to pump liquid refrigerant to circulate between the server heat sink branch 110 and the first cold sink branch 120; in the second cooling mode, liquid cooling may be used to pump liquid refrigerant to circulate between the server heat rejection branch 110 and the heat exchanger 131. Moreover, the expansion valve 116 can perform effective throttling and pressure reducing functions, so that the high-temperature and high-pressure liquid refrigerant output from the heat exchanger 131 or the cold source module 121 becomes low-temperature and low-pressure foggy hydraulic refrigerant after being throttled by the throttle orifice of the expansion valve 116, thereby creating conditions for evaporation of the hydraulic refrigerant, controlling the flow rate of the liquid refrigerant, ensuring that the refrigerant output from the output end of the server heat dissipation branch 110 is gaseous refrigerant, and realizing better refrigeration effect.

In one embodiment, as shown in fig. 4, the server heat dissipation branch 110 includes a plurality of chip cold plates 111, the plurality of chip cold plates 111 are respectively attached to a plurality of chips of the server 210, and the liquid refrigerant passes through the chip cold plates 111 and exchanges heat with the chips to be converted into the gaseous refrigerant. The chip may be a Central Processing Unit (CPU) or a Graphics Processing Unit (GPU). The server 210 may further include a hard disk, a board card, and the like, and a part of heat dissipation of the entire server 210 may be realized by heat exchange with the liquid refrigerant flowing through the chip cold plate 111, and another part of heat dissipation may be realized by heat exchange with air.

Therefore, by arranging the plurality of chip cold plates 111, the liquid refrigerant can exchange heat with the chips when passing through the chip cold plates 111, and the heat generated during the working of the chips is taken away, so that the temperature on the surfaces of the chips can be kept within a certain range, the influence on the normal working of the chips due to overhigh temperature is avoided, and the service life of the server 210 is effectively prolonged. Moreover, because the chip cold plate 111 is directly attached to the plurality of chips, the distance between the liquid refrigerant and the chips is small, and the heat exchange effect between the liquid refrigerant and the chips can be greatly improved, so that the cooling device 100 can effectively dissipate heat of the server 210 of a high-power cabinet (for example, the power density of a single cabinet reaches 50kW), and the heat dissipation requirement of the server 210 in the next 5 years to 10 years is at least met.

For example, in conjunction with fig. 3 and 4, the server heat dissipation branch 110 may include an indoor unit module, and the indoor unit module may function as an evaporator to dissipate heat of the server 210. Wherein, the indoor unit module may include the whole cabinet 11a of liquid cooling, such as the whole cabinet of plate liquid cooling, and the whole cabinet 11a of liquid cooling includes a plurality of chip cold plates 111, and the input and the output of the whole cabinet 11a of liquid cooling may be through the quick-operation joint 117 with the pipeline of server heat dissipation branch 110 dock fast. The quick coupling 117 may be mechanically connected or welded to the liquid cooling cabinet 11a and the pipeline.

Of course, the present disclosure is not limited thereto, and the indoor unit module may further include an air cooling module, for example, the air wall 11b, the inter-row air conditioner 11c, the back panel air conditioner, and the like. In this case, the data center 200 may be an air-cooled data center, and the power density of the single cabinet may be 2kW to 20kW (inclusive). The cold air output by the air cooling module can take away heat generated by the server 210 in the cabinet during operation, and heat dissipation of the server 210 can also be realized.

In one embodiment, referring to fig. 4, the server heat dissipation branch 110 further includes a liquid cooling liquid collecting pipe 112, the liquid cooling liquid collecting pipe 112 is used for accommodating a liquid refrigerant, and an output end of the liquid cooling liquid collecting pipe 112 is connected to an input end of each of the plurality of chip cold plates 111. For example, the liquid cooling header 112 may include a first main pipe and a plurality of first branch pipes, an input end of each of the plurality of first branch pipes is connected to an output end of the first main pipe, and an output end of each of the plurality of first branch pipes is connected to an input end of the corresponding chip cold plate 111. Like this, liquid cooling collector tube 112 can play better collection and distribution effect for the input of liquid refrigerant, makes the liquid refrigerant can distribute to a plurality of chip cold drawing 111 respectively through liquid cooling collector tube 112 to can provide cold volume for a plurality of chips, the heat that makes a plurality of chips during operation production can conduct to liquid refrigerant, realizes the effective heat dissipation of a plurality of chips.

In one embodiment, referring to fig. 4, the server heat dissipation branch 110 may further include a liquid-cooled manifold 114 for accommodating gaseous refrigerant, and the input end of the liquid-cooled manifold 114 is connected to the output ends of the plurality of chip cold plates 111, respectively. For example, the liquid-cooled header 114 may include a second main pipe and a plurality of second branch pipes, wherein input ends of the plurality of second branch pipes are respectively connected to output ends of the plurality of chip cold plates 111, and output ends of the plurality of second branch pipes are connected to input ends of the second main pipe. So set up, after liquid refrigerant absorbs heat and evaporates to gaseous state refrigerant, liquid cooling collecting main 114 can play effectual collection and guide effect for gaseous state refrigerant's output, makes the gaseous state refrigerant of output from a plurality of chip cold plates 111 can collect to liquid cooling collecting main 114, then exports to first cold source branch road 120 or heat exchanger 131 through liquid cooling collecting main 114.

Alternatively, the liquid-cooled liquid collector 112 and the liquid-cooled gas collector 114 may be copper tubes, stainless steel tubes, aluminum alloy tubes, or the like. The liquid cooling liquid collecting tube 112 and the liquid cooling gas collecting tube 114 may be made of the same material or different materials. So set up, liquid cooling collector 112 and liquid cooling collector 114 can have higher structural strength, and corrosion resistance is better.

Of course, the materials of the liquid-cooled liquid collecting tube 112 and the liquid-cooled gas collecting tube 114 are not limited to the above. It is understood that the specific materials of the liquid cooling header 112 and the liquid cooling header 114 can be determined according to actual requirements, so as to better meet the actual application.

Further, as shown in fig. 4, an input end of the liquid cooling header pipe 112 is provided with a throttle device 113. For example, the throttle device 113 may be an electronic expansion valve, a thermal expansion valve, or the like. When the throttling device 113 is an electronic expansion valve, the output end of the liquid cooling cabinet 11a may be provided with a temperature sensor and a pressure sensor to collect a superheat signal, and the controller may adjust the opening degree of the electronic expansion valve according to the superheat signal; when the throttling device 113 is a thermostatic expansion valve, the output end of the liquid cooling cabinet 11a may be provided with a temperature sensing bulb to mechanically control the opening degree of the thermostatic expansion valve. Therefore, the throttling device 113 can effectively throttle and reduce pressure of the liquid refrigerant, and can control the flow of the liquid refrigerant.

The three modes of operation of the cooling device 100 are described in detail below in conjunction with fig. 3. The cooling device 100 can be divided into a primary side and a secondary side from the perspective of a flowing working medium, wherein the flowing working medium on the primary side can be water, water is supplemented through auxiliary systems such as a water supplementing system and an exhaust system, the flowing working medium on the secondary side can be a refrigerant, and the heat exchanger 131 can be a water-fluorine heat exchanger.

(1) First cooling mode

In the first cooling mode, the first regulating valve 122 is opened and the second regulating valve 132 is closed. The circulation flow path of the secondary side refrigerant is as follows: the evaporator (i.e., the liquid cooling cabinet 11a or the indoor unit coil) → the air pump 1211 → the first regulator valve 122 → the condenser 1212 → the liquid pump 115 → the expansion valve 116 → the evaporator, completing the refrigeration cycle.

The circulation flow path of the primary side water is as follows: heat exchanger 131 → water pump 143 → heat pump unit 141 → water heat storage tank 142 → heat exchanger 131. At this time, since the water circulation flow path has no thermal load other than loss and the chilled water storage tank 142 is in a standby cooling state, the primary side can be intermittently operated, and it is only necessary to ensure that the temperature of the outlet water of the chilled water storage tank 142 is 3 to 8 ℃ (inclusive), for example, 6 ℃. Like this, when guaranteeing that the cold volume of water cold accumulation jar 142 can satisfy the cold volume demand when the commercial power has a power failure, the distribution is more reasonable, can further reduce cost.

(2) Second cooling mode

In the second cooling mode, the first regulating valve 122 is closed and the second regulating valve 132 is opened. The secondary side refrigerant circulation flow path is as follows: evaporator → second regulator valve 132 → heat exchanger 131 → liquid pump 115 → expansion valve 116 → evaporator, completing the refrigeration cycle. The heat exchanger 131 may now function as a condenser so that the gaseous refrigerant may be converted to a liquid refrigerant.

The circulation flow path of the primary side water is as follows: the heat exchanger 131 → the water pump 143 → the heat pump unit 141 → the water storage tank 142 → the heat exchanger 131, at this time, the water circulation flow path provides the final heat load, so as to ensure that the water storage tank 142 can be cooled down to realize the effective heat dissipation of the server 210 when the utility power fails or the common cold source fails, and the configuration of the UPS can be reduced, so that the cooling device 100 can be applied to the areas with large cost and pressure, small building area and high PUE index requirements, such as beijing, shanghai and the like in china.

(3) Heat recovery mode

In the heat recovery mode, the first regulating valve 122 is closed and the second regulating valve 132 is opened. The secondary-side refrigerant circulation flow path and the primary-side water circulation flow path are the same as those in the second cooling mode.

At this time, the heat recovery device is turned on, the heat pump unit 141 provides a heat source to the outside while providing a cold source to the inside, and provides hot water to the heat user, so that the heat energy of the data center 200 can be effectively utilized, and the comprehensive utilization of the energy is realized.

A data center 200 according to an embodiment of the second aspect of the present disclosure is described below with reference to fig. 3 and 5.

As shown in fig. 5, a data center 200 according to an embodiment of the second aspect of the present disclosure includes a plurality of servers 210 and a plurality of cooling devices 100 according to the above-mentioned embodiments of the first aspect of the present disclosure. The plurality of cooling devices 100 may dissipate heat for the plurality of servers 210, respectively, for example, one cooling device 100 may dissipate heat for the plurality of servers 210; alternatively, multiple cooling devices 100 dissipate heat for one server 210; of course, one cooling device 100 may also dissipate heat for one server 210, and in this case, a plurality of cooling devices 100 correspond to a plurality of servers 210 one to one. Among them, the plurality of cooling apparatuses 100 constitute a cooling system 220.

According to the data center 200 of the embodiment of the present disclosure, by using the cooling device 100, the gaseous refrigerant can be converted into the liquid refrigerant through the heat exchanger 131 in the event of a mains power failure, and the number of UPS units in the entire data center 200 can be reduced, so that the investment cost can be reduced, and the building area of a power distribution room can be reduced.

In the description of the present specification, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present application and to simplify the description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be considered limiting of the present application.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.

In this application, unless expressly stated or limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can include, for example, fixed connections, removable connections, or integral parts; the connection can be mechanical connection, electrical connection or communication; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact of the first and second features, or may comprise contact of the first and second features not directly but through another feature in between. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly above and obliquely above the second feature, or simply meaning that the first feature is at a lesser level than the second feature.

The above disclosure provides many different embodiments or examples for implementing different structures of the application. The components and arrangements of specific examples are described above to simplify the present disclosure. Of course, they are merely examples and are not intended to limit the present application. Moreover, the present application may repeat reference numerals and/or letters in the various examples, such repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed.

The above detailed description should not be construed as limiting the scope of the disclosure. It should be understood by those skilled in the art that various modifications, combinations, sub-combinations and substitutions may be made in accordance with design requirements and other factors. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present disclosure should be included in the scope of protection of the present disclosure.

Claims (10)

1. A cooling apparatus, comprising:

the server heat dissipation branch is used for dissipating heat of the server;

the first cold source branch is provided with a cold source module, the first cold source branch and the server heat dissipation branch form a circulation loop in a first cooling mode, and the cold source module is used for converting a gaseous refrigerant output by the server heat dissipation branch into a liquid refrigerant and conveying the liquid refrigerant back to the server heat dissipation branch;

and the heat exchange branch is provided with a heat exchanger, and in a second cooling mode, the heat exchange branch and the server heat dissipation branch form a circulation loop, and the heat exchanger works.

2. The cooling device as claimed in claim 1, wherein the first cold source branch is further provided with a first regulating valve, and the heat exchange branch is further provided with a second regulating valve; in the first cooling mode, the first regulating valve is opened, and the second regulating valve is closed; in the second cooling mode, the second regulating valve is opened, and the first regulating valve is closed.

3. The cooling device as claimed in claim 1, further comprising a second cold source branch, wherein the heat exchanger comprises a first heat exchange tube and a second heat exchange tube, in the second cooling mode, the first heat exchange tube and the server heat dissipation branch form a circulation loop, and the second heat exchange tube and the second cold source branch form a circulation loop.

4. The cooling device as claimed in claim 3, wherein the second heat sink branch comprises a heat pump unit, and the heat pump unit is used for connecting with a heat recovery device.

5. The cooling device as claimed in claim 1, wherein the cold source module includes an air pump and a condenser, the air pump is disposed between the output end of the server heat dissipation branch and the input end of the condenser, and the output end of the condenser is connected to the input end of the server heat dissipation branch.

6. The cooling device of claim 5, wherein the air pump is an oil-free air pump.

7. The cooling device according to any one of claims 1 to 6, wherein the server heat dissipation branch comprises a plurality of chip cold plates respectively attached to a plurality of chips of the server, and the liquid refrigerant passes through the chip cold plates and exchanges heat with the chips to be converted into the gaseous refrigerant.

8. The cooling apparatus of claim 7, wherein the server heat sink branch further comprises:

the liquid cooling liquid collecting pipe is used for containing the liquid refrigerant, and the output end of the liquid cooling liquid collecting pipe is respectively connected with the input ends of the plurality of chip cold plates;

and the liquid cooling gas collecting pipe is used for containing the gaseous refrigerant, and the input end of the liquid cooling gas collecting pipe is respectively connected with the output ends of the plurality of chip cold plates.

9. The cooling device as claimed in claim 8, wherein the input end of the liquid cooling header is provided with a throttling means.

10. A data center, comprising: a plurality of servers and a plurality of cooling apparatuses according to any one of claims 1-9.

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