CN215526584U - Heat radiation structure of software engineering component - Google Patents
Heat radiation structure of software engineering component Download PDFInfo
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- CN215526584U CN215526584U CN202121380294.7U CN202121380294U CN215526584U CN 215526584 U CN215526584 U CN 215526584U CN 202121380294 U CN202121380294 U CN 202121380294U CN 215526584 U CN215526584 U CN 215526584U
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- receiving box
- software engineering
- water receiving
- cooling assembly
- heat dissipation
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Abstract
The utility model provides a heat dissipation structure of a software engineering element. The heat dissipation structure of the software engineering element comprises a mounting assembly, a liquid cooling assembly, an air cooling assembly, a fixing structure and a positioning structure. The cooling water tank in the liquid cooling assembly and the fan in the air cooling assembly are both far away from the software engineering element, so that the heat source is prevented from influencing the heat dissipation effect of the software engineering element, the air cooling assembly enables the interior of the mounting cylinder to generate suction, the software engineering element is not directly blown with fan heat, but airflow is guided to flow, hot air generated by the software engineering element is firstly dissipated through the liquid cooling assembly and then is discharged from the other end of the mounting cylinder, so that the hot air is dissipated, when the hot air meets the liquid cooling assembly, cold and heat are mixed, water vapor is easily generated, water drops are formed on the liquid cooling assembly, the water drops can fall into the water receiving box and then are discharged, the use safety of the software engineering element is protected, when the liquid cooling assembly leaks, the water receiving box can also collect and guide leaked liquid, and the safety is higher.
Description
Technical Field
The utility model relates to the field of heat dissipation structures, in particular to a heat dissipation structure of a software engineering element.
Background
The software engineering element can generate heat in the using process, particularly, the generated heat can be more in long-time and large-amount calculation, generally, in order to protect the software engineering element, a heat dissipation device is installed in the device to dissipate heat of the software engineering element, generally, a liquid cooling or air cooling mode is adopted to dissipate heat of the software engineering element, and the other mode is a combination mode of two heat dissipation modes to dissipate heat of the software engineering element.
When the software engineering element is radiated by using a liquid cooling mode or a mode of combining the liquid cooling and the air cooling, when a large amount of heat is generated in the software engineering element, hot air meets a cooling liquid flowing pipeline of the liquid cooling, cold and hot are mixed, water drops are easily generated, and some liquid cooling devices possibly have leakage after being used for a long time, so that certain potential safety hazards are caused to the software engineering element.
Therefore, it is necessary to provide a new heat dissipation structure for software engineering components to solve the above technical problems.
SUMMERY OF THE UTILITY MODEL
In order to solve the above technical problems, the present invention provides a heat dissipation structure for a software engineering component.
The heat radiation structure of the software engineering element provided by the utility model comprises: the mounting assembly comprises a water receiving box, a mounting cylinder, a water bar and air holes, the front end of the water receiving box is arranged in a U shape, the mounting cylinder is fixedly mounted at the rear end of the water receiving box and communicated with the rear end of the water receiving box, the water bar is fixedly mounted on the inner wall of the water receiving box and arranged close to the front end of the water receiving box, and the two groups of air holes are symmetrically formed in the side walls of the two sides of the water receiving box; the liquid cooling assembly is arranged in the water receiving box; the air cooling assembly is arranged in the mounting cylinder; the fixing structure is arranged on the mounting cylinder; and the positioning structure is arranged on the air cooling assembly.
Preferably, the liquid cooling subassembly includes cooling water tank, radiating fin, hot exchange pipe and the lantern ring, and is a plurality of radiating fin is vertical arranges the setting and all is located the water receiving box, every all install a set of lantern ring on the radiating fin, cooling water tank installs in the top of water receiving box, and hot exchange pipe installs on cooling water tank and runs through the lantern ring.
Preferably, the air cooling assembly comprises a fan, an annular mounting groove and an annular mounting block, the fan is inserted into the mounting cylinder and is far away from the water receiving box, the annular mounting groove is provided with the rear end of the mounting cylinder, and the annular mounting block is inserted into the annular mounting groove and is fixedly sleeved on the fan.
Preferably, the fixing structure comprises connecting ports and connecting screws, the two connecting ports are symmetrically arranged on the side wall of the mounting cylinder, and the two connecting screws penetrate through the two connecting ports and are in threaded connection with the annular mounting block.
Preferably, the positioning structure comprises a positioning groove and a positioning column, the positioning groove is arranged in the annular mounting groove, and the positioning column is inserted in the positioning groove and fixedly connected with the annular mounting block.
Preferably, the height of the inner bottom of the mounting cylinder is lower than that of the inner bottom of the water receiving box.
Compared with the related art, the heat dissipation structure of the software engineering element provided by the utility model has the following beneficial effects:
1. the cooling water tank in the liquid cooling component is positioned above the software engineering component and is far away from the software engineering component, the fan in the air cooling component is also far away from the software engineering component, the component capable of generating heat is far away from the software engineering component as far as possible, so that the heat source is prevented from influencing the heat dissipation effect of the software engineering component, the opening part of the water receiving box is opposite to the software engineering component, the air cooling component enables the interior of the mounting cylinder to generate suction, the software engineering component is not directly blown with fan heat, but airflow is guided to flow, hot air generated by the software engineering component is firstly dissipated through the liquid cooling component and then is discharged from the other end of the mounting cylinder, so that the hot air and the cold air are dissipated, when the hot air meets the liquid cooling component, the cold air and the hot air are mixed, water is easily generated, water drops are formed on the liquid cooling component, the water drops can fall into the water receiving box and then are discharged, and the use safety of the software engineering component is protected, when the liquid cooling assembly leaks, the water receiving box can collect and guide the leaked liquid, so that the safety is higher;
2. part of the liquid cooling assembly is positioned in the water receiving box and is not connected, and the air cooling assembly and the mounting cylinder can be detached, so that the device is convenient to overhaul and replace;
3. according to the utility model, by arranging the positioning structure, when the positioning column is inserted into the positioning groove, the connecting port can be aligned with the connecting groove of the preset connecting screw on the side wall of the annular mounting block, so that the fan is convenient to mount.
Drawings
Fig. 1 is a schematic structural diagram of a heat dissipation structure of a software engineering component according to a preferred embodiment of the present invention;
FIG. 2 is a schematic structural view of the mounting assembly shown in FIG. 1;
FIG. 3 is a schematic diagram of a portion of the liquid cooling assembly of FIG. 1;
FIG. 4 is a schematic structural view of the heat exchange tube shown in FIG. 1;
FIG. 5 is a schematic structural view of the heat dissipating fin shown in FIG. 1;
fig. 6 is a schematic structural view of the air-cooling assembly shown in fig. 1.
Reference numbers in the figures: 1. mounting the component; 11. a water receiving box; 12. mounting the cylinder; 13. a water bar; 14. air holes are formed; 2. a liquid cooling assembly; 21. a cooling water tank; 22. a heat dissipating fin; 23. a heat exchange tube; 24. a collar; 3. an air-cooled assembly; 31. a fan; 32. an annular mounting groove; 33. an annular mounting block; 4. a fixed structure; 41. a connecting port; 42. a connecting screw; 5. a positioning structure; 51. positioning a groove; 52. and a positioning column.
Detailed Description
The utility model is further described with reference to the following figures and embodiments.
Please refer to fig. 1, fig. 2, fig. 3, fig. 4, fig. 5 and fig. 6 in combination, wherein fig. 1 is a schematic structural diagram of a heat dissipation structure of a software engineering component according to a preferred embodiment of the present invention; FIG. 2 is a schematic structural view of the mounting assembly shown in FIG. 1; FIG. 3 is a schematic diagram of a portion of the liquid cooling assembly of FIG. 1; FIG. 4 is a schematic structural view of the heat exchange tube shown in FIG. 1; FIG. 5 is a schematic structural view of the heat dissipating fin shown in FIG. 1; fig. 6 is a schematic structural view of the air-cooling assembly shown in fig. 1. The method comprises the following steps: the device comprises a mounting assembly 1, a liquid cooling assembly 2, an air cooling assembly 3, a fixing structure 4 and a positioning structure 5.
In the specific implementation process, as shown in fig. 1 and 2, the mounting assembly 1 includes a water receiving box 11, a mounting cylinder 12, a water bar 13 and air holes 14, the front end of the water receiving box 11 is U-shaped, the mounting cylinder 12 is fixedly mounted at the rear end of the water receiving box 11 and communicated with the water receiving box, the water bar 13 is fixedly mounted on the inner wall of the water receiving box 11 and is arranged near the front end thereof, two sets of air holes 14 are symmetrically arranged on the side walls of the two sides of the water receiving box 11, the liquid cooling assembly 2 is mounted in the water receiving box 11, and the air cooling assembly 3 is mounted in the mounting cylinder 12;
it should be noted that: in the use process of the device, the cooling water tank 21 in the liquid cooling component 2 is positioned above the software engineering component and is far away from the software engineering component, the fan 31 in the air cooling component 3 is also far away from the software engineering component, the component capable of generating heat is far away from the software engineering component as far as possible, so that the heat source is prevented from influencing the heat dissipation effect of the software engineering component, the opening part of the water receiving box 11 is opposite to the software engineering component, the air cooling component 3 enables the interior of the mounting cylinder 12 to generate suction force, the software engineering component is not directly blown with fan heat, but airflow is guided to flow, hot air generated by the software engineering component is firstly radiated by the liquid cooling component 2 and then discharged from the other end of the mounting cylinder 12, so that the hot air is radiated, when the hot air meets the liquid cooling component 2, the cold and the hot air are mixed, water is easy to generate and form water drops on the liquid cooling component 2, the water drops can fall into the water receiving box 11 and then be discharged, the use safety of software engineering elements is protected, when the liquid cooling assembly 2 leaks, the water receiving box 11 can collect and guide leaked liquid, and the safety is higher;
wherein, the air holes 14 facilitate the hot air to enter the mounting cylinder 12 from the side surface and be discharged, and the water bar 13 is used for preventing the water or liquid entering the water receiving box 11 from falling onto the software engineering element.
Referring to fig. 1, 3, 4 and 5, the liquid cooling assembly 2 includes a cooling water tank 21, a plurality of heat dissipating fins 22, a plurality of heat exchanging pipes 23 and collars 24, wherein the heat dissipating fins 22 are vertically arranged and are all located in the water receiving box 11, each heat dissipating fin 22 is provided with a set of collars 24, the cooling water tank 21 is installed above the water receiving box 11, and the heat exchanging pipes 23 are installed on the cooling water tank 21 and penetrate through the collars 24;
it should be noted that: the heat exchange tube 23 is used for guiding the cooling liquid, the cooling liquid is guided out from the cooling water tank 21, the temperature is lower, hot air is cooled through heat exchange when passing through the heat exchange tube 23, the contact area of the hot air is enlarged by the heat exchange tube 22, the heat exchange capacity of the heat exchange tube 23 is increased, and the lantern ring 24 is used for limiting among the plurality of heat exchange tubes 22.
Referring to fig. 1 and 6, the air cooling assembly 3 includes a fan 31, an annular mounting groove 32 and an annular mounting block 33, the fan 31 is inserted into the mounting cylinder 12 and is disposed away from the water receiving box 11, the annular mounting groove 32 is opened at the rear end of the mounting cylinder 12, and the annular mounting block 33 is inserted into the annular mounting groove 32 and is fixedly sleeved on the fan 31;
it should be noted that: when the fan 31 works, suction force is generated, so that external hot air enters the mounting cylinder 12 through the water receiving box 11 and is discharged, and the annular mounting block 33 and the annular mounting groove 32 are used for mounting the fan 31, so that the fan is convenient to mount and dismount.
Referring to fig. 2 and 6, the fixing structure 4 is mounted on the mounting cylinder 12, the fixing structure 4 includes connecting ports 41 and connecting screws 42, the two connecting ports 41 are symmetrically arranged on the side wall of the mounting cylinder 12, and the two connecting screws 42 penetrate through the two connecting ports 41 and are in threaded connection with the annular mounting block 33;
it should be noted that: when the fan 31 is fixed, the ring-shaped mounting block 33 is inserted into the ring-shaped mounting groove 32, the positioning structure 5 positions the connecting port 41, and the connecting screw 42 is used to fix the ring-shaped mounting block 33 in the ring-shaped mounting groove 32, thereby completing the installation of the fan 31.
Referring to fig. 6, the positioning structure 5 is installed on the air cooling assembly 3, the positioning structure 5 includes a positioning groove 51 and a positioning column 52, the positioning groove 51 is opened in the annular installation groove 32, and the positioning column 52 is inserted into the positioning groove 51 and is fixedly connected with the annular installation block 33;
it should be noted that: when the positioning post 52 is inserted into the positioning slot 51, the connecting port 41 is aligned with the connecting slot of the connecting screw 42 preset on the sidewall of the annular mounting block 33, so as to facilitate the installation of the fan 31.
Wherein, the inner bottom height of the installation cylinder 12 is lower than that of the water receiving box 11;
it should be noted that: the mounting cylinder 12 is slightly lower than the water receiving box 11, and can guide water drops to be discharged outwards, so that water can not be accumulated in the water receiving box 11.
The circuits and controls involved in the present invention are prior art and will not be described in detail herein.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes, which are made by using the contents of the present specification and the accompanying drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (6)
1. A heat dissipation structure of a software engineering component, comprising:
the mounting assembly (1) comprises a water receiving box (11), a mounting cylinder (12), a water bar (13) and air holes (14), the front end of the water receiving box (11) is arranged in a U shape, the mounting cylinder (12) is fixedly mounted at the rear end of the water receiving box (11) and communicated with the rear end of the water receiving box, the water bar (13) is fixedly mounted on the inner wall of the water receiving box (11) and is arranged close to the front end of the water receiving box, and the two groups of air holes (14) are symmetrically formed in the side walls of the two sides of the water receiving box (11);
the liquid cooling assembly (2), the said liquid cooling assembly (2) is installed in water receiving box (11);
the air cooling assembly (3), the air cooling assembly (3) is installed in the installation cylinder (12);
the fixing structure (4), the said fixing structure (4) is mounted on mounting cylinder (12);
the positioning structure (5), positioning structure (5) is installed on air-cooled subassembly (3).
2. The heat dissipation structure of the software engineering element according to claim 1, wherein the liquid cooling assembly (2) comprises a cooling water tank (21), a plurality of cooling fins (22), a plurality of heat exchange tubes (23) and a collar (24), the plurality of cooling fins (22) are vertically arranged and are all located in the water receiving box (11), a set of collars (24) are installed on each cooling fin (22), the cooling water tank (21) is installed above the water receiving box (11), and the heat exchange tubes (23) are installed on the cooling water tank (21) and penetrate through the collars (24).
3. The heat dissipation structure of the software engineering element as claimed in claim 1, wherein the air cooling assembly (3) includes a fan (31), an annular mounting groove (32) and an annular mounting block (33), the fan (31) is inserted into the mounting cylinder (12) and disposed away from the water receiving box (11), the annular mounting groove (32) is opened with a rear end of the mounting cylinder (12), and the annular mounting block (33) is inserted into the annular mounting groove (32) and fixedly sleeved on the fan (31).
4. The heat dissipation structure of software engineering elements according to claim 3, characterized in that the fixing structure (4) comprises connecting ports (41) and connecting screws (42), two of the connecting ports (41) are symmetrically arranged on the side wall of the mounting cylinder (12), and two of the connecting screws (42) penetrate through the two connecting ports (41) and are in threaded connection with the annular mounting block (33).
5. The heat dissipation structure of software engineering components according to claim 3, characterized in that the positioning structure (5) comprises a positioning groove (51) and a positioning column (52), the positioning groove (51) is opened in the annular mounting groove (32), and the positioning column (52) is inserted in the positioning groove (51) and is fixedly connected with the annular mounting block (33).
6. The heat dissipation structure of a software engineering element according to claim 1, wherein the inner bottom height of the installation cylinder (12) is lower than the inner bottom height of the water receiving box (11).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121380294.7U CN215526584U (en) | 2021-06-22 | 2021-06-22 | Heat radiation structure of software engineering component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121380294.7U CN215526584U (en) | 2021-06-22 | 2021-06-22 | Heat radiation structure of software engineering component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215526584U true CN215526584U (en) | 2022-01-14 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121380294.7U Active CN215526584U (en) | 2021-06-22 | 2021-06-22 | Heat radiation structure of software engineering component |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215526584U (en) |
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2021
- 2021-06-22 CN CN202121380294.7U patent/CN215526584U/en active Active
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