CN215514686U - Front opening type wafer transfer box suitable for Taiko wafer - Google Patents

Abstract

The utility model discloses a front-opening wafer transfer box suitable for Taiko wafers, which comprises a box body and a front door, wherein a spareribs strip is installed on the front door, a wafer support frame is installed in an inner cavity of the box body, the wafer support frame is provided with a plurality of groups of support legs, each group of support legs is composed of a left support leg and a right support leg, the distance between a slot formed between every two adjacent groups of support legs in the vertical direction is 20mm, the distance between a support surface formed by the group of support legs at the bottom of the wafer support frame and the bottom of the inner cavity of the box body in the vertical direction is larger than or equal to 14mm, a limiting block is formed at one end, far away from an opening, of each support leg, a wafer positioned in the slot abuts against a limiting block, and the distance between the wafer and the spareribs strip is 1mm-2mm through the limiting block. The utility model can ensure that the mechanical arm can not rub against the wafer and the inner cavity of the transmission box when grabbing the Taiko wafer with the warping degree increased, and meanwhile, the rib bars can not apply stress to the wafer inside, thereby avoiding the wafer from arching and deforming or breaking.

Description

Front opening type wafer transfer box suitable for Taiko wafer

Technical Field

The utility model relates to semiconductor integrated circuit manufacturing equipment, in particular to a front opening type wafer transmission box suitable for a BGBM (wafer back grinding and wafer back evaporation) process.

Background

With the development of IC technology, the demand for integration, speed and reliability of chips is higher and higher, which requires the chips to be smaller and thinner. Meanwhile, in order to reduce the production cost of a single chip and from the aspect of better product performance control, more and more chip types are produced by using 12-inch wafers.

At present, the BGBM project is started in the industry, and the warpage (warp) of the Taiko Wafer after Wafer back grinding is obviously increased compared with that of a standard Wafer. Currently, a Front Opening Unified Pod (FOUP) for transferring wafers in different equipment is a 25slot FOUP, that is, the FOUP has 25 slots for receiving 25 wafers.

In the transport box, the distance (pitch) between two adjacent support surfaces is only 10mm, and the ribs which are fixed on the door of the FOUP, used for abutting against the wafer after the door of the FOUP is closed to prevent the wafer from sliding in the process of carrying and the supporting legs used for supporting the wafer are designed aiming at the standard wafer, so that the storage requirement of the Taiko wafer with the increased warping degree cannot be met.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a front-opening wafer transfer box suitable for a Taiko wafer, which can solve the problem that the existing transfer box designed for standard wafers cannot meet the storage requirement of the Taiko wafer with increased warping degree.

To solve the above technical problems, the present invention provides a front opening unified pod for Taiko wafers, which comprises a box body and a front door, wherein the front end of the box body is provided with an opening for putting in and taking out wafers, the front door is used for sealing the opening of the box body, the front door is fixedly provided with a spareribs strip, the inner cavity of the box body is provided with a wafer support frame, the wafer supporting frame is provided with a plurality of groups of supporting legs, each group of supporting legs consists of a left supporting leg and a right supporting leg, the distance between a supporting surface formed by a group of supporting legs positioned at the lowest part of the wafer supporting frame and the bottom of the inner cavity of the box body in the vertical direction is more than or equal to 14mm, one end of each supporting leg far away from the opening is provided with a limiting block, a wafer positioned in the slot is abutted against the limiting block, the distance between the wafer and the spareribs strip is 1mm-2mm through the limiting block.

Preferably, the distance between the slots formed between two adjacent sets of support legs for inserting the wafer is 20mm in the vertical direction.

Preferably, the bottom of the wafer support frame is fixedly connected with the box body through a connecting piece.

Preferably, the bottom of the wafer support frame is provided with four threaded connection structures.

Preferably, four support legs with threaded holes are formed at the bottom of the wafer support frame, and the box body and the wafer support frame are fixedly connected with the support legs through screws.

Preferably, an adjusting washer for adjusting the distance between the bottommost group of supporting legs and the bottom of the inner cavity of the box body is further arranged between the screw and the supporting legs.

Preferably, the top of the wafer support frame is connected with the box body through a buckle.

Preferably, four clamping blocks are arranged at the top of the wafer support frame, four clamping grooves are formed in the top surface of the inner side of the box body, and each clamping block is correspondingly inserted into one clamping groove.

Preferably, the minimum distance between two support feet in each set of support feet is greater than or equal to 260 mm. .

Preferably, the wafer support frame has 13 slots for wafers to be inserted into.

The utility model fully considers the warping degree of the Taiko wafer obtained after the back surface of the wafer is ground, and improves the front-opening wafer transmission box for transmitting the wafer, thereby meeting the requirements of storing and transmitting the Taiko wafer. The utility model has the beneficial effects that:

firstly, in the front-opening wafer transmission box, the distance between a supporting surface formed by the lowest group of supporting legs and the bottom of the inner cavity of the box body in the vertical direction is increased, so that the wafers and the bottom of the inner cavity of the transmission box can be prevented from being scratched when the Taiko wafers with the increased warping degree are grabbed by the mechanical arm;

secondly, the utility model forms a limit block on the supporting leg for supporting the wafer, which is used for limiting the position of the wafer placed in the slot, so that a proper gap is kept between the wafer and the spareribs, and thus, the spareribs can not apply stress to the wafer inside when the front-open type wafer transmission box is in a door closing state, thereby avoiding the situation that the wafer is arched and deformed or even broken under the stress action.

Drawings

FIG. 1 is a front view of a front opening unified pod;

FIG. 2 is a side view of a front opening unified pod;

FIG. 3 is a top view of the front opening unified pod;

fig. 4 is a perspective view of the wafer support.

Wherein the reference numerals are as follows:

1 is a box body; 2 is a wafer support frame; 21 is a supporting leg; 22 is a limiting block; 23 is a support leg; 3 is a wafer; 4 is a fixture block; 5 front door; and 6, spareribs strips.

Detailed Description

The embodiments of the present invention are described below with reference to specific embodiments, and other advantages and technical effects of the present invention will be fully apparent to those skilled in the art from the disclosure in the specification. It is to be understood that the embodiments described are only a few embodiments of the present invention, and not all embodiments. The utility model is capable of other embodiments and of being practiced or of being carried out in various ways, and its several details are capable of modification in various respects, all without departing from the general spirit of the utility model. It should be noted that, in the following embodiments, technical features may be combined with each other without conflict. The following exemplary embodiments of the present invention may be embodied in many different forms and should not be construed as limited to the specific embodiments set forth herein. It is to be understood that these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the technical solutions of these exemplary embodiments to those skilled in the art.

In the description of the present application, it is to be noted that the terms "central", "near", "far", "vertical", "inner", "outer", "upper", "lower", "top", "bottom", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience in describing the present application and simplifying the description, but do not indicate or imply that the referred device or element must have a specific orientation, be configured in a specific orientation, and operate, and thus, should not be construed as limiting the present application.

In the description of the present application, it is to be noted that the terms "having," "forming," "mounting," "connecting," and "connecting" are to be construed broadly unless otherwise specifically stated or limited. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art. Furthermore, the terms "first", "second" and "third" are used in the following embodiments to describe various elements and components, but these elements and components should not be limited by these terms, and these terms are only used to distinguish them, so that the first element and component discussed below can also be referred to as the second element and component without departing from the teaching of the embodiments according to the present invention.

During the transport and shipping stages of a semiconductor manufacturing facility, wafers are typically stored in containers, most often front opening foups. The front-opening wafer transfer box suitable for the Taiko wafers comprises a box body 1 and a front door 5, wherein the front end of the box body 1 is provided with an opening for placing and taking out the wafers 3, the front door 5 is used for closing the opening of the box body 1, and the front door 5 is fixedly provided with a spareribs 6, as shown in FIG. 3.

The box body 1 of the front-opening wafer conveying box is provided with a top plate, a bottom plate, a left side plate, a right side plate and a rear plate, wherein the top plate, the bottom plate, the left side plate, the right side plate and the rear plate define an inner cavity of the box body together. In this embodiment, the box body 1 may be provided with a handle for manually moving the front opening foup, but the present invention is not limited thereto, and in other embodiments, a plurality of handles may be provided on the side plate of the box body.

As shown in fig. 1, 2 and 4, a wafer support frame 2 is installed in an inner cavity of a box body 1, the wafer support frame 2 is provided with a plurality of groups of support legs 21, each group of support legs 21 is composed of a left support leg and a right support leg, a distance between a slot for inserting a wafer formed between two adjacent groups of support legs 21 in the vertical direction is 20mm, a distance between a support surface formed by the group of support legs 21 at the bottom of the wafer support frame 2 and the bottom of the inner cavity of the box body 1 in the vertical direction is greater than or equal to 14mm, a limiting block 22 is formed at one end, far away from the opening, of each support leg 21, a wafer 3 located in the slot abuts against the limiting block 22, and the limiting block 22 enables the distance between the wafer 3 and the rib arranging strips 6 to be 1mm-2 mm.

In this embodiment, the wafer support frame 2 has 13 slots for inserting the wafers 3, and the distance between the slots is 20mm, which can satisfy the storage requirement of the Taiko wafers.

In the present embodiment, the wafer support 2 is an integral structure formed by injection molding, but the utility model is not limited thereto, and in other embodiments, the wafer support may be formed or assembled by other processes.

In the front-opening wafer transmission box provided by the embodiment of the utility model, the distance between the supporting surface formed by the lowest group of supporting legs and the bottom of the inner cavity of the box body in the vertical direction is increased, so that the wafers and the bottom of the inner cavity of the transmission box can be prevented from being scratched when the Taiko wafers with the increased warpage (with the warpage of 2mm-3mm) are grabbed by a mechanical arm (with the thickness of about 5 mm).

Meanwhile, a limiting block is formed on the supporting leg for supporting the wafer and used for limiting the position of the wafer placed in the slot, so that a proper gap is kept between the wafer and the spareribs, the spareribs can not apply stress to the wafer inside when the front-open type wafer transmission box is in a door closing state, and the situation that the wafer is arched and deformed or even broken under the stress action is avoided.

In this embodiment, the bottom of the wafer support frame 2 is fixedly connected with the box body 1 through a connecting piece, and the top of the wafer support frame 2 is connected with the box body 1 through a buckle.

Specifically, the bottom of the wafer support frame is provided with four threaded connection structures. As shown in fig. 1, four legs 23 with threaded holes are formed at the bottom of the wafer support frame, and the cassette and the wafer support frame are fixedly connected to the legs 23 by screws.

The screw with still install the adjusting washer who is used for adjusting the distance between a set of supporting legs at the bottom and the box body inner chamber bottom between the stabilizer blade, can adjust the distance of a set of supporting legs at the bottom of wafer support frame and box body inner chamber bottom under the prerequisite of guaranteeing that wafer support frame and box body are reliably connected like this to guarantee better that the in-process of snatching the wafer can not cause the damage to wafer and conveying box. Of course, in order to ensure the stability of the wafer support frame, the adjusting washer and the support leg of the threaded hole can be integrally formed by injection molding.

The top of the wafer support frame is provided with four clamping blocks 4, the top surface of the inner side of the box body is provided with four clamping grooves, and each clamping block is correspondingly inserted into one clamping groove.

In order to ensure that the front opening type wafer transmission box for storing the wafers can be suitable for the mechanical arms of all the machine stations, the minimum distance between two supporting legs in each group of supporting legs is larger than or equal to 260 mm.

In the embodiment of the utility model, the front opening type wafer transmission box is used for storing and transmitting 12-inch wafers. Of course, the above-mentioned transfer box can also be applied to the wafer Taiko thinning process with other sizes, which is not limited in this embodiment.

The present invention has been described in detail with reference to the specific embodiments, which are merely preferred embodiments of the present invention, and the present invention is not limited to the above embodiments. Equivalent alterations and modifications made by those skilled in the art without departing from the principle of the utility model should be considered to be within the technical scope of the utility model.

Claims (10)

1. The front-opening wafer conveying box is characterized in that a wafer supporting frame is installed in an inner cavity of the box body and is provided with a plurality of groups of supporting legs, each group of supporting legs consists of a left supporting leg and a right supporting leg, the distance between a supporting surface formed by a group of supporting legs positioned at the bottommost of the wafer supporting frame and the bottom of the inner cavity of the box body in the vertical direction is larger than or equal to 14mm, a limiting block is formed at one end, away from the opening, of each supporting leg, a wafer positioned in the slot abuts against the limiting block, and the distance between the wafer and the rib bars is 1-2 mm through the limiting block.

2. The foup for Taiko wafers as claimed in claim 1, wherein the slots formed between two adjacent sets of support legs for inserting wafers are spaced apart by 20mm in the vertical direction.

3. The front opening unified pod for Taiko wafers as claimed in claim 1, wherein the bottom of the wafer support is fixedly connected to the pod by a connector.

4. The foup for Taiko wafers as claimed in claim 3, wherein the bottom of the wafer support frame has four screw connections.

5. The front opening type wafer transfer box suitable for the Taiko wafers as claimed in claim 4, wherein the bottom of the wafer support frame is formed with four legs having threaded holes, and the box body and the wafer support frame are fixedly connected with the legs through screws.

6. The foup suitable for Taiko wafers as claimed in claim 5, wherein an adjusting washer is further installed between the screw and the support leg for adjusting the distance between the bottom set of support legs and the bottom of the chamber body.

7. The front opening unified pod for Taiko wafers as claimed in claim 1, wherein the top of the wafer support shelf is snap-fit to the pod.

8. The foup suitable for Taiko wafers as claimed in claim 7, wherein the top of the wafer support frame has four engaging blocks, the top surface of the inner side of the box has four engaging slots, and each engaging block is inserted into one engaging slot.

9. The foup for Taiko wafers as recited in claim 1, wherein the minimum distance between two of the support legs in each set of support legs is greater than or equal to 260 mm.

10. The foup for Taiko wafers as claimed in claim 1, wherein the wafer support frame has 13 slots for wafers to be inserted.

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