CN215507210U - Silicon carbide semiconductor processing equipment - Google Patents
Silicon carbide semiconductor processing equipment Download PDFInfo
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- CN215507210U CN215507210U CN202121732874.8U CN202121732874U CN215507210U CN 215507210 U CN215507210 U CN 215507210U CN 202121732874 U CN202121732874 U CN 202121732874U CN 215507210 U CN215507210 U CN 215507210U
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- silicon carbide
- carbide semiconductor
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- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The utility model provides silicon carbide semiconductor processing equipment, which belongs to the technical field of semiconductor processing and comprises a processing box, a feeding hopper and two shaft levers, wherein the feeding hopper penetrates through the top of the processing box, the front wall of the lower end of the processing box is provided with the material collecting box in a penetrating manner, the inner part of the upper end of the processing box is rotatably connected with the two shaft levers, the outer parts of the two shaft levers are respectively sleeved with a crushing roller, the inner walls of the left side and the right side of the upper end of the processing box are respectively welded with a fixed plate, and the upper ends of the opposite sides of the two fixed plates are respectively fixedly connected with an elastic brush. This kind of carborundum semiconductor processing equipment stable in structure can smash the carborundum semiconductor material earlier and then mill to for carborundum semiconductor material mills and lays a good basis, be favorable to the operation of milling of carborundum semiconductor material, and accelerated the speed of milling, and the carborundum semiconductor material size after milling is even, thereby has improved the quality of milling, and has satisfied the quality requirement of later stage product production.
Description
Technical Field
The utility model relates to the technical field of semiconductor processing, in particular to silicon carbide semiconductor processing equipment.
Background
The hardness of silicon carbide is very high, the mohs hardness is 9.5 grade, which is next to the hardest diamond (10 grade) in the world, the silicon carbide has excellent heat-conducting property, is a semiconductor and can resist oxidation at high temperature.
In the prior art, a grinding operation is mostly adopted when silicon carbide semiconductor is ground, because the silicon carbide semiconductor material is uneven in size before grinding, when grinding, the material of a small block is firstly ground, the grinding time of the large block is too long, the speed is reduced, and the size of the ground material is uneven, so that the grinding quality is reduced, and the quality requirement of later-stage product production is influenced.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide silicon carbide semiconductor processing equipment to solve the defects in the prior art.
In order to achieve the purpose, the utility model provides the following technical scheme:
a silicon carbide semiconductor processing device comprises a processing box, a feeding hopper and material collecting boxes, wherein the feeding hopper penetrates through the top of the processing box, the material collecting box penetrates through the front wall of the lower end of the processing box, two shaft levers are rotatably connected inside the upper end of the processing box, crushing rollers are sleeved outside the two shaft levers, fixed plates are welded on the inner walls of the left side and the right side of the upper end of the processing box, elastic brushes are fixedly connected with the upper ends of the two fixed plates on opposite sides, first material guide plates are welded on the lower ends of the two fixed plates on opposite sides, a rotary rod is rotatably connected with the middle part of the processing box, grinding blocks are fixedly connected with the lower ends of the rotary rod, grinding plates are arranged on the bottoms of the grinding blocks in a laminating manner, gears are sleeved at one ends of the two shaft levers close to the rear wall of the processing box, and are meshed with each other gears, the upper end of the back wall of processing case is provided with direct current motor, the lower extreme of the back wall of processing case is provided with positive reverse motor, the equal fixedly connected with rubber baffle of lower extreme left and right sides inner wall of feeder hopper, the equal fixedly connected with second stock guide in the left and right sides bottom of feeder hopper.
As a preferable scheme, the whole processing box is in a convex shape, the two crushing rollers and the two fixing plates are positioned at the upper end of the processing box, and the inside of the processing box is communicated with the inside of the aggregate box.
Preferably, the two crushing rollers are horizontally distributed, the distance between the two crushing rollers is less than 1cm, and a gap between the two crushing rollers is located right below the middle of the two second material guide plates.
Preferably, the elastic brush is made of rubber, and the tail end of the elastic brush is tightly attached to the side surface of the crushing roller.
Preferably, the front surface of the grinding block is fan-shaped, the lower surface of the grinding block and the upper surface of the grinding plate are fixedly connected with the corrugated plates, and the two corrugated plates are tightly attached to each other.
As a preferred scheme, the grinding plate is in a concave arc shape, the left end and the right end of the grinding plate are fixed in the middle of the processing box, and a plurality of discharge holes penetrate through the middle of the grinding plate.
As a preferable scheme, the direct current motor and the forward and reverse rotation motor are respectively connected with one of the shaft lever and the rotating lever, and the wiring terminals of the direct current motor and the forward and reverse rotation motor are both connected with an external power supply.
Compared with the prior art, the utility model has obvious advantages and beneficial effects, and specifically, the technical scheme includes that:
(1) this kind of carborundum semiconductor processing equipment passes through the improvement of structure, makes this equipment when the in-service use, can smash the carborundum semiconductor material earlier and then mill to grind for carborundum semiconductor material grinds and lays a good basis, is favorable to the operation of milling of carborundum semiconductor material, and accelerated the speed of milling, and the carborundum semiconductor material size after milling is even, thereby has improved the quality of milling, and has satisfied the quality requirement of later stage product production.
(2) The silicon carbide semiconductor processing equipment has the advantages that: when silicon carbide semiconductor material enters into the processing case from the feeder hopper, accessible second stock guide advances the material water conservancy diversion in the gap between two crushing rollers, then smash the operation to silicon carbide semiconductor material through two crushing rollers, still can support the both sides that keep off silicon carbide semiconductor material and drop to two crushing rollers through the second stock guide, avoid omitting the material not smashed, when two crushing rollers are to silicon carbide semiconductor material crushing, in case when massive material is pushed by two crushing rollers and is moved towards the top, accessible rubber baffle keeps off the material and shifts up, thereby accelerate the kibbling speed of material.
(3) Secondly, the method comprises the following steps: when the material drops on the grinding plate, because the grinding plate is recessed arc form, can make the carborundum semiconductor material on the grinding plate concentrate on the middle part of the board of milling, then drive the fluted plate swing through the piece of milling, and because the piece of milling is fan-shaped just, thereby make the material enter into the grinding piece and mill between the board from the left and right sides of the piece of milling, thereby be favorable to further processing to mill to carborundum semiconductor material, make the material more even that mills, mill the back, be powdered material accessible relief hole and enter into the lower extreme of processing case, and drop and collect in the collection box, and then acquire the carborundum powder of compound requirement.
Drawings
Fig. 1 is a schematic view of the overall structure of the present invention.
Fig. 2 is an overall sectional structure diagram of the present invention.
FIG. 3 is a schematic view of the structure of the processing box and the gear of the present invention.
Fig. 4 is an enlarged view of the structure at a in fig. 2 according to the present invention.
Fig. 5 is an enlarged view of the structure at B in fig. 2 according to the present invention.
In FIGS. 1-5: 1-processing a box; 2-a feed hopper; 3-a material collecting box; 4-shaft lever; 5-a crushing roller; 6, fixing a plate; 7-an elastic brush; 8-a first material guide plate; 9-rotating rod; 10-grinding block; 11-grinding plate; 1101-a discharge aperture; 12-a direct current motor; 13-a positive and negative rotation motor; 14-a gear; 15-rubber baffles; 16-a second material guide plate; 17-corrugated board.
Detailed Description
Example (b):
with reference to the figures 1-5 of the drawings,
the silicon carbide semiconductor processing device provided by the embodiment comprises a processing box 1, a feeding hopper 2 and a material collecting box 3, wherein the feeding hopper 2 penetrates through the top of the processing box 1, the material collecting box 3 penetrates through the front wall of the lower end of the processing box 1, two shaft levers 4 are rotatably connected to the inner part of the upper end of the processing box 1, crushing rollers 5 are sleeved on the outer parts of the two shaft levers 4, fixing plates 6 are welded on the inner walls of the left side and the right side of the upper end of the processing box 1, elastic brushes 7 are fixedly connected to the upper ends of the opposite sides of the two fixing plates 6, first material guide plates 8 are welded to the lower ends of the opposite sides of the two fixing plates 6, a rotating rod 9 is rotatably connected to the middle part of the inner part of the processing box 1, grinding blocks 10 are fixedly connected to the lower ends of the rotating rod 9, grinding plates 11 are attached to the bottoms of the grinding blocks 10, gears 14 are sleeved on the ends of the two shaft levers 4 close to the rear wall of the processing box 1, and the two gears 14 are meshed with each other, the upper end of the rear wall of the processing box 1 is provided with a direct current motor 12, the lower end of the rear wall of the processing box 1 is provided with a forward and reverse rotation motor 13, the inner walls of the left side and the right side of the lower end of the feeding hopper 2 are fixedly connected with rubber baffles 15, and the bottoms of the left side and the right side of the feeding hopper 2 are fixedly connected with second guide plates 16.
Further, the whole processing box 1 is in a convex shape, the two crushing rollers 5 and the two fixing plates 6 are positioned at the upper end of the processing box 1, and the interior of the processing box 1 is communicated with the interior of the aggregate box 3;
in this embodiment, the inner space at the upper end of the processing box 1 is made smaller and the inner space at the lower end of the processing box 1 is made larger by the design of the processing box 1, so that the two crushing rollers 5 and the two fixing plates 6 are compactly distributed, and the silicon carbide semiconductor material which is not crushed can be prevented from falling to the lower end of the processing box 1 from the gap.
Further, the two crushing rollers 5 are horizontally distributed, the distance between the two crushing rollers 5 is less than 1cm, and a gap between the two crushing rollers 5 is positioned right below the middle of the two second material guide plates 16;
in this embodiment, by this design, the silicon carbide semiconductor material entering the feeding hopper 2 can be guided into the gap between the two crushing rollers 5 by the two second material guiding plates 16, and then the silicon carbide semiconductor material is crushed by the two crushing rollers 5.
Further, the elastic brush 7 is made of rubber, and the tail end of the elastic brush 7 is tightly attached to the side surface of the crushing roller 5;
in this embodiment, through the design of elasticity brush 7, after two crushing rollers 5 smashed the completion to carborundum semiconductor material, accessible elasticity brush 7 brushed the remaining carborundum semiconductor material in crushing roller 5 surface, and through the upper surface of first stock guide 8 with the material water conservancy diversion that brushes and fall to grinding piece 10, rethread grinding piece 10 with the material water conservancy diversion on grinding board 11, and make the material be located the left and right sides of grinding piece 10, thereby be convenient for the material from the left and right sides of grinding piece 10 enter into grinding piece 10 and grind between the board 11, be favorable to milling the material.
Further, the front surface of the grinding block 10 is fan-shaped, the lower surface of the grinding block 10 and the upper surface of the grinding plate 11 are both fixedly connected with a toothed plate 17, and the two toothed plates 17 are tightly attached to each other;
in this embodiment, through this design, the accessible grinding block 10 drives the friction back and forth between the insection board 17 of insection board 17 and the upper surface of grinding board 11 to grind the material, and effectual mill the material and be likepowder, and improved operating mass with the material.
Further, the milling plate 11 is in a concave arc shape, the left end and the right end of the milling plate 11 are fixed in the middle of the processing box 1, and a plurality of discharge holes 1101 penetrate through the middle of the milling plate 11;
in this embodiment, when the material is milled by the milling block 10, the silicon carbide semiconductor material on the milling plate 11 can be concentrated in the middle of the milling plate 11 due to the concave arc shape of the milling plate 11, and is milled by the milling block 10, and after the silicon carbide semiconductor material is milled into powder by the milling block 10, the silicon carbide semiconductor material can enter the lower end of the processing box 1 through the discharge hole 1101 and fall into the collecting box 3 for collection.
Further, the direct current motor 12 and the forward and reverse rotation motor 13 are respectively connected with one shaft lever 14 and the rotating lever 9, and the wiring terminals of the direct current motor 12 and the forward and reverse rotation motor 13 are both connected with an external power supply;
in this embodiment, the dc motor 12 and the forward and reverse motor 13 can be driven to operate by an external power supply, the dc motor 12 drives a shaft rod 14 connected thereto to rotate, and the forward and reverse motor 13 drives the rotary rod 9 to rotate in forward and reverse directions, so as to drive the grinding block 10 to swing.
The working principle is as follows:
firstly, an external power supply is started, the direct current motor 12 and the forward and reverse rotation motor 13 can be driven to run by the external power supply, a shaft rod 14 connected with the direct current motor 12 is driven to rotate by the direct current motor 12, then another grinding roller 5 can be driven to rotate by another gear 14 through the transmission of the gear 14, the forward and reverse rotation motor 13 can drive the rotating rod 9 to rotate in the forward and reverse directions, so that the grinding block 10 is driven to swing, then the silicon carbide semiconductor material is poured from the feeding head 2, passes through the rubber baffle 15, then is guided into a gap between the two grinding rollers 5 through the second guide plate 16, is ground by the two grinding rollers 5, and the silicon carbide semiconductor material left on the surfaces of the grinding rollers 5 can be brushed down by the elastic brush 7 in the process of grinding the silicon carbide semiconductor material by the two grinding rollers 5, the brushed materials are guided to the upper surface of the grinding block 10 through the first material guide plate 8, the grinding block 10 drives the corrugated plate 17 to swing to grind the silicon carbide semiconductor materials on the grinding plate 11 into powder, the powder silicon carbide semiconductor materials are discharged to the lower end of the processing box 1 through the discharge hole 1101 and fall into the material collecting box 3 to be collected, and finally the silicon carbide semiconductor materials are taken out through the material collecting box 3.
Claims (7)
1. The silicon carbide semiconductor processing equipment comprises a processing box (1), a feeding hopper (2) and a material collecting box (3), and is characterized in that the feeding hopper (2) penetrates through the top of the processing box (1), the material collecting box (3) penetrates through the front wall of the lower end of the processing box (1), two shaft levers (4) are rotatably connected to the inner part of the upper end of the processing box (1), crushing rollers (5) are sleeved on the outer parts of the shaft levers (4), fixing plates (6) are welded on the inner walls of the left side and the right side of the upper end of the processing box (1), elastic brushes (7) are fixedly connected to the upper ends of the two opposite sides of the fixing plates (6), first material guide plates (8) are welded to the lower ends of the two opposite sides of the fixing plates (6), a rotary rod (9) is rotatably connected to the inner middle part of the processing box (1), and grinding blocks (10) are fixedly connected to the lower ends of the rotary rod (9), the bottom laminating of stone roller (10) is provided with grinding plate (11), two gear (14) have all been cup jointed to the one end that axostylus axostyle (4) is close to processing case (1) back wall, and two gear (14) intermeshing connects, the upper end of the back wall of processing case (1) is provided with direct current motor (12), the lower extreme of the back wall of processing case (1) is provided with just reversal motor (13), the equal fixedly connected with rubber baffle (15) of the lower extreme left and right sides inner wall of feeder hopper (2), the equal fixedly connected with second stock guide (16) in the left and right sides bottom of feeder hopper (2).
2. The silicon carbide semiconductor processing apparatus according to claim 1, wherein the processing tank (1) is integrally convex-shaped, and the two crushing rollers (5) and the two fixing plates (6) are located at an upper end of the processing tank (1), and an interior of the processing tank (1) communicates with an interior of the material collecting box (3).
3. The silicon carbide semiconductor processing device according to claim 1, wherein the two crushing rollers (5) are horizontally arranged, the distance between the two crushing rollers (5) is less than 1cm, and the gap between the two crushing rollers (5) is located right below the middle of the two second material guide plates (16).
4. The silicon carbide semiconductor processing apparatus according to claim 1, wherein the elastic brush (7) is made of rubber, and a tip end of the elastic brush (7) is closely attached to a side surface of the crushing roller (5).
5. The silicon carbide semiconductor processing device according to claim 1, wherein the front surface of the grinding block (10) is fan-shaped, the lower surface of the grinding block (10) and the upper surface of the grinding plate (11) are fixedly connected with the corrugated plates (17), and the two corrugated plates (17) are tightly attached to each other.
6. The silicon carbide semiconductor processing device according to claim 1, wherein the grinding plate (11) is in a concave arc shape, the left and right ends of the grinding plate (11) are fixed to the middle of the processing box (1), and a plurality of discharge holes (1101) are arranged in the middle of the grinding plate (11) in a penetrating manner.
7. The silicon carbide semiconductor processing apparatus according to claim 1, wherein the dc motor (12) and the counter-rotating motor (13) are connected to one of the shaft (14) and the rotating rod (9), respectively, and terminals of the dc motor (12) and the counter-rotating motor (13) are connected to an external power source.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121732874.8U CN215507210U (en) | 2021-07-28 | 2021-07-28 | Silicon carbide semiconductor processing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121732874.8U CN215507210U (en) | 2021-07-28 | 2021-07-28 | Silicon carbide semiconductor processing equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215507210U true CN215507210U (en) | 2022-01-14 |
Family
ID=79787945
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121732874.8U Expired - Fee Related CN215507210U (en) | 2021-07-28 | 2021-07-28 | Silicon carbide semiconductor processing equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215507210U (en) |
-
2021
- 2021-07-28 CN CN202121732874.8U patent/CN215507210U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20220114 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |