CN215499258U

CN215499258U - High-bounce FPC board and camera module thereof

Info

Publication number: CN215499258U
Application number: CN202121910220.XU
Authority: CN
Inventors: 刘为戗; 张运社; 钟秀兴
Original assignee: Huizhou Zhongxing Round Technology Co ltd
Current assignee: Huizhou Zhongxing Round Technology Co ltd
Priority date: 2021-08-13
Filing date: 2021-08-13
Publication date: 2022-01-11
Anticipated expiration: 2031-08-13

Abstract

The application relates to a high-bounce FPC board and a camera module thereof, which are applied to the camera module and comprise an FPC board body, a first connecting part and a second connecting part, wherein the first connecting part and the second connecting part are respectively arranged at two ends of the FPC board body; the FPC board body at least comprises a glue-free pressing and extending layer, a conducting layer and a protective layer, and the conducting layer is arranged between the pressing and extending layer and the protective layer. The beneficial effects are that: the application resets the FPC material, greatly improves the bouncing property of the FPC board, and enables the FPC board to be repeatedly bent by more than 10 thousands. The method can be used for various shooting scenes.

Description

High-bounce FPC board and camera module thereof

Technical Field

The application relates to the technical field of camera shooting, in particular to a high-bounce FPC board and a camera module thereof.

Background

Present camera application is more and more extensive, and present camera module is mostly the camera module that adopts the FPC structure, and the FPC of module needs to buckle under many service conditions, perhaps FPC region can receive buckling in the test procedure, and the fracture appears in FPC this moment easily, perhaps the circuit because of buckling the condition of opening circuit, and above-mentioned not good will cause unrepairable direct loss.

Disclosure of Invention

This application is for overcoming among the prior art cracked technical problem appears in FPC easily, provides a high-bounce FPC board and camera module thereof.

A high-bounce FPC board is applied to a camera module and comprises an FPC board body, a first connecting part and a second connecting part, wherein the first connecting part and the second connecting part are respectively arranged at two ends of the FPC board body;

the FPC board body at least comprises a glue-free pressing and extending layer, a conducting layer and a protective layer, and the conducting layer is arranged between the pressing and extending layer and the protective layer.

Optionally, the adhesive-free rolled layer at least comprises a first copper material layer and a first PI layer, and the first PI layer and the first copper material layer are sequentially stacked between the conductive layers from top to bottom.

Optionally, the protective layer at least includes a first AD glue layer and a second PI layer, and the first AD glue layer and the second PI layer are stacked in sequence from top to bottom.

Optionally, the conductive layer is a copper plating layer, and the conductive layer is electroplated on the upper surface of the protective layer.

Optionally, first connecting portion, second connecting portion still are provided with the articulamentum, the articulamentum includes solder mask, copper plate, second copper material layer, solder mask, copper plate, second copper material layer are from last down to pile up in proper order at the calendering layer upper surface.

Optionally, first connecting portion, second connecting portion lower extreme still are provided with the strengthening layer, the strengthening layer includes second AD glue film, steel layer, up fix from down is followed to steel layer, second AD glue film the protective layer lower surface.

Optionally, the thickness of the FPC board body is 100-120 um.

In addition, this application still discloses a camera module, including camera lens subassembly, connector and foretell high-bounce FPC board, the first connecting portion of high-bounce FPC board with the camera lens subassembly is connected, the second connecting portion and the connector of high-bounce FPC board are connected.

Optionally, the lens assembly includes a bracket, a circuit board, and a lens, the bracket is fixed to the first connecting portion or the second connecting portion, the circuit board is disposed in the bracket and connected to the connecting portion of the first connecting portion or the second connecting portion, and the lens is disposed in the bracket and located on the circuit board; the circuit board is provided with an imaging chip.

Optionally, the field angle of the lens assembly is 87.6 °.

Compared with the prior art, the beneficial effects of this application are: the application resets the FPC material, greatly improves the bouncing property of the FPC board, and enables the FPC board to be repeatedly bent by more than 10 thousands. The method can be used for various shooting scenes.

Drawings

Fig. 1 is a schematic view of an FPC board according to an embodiment of the present invention.

Fig. 2 is a view 1 of a camera module according to an embodiment of the present invention.

Fig. 3 is a view 2 of a camera module according to an embodiment of the present invention.

Fig. 4 is a schematic view of a lens assembly according to an embodiment of the utility model.

Detailed Description

The present application will be further described with reference to the following detailed description.

The same or similar reference numerals in the drawings of the embodiments of the present application correspond to the same or similar components; in the description of the present application, it is to be understood that the terms "upper", "lower", "left", "right", "top", "bottom", "inner", "outer", and the like, if any, are used in the orientations and positional relationships indicated in the drawings only for the convenience of describing the present application and for simplicity of description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and therefore the terms describing the positional relationships in the drawings are for illustrative purposes only and are not to be construed as limiting the present patent.

Furthermore, if the terms "first," "second," and the like are used for descriptive purposes only, they are used for mainly distinguishing different devices, elements or components (the specific types and configurations may be the same or different), and they are not used for indicating or implying relative importance or quantity among the devices, elements or components, but are not to be construed as indicating or implying relative importance.

In an embodiment as shown in fig. 1-2, the present application discloses a high-bounce FPC board, which is applied to a camera module, and includes an FPC board body 11, and a first connecting portion 12 and a second connecting portion 13 respectively disposed at two ends of the FPC board body 11, wherein the first connecting portion 12 is connected to the lens assembly 2, and the second connecting portion 13 is connected to the connector 3; the FPC board body 11 at least includes the adhesive-free epitaxial lamination layer 110, a conductive layer 113, and a protective layer 116, and the conductive layer 113 is disposed between the epitaxial lamination layer and the protective layer 116. In this embodiment, this through the structure that sets up the FPC board body 11, set it to the FPC board that comprises no gluey epitaxial layer 110, conducting layer 113, protective layer 116, through setting up the two-sided epitaxial layer of pressing, make the bounce performance on FPC layer better.

In some embodiments, the adhesive-free epitaxial layer 110 includes at least a first copper layer 111 and a first PI layer 112, and the first PI layer 112 and the first copper layer 111 are sequentially stacked between the conductive layers 113 from top to bottom. In this embodiment, the first PI layer 112 is an outer layer, and the first copper layer 111 is connected to the conductive layer 113. Second copper material layers are further arranged on the first connection portion 12 and the second connection portion 13, wherein the second copper material layers further penetrate through the through holes of the first PI layers 112 to be connected with the first copper material layers 111. The application makes FPC board have high spring performance through setting up glueless epitaxial layer 110 of pressing.

In some embodiments, the protection layer 116 includes at least a first AD glue layer 114 and a second PI layer 115, and the first AD glue layer 114 and the second PI layer 115 are sequentially stacked from top to bottom. The conductive layer 113 is a copper plating layer, and the conductive layer 113 is electroplated on the upper surface of the protection layer 116. This application protects conducting layer 113 through first AD glue layer 114, second PI layer 115 and protects.

In some embodiments, the first connection portion 12 and the second connection portion 13 are further provided with a connection layer 120, the connection layer 120 includes a solder resist layer 121, a copper plating layer 122 and a second copper material layer 123, and the solder resist layer 121, the copper plating layer 122 and the second copper material layer 123 are sequentially stacked on the upper surface of the rolled layer from top to bottom. First connecting portion 12, second connecting portion 13 lower extreme still are provided with strengthening layer 130, and strengthening layer 130 includes second AD glue film 131, steel layer 132, and steel layer 132, second AD glue film 131 are from down up fixing at protective layer 116 lower surface. In the present embodiment, the first connection portion 12 and the second connection portion 13 are formed by disposing the connection layer 120 on the upper surface of the FPC board body and disposing the reinforcing layer 130 on the lower surface, and the connection layer 120 is connected to the lens assembly or the connector 3 by disposing the solder resist layer 121, the copper plating layer 122 and the second copper material layer 123, so that the electrical conductivity is better. This application strengthening layer 130 is further strengthened the structure of first connecting portion 12, second connecting portion 13 through setting up second AD glue film 131, steel layer 132, makes its structure more stable.

In some embodiments, the thickness of the FPC board body 11 is 100-120 um. In this embodiment, the thickness of the solder mask layer 121 is 15um, the thickness of the first copper layer 111 is 12um, the thickness of the second copper layer 123 is 12um, the thickness of the first PI layer 112 is 25um, the thickness of the second PI layer 115 is 12.5um, the thickness of the conductive layer 113 is 8um, the thickness of the copper plating layer 122 is 8um, the thickness of the first AD glue layer 114 is 15um, the thickness of the second AD glue layer 131 is 50um, and the thickness of the steel layer 132 is 200 um. The first AD glue layer 114 and the second AD glue layer 131 are acrylic hot melt glue layers, and the first PI layer 112 and the second PI layer 115 are polyimide layers.

In the embodiment shown in fig. 3-4, the present application further discloses a camera module, which includes the lens assembly 2, the connector 3, and the high-bounce FPC board 1, wherein the first connection portion 12 of the high-bounce FPC board 1 is connected to the lens assembly, and the second connection portion 13 of the high-bounce FPC board 1 is connected to the connector 3. The lens component 2 comprises a bracket 21, a circuit board 22 and a lens 23, wherein the bracket 21 is fixed on the first connecting part 12 or the second connecting part 13, the circuit board 22 is arranged in the bracket and is connected with the connecting part of the first connecting part 12 or the second connecting part 13, and the lens 23 is arranged in the bracket and is positioned on the circuit board; the wiring board 21 is provided with an imaging chip. The angle of view of the lens assembly 2 is 87.6 °. In this embodiment, the lens assembly 2 is used for obtaining an external image, and the connector 3 is used for connecting with a circuit board of the smart terminal. The size of the field angle determines the field range of the optical instrument; the selected field angle of 87.6 degrees can ensure that the lens assembly 2 obtains better imaging effect at the field angle. This application passes through the imaging chip of camera lens subassembly 2 and obtains outside image signal through the lens, carries out the transcoding again and gives intelligent terminal such as cell-phone through FPC board, connector 3 and handles.

It should be understood that the above examples of the present application are only examples for clearly illustrating the present application, and are not intended to limit the embodiments of the present application. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present application shall be included in the protection scope of the claims of the present application.

Claims

1. A high-bounce FPC board is applied to a camera module and is characterized by comprising an FPC board body, a first connecting part and a second connecting part, wherein the first connecting part and the second connecting part are respectively arranged at two ends of the FPC board body;

2. The high-bounce FPC board according to claim 1, wherein the non-adhesive epitaxial layer at least comprises a first copper material layer and a first PI layer, and the first PI layer and the first copper material layer are sequentially stacked between the conductive layers from top to bottom.

3. The high-bounce FPC board according to claim 2, wherein the protective layer at least comprises a first AD adhesive layer and a second PI layer, and the first AD adhesive layer and the second PI layer are sequentially stacked from top to bottom.

4. The high-bounce FPC board according to claim 3, wherein said conductive layer is a copper plated layer, and said conductive layer is electroplated on the upper surface of said protective layer.

5. The high-bounce FPC board according to claim 1, wherein the first connecting portion and the second connecting portion are further provided with connecting layers, the connecting layers comprise a solder resist layer, a copper plating layer and a second copper material layer, and the solder resist layer, the copper plating layer and the second copper material layer are sequentially stacked on the upper surface of the calendering layer from top to bottom.

6. The high-bounce FPC board according to claim 5, wherein reinforcing layers are further arranged at lower ends of the first connecting portion and the second connecting portion, each reinforcing layer comprises a second AD glue layer and a steel material layer, and the steel material layers and the second AD glue layers are fixed on the lower surface of the protective layer from bottom to top.

7. The high-bounce FPC board according to claim 1, wherein the thickness of the FPC board body is 100-120 um.

8. A camera module comprising a lens assembly, a connector, and a high-bounce FPC board as claimed in any one of claims 1 to 7, wherein the first connecting portion of the high-bounce FPC board is connected to the lens assembly, and the second connecting portion of the high-bounce FPC board is connected to the connector.

9. The camera module according to claim 8, wherein the lens assembly comprises a holder, a circuit board, and a lens, the holder is fixed to the first connecting portion or the second connecting portion, the circuit board is disposed in the holder and connected to the connecting portion of the first connecting portion or the second connecting portion, and the lens is disposed in the holder and on the circuit board; the circuit board is provided with an imaging chip.

10. The camera module of claim 8, wherein the lens assembly has a field angle of 87.6 °.