CN215470116U - Ceramic substrate grinding device - Google Patents
Ceramic substrate grinding device Download PDFInfo
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- CN215470116U CN215470116U CN202121373386.2U CN202121373386U CN215470116U CN 215470116 U CN215470116 U CN 215470116U CN 202121373386 U CN202121373386 U CN 202121373386U CN 215470116 U CN215470116 U CN 215470116U
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Abstract
The utility model provides a ceramic substrate polishing device which comprises a machine body, wherein a rotating table mechanism and a polishing mechanism are arranged in the machine body, the polishing mechanism is close to the side part of the rotating table mechanism, a pressing mechanism is arranged in the machine body, the pressing mechanism comprises a lifting mechanism, a rotating shaft, a mounting plate, a swing rod, a movable block, a sliding piece, a pressing plate and an elastic telescopic piece, one end of the rotating shaft is rotatably connected with the top wall of the machine body, the other end of the rotating shaft is fixedly connected with the mounting plate, the lifting mechanism is arranged on a fixing plate and rotatably connected with the movable block, the movable block is sleeved on the swing rod and is slidably connected with the swing rod, one end of the swing rod is rotatably connected with the sliding piece arranged at the top of the pressing plate, the other end of the swing rod is rotatably connected with the bottom of the mounting plate, and the mounting plate is connected with the pressing plate through the elastic telescopic piece. The device can realize polishing ceramic substrate's automation, and it is efficient to polish, and the accuracy of polishing is high.
Description
Technical Field
The utility model relates to the field of ceramic substrate production, in particular to a ceramic substrate polishing device.
Background
The ceramic substrate refers to a special process plate in which copper foil is directly bonded to the surface (single or double side) of an alumina (Al2O3) or aluminum nitride (AlN) ceramic substrate at a high temperature. The manufactured ultrathin composite substrate has excellent electrical insulation performance, high heat conduction characteristic, excellent soft solderability and high adhesion strength, can be etched into various patterns like a PCB (printed circuit board), and has great current carrying capacity. Therefore, the ceramic substrate has become a basic material for high-power electronic circuit structure technology and interconnection technology. The existing ceramic substrate is polished by adopting a manual handheld grinding tool to polish the edge of the ceramic substrate, the polishing speed is low, the polishing efficiency is low, and flying powder can influence the health of operators when being polished, so that great potential safety hazards exist for the operators. However, if mechanical polishing is used, the ceramic substrate is easily damaged or the ceramic substrate is moved and damaged during polishing, which affects the mass application of mechanical polishing.
SUMMERY OF THE UTILITY MODEL
In order to solve the problems, the utility model adopts the following technical scheme: the utility model provides a ceramic substrate grinding device, includes the organism, is equipped with swivel mount mechanism and grinding machanism in the organism, and grinding machanism is close to the lateral part of swivel mount mechanism, be equipped with hold-down mechanism in the organism, hold-down mechanism includes elevating system, pivot, mounting panel, pendulum rod, movable block, slider, clamp plate and elastic expansion piece, pivot one end rotates with the organism roof to be connected, and the pivot other end is connected with mounting panel fixed connection, is equipped with elevating system on the fixed plate, and elevating system rotates with the movable block to be connected, and the movable block cover is on the pendulum rod and movable block and pendulum rod sliding connection, and pendulum rod one end rotates with the slider of establishing at the clamp plate top to be connected, and the other end and the mounting panel bottom of pendulum rod rotate to be connected, and the mounting panel passes through elastic expansion piece and is connected with the clamp plate.
Furthermore, the elastic telescopic piece and the sliding piece are respectively positioned at two ends of the pressing plate, and the pressing mechanism is positioned right above the rotating table mechanism.
Furthermore, grinding mechanism includes the polishing dish and second motor, and the second motor passes through the motor mount to be fixed in the organism, and the output shaft and the polishing dish of second motor are connected, and the polishing dish is close to the lateral part of revolving stage mechanism.
Further, the rotating platform mechanism comprises a first motor, a motor box and a rotating platform, the motor box is arranged on the bottom wall of the machine body, the first motor is arranged in the motor box, an output shaft of the first motor penetrates through the top wall of the motor box to be connected with the rotating platform, and the rotating platform is located in the machine body and is located right above the motor box.
Further, elevating system includes third motor, worm wheel, guide and worm, the third motor is established on the mounting panel, and the output shaft and the worm wheel of third motor are connected, and the worm wheel meshes with the worm, and the worm is connected with the one end of guide, and the other end and the movable block of guide are connected.
Furthermore, the guide piece comprises a sliding sleeve and a sliding rod, the sliding sleeve is embedded in the mounting plate, the sliding sleeve is inserted into the sliding sleeve and is in sliding connection with the sliding rod, the top end of the sliding rod is connected with the worm, and the bottom end of the sliding rod is hinged to the movable block.
Furthermore, the sliding part comprises a sliding block and a sliding rail, the sliding rail is arranged on the mounting plate, the sliding rail is connected with the sliding block and is in sliding connection with the sliding block, and the sliding block is hinged with the oscillating bar.
Furthermore, the elastic telescopic piece comprises a spring, a guide rod and a guide sleeve, the guide sleeve is embedded in the mounting plate, the guide rod is inserted in the guide sleeve, the guide sleeve is in sliding connection with the guide rod, the guide rod is sleeved with the spring, and the spring is located between the guide sleeve and the pressing plate.
Furthermore, the machine body is provided with an opening and closing door and a control panel.
The utility model has the beneficial effects that: the device can realize automatically polishing ceramic substrate, and it is efficient to polish, and the precision of polishing is high, compresses tightly ceramic substrate through hold-down mechanism when polishing, drives ceramic substrate through the revolving stage mechanism simultaneously and rotates and realize polishing fast, and ceramic substrate damages or removes and the phenomenon that the rejection rate of polishing that leads to is high when avoiding polishing.
Drawings
The figures further illustrate the utility model, but the examples in the figures do not constitute any limitation of the utility model.
Fig. 1 is a schematic view of the internal structure of the present invention.
Fig. 2 is a schematic view of an external mechanism of the present invention.
Detailed Description
The technical solutions of the present invention will be further described below with reference to the accompanying drawings of the embodiments of the present invention, and the present invention is not limited to the following specific embodiments. It should be noted that the embodiments and features of the embodiments may be combined with each other without conflict.
As shown in fig. 1 to 2, a ceramic substrate polishing device comprises a machine body 9, an opening and closing door 23 and a control panel 24 are arranged on the machine body 9, a turntable mechanism and a polishing mechanism are arranged in the machine body 9, the turntable mechanism is used for containing a ceramic substrate and driving the ceramic substrate to rotate, the polishing mechanism is close to the side part of the turntable mechanism, the polishing mechanism is used for automatically polishing the ceramic substrate on the turntable mechanism, a pressing mechanism is arranged in the machine body 9 and used for pressing the ceramic substrate, the pressing mechanism comprises a lifting mechanism, a rotating shaft 19, a mounting plate 16, a swing rod 3, a movable block 4, a sliding part, a pressure plate 6 and an elastic telescopic part, one end of the rotating shaft 19 is rotatably connected with the top wall of the machine body 9, the other end of the rotating shaft 19 is fixedly connected with the mounting plate 16, a lifting mechanism is arranged on the fixed plate, the lifting mechanism is rotatably connected with the movable block 4, the movable block 4 is sleeved on the swing rod 3, and the movable block 4 is slidably connected with the swing rod 3, one end of the swing rod 3 is rotatably connected with a sliding part arranged at the top of the pressing plate 6, the other end of the swing rod 3 is rotatably connected with the bottom of the mounting plate 16, the mounting plate 16 is connected with the pressing plate 6 through an elastic telescopic piece, an elastic pressing sheet 7 is arranged at the bottom of the pressing plate 6, the pressing plate 6 is prevented from being damaged when being pressed tightly, and the elastic pressing sheet 7 plays a role in buffering.
The elastic telescopic piece and the sliding piece are respectively positioned at two ends of the pressing plate 6, and the pressing mechanism is positioned right above the rotating table mechanism.
The grinding mechanism comprises a grinding disc 12 and a second motor 13, the second motor 13 is fixed in the machine body 9 through a motor fixing frame, an output shaft of the second motor 13 is connected with the grinding disc 12, and the grinding disc 12 is close to the side part of the rotating table mechanism.
The rotating platform mechanism comprises a first motor 11, a motor box 10 and a rotating platform 8, the motor box 10 is arranged on the bottom wall of the machine body 9, the first motor 11 is arranged in the motor box 10, an output shaft of the first motor 11 penetrates through the top wall of the motor box 10 to be connected with the rotating platform 8, and the rotating platform 8 is located in the machine body 9 and is located right above the motor box 10.
The lifting mechanism comprises a third motor 20, a worm wheel 22, a guide piece and a worm 21, wherein the third motor 20 is arranged on the mounting plate 16, an output shaft of the third motor 20 is connected with the worm wheel 22, the worm wheel 22 is meshed with the worm 21, the worm 21 is connected with one end of the guide piece, and the other end of the guide piece is rotatably connected with the movable block 4.
The guide piece comprises a sliding sleeve 1 and a sliding rod 2, the sliding sleeve 1 is embedded in the mounting plate 16, the sliding sleeve 1 is internally inserted with the sliding rod 2, the sliding sleeve 1 is in sliding connection with the sliding rod 2, the top end of the sliding rod 2 is connected with the worm 21, and the bottom end of the sliding rod 2 is hinged with the movable block 4.
The sliding part comprises a sliding block 5 and a sliding rail 18, the sliding rail 18 is arranged on the mounting plate 16, the sliding rail 18 is connected with the sliding block 5 and is in sliding connection with the sliding block 5, and the sliding block 5 is hinged with the swing rod 3.
The elastic telescopic piece comprises a spring 14, a guide rod 15 and a guide sleeve 17, the guide sleeve 17 is embedded in the mounting plate 16, the guide rod 15 is inserted in the guide sleeve 17, the guide sleeve 17 is in sliding connection with the guide rod 15, the spring 14 is sleeved on the guide rod 15, and the spring 14 is located between the guide sleeve 17 and the pressing plate 6.
The working principle of the device is as follows: firstly, opening the opening and closing door 23 to place a ceramic substrate on the rotating platform 8, starting the third motor 20, driving the worm wheel 22 to rotate by the third motor 20, driving the worm 21 to move downwards by the worm wheel 22 and driving the slide rod 2 to move downwards along the sliding sleeve 1, driving the slide rod 2 to swing downwards by the movable block 4 when the slide rod 2 moves downwards, driving the slide block 5 to slide along the slide rail 18 and driving the pressing plate 6 to move downwards until the pressing plate 6 is pressed on the ceramic substrate when the slide rod 2 swings downwards, driving the guide rod 15 to slide downwards along the guide sleeve 17 and stretching the spring 14 when the pressing plate 6 moves downwards, and when the pressing plate 6 is pressed, the elastic expansion piece can also play a role in buffering. When clamp plate 6 compresses tightly on ceramic substrate, accomplish the fixed to ceramic substrate, at this moment, start first motor 11, first motor 11 drives and rotates platform 8 and rotate, hold-down mechanism and ceramic substrate all rotate along with rotating platform 8, start second motor 13 this moment, second motor 13 drives and beats mill 12 and rotate and carry out the automation to ceramic substrate and polish, accomplish the automation to ceramic substrate through the above-mentioned operation and polish, it is efficient to polish, fix ceramic substrate through hold-down mechanism, thereby avoid ceramic substrate to remove the precision of polishing when improving and polish. In addition, the ceramic substrate is prevented from being damaged during clamping by elastic clamping of the pressing mechanism. When polishing of the ceramic substrate is completed, the opening and closing door 23 is opened, and the ceramic substrate is taken out. The scraps produced by grinding are all in the machine body 9, so that the condition that the scraps diffuse in a workshop to influence the health of operators is avoided, and the safety of the equipment is improved. In addition, the scraps generated by grinding can be gathered on the bottom wall of the machine body 9, and the scraps generated by grinding can be conveniently cleaned by opening the opening and closing door 23.
The device can realize automatically polishing ceramic substrate, and it is efficient to polish, and the precision of polishing is high, compresses tightly ceramic substrate through hold-down mechanism when polishing, drives ceramic substrate through the revolving stage mechanism simultaneously and rotates and realize polishing fast, and ceramic substrate damages or removes and the phenomenon that the rejection rate of polishing that leads to is high when avoiding polishing.
In summary, the above embodiments are not intended to be limiting embodiments of the present invention, and modifications and equivalent variations made by those skilled in the art based on the spirit of the present invention are within the technical scope of the present invention.
Claims (9)
1. The utility model provides a ceramic substrate grinding device, includes the organism, its characterized in that: be equipped with revolving stage mechanism and grinding machanism in the organism, grinding machanism is close to the lateral part of revolving stage mechanism, be equipped with hold-down mechanism in the organism, hold-down mechanism includes elevating system, pivot, mounting panel, pendulum rod, movable block, slider, clamp plate and elastic expansion piece, pivot one end is rotated with the organism roof and is connected, and the pivot other end and mounting panel fixed connection are equipped with elevating system on the fixed plate, and elevating system rotates with the movable block to be connected, and the movable block cover is on the pendulum rod and movable block and pendulum rod sliding connection, and pendulum rod one end rotates with the slider of establishing at the clamp plate top to be connected, and the other end and the mounting panel bottom of pendulum rod rotate to be connected, and the mounting panel passes through elastic expansion piece and is connected with the clamp plate.
2. The ceramic substrate polishing apparatus as set forth in claim 1, wherein: the elastic telescopic piece and the sliding piece are respectively positioned at two ends of the pressing plate, and the pressing mechanism is positioned right above the rotating table mechanism.
3. The ceramic substrate polishing apparatus as set forth in claim 1, wherein: the polishing mechanism comprises a polishing disc and a second motor, the second motor is fixed in the machine body through a motor fixing frame, an output shaft of the second motor is connected with the polishing disc, and the polishing disc is close to the side part of the rotating table mechanism.
4. The ceramic substrate polishing apparatus as set forth in claim 1, wherein: the rotating platform mechanism comprises a first motor, a motor box and a rotating platform, the motor box is arranged on the bottom wall of the machine body, the first motor is arranged in the motor box, an output shaft of the first motor penetrates through the top wall of the motor box to be connected with the rotating platform, and the rotating platform is located in the machine body and is located right above the motor box.
5. The ceramic substrate polishing apparatus as set forth in claim 1, wherein: the lifting mechanism comprises a third motor, a worm wheel, a guide piece and a worm, the third motor is arranged on the mounting plate, an output shaft of the third motor is connected with the worm wheel, the worm wheel is meshed with the worm, the worm is connected with one end of the guide piece, and the other end of the guide piece is connected with the movable block.
6. The ceramic substrate polishing apparatus as set forth in claim 5, wherein: the guide piece comprises a sliding sleeve and a sliding rod, the sliding sleeve is embedded in the mounting plate, the sliding sleeve is inserted with the sliding rod in a sliding mode, the sliding sleeve is connected with the sliding rod in a sliding mode, the top end of the sliding rod is connected with the worm, and the bottom end of the sliding rod is hinged to the movable block.
7. The ceramic substrate polishing apparatus as set forth in claim 1, wherein: the sliding part comprises a sliding block and a sliding rail, the sliding rail is arranged on the mounting plate, the sliding rail is connected with the sliding block and is in sliding connection with the sliding block, and the sliding block is hinged with the swing rod.
8. The ceramic substrate polishing apparatus as set forth in claim 1, wherein: the elastic telescopic piece comprises a spring, a guide rod and a guide sleeve, the guide sleeve is embedded in the mounting plate, the guide rod is inserted in the guide sleeve, the guide sleeve is in sliding connection with the guide rod, the guide rod is sleeved with the spring, and the spring is located between the guide sleeve and the pressing plate.
9. The ceramic substrate polishing apparatus as set forth in claim 1, wherein: the machine body is provided with an opening and closing door and a control panel.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202121373386.2U CN215470116U (en) | 2021-06-21 | 2021-06-21 | Ceramic substrate grinding device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202121373386.2U CN215470116U (en) | 2021-06-21 | 2021-06-21 | Ceramic substrate grinding device |
Publications (1)
Publication Number | Publication Date |
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CN215470116U true CN215470116U (en) | 2022-01-11 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN202121373386.2U Active CN215470116U (en) | 2021-06-21 | 2021-06-21 | Ceramic substrate grinding device |
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CN (1) | CN215470116U (en) |
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2021
- 2021-06-21 CN CN202121373386.2U patent/CN215470116U/en active Active
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