CN215466227U

CN215466227U - Semiconductor laser chip test fixing device

Info

Publication number: CN215466227U
Application number: CN202122063468.3U
Authority: CN
Inventors: 焦英豪; 毛森; 吴文涛
Original assignee: Lewei Semiconductor Technology Jiaxing Co ltd
Current assignee: Lewei Semiconductor Technology Jiaxing Co ltd
Priority date: 2021-08-30
Filing date: 2021-08-30
Publication date: 2022-01-11
Anticipated expiration: 2031-08-30

Abstract

The utility model relates to the technical field of semiconductor laser chips and discloses a semiconductor laser chip testing and fixing device. Can carry out temporary storage to qualified chip and unqualified chip through pushing mechanism to carry out the classified collection in propelling movement to first receiver and the second receiver, make things convenient for follow-up centralized processing, the drawback that traditional chip can't carry out the classified collection to qualified and defective work after detecting has been solved to this mode, can drive second splint through adjustment mechanism and move to the front side, thereby press from both sides tightly semiconductor laser chip, and the mode through elastic clamping can avoid traditional anchor clamps centre gripping dynamics to cause the damage to semiconductor laser chip too big.

Description

Semiconductor laser chip test fixing device

Technical Field

The utility model relates to the technical field of semiconductor laser chips, in particular to a semiconductor laser chip testing and fixing device.

Background

Semiconductor lasers are the most important class of lasers, are small, long-lived, can be pumped by simple injection of current, are compatible with and therefore monolithically integrated with integrated circuits, and can also be current-modulated directly at frequencies up to GHz to achieve high-speed modulated laser output. Because of these advantages, semiconductor diode lasers have been widely used in laser communication, optical storage, optical gyroscope, laser printing, ranging, radar, etc., the chip is the core component of the semiconductor laser, after the semiconductor laser chip is produced, it is necessary to test its various performances, and during the test, it is necessary to clamp and fix it.

Most of the existing fixing devices are clamped through clamps, and the traditional clamps are rigid clamps, so that the semiconductor laser chip is easily damaged, and meanwhile, the existing semiconductor laser chip is difficult to classify and collect qualified chips and unqualified chips after the existing semiconductor laser chip is fixedly tested. Therefore, a semiconductor laser chip test fixture is provided by those skilled in the art to solve the above problems in the background art.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a semiconductor laser chip testing and fixing device, which can temporarily store qualified chips and unqualified chips through a pushing mechanism, and push the chips into a first storage box and a second storage box for classified collection, so that subsequent centralized processing is facilitated.

In order to achieve the purpose, the utility model provides the following technical scheme:

a semiconductor laser chip testing and fixing device comprises a test board, wherein a first clamping plate is fixedly connected at the corner of the upper surface of the test board, a second clamping plate is installed at the rear side of the first clamping plate, a controller is fixedly connected to the front surface of the test board, a first storage box and a second storage box are fixedly connected to the front surface of the test board, a pushing mechanism is installed on one side of the upper surface of the test board, a mounting box is fixedly connected to the upper surface of the test board, sliding grooves are formed in two sides of the inner wall of the mounting box, and an adjusting mechanism is installed inside the mounting box;

push mechanism includes mounting panel, electric putter, fastening frame, first slide rail, first push pedal, second push pedal and second slide rail, electric putter's one end rigid coupling has the mounting panel, and electric putter's other end rigid coupling has the fastening frame, and the both ends of fastening frame rigid coupling respectively has first push pedal and second push pedal, first slide rail has been cup jointed in the outside activity of first push pedal, and the second slide rail has been cup jointed in the outside activity of second push pedal.

As a still further scheme of the utility model: the mounting plate, the first slide rail and the second slide rail are fixedly connected to the upper surface of the test board.

As a still further scheme of the utility model: the fixed end of the electric push rod is fixedly connected to the mounting plate, and the telescopic end of the electric push rod is fixedly connected to the fastening frame.

As a still further scheme of the utility model: the first sliding rail and the second sliding rail are both U-shaped structures.

As a still further scheme of the utility model: adjustment mechanism includes threaded rod, regulating plate, metal ring, contact plate, spring and links up the pole, the one end screw thread of threaded rod runs through the rear surface of mounting box and is connected with the regulating plate through the bearing rotation, and the front side department of regulating plate installs the contact plate, and the rigid coupling has three metal ring between regulating plate and the contact plate, and the equal rigid coupling in front surface both sides of contact plate has the pole that links up, is connected with the spring between contact plate and the mounting box.

As a still further scheme of the utility model: the joint rod movably penetrates through the front surface of the mounting box and is fixedly connected to the rear surface of the second clamping plate.

As a still further scheme of the utility model: the contact plate is movably installed in the installation box, and one end of the spring is connected to the interior of the installation box.

As a still further scheme of the utility model: the both sides of regulating plate all the rigid coupling have the slider, slider sliding connection is in the inside of spout.

Compared with the prior art, the utility model has the beneficial effects that:

1. qualified chips and unqualified chips can be temporarily stored through the pushing mechanism and pushed into the first storage box and the second storage box for classified collection, so that subsequent centralized processing is facilitated, the defect that qualified and unqualified products cannot be classified and collected after traditional chip detection is overcome, and the practicability is high;

2. can drive the second splint through adjustment mechanism and move to the front side to press from both sides tightly semiconductor laser chip, prevent that it from appearing not hard up influence when detecting and detecting the precision, this adjustment mechanism can adjust the centre gripping dynamics of second splint according to actual need simultaneously, and the mode through elasticity centre gripping can avoid traditional anchor clamps centre gripping dynamics to cause the damage to semiconductor laser chip excessively.

Drawings

FIG. 1 is a schematic structural diagram of a semiconductor laser chip test fixture;

FIG. 2 is a schematic structural diagram of a pushing mechanism in a semiconductor laser chip testing fixture;

fig. 3 is a schematic structural diagram of an adjusting mechanism in a semiconductor laser chip testing and fixing device.

In the figure: 1. mounting a box; 2. a second splint; 3. a first splint; 4. a controller; 5. a test bench; 6. a first storage box; 7. a second storage box; 8. mounting a plate; 9. an electric push rod; 10. a fastening frame; 11. a first slide rail; 12. a first push plate; 13. a second push plate; 14. a second slide rail; 15. a pushing mechanism; 16. a chute; 17. a threaded rod; 18. an adjusting plate; 19. a metal ring; 20. a contact plate; 21. a spring; 22. a connecting rod; 23. an adjustment mechanism.

Detailed Description

Example 1

Referring to fig. 1 and 2, a semiconductor laser chip testing and fixing device includes a testing table 5, a first clamping plate 3 is fixedly connected to a corner of an upper surface of the testing table 5, a second clamping plate 2 is installed at a rear side of the first clamping plate 3, a controller 4 is fixedly connected to a front surface of the testing table 5, a first storage box 6 and a second storage box 7 are further fixedly connected to the front surface of the testing table 5, a pushing mechanism 15 is installed at one side of the upper surface of the testing table 5, the pushing mechanism 15 includes a mounting plate 8, an electric push rod 9, a fastening frame 10, a first slide rail 11, a first push plate 12, a second push plate 13 and a second slide rail 14, the mounting plate 8 is fixedly connected to one end of the electric push rod 9, the fastening frame 10 is fixedly connected to the other end of the electric push rod 9, the first push plate 12 and the second push plate 13 are respectively fixedly connected to two ends of the fastening frame 10, the first push plate 12 is movably sleeved to the first slide rail 11, the second push plate 13 is movably sleeved to the outside, mounting panel 8, the equal rigid coupling of first slide rail 11 and second slide rail 14 is at the upper surface of testboard 5, electric putter 9's stiff end rigid coupling is on mounting panel 8, and electric putter 9's flexible end rigid coupling is on fastening frame 10, first slide rail 11 and second slide rail 14 are "U" type structure, can carry out temporary storage to qualified chip and unqualified chip through push mechanism 15, and carry out categorised collection in propelling movement to first receiver 6 and the second receiver 7, make things convenient for follow-up centralized processing, the drawback that traditional chip detected the back and can't carry out categorised collection to qualified and unqualified product has been solved to this mode, therefore, the clothes hanger is strong in practicability.

In fig. 1 and 3, a mounting box 1 is further fixedly connected to the upper surface of the test platform 5, sliding grooves 16 are formed in both sides of the inner wall of the mounting box 1, an adjusting mechanism 23 is further installed inside the mounting box 1, the adjusting mechanism 23 includes a threaded rod 17, an adjusting plate 18, a metal ring 19, a contact plate 20, a spring 21 and an engaging rod 22, one end of the threaded rod 17 penetrates through the rear surface of the mounting box 1 and is rotatably connected with the adjusting plate 18 through a bearing, a contact plate 20 is installed at the front side of the adjusting plate 18, three metal rings 19 are fixedly connected between the adjusting plate 18 and the contact plate 20, two sides of the front surface of the contact plate 20 are fixedly connected with the engaging rod 22, the spring 21 is connected between the contact plate 20 and the mounting box 1, the engaging rod 22 movably penetrates through the front surface of the mounting box 1 and is fixedly connected to the rear surface of the second clamping plate 2, the contact plate 20 is movably installed inside the mounting box 1, one end of the spring 21 is connected inside the mounting box 1, the equal rigid coupling in both sides of regulating plate 18 has the slider, slider sliding connection is in the inside of spout 16, can drive second splint 2 through adjustment mechanism 23 and remove to the front side, thereby press from both sides tightly semiconductor laser chip, prevent that it from appearing not hard up influence when examining and detecting the precision, this adjustment mechanism 23 can adjust the centre gripping dynamics of second splint 2 according to actual need simultaneously, and the mode through the elasticity centre gripping can avoid traditional anchor clamps centre gripping dynamics to cause the damage to semiconductor laser chip excessively.

When the device is used, a semiconductor laser chip is placed between the first clamping plate 3 and the second clamping plate 2, then the threaded rod 17 is held by a hand to rotate forwards, the adjusting plate 18 can be driven to move forwards, on one hand, the metal ring 19 can be pressed and deformed, the contact plate 20 can be driven to move forwards after the metal ring 19 deforms, the spring 21 is further pressed and deformed, and finally, the connecting rod 22 and the second clamping plate 2 are driven to move forwards, so that the semiconductor laser chip is clamped, the metal ring 19 and the spring 21 can be gradually restored to the original state through the reverse rotation of the threaded rod 17, the clamping force of the second clamping plate 2 is reduced, so that the second clamping plate 2 can be driven to move forwards through the adjusting mechanism 23, the semiconductor laser chip is clamped, the semiconductor laser chip is prevented from being loosened during detection, the detection accuracy is prevented, and meanwhile, the adjusting mechanism 23 can adjust the clamping force of the second clamping plate 2 according to actual needs, the semiconductor laser chip can be prevented from being damaged due to overlarge clamping force of a traditional clamp by an elastic clamping mode, the semiconductor laser chip can be normally tested after being fixed, after the test is finished, qualified products are placed in the first slide rail 11, unqualified products are placed in the second slide rail 14, the controller 4 controls the electric push rod 9 to extend, the fastening frame 10 can be driven to move forwards at the moment, the first push plate 12 and the second push plate 13 are driven to move forwards, so that the qualified products in the first slide rail 11 are pushed into the first storage box 6, the unqualified products in the second slide rail 14 are pushed into the second storage box 7, the qualified chips and the unqualified chips can be temporarily stored by the pushing mechanism 15 and pushed into the first storage box 6 and the second storage box 7 for classified collection, the subsequent centralized processing is convenient, and the defect that the qualified products and the unqualified products cannot be classified collection after the traditional chip detection is overcome, the practicability is strong.

The foregoing shows and describes the general principles, essential features, and advantages of the utility model. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the utility model as claimed.

Claims

1. The semiconductor laser chip testing and fixing device comprises a testing table (5), wherein a first clamping plate (3) is fixedly connected to the corner of the upper surface of the testing table (5), and a second clamping plate (2) is installed on the rear side of the first clamping plate (3), and is characterized in that a controller (4) is fixedly connected to the front surface of the testing table (5), a first storage box (6) and a second storage box (7) are further fixedly connected to the front surface of the testing table (5), a pushing mechanism (15) is installed on one side of the upper surface of the testing table (5), a mounting box (1) is further fixedly connected to the upper surface of the testing table (5), sliding grooves (16) are formed in two sides of the inner wall of the mounting box (1), and an adjusting mechanism (23) is further installed inside the mounting box (1);

push mechanism (15) are including mounting panel (8), electric putter (9), fastening frame (10), first slide rail (11), first push pedal (12), second push pedal (13) and second slide rail (14), the one end rigid coupling of electric putter (9) has mounting panel (8), and the other end rigid coupling of electric putter (9) has fastening frame (10), and the both ends of fastening frame (10) are the rigid coupling respectively have first push pedal (12) and second push pedal (13), first slide rail (11) have been cup jointed in the outside activity of first push pedal (12), and second slide rail (14) have been cup jointed in the outside activity of second push pedal (13).

2. The semiconductor laser chip test fixture according to claim 1, wherein the mounting plate (8), the first slide rail (11) and the second slide rail (14) are all fixedly connected to the upper surface of the test table (5).

3. The semiconductor laser chip test fixing device according to claim 1, wherein a fixed end of the electric push rod (9) is fixedly connected to the mounting plate (8), and a telescopic end of the electric push rod (9) is fixedly connected to the fastening frame (10).

4. The semiconductor laser chip testing fixture according to claim 1, wherein the first rail (11) and the second rail (14) are u-shaped structures.

5. The semiconductor laser chip test fixing device of claim 1, wherein the adjusting mechanism (23) comprises a threaded rod (17), an adjusting plate (18), metal rings (19), a contact plate (20), a spring (21) and a joint rod (22), one end of the threaded rod (17) penetrates through the rear surface of the mounting box (1) and is connected with the adjusting plate (18) in a rotating mode through a bearing, the contact plate (20) is mounted at the front side of the adjusting plate (18), the three metal rings (19) are fixedly connected between the adjusting plate (18) and the contact plate (20), the joint rod (22) is fixedly connected to two sides of the front surface of the contact plate (20), and the spring (21) is connected between the contact plate (20) and the mounting box (1).

6. A semiconductor laser chip test fixture according to claim 5, characterized in that the joint rod (22) movably penetrates the front surface of the mounting box (1) and is fixedly connected to the rear surface of the second clamping plate (2).

7. A semiconductor laser chip test fixture according to claim 5, characterized in that said contact plate (20) is movably mounted inside the mounting box (1), and one end of the spring (21) is connected inside the mounting box (1).

8. A semiconductor laser chip test fixture according to claim 5, wherein the adjusting plate (18) is fixed with sliding blocks at both sides, and the sliding blocks are slidably connected inside the sliding grooves (16).