CN215440747U

CN215440747U - Circuit board electroplating system

Info

Publication number: CN215440747U
Application number: CN202122294637.4U
Authority: CN
Inventors: 张艳梅; 郭春花; 张国华; 周海艳
Original assignee: Jiangxi Huajiafu Circuit Co ltd
Current assignee: Jiangxi Huajiafu Circuit Co ltd
Priority date: 2021-09-22
Filing date: 2021-09-22
Publication date: 2022-01-07
Anticipated expiration: 2031-09-22

Abstract

The utility model discloses a circuit board electroplating system, which belongs to the technical field of circuit board processing and comprises a cooling box, wherein a heat insulation box is arranged outside the cooling box, the upper surface of the heat insulation box is fixedly connected with the lower surface of a gas collecting plate, the upper surface of the inner wall of the cooling box is connected with five circulating pipes in a clamping manner, and the top ends of the circulating pipes are communicated with the lower surface of the gas collecting plate. This circuit board electroplating system, through being provided with the aeration board, the air-collecting plate, circulating pipe and aeration board, utilize the air pump to transmit the cooling tank inside with the aeration board that the air set up through aeration board lower surface, carry out aeration treatment to the plating solution, make the plating solution tumble, thereby make the plating solution and the surface of cooling tube can even contact, the cooling efficiency to the plating solution has been improved, then through circulating pipe and air-collecting plate with the inside air recovery of cooling tank, make the inside air cycle of cooling tank, avoid containing acidic gas to discharge in the middle of the operational environment, thereby guarantee operational environment's health.

Description

Circuit board electroplating system

Technical Field

The utility model belongs to the technical field of circuit board processing, and particularly relates to a circuit board electroplating system.

Background

Electroplating is a process of plating a thin layer of other metals or alloys on the surface of some metals by using the principle of electrolysis, and is a process of attaching a layer of metal film on the surface of a metal or other material product by using the action of electrolysis, thereby having the effects of preventing metal oxidation (such as corrosion), improving wear resistance, conductivity, light reflection, corrosion resistance (such as copper sulfate and the like), enhancing the appearance and the like.

Among the present electroplating system, because the plating solution passes through the reason of electric current for a long time, the temperature of plating solution will rise, the temperature rise of plating solution just can lead to the unstable phenomenon to appear in the plating solution, thereby influence whole electroplating's quality, and then need reduce the temperature of plating solution to certain temperature range just can carry out next round of electroplating work, just can guarantee electroplating's normal clear, traditional cooling device plating solution and the unable even contact of cooling tube, thereby lead to cooling efficiency lower, the cooling effect is not good, influence whole electroplating's quality.

SUMMERY OF THE UTILITY MODEL

Technical problem to be solved

In order to overcome the defects in the prior art, the utility model provides a circuit board electroplating system, which solves the problems that the traditional cooling device cannot uniformly contact electroplating liquid with a cooling pipe, so that the cooling efficiency is low, the cooling effect is poor, and the whole electroplating quality is influenced.

(II) technical scheme

In order to achieve the purpose, the utility model provides the following technical scheme: a circuit board electroplating system comprises a cooling box, wherein an insulation box is arranged outside the cooling box, the upper surface of the insulation box is fixedly connected with the lower surface of an air collecting plate, the upper surface of the inner wall of the cooling box is connected with five circulating pipes in a clamping manner, the top ends of the circulating pipes are communicated with the lower surface of the air collecting plate, the upper surface of the inner wall of the cooling box is fixedly connected with an aeration plate, the lower surface of the aeration plate is fixedly connected with six aeration pipes, the upper surface of the air collecting plate is fixedly connected with the bottom end of an air pump, the input end of the air pump is communicated with the upper surface of the air collecting plate, the input end of the air pump is fixedly connected with a conveying pipe, the left side surface of the inner wall of the cooling box and the right side surface of the inner wall of the cooling box are fixedly connected with the same cooling pipe, the left end and the right end of the cooling pipe are fixedly connected with cooling connecting pipes, and the lower surface of the insulation box is fixedly connected with the upper surface of a cooling mechanism, and one ends of the two cooling connecting pipes, which are close to each other, are fixedly connected with the input end and the output end of the cooling mechanism respectively.

As a further scheme of the utility model: the right side face of the heat insulation box is fixedly connected with a temperature display, and the left end of the temperature display penetrates through the outer surfaces of the heat insulation box and the cooling box and is located inside the cooling box.

As a further scheme of the utility model: the cooling pipe is in a curve shape, and a heat-insulation filling layer is arranged between the cooling box and the heat-insulation box.

As a further scheme of the utility model: the output end of the conveying pipe penetrates through the upper surfaces of the air collecting plate, the heat preservation box and the cooling box to be communicated with the aeration plate, and supporting bottom plates are fixedly connected to four corners of the lower surface of the heat preservation box.

As a further scheme of the utility model: and electroplating liquid pipes are clamped on the left side surface and the right side surface of the heat preservation box, and the left ends of the electroplating liquid pipes are communicated with the cooling box.

As a further scheme of the utility model: the inner wall of the cooling pipe is provided with an arc-shaped plate, and the arc-shaped plate is arc-shaped.

(III) advantageous effects

Compared with the prior art, the utility model has the beneficial effects that:

1. this circuit board electroplating system, through being provided with the aeration board, the gas collection board, the conveyer pipe, circulating pipe and aeration pipe, utilize the air pump to transmit the cooling tank inside with the aeration pipe that the air set up through aeration board lower surface, carry out aeration treatment to the plating solution, make the plating solution tumble, thereby make the plating solution and the surface of cooling pipe can even contact, the cooling efficiency to the plating solution has been improved, then through circulating pipe and gas collection board with the inside air recovery of cooling tank, make the inside air cycle of cooling tank, avoid containing acidic gas to discharge in the middle of the operational environment, thereby guarantee operational environment's health.

2. This circuit board electroplating system, through being provided with the cooling tube, because the shape of cooling tube is the curve form to increased the time that the coolant liquid flowed in the cooling tube, improved the area of contact of cooling tube and plating solution, reinforcing cooling effect.

3. This circuit board electroplating system, through being provided with the arc, utilize the arc to make the coolant liquid roll in the cooling tube to make the coolant liquid can be even with the contact of cooling tube inner wall, the effectual cooling effect who utilizes the coolant liquid improves cooling efficiency.

Drawings

FIG. 1 is a schematic structural view of a front view cross section of the present invention;

FIG. 2 is an enlarged schematic view of the gas collector of the present invention;

FIG. 3 is a schematic structural view of a front cross section of a cooling pipe of the present invention;

in the figure: 1 cooling box, 2 heat preservation boxes, 3 temperature displays, 4 heat preservation filling layers, 5 cooling pipes, 6 cooling connecting pipes, 7 cooling mechanisms, 8 aeration plates, 9 air collecting plates, 10 air pumps, 11 conveying pipes, 12 circulating pipes, 13 aeration pipes, 14 electroplating liquid pipes, 15 supporting bottom plates and 16 arc-shaped plates.

Detailed Description

The technical solution of the present patent will be described in further detail with reference to the following embodiments.

As shown in fig. 1-3, the present invention provides a technical solution: a circuit board electroplating system comprises a cooling box 1, wherein an insulation box 2 is arranged outside the cooling box 1, the upper surface of the insulation box 2 is fixedly connected with the lower surface of a gas collecting plate 9, the upper surface of the inner wall of the cooling box 1 is connected with five circulating pipes 12 in a clamping manner, the top ends of the circulating pipes 12 are communicated with the lower surface of the gas collecting plate 9, the upper surface of the inner wall of the cooling box 1 is fixedly connected with an aeration plate 8, the lower surface of the aeration plate 8 is fixedly connected with six aeration pipes 13, the upper surface of the gas collecting plate 9 is fixedly connected with the bottom end of an air pump 10, the input end of the air pump 10 is communicated with the upper surface of the gas collecting plate 9, the input end of the air pump 10 is fixedly connected with a conveying pipe 11, the left side surface of the inner wall of the cooling box 1 and the right side surface of the inner wall are fixedly connected with the same cooling pipe 5, the left end and the right end of the cooling pipe 5 are fixedly connected with a cooling connecting pipe 6, the lower surface of the insulation box 2 is fixedly connected with the upper surface of a cooling mechanism 7, the one end that two cooling connecting pipes 6 are close to each other respectively with cooling body 7's input and output fixed connection, through being provided with aeration plate 8, gas collection board 9, conveyer pipe 11, circulating pipe 12 and aeration pipe 13, utilize air pump 10 to transmit the air to the cooling tank 1 inside through aeration pipe 13 that aeration plate 8 lower surface set up, carry out aeration treatment to the plating solution, make the plating solution tumble, thereby make the plating solution and the surface of cooling tube 5 can even contact, the cooling efficiency to the plating solution has been improved, then through circulating pipe 12 and gas collection board 9 with the inside air recovery of cooling tank 1, make the inside air circulation of cooling tank 1, avoid containing in the middle of the acidic gas discharges operational environment, thereby guarantee operational environment's health.

Specifically, as shown in fig. 1 and 2, a temperature display 3 is fixedly connected to the right side surface of the heat insulation box 2, the left end of the temperature display 3 penetrates through the outer surfaces of the heat insulation box 2 and the cooling box 1 and is located inside the cooling box 1, the cooling pipe 5 is in a curved shape, a heat insulation filling layer 4 is arranged between the cooling box 1 and the heat insulation box 2, the heat insulation filling layer is made of polyurethane foam, and by arranging the cooling pipe 5, the shape of the cooling pipe 5 is in a curved shape, so that the time for the cooling liquid to flow in the cooling pipe 5 is increased, the contact area between the cooling pipe 5 and the electroplating liquid is increased, and the cooling effect is enhanced.

Specifically, as shown in fig. 3, the output end of the conveying pipe 11 passes through the gas collecting plate 9, the upper surfaces of the heat preservation box 2 and the cooling box 1 are communicated with the aeration plate 8, the four corners of the lower surface of the heat preservation box 2 are fixedly connected with the supporting bottom plates 15, the left side and the right side of the heat preservation box 2 are respectively connected with the electroplating liquid pipe 14, the left end of the electroplating liquid pipe 14 is communicated with the cooling box 1, the inner wall of the cooling pipe 5 is provided with an arc-shaped plate 16, the arc-shaped plate 16 is arc-shaped, and the arc-shaped plate 16 is used for enabling the cooling liquid to roll in the cooling pipe 5, so that the cooling liquid can be uniformly contacted with the inner wall of the cooling pipe 5, the cooling effect of the cooling liquid is effectively utilized, and the cooling efficiency is improved.

The working principle of the utility model is as follows:

s1, when the cooling device is in use, the cooling mechanism 7 continuously cools and circulates the cooling liquid in the cooling pipe 5, the plating liquid is cooled by the contact of the plating liquid with the outer surface of the cooling pipe 5, and the temperature change of the plating liquid can be observed through the temperature display 3;

s2, transferring air into the cooling box 1 through the aeration pipe 13 arranged on the lower surface of the aeration plate 8 by the air pump 10, aerating the plating solution to make the plating solution tumble so that the plating solution can uniformly contact with the outer surface of the cooling pipe 5, and then recovering the air in the cooling box 1 through the circulation pipe 12 and the air collection plate 9 to circulate the air in the cooling box 1.

In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art through specific situations.

Although the preferred embodiments of the present patent have been described in detail, the present patent is not limited to the above embodiments, and various changes can be made without departing from the spirit of the present patent within the knowledge of those skilled in the art.

Claims

1. The utility model provides a circuit board electroplating system, includes cooler bin (1), its characterized in that: the cooling box is characterized in that an insulation box (2) is arranged outside the cooling box (1), the upper surface of the insulation box (2) is fixedly connected with the lower surface of the gas collecting plate (9), five circulating pipes (12) are connected to the upper surface of the inner wall of the cooling box (1) in a clamping manner, the top ends of the circulating pipes (12) are communicated with the lower surface of the gas collecting plate (9), an aeration plate (8) is fixedly connected to the upper surface of the inner wall of the cooling box (1), six aeration pipes (13) are fixedly connected to the lower surface of the aeration plate (8), the upper surface of the gas collecting plate (9) is fixedly connected with the bottom end of an air pump (10), the input end of the air pump (10) is communicated with the upper surface of the gas collecting plate (9), the input end of the air pump (10) is fixedly connected with a conveying pipe (11), the left side surface of the inner wall of the cooling box (1) and the right side surface of the inner wall are fixedly connected with the same cooling pipe (5), the left end and the right end of the cooling pipe (5) are fixedly connected with cooling connecting pipes (6), the lower surface of the heat preservation box (2) is fixedly connected with the upper surface of the cooling mechanism (7), and one ends, close to each other, of the two cooling connecting pipes (6) are fixedly connected with the input end and the output end of the cooling mechanism (7) respectively.

2. A circuit board plating system according to claim 1, wherein: the right side face of the heat preservation box (2) is fixedly connected with a temperature display (3), and the left end of the temperature display (3) penetrates through the outer surfaces of the heat preservation box (2) and the cooling box (1) and is located inside the cooling box (1).

3. A circuit board plating system according to claim 1, wherein: the cooling pipe (5) is in a curve shape, and a heat-preservation filling layer (4) is arranged between the cooling box (1) and the heat-preservation box (2).

4. A circuit board plating system according to claim 1, wherein: the output end of the conveying pipe (11) penetrates through the upper surfaces of the air collecting plate (9), the heat preservation box (2) and the cooling box (1) to be communicated with the aeration plate (8), and supporting bottom plates (15) are fixedly connected to four corners of the lower surface of the heat preservation box (2).

5. A circuit board plating system according to claim 1, wherein: and electroplating liquid pipes (14) are clamped on the left side surface and the right side surface of the heat preservation box (2), and the left ends of the electroplating liquid pipes (14) are communicated with the cooling box (1).

6. A circuit board plating system according to claim 1, wherein: the inner wall of the cooling pipe (5) is provided with an arc-shaped plate (16), and the arc-shaped plate (16) is arc-shaped.