CN215420953U

CN215420953U - PCB stress protection structure

Info

Publication number: CN215420953U
Application number: CN202121323436.6U
Authority: CN
Inventors: 彭维萍
Original assignee: Yunjian Information Technology Co ltd
Current assignee: Yunjian Information Technology Co ltd
Priority date: 2021-06-15
Filing date: 2021-06-15
Publication date: 2022-01-04
Anticipated expiration: 2031-06-15

Abstract

The utility model provides a PCB stress protection structure which comprises a PCB, wherein a BGA chip and a screw hole are arranged on the PCB, and a stress protection groove penetrating through the PCB is arranged between the BGA chip and the screw hole on the PCB. The utility model can change the transmission path of the stress to the target device by slotting in the proper position between the stress sensitive device (BGA chip, ceramic capacitor, etc.) and the stress source (connector, screw hole, etc.), thereby achieving the purpose of dissipating the stress greatly, ensuring that the stress sensitive device is not damaged, solving the high-density design requirement of the PCB, having strong practicability in the PCB design, providing excellent stress protection effect, combining the flexible application of the PCB design condition, greatly reducing the layout constraint of the stress sensitive device, and bringing greater flexibility for the layout of the stress devices such as the BGA chip, etc.

Description

PCB stress protection structure

Technical Field

The utility model belongs to the field of PCBs, and particularly relates to a PCB stress protection structure.

Background

Mechanical stress is usually caused in the processes of assembly, plugging, transferring, transportation and the like of the single board, and if the PCB is not concerned in design, a stress sensitive device on the single board and the PCB can be caused to have failure or potential hidden trouble in practical application. In general, the usual design approach is to maintain a sufficient safety distance between the stress sensitive devices (typically ceramic capacitors and BGA chips) and the stress sources (e.g., screw holes, connectors) and to attenuate the magnitude of the pre-production stress. However, not all single boards have enough space to ensure the conventional stress protection design, and especially under the trend of miniaturization and high density of products, the problem of stress protection becomes more and more troublesome.

The current stress protection schemes mainly comprise 2 types, respectively: 1. enlarging the design distance between the stress sensitive device and the stress source; 2. and adding a structural member on the back surface of the PCB corresponding to the BGA chip to reinforce the PCB. The first solution has a disadvantage of difficulty in implementing a high-density PCB design, requiring a larger PCB area and higher PCB cost, and the second solution has a disadvantage of increasing the cost of the structural members, which occupy the layout space on the reverse side of the PCB.

SUMMERY OF THE UTILITY MODEL

In order to solve the technical problem, the utility model provides a PCB stress protection structure.

The technical scheme of the utility model is as follows:

the utility model provides a PCB stress protection structure, includes the PCB board, is provided with BGA chip and screw hole on the PCB board, and the position department between BGA chip and the screw hole on the PCB board is provided with the stress protection groove that runs through the PCB board.

The stress protection groove is a stress protection groove A, the stress protection groove A is provided with 1 strip, the stress protection groove A is linear, and the stress protection groove A is parallel to the edge of the BGA chip.

The stress protection groove is a stress protection groove B, the number of the stress protection grooves B is 2, the stress protection grooves B are crescent-shaped, and the crescent directions of the 2 stress protection grooves B are opposite.

The utility model has the following beneficial effects: according to the PCB stress protection structure, the grooving design is carried out at a proper position between the stress sensitive device (BGA chip, ceramic capacitor and the like) and the stress source (connector, screw hole and the like), so that the transmission path of the stress to the target device can be changed, the purpose of greatly dissipating the stress is achieved, the stress sensitive device is ensured not to be damaged, the high-density design requirement of the PCB can be met, the PCB has high practicability in the design, the excellent stress protection effect can be provided, the PCB can be flexibly applied by combining with the design condition of the PCB, the layout constraint of the stress sensitive device is greatly reduced, and the greater flexibility is brought to the layout of the stress devices such as the BGA chip and the like.

Drawings

FIG. 1 is a schematic top view of a first embodiment of the present invention;

FIG. 2 is a schematic top view of a second embodiment of the present invention;

in the figure, 1-PCB board; 2-BGA chip; 3-screw holes; 4-stress protection groove A; and 5, a stress protection groove B.

Detailed Description

The present invention will be described in detail with reference to the accompanying drawings.

Referring to fig. 1, a first embodiment of the present invention is a stress protection structure for a PCB, including a PCB 1, a BGA chip 2 and a screw hole 3 are disposed on the PCB 1, a stress protection groove a4 penetrating the PCB 1 is disposed at a position between the BGA chip 2 and the screw hole 3 on the

PCB

1, 1 stress protection groove a4 is provided, a stress protection groove a4 is linear, and a stress protection groove a4 is parallel to an edge of the BGA chip 2. The embodiment can be suitable for the condition that the distance between the stress sensitive device and the stress source is small, the stress can be greatly offset, the stress sensitive device is ensured not to be damaged, and the high-density design requirement of the PCB can be met.

Referring to fig. 2, a second embodiment of the present invention, a stress protection structure for a PCB, includes a PCB 1, a BGA chip 2 and a screw hole 3 are disposed on the PCB 1, a stress protection groove B5 penetrating through the PCB 1 is disposed at a position between the BGA chip 2 and the screw hole 3 on the

PCB

1, 2 stress protection grooves B5 are provided, the stress protection groove B5 is crescent-shaped, and the crescent directions of the 2 stress protection grooves B5 are opposite. The embodiment can be suitable for the condition that the distance between the stress sensitive device and the stress source is large, and through experiments, the stress can be counteracted to the greatest extent by the 2 crescent stress protection grooves B with opposite directions on the premise of ensuring the stable structure.

The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the utility model, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are included in the scope of the present invention.

Claims

1. The utility model provides a PCB stress protection structure, includes PCB board (1), is provided with BGA chip (2) and screw hole (3) on PCB board (1), and the position department between BGA chip (2) and screw hole (3) on its characterized in that PCB board (1) is provided with the stress protection groove that runs through PCB board (1).

2. A stress protection structure for PCB as claimed in claim 1, wherein said stress protection groove is stress protection groove a (4), said stress protection groove a (4) has 1, said stress protection groove a (4) is linear, said stress protection groove a (4) is parallel to the edge of BGA chip (2).

3. A stress protection structure for PCB according to claim 1, wherein said stress protection groove is stress protection groove B (5), said stress protection groove B (5) has 2 strips, said stress protection groove B (5) is crescent-shaped, and the crescent directions of 2 stress protection grooves B (5) are opposite.