CN215420696U - Microphone positioning structure and earphone - Google Patents
Microphone positioning structure and earphone Download PDFInfo
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- CN215420696U CN215420696U CN202121668482.XU CN202121668482U CN215420696U CN 215420696 U CN215420696 U CN 215420696U CN 202121668482 U CN202121668482 U CN 202121668482U CN 215420696 U CN215420696 U CN 215420696U
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- microphone
- circuit board
- positioning structure
- flexible circuit
- diaphragm
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Abstract
The utility model belongs to the technical field of earphone equipment, and particularly relates to a microphone positioning structure and an earphone with the microphone positioning structure. The microphone positioning structure of the embodiment comprises a loudspeaker, a flexible circuit board and a microphone single body, wherein the loudspeaker comprises a loudspeaker shell body formed with a containing cavity, a sound outlet hole and an outwards extending end are formed in the end face of one end of the loudspeaker shell body, at least part of the flexible circuit board is arranged in the containing cavity, one end of the flexible circuit board extends out of the end face of one end of the loudspeaker shell body, the microphone single body is electrically connected with one end of the flexible circuit board, and at least one of the microphone single body and one end of the flexible circuit board is connected with the extending end. According to the microphone positioning structure, the sound-emitting noise of the loudspeaker can be reduced or eliminated, meanwhile, the loudspeaker shell and the flexible circuit board are integrally sealed in the earphone assembling process, and the process complexity in the earphone assembling process is reduced.
Description
Technical Field
The utility model belongs to the technical field of earphone equipment, and particularly relates to a microphone positioning structure and an earphone with the microphone positioning structure.
Background
With the development of intelligent audio technology, numerous TWS (bluetooth headset), head-wearing and wired headset products with active noise reduction function appear in the market. Specifically, the active noise reduction generally includes a feed forward (feed forward), a Feedback (Feedback), and a hybrid (feed forward + Feedback) noise reduction method according to the acquisition mode of the noise signal.
For the TWS earphone product, the whole volume is small, the internal space is tight, and especially for the TWS earphone product adopting feedback or mixed noise reduction, the front cavity sealing not only has the sealing between the loudspeaker and the shell, but also needs to consider the arrangement of the feedback microphone in the front cavity and the sealing of the route leading the related circuit into the main board of the rear cavity. This requires special features to be machined into the housing or separate parts designed to achieve the microphone attachment within the front cavity and additional process concerns regarding the feedback microphone line seal. The arrangement mode of the feedback microphone in the front cavity is that a slot is specially designed on the front shell of the earphone, an FPC (Flexible Printed Circuit) of the feedback microphone (also called a Flexible Circuit board) is introduced into the rear cavity through a loudspeaker sealing surface, and extra glue is needed to be dispensed to completely seal the rear cavity, so that the risk and the cost of a product on a part layer and final assembly are increased.
SUMMERY OF THE UTILITY MODEL
The utility model aims to at least solve the problem that the sealing surface between the loudspeaker shell and the earphone shell needs additional sealing due to the flexible circuit board of the feedback microphone.
A first aspect of the present invention provides a microphone positioning structure, including:
the loudspeaker comprises a loudspeaker shell body formed with an accommodating cavity, and the end face of one end of the loudspeaker shell body is provided with a sound outlet and an outward extending end;
at least part of the flexible circuit board is arranged in the accommodating cavity, and one end of the flexible circuit board extends out of the end face of one end of the loudspeaker shell;
the microphone single body is electrically connected with one end of the flexible circuit board, and at least one of the microphone single body and the one end of the flexible circuit board is connected with the extending end.
According to the microphone positioning structure of the utility model, the extending end extending outwards is arranged on the end face of one end of the loudspeaker shell provided with the sound outlet hole, the microphone monomer is electrically connected with one end of the flexible circuit board, and at least one of the microphone monomer and the one end of the flexible circuit board is connected with the extending end, so that the microphone monomer is fixed in the sound outlet direction of the loudspeaker through the extending end, the sound outlet of the loudspeaker is subjected to noise collection and feedback through the microphone monomer, the sound outlet noise of the loudspeaker is reduced or eliminated according to the feedback information of the microphone monomer, the sound quality of the loudspeaker is improved, meanwhile, at least part of the flexible circuit board is arranged in the accommodating cavity, one end of the flexible circuit board extends out of the end face of the one end of the loudspeaker shell, and the sealing performance between the loudspeaker shell and the earphone shell when the loudspeaker shell is assembled is not influenced, the loudspeaker shell and the flexible circuit board are integrally sealed in the earphone assembling process, so that the sound quality of the earphone is guaranteed, the loudspeaker shell and the earphone shell do not need to be sealed again between sealing surfaces, and the process complexity in the earphone assembling process is reduced.
In addition, the microphone positioning structure according to the present invention may further have the following additional technical features:
in some embodiments of the present invention, the flexible circuit board includes a first connecting portion, a mounting portion and a second connecting portion, which are sequentially disposed, the mounting portion is disposed in the accommodating cavity and is adapted to a partial structure in the accommodating cavity, one end of the first connecting portion extends out of an end surface of the one end of the speaker housing and is electrically connected to the microphone unit, and one end of the second connecting portion extends out of the other end of the speaker housing and is electrically connected to the noise reduction circuit.
In some embodiments of the present invention, the first connection portion includes a first connection plate and a second connection plate, the first connection plate and the second connection plate together form an L-shaped structure, the first connection plate is attached to an inner wall surface of the accommodation cavity, and the second connection plate extends out of an end surface of the one end of the speaker housing and is electrically connected to the microphone unit.
In some embodiments of the present invention, the one end of the second connection portion is spaced by a first connection location and a second connection location, the first connection location is electrically connected to the noise reduction circuit, and the second connection location is electrically connected to a diaphragm of a speaker.
In some embodiments of the utility model, the mounting portion is of arcuate configuration and is adapted to fit a portion of the inner wall surface of the speaker housing.
In some embodiments of the present invention, the one end of the flexible printed circuit board is attached to the protruding end by gluing, and the microphone unit is connected to the protruding end through the flexible printed circuit board.
In some embodiments of the present invention, the speaker further includes a diaphragm and a diaphragm holder disposed in the accommodating cavity, the diaphragm is connected to the diaphragm holder and disposed opposite to the sound outlet, and at least a portion of the flexible circuit board is disposed between an outer peripheral wall of the diaphragm holder and an inner peripheral wall of the speaker housing.
In some embodiments of the present invention, the number of the sound outlet holes is one, and the flexible printed circuit board is disposed opposite to the diaphragm, and the one end of the flexible printed circuit board protrudes out of an end surface of the one end of the speaker housing through the sound outlet holes.
In some embodiments of the utility model, the protruding end is disposed opposite to the diaphragm and near an edge position of the diaphragm.
In another aspect of the present invention, an earphone is further provided, where the earphone has the microphone positioning structure described in any one of the above, where the speaker housing divides the housing of the earphone into a front sound cavity and a rear sound cavity, and the microphone unit is disposed in the front sound cavity.
Drawings
Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments. The drawings are only for purposes of illustrating the preferred embodiments and are not to be construed as limiting the utility model. Also, like parts are designated by like reference numerals throughout the drawings. Wherein:
fig. 1 is a schematic sectional view of a part of an earphone according to the present embodiment;
FIG. 2 is a schematic structural diagram of the microphone positioning structure in FIG. 1;
FIG. 3 is a schematic structural diagram of the speaker housing of FIG. 2;
FIG. 4 is a schematic structural diagram of the flexible printed circuit of FIG. 2;
fig. 5 is a schematic structural view of the microphone positioning structure in fig. 2 with the housing removed.
The reference numerals in the drawings denote the following:
1: an earphone;
10: a microphone positioning structure;
11: speaker, 111: speaker housing, 112: sound outlet, 113: protruding end, 1131: mounting hole, 114: front end face, 115: outer peripheral surface, 116: mounting inclined surface, 117: a diaphragm, 118: a diaphragm support;
12: flexible wiring board, 121: first connection portion, 1211: first connecting plate, 1212: second connection plate, 1213: third connection site, 122: mounting part, 123: second connection portion, 1231: first connection site, 1232: a second connection bit;
13: a microphone unit;
20: an earphone housing;
21: front acoustic chamber, 22: the posterior acoustic chamber.
Detailed Description
Exemplary embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the utility model are shown in the drawings, it should be understood that the utility model can be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the utility model to those skilled in the art.
It is to be understood that the terminology used herein is for the purpose of describing particular example embodiments only, and is not intended to be limiting. As used herein, the singular forms "a", "an" and "the" may be intended to include the plural forms as well, unless the context clearly indicates otherwise. The terms "comprises," "comprising," "including," and "having" are inclusive and therefore specify the presence of stated features, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, steps, operations, elements, components, and/or groups thereof. The method steps, processes, and operations described herein are not to be construed as necessarily requiring their performance in the particular order described or illustrated, unless specifically identified as an order of performance. It should also be understood that additional or alternative steps may be used.
Although the terms first, second, third, etc. may be used herein to describe various elements, components, regions, layers and/or sections, these elements, components, regions, layers and/or sections should not be limited by these terms. These terms may be only used to distinguish one element, component, region, layer or section from another region, layer or section. Terms such as "first," "second," and other numerical terms when used herein do not imply a sequence or order unless clearly indicated by the context. Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section without departing from the teachings of the example embodiments.
For convenience of description, spatially relative terms, such as "inner", "outer", "lower", "below", "upper", "above", and the like, may be used herein to describe one element or feature's relationship to another element or feature as illustrated in the figures. Such spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "below" or "beneath" other elements or features would then be oriented "above" or "over" the other elements or features. Thus, the example term "below … …" can include both an orientation of above and below. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.
Referring to fig. 1 and 2, the earphone 1 of the present embodiment includes an earphone housing 20 and a microphone positioning structure 10 disposed in the earphone housing 20. The microphone positioning structure 10 of the present embodiment includes a speaker 11, a flexible wiring board 12, and a microphone unit 13. Specifically, the speaker 11 includes a speaker housing 111 formed with a housing chamber, and a front end surface 114 of the speaker housing 111 is provided with a sound outlet hole 112 and an outwardly extending protruding end 113. At least part of the flexible circuit board 12 is arranged in the accommodating cavity, one end of the flexible circuit board 12 extends out of the front end face 114 of the loudspeaker shell 11 and is attached to the extending end 113, and the microphone monomer 13 is electrically connected with one end of the flexible circuit board 12 and is fixed on the extending end 113 through the flexible circuit board 12. The speaker housing 111 divides the earphone housing 20 into a front sound cavity 21 and a rear sound cavity 22, and the microphone unit 13 is disposed in the front sound cavity 21, so as to form a feedback noise reduction in the earphone housing 20 through the microphone unit 13. In the present embodiment, one end in the sound emitting direction of the speaker 11 is set as the front end of the speaker 11, that is, the end face having the sound emitting hole 112 is the front end face 114 of the speaker housing 111.
According to the microphone positioning structure 10 of the present invention, the extending end 113 extending outward is disposed on the front end surface 114 of the speaker housing 111, the microphone unit 13 is electrically connected to one end of the flexible printed circuit 12, and one end of the flexible printed circuit 12 is connected to the extending end 113, so that the microphone unit 13 is fixed in the sound emitting direction of the speaker 11 through the extending end 113, that is, the microphone unit 13 is disposed in the front sound cavity 21 of the earphone housing 20, so that the sound emitted from the speaker 11 is collected and fed back through the microphone unit 13, and the sound emitting noise of the speaker 11 is reduced or eliminated according to the feedback information of the microphone unit 13, thereby improving the sound emitting quality of the speaker 11, and at least part of the flexible printed circuit 12 is disposed in the accommodating cavity, and one end of the flexible printed circuit 12 extends out of the front end surface 114 of the speaker housing 111, so that the sealing performance between the speaker housing 111 and the earphone housing 20 when assembled is not affected, the loudspeaker shell 111 and the flexible circuit board 12 are integrally sealed in the assembly process of the earphone 1, so that the tone quality of the earphone 1 is guaranteed, the loudspeaker shell 111 and the sealing surface of the earphone shell 20 do not need to be sealed again, and the process complexity in the assembly process of the earphone 1 is reduced.
The microphone positioning structure 10 of the present embodiment can be used not only for earphones having a feedback noise reduction function, but also for earphones having a hybrid noise reduction function.
As shown in fig. 2, fig. 3, and fig. 5, the speaker 11 of the present embodiment further includes a diaphragm 117 and a diaphragm holder 118, the diaphragm 117 is connected to the diaphragm holder 118 and is disposed opposite to the sound outlet 112, and sound waves generated when the diaphragm 117 vibrates can be emitted through the sound outlet 112. At least part of the flexible circuit board 12 is arranged between the outer peripheral wall of the diaphragm support 118 and the inner peripheral wall of the speaker housing 111, so that the flexible circuit board 12 is clamped and fixed by the outer peripheral wall of the diaphragm support 118 and the inner peripheral wall of the speaker housing 111, and the original structure in the accommodating cavity is not influenced. An installation inclined plane 116 is disposed between the front end surface 114 and the outer peripheral surface 115 of the speaker housing 111, and when the speaker housing 111 is assembled with the earphone housing 20, the installation inclined plane 116 abuts against an inner wall surface of the earphone housing 20, so as to achieve a sealed connection between the speaker housing 111 and the earphone housing 20, and the specific manner may be glue connection. The specific structure of installation slope 116 may be adjusted according to the specific shape of the inner wall surface of headphone housing 20, so as to meet the requirement of matching between the two. Since one end of the flexible printed circuit 12 of the present embodiment extends out from the front end surface 114 of the speaker housing 111, the flexible printed circuit 12 and the speaker housing 111 are integrally sealed, and the sealing surface between the speaker housing 111 and the earphone housing 20 is not damaged, so that a secondary sealing between the speaker housing 111 and the earphone housing 20 is not required, and the process complexity during the assembly of the earphone 1 is reduced.
As shown in fig. 2, fig. 3 and fig. 5, the number of the sound outlet holes 112 of the front end surface 114 of the speaker housing 111 of the present embodiment is one, and the sound outlet holes 112 are disposed opposite to the diaphragm 117, and one end of the flexible circuit board 12 extends out of the front end surface 114 of the speaker housing 111 through the sound outlet holes 112, so that an additional opening on the front end surface 114 is not required, and the process complexity of manufacturing the speaker housing 111 is reduced. When the front end surface 114 has a plurality of sound outlet holes 112, one end of the flexible printed circuit board 12 can pass through any one of the sound outlet holes 12.
In this embodiment, only the protruding end 113 needs to be disposed on the front end surface 114 of the speaker housing 111, the specific protruding end can be obtained by stamping and forming integrally with the speaker housing 111, and the bent protruding end 113 and the plane where the diaphragm 117 is located are disposed at an angle, so that the sound wave emitted by the diaphragm 117 is collected and fed back through the microphone unit 13 fixed on the protruding end 113. One end of the flexible circuit board 12 in this embodiment is attached to the protruding end 113, so as to ensure the sealing of the sound pickup hole of the microphone unit 13. In another example of the present embodiment, the microphone unit 13 may be connected to the protruding end 113, and then the microphone unit 13 may be electrically connected to the flexible printed circuit board 12.
Further, as shown in fig. 2 and fig. 3, the protruding end 113 of the present embodiment is disposed opposite to the diaphragm 117 and close to the edge of the diaphragm 117, so as to reduce the shielding of the sound emitting path while ensuring that the microphone unit 13 collects noise, and ensure the normal sound emission of the earphone 1.
As shown in fig. 2, 4, and 5, the flexible wiring board 12 of the present embodiment includes a first connection portion 121, a mounting portion 122, and a second connection portion 123, which are sequentially provided in this order. The mounting portion 122 is disposed in the accommodating cavity and adapted to a portion of the accommodating cavity, one end of the first connecting portion 121 extends out of the front end surface 114 of the speaker housing 111 and is electrically connected to the microphone unit 13, and one end of the second connecting portion 123 extends out of the other end of the speaker housing 111 and is electrically connected to the noise reduction circuit.
As shown in fig. 2 and 5, the mounting portion 122 has an arc-shaped structure and is adapted to a part of the inner wall surface of the speaker housing 111. The installation portion 122 is clamped between the peripheral wall of the diaphragm support 118 and the inner peripheral wall of the speaker shell 111, so as to be fixed, and furthermore, the installation portion can be fixed by adopting a gluing mode.
As shown in fig. 2, 3 and 4, the first connecting portion 121 includes a first connecting plate 1211 and a second connecting plate 1212, the first connecting plate 1211 and the second connecting plate 1212 form an L-shaped structure together, and the first connecting plate 1211 is attached to an inner wall surface of the accommodating cavity and disposed opposite to the front end surface 114 for electrically connecting the second connecting plate 1212 and the mounting portion 122. The second connecting plate 1212 protrudes from the front end surface 114 of the speaker housing 111 and is electrically connected to the microphone unit 13. The second connecting plate 1212 is provided with a third connecting position 1213, the protruding end 113 is provided with a mounting hole 1131, when assembling, the third connecting position 1213 is aligned with the mounting hole 1131, and the second connecting plate 1212 and the protruding end 113 are connected and fixed by welding. In other examples of the present embodiment, the second connecting plate 1212 and the protruding end 113 may be connected and fixed by a connecting buckle, wherein a male buckle is disposed on the third connecting position 1213, and a female buckle is disposed on the mounting hole 1131, so as to be connected and fixed by a buckling manner.
As shown in fig. 2 and 4, a first connection position 1231 and a second connection position 1232 are spaced apart from one end of the second connection portion 123 extending out of the speaker housing 111, and the other end of the second connection portion 123 is electrically connected to the mounting portion 122. Wherein, first connection position 1231 is used for being connected with the circuit electricity of making an uproar of falling, and concrete connection mode can be for welding or lock joint to through flexible line way board 12 with the noise signal transmission that microphone monomer 13 gathered to fall the circuit of making an uproar, and then carry out the initiative noise reduction to noise signal and handle. The second connection portion 1232 is used for electrically connecting to the diaphragm 117 of the speaker 11, and the connection manner may also be welding or fastening, so as to process the current passing through the diaphragm 117, so as to reduce or eliminate the noise. In this embodiment, the same flexible circuit board 12 is used to process the current signal of the diaphragm 117 and the feedback signal of the microphone unit 13, so that the number of the flexible circuit boards 12 is reduced, the space occupancy rate in the earphone housing 20 is further reduced, the arrangement of other structures in the earphone housing 20 is facilitated, and the manufacturing cost of the earphone 1 is reduced.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention are included in the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (10)
1. A microphone positioning structure, comprising:
the loudspeaker comprises a loudspeaker shell body formed with an accommodating cavity, and the end face of one end of the loudspeaker shell body is provided with a sound outlet and an outward extending end;
at least part of the flexible circuit board is arranged in the accommodating cavity, and one end of the flexible circuit board extends out of the end face of one end of the loudspeaker shell;
the microphone single body is electrically connected with one end of the flexible circuit board, and at least one of the microphone single body and the one end of the flexible circuit board is connected with the extending end.
2. The microphone positioning structure according to claim 1, wherein the flexible printed circuit board includes a first connecting portion, an installation portion and a second connecting portion sequentially disposed in sequence, the installation portion is disposed in the accommodating cavity and adapted to a partial structure in the accommodating cavity, one end of the first connecting portion extends out of the end face of the one end of the speaker housing and is electrically connected to the microphone unit, and one end of the second connecting portion extends out of the other end of the speaker housing and is electrically connected to the noise reduction circuit.
3. The microphone positioning structure according to claim 2, wherein the first connecting portion includes a first connecting plate and a second connecting plate, the first connecting plate and the second connecting plate together form an L-shaped structure, the first connecting plate is attached to an inner wall surface of the accommodating cavity, and the second connecting plate extends out of an end surface of the one end of the speaker housing and is electrically connected to the microphone unit.
4. The microphone positioning structure as claimed in claim 2, wherein the one end of the second connecting portion is spaced apart from a first connecting portion electrically connected to the noise reduction circuit and a second connecting portion electrically connected to a diaphragm of a speaker.
5. The microphone positioning structure as claimed in claim 2, wherein the mounting portion has an arc-shaped configuration and is fitted to a part of an inner wall surface of the speaker housing.
6. The microphone positioning structure of claim 1, wherein the one end of the flexible circuit board is attached to the protruding end by gluing, and the microphone unit is connected to the protruding end through the flexible circuit board.
7. The microphone positioning structure of claim 1, wherein the speaker further comprises a diaphragm and a diaphragm holder disposed in the accommodating cavity, the diaphragm is connected to the diaphragm holder and disposed opposite to the sound outlet, and at least a portion of the flexible circuit board is disposed between an outer peripheral wall of the diaphragm holder and an inner peripheral wall of the speaker housing.
8. The microphone positioning structure as claimed in claim 7, wherein the number of the sound outlet holes is one, and the flexible printed circuit board is disposed opposite to the diaphragm, and the one end of the flexible printed circuit board protrudes from an end surface of the one end of the speaker housing through the sound outlet holes.
9. The microphone positioning structure of claim 7, wherein the protruding end is disposed opposite to the diaphragm and near an edge of the diaphragm.
10. An earphone having a microphone positioning structure according to any one of claims 1 to 9, wherein the speaker housing divides the casing of the earphone into a front sound chamber and a rear sound chamber, and the microphone unit is provided in the front sound chamber.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121668482.XU CN215420696U (en) | 2021-07-21 | 2021-07-21 | Microphone positioning structure and earphone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121668482.XU CN215420696U (en) | 2021-07-21 | 2021-07-21 | Microphone positioning structure and earphone |
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| Publication Number | Publication Date |
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| CN215420696U true CN215420696U (en) | 2022-01-04 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202121668482.XU Active CN215420696U (en) | 2021-07-21 | 2021-07-21 | Microphone positioning structure and earphone |
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| CN (1) | CN215420696U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114679668A (en) * | 2022-03-25 | 2022-06-28 | 美律电子(深圳)有限公司 | Earphone with circuit board module |
-
2021
- 2021-07-21 CN CN202121668482.XU patent/CN215420696U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114679668A (en) * | 2022-03-25 | 2022-06-28 | 美律电子(深圳)有限公司 | Earphone with circuit board module |
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