CN215418134U

CN215418134U - Improved 12-inch chip die bonder

Info

Publication number: CN215418134U
Application number: CN202121517155.4U
Authority: CN
Inventors: 刘振禹; 李健; 刘进; 马有明; 陈韶华; 尚伟华; 刘慧靖
Original assignee: Shandong Ruida Wulian Technology Co Ltd
Current assignee: Shandong Ruida Wulian Technology Co Ltd
Priority date: 2021-07-02
Filing date: 2021-07-02
Publication date: 2022-01-04
Anticipated expiration: 2031-07-02

Abstract

The application discloses a modified 12-inch chip die bonder, which comprises a working platform, a swing arm and a suction nozzle assembly, wherein a wafer carrying mechanism and a wafer mechanism are arranged on the working platform, and the swing arm is used for sucking a wafer by the wafer mechanism and moving the wafer to the wafer carrying mechanism so as to fix the wafer; the swing arm comprises a swing part and a supporting part, the swing part is in a conical structure, the supporting part and the swing part are arranged vertically, and the supporting part extends along the central axis of the swing part; lightening holes are uniformly formed in the surfaces of the swinging part and the supporting part; the front end of the swinging part is provided with a suction nozzle mounting position; the suction nozzle component is used for adsorbing a wafer and is arranged at a suction nozzle mounting position, the suction nozzle component comprises an air guide tube and a mounting head, one end of the air guide tube is communicated with the air guide tube, the other end of the air guide tube is detachably connected with the mounting head, and a supporting piece used for supporting the wafer is arranged at the air inlet end of the mounting head. This application has that stability is good, intensity is high, be convenient for change suction nozzle subassembly, advantages such as product quality height.

Description

Improved 12-inch chip die bonder

Technical Field

The application belongs to the technical field of die bonder, and particularly relates to a modified 12-inch chip die bonder.

Background

At present, in the post-packaging process of the chip production process, a die bonder is usually used for wafer fixing operation, the die bonding process comprises die taking and die releasing, a swing arm is used for completing the die taking and die releasing actions, and the main actions are as follows: the wafer is sucked by the suction nozzle arranged at the front end of the swing arm, and the wafer is accurately placed on the substrate through the swing arm.

When 8 cun solid brilliant machine of transformation becomes 12 cun solid brilliant machines, because chip size grow, consequently need with the corresponding extension of swing arm, the swing arm after the extension is because the quality grow at high-speed motion, inertia grow for its size of decline strength is difficult to control, the wafer is crushed easily, and in crushing the wafer in-process, suction nozzle and wafer produce the striking, lead to the wafer atress unbalanced, damage to the wafer is great, and also comparatively serious to the wearing and tearing of suction nozzle in daily absorption process, need often change the suction nozzle. The circular through-hole that current swing arm utilized the front end to set up is through inserting the suction nozzle to carry out the connected mode of fastening with the suction nozzle fixed to the screw, when needing to be changed the suction nozzle, need pull down whole suction nozzle, and the process is complicated, has caused very big inconvenience for production work.

It will thus be seen that the prior art is susceptible to further improvement and enhancement.

SUMMERY OF THE UTILITY MODEL

The utility model provides a modified 12-inch chip die bonder, which is used for solving at least one of the technical problems.

In order to achieve the purpose, the utility model provides a modified 12-inch chip die bonder which comprises a working platform, a swing arm and a suction nozzle assembly, wherein a carrier mechanism for placing die bonding materials and a wafer mechanism for carrying wafers are arranged on the working platform, and the swing arm is used for sucking the wafers by the wafer mechanism and moving the wafers to the carrier mechanism to fix the wafers; the swing arm comprises a swing part and a supporting part, the swing part is in a conical structure, the supporting part and the swing part are arranged vertically, and the supporting part extends along the central axis of the swing part; lightening holes are uniformly formed in the surfaces of the swinging part and the supporting part; the front end of the swinging part is provided with a suction nozzle mounting position; the suction nozzle component is used for adsorbing a wafer and is arranged at a suction nozzle mounting position, the suction nozzle component comprises an air guide tube and a mounting head, one end of the air guide tube is communicated with the air guide tube, the other end of the air guide tube is detachably connected with the mounting head, and a supporting piece used for supporting the wafer is arranged at the air inlet end of the mounting head.

The swing arm has the advantages that the supporting part is arranged, so that the swing part is supported and stabilized, on one hand, the strength of the swing arm is enhanced, and on the other hand, the rigidity of the swing arm is enhanced; this application sets up the lightening hole respectively through swinging portion and supporting part surface, and the frame rack construction of current swing arm improves to platelike structure, has simplified the structure to reduce the dead weight of swing arm, reduced the inertia of the high-speed motion in-process of swing arm, improved the stability and the precision of swing arm motion. Since the mounting head is used for sucking the wafer and is easy to wear, the gas cylinder and the mounting head are detachably connected, so that the mounting head is convenient to replace; this application can produce the supporting role to the wafer through support piece's setting, avoids suction too big to damage the wafer, protects the wafer to can guarantee product quality.

In a preferred implementation, the support is provided as a support plate, the support plate surface being provided with a flexible member. This application can play the guard action to the wafer through set up the flexible piece on backup pad surface.

In a preferred implementation, the support part is of a conical structure, and a reinforcing plate is arranged between the swing part and the support part. Because the width of swing portion reduces by rear end to front end gradually, consequently set up the supporting part into the toper structure, the height of supporting part for promptly by the rear end of swing portion to the front end direction of swing portion reduce gradually, can adapt to the width of swing portion to play better support and stabilizing action to swing portion.

In a preferred implementation mode, the maximum height of the supporting part is 0.5-1.5 times of the maximum width of the swinging part. When the maximum height of the supporting part is less than 0.5 times of the maximum width of the swinging part, the supporting and stabilizing effect of the supporting part on the swinging part is small; when the maximum height of the supporting part is 1.5 times larger than the maximum width of the swinging part, the supporting part is too high, so that the integral gravity center of the swinging arm is unstable, and the stability of the swinging arm is reduced. Therefore, the maximum height of the supporting part is set to be 0.5-1.5 times of the maximum width of the swinging part, so that the supporting effect of the supporting part on the swinging part can be met, and the stability of the swinging arm can be improved.

In a preferred implementation, a seal is provided between the gas cartridge and the mounting head. The sealing element is arranged between the air guide cylinder and the mounting head, so that the sealing property between the air guide cylinder and the mounting head can be improved.

In a preferred implementation, the mounting head and the gas cartridge are removably connected by threads. The mounting head and the gas cylinder can be detachably connected through the threads, and the mounting head and the gas cylinder can be conveniently detached and connected.

In a preferred implementation manner, the suction nozzle mounting position comprises a mounting hole arranged at the front end of the swinging part, the air guide cylinder is vertically arranged in the mounting hole, and the swinging part and the air guide cylinder are fixed through a bolt.

In a preferred implementation, the air duct extends along the top of the support portion, and the air duct is connected to the blower. The fan passes through the air duct and outwards convulsions to produce the negative pressure at the air inlet end of installation head, thereby can adsorb the wafer.

In a preferred implementation mode, the gas cylinder comprises a gas guide section, a transition section and a connecting section which are sequentially communicated, the transition section and the connecting section are provided with steps, and the transition section is obliquely arranged. The installation head is limited to a certain extent by the arrangement of the steps; this application sets up through the slope with the changeover portion to certain water conservancy diversion effect has been played gas.

In a preferred implementation mode, the swing arm is connected with the driving device, the driving device can drive the swing arm to move in a reciprocating mode in the vertical direction, and the driving device can also drive the swing arm to rotate between the carrier mechanism and the wafer mechanism so as to achieve crystal taking and crystal fixing.

Drawings

The accompanying drawings, which are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this specification, illustrate embodiments of the utility model and together with the description serve to explain the utility model and not to limit the utility model. In the drawings:

fig. 1 is a schematic structural diagram of a modified 12-inch die bonder provided in an embodiment of the present application;

FIG. 2 is a schematic view of the swing arm and the suction nozzle assembly assembled according to an embodiment of the present application;

fig. 3 is a schematic structural diagram of the swing arm provided in the embodiment of the present application;

FIG. 4 is a schematic structural view of the nozzle assembly provided in the embodiments of the present application;

FIG. 5 is an enlarged view of a portion of A in FIG. 4;

FIG. 6 is a schematic structural view of the gas cartridge of FIG. 4;

fig. 7 is a bottom view of fig. 4 showing the support member.

Description of reference numerals:

1. a working platform; 101. a carrier mechanism; 102. a wafer mechanism;

2. swinging arms; 201. a swing portion; 202. a support portion; 203. lightening holes; 204. a suction nozzle mounting position; 2041. mounting holes; 205. a reinforcing plate;

3. a suction nozzle assembly; 301. an air guide cylinder; 3011. an air guide section; 3012. a transition section; 3013. a connecting section; 302. a mounting head; 303. an air duct; 304. a support member; 3041. a support plate; 305. a seal member; 4. a drive device.

Detailed Description

In order to more clearly explain the overall concept of the present invention, the following detailed description is given by way of example in conjunction with the accompanying drawings.

It should be noted that in the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, however, the present invention may be practiced in other ways than those specifically described herein, and thus the scope of the present invention is not limited by the specific embodiments disclosed below.

In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "vertical", "horizontal", "top", "bottom", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are only for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. In the present invention, unless otherwise expressly stated or limited, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through an intermediate.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; either directly or indirectly through intervening media, either internally or in any other relationship. However, the direct connection means that the two bodies are not connected to each other by the intermediate structure but connected to each other by the connecting structure to form a whole. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

Descriptions in this specification as relating to "first", "second", etc. are for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicit to any indicated technical feature or quantity. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature.

As shown in fig. 1-7, the present invention provides a modified 12-inch chip die bonder, which includes a working platform 1, a swing arm 2 and a suction nozzle assembly 3, wherein the working platform 1 is provided with a carrier mechanism 101 for placing die bonding material and a wafer mechanism 102 for carrying a wafer, the swing arm 2 is used for sucking the wafer by the wafer mechanism 102 and moving the wafer to the carrier mechanism 101 to fix the wafer; the swing arm 2 comprises a swing part 201 and a support part 202, the swing part 201 is in a conical structure, the support part 202 and the swing part 201 are arranged perpendicular to each other, and the support part 202 extends along the central axis of the swing part 201; lightening holes 203 are uniformly formed in the surfaces of the swinging part 201 and the supporting part 202; the front end of the swinging part 201 is provided with a suction nozzle mounting position 204; the suction nozzle component 3 is used for sucking a wafer, the suction nozzle component 3 is installed at the suction nozzle installation position 204, the suction nozzle component 3 comprises a gas cylinder 301 and an installation head 302, one end of the gas cylinder 301 is communicated with a gas guide pipe 303, the other end of the gas cylinder 301 is detachably connected with the installation head 302, and the air inlet end of the installation head 302 is provided with a supporting piece 304 for supporting the wafer.

From the above description, it can be seen that the present invention achieves the following technical effects:

according to the swing arm, the support part 202 is arranged, so that the swing part 201 is supported and stabilized, on one hand, the strength of the swing arm 2 is enhanced, and on the other hand, the rigidity of the swing arm 2 is enhanced; this application sets up lightening hole 203 respectively through setting up on swing portion 201 and supporting part 202 surface, and the frame rack construction of present swing arm 2 improves for platelike structure, has simplified the structure to reduce swing arm 2's dead weight, reduced the inertia of swing arm 2 high-speed motion in-process, improved the stability and the precision of swing arm 2 motion. Since the mounting head 302 is used for sucking the wafer and is easily worn, the present application facilitates the replacement of the mounting head 302 by providing the gas cylinder 301 and the mounting head 302 in a detachable connection; this application can produce the supporting role to the wafer through support piece 304's setting, avoids the too big damage to the wafer of suction, protects the wafer to can guarantee product quality.

In one embodiment, as shown in fig. 4, 5 and 7, the supporting member 304 is provided as a supporting plate 3041, and the supporting plate 3041 is provided with a flexible member (not shown) on the surface. The flexible member is disposed on the surface of the support plate 3041, so that the wafer can be protected. Of course, it will be understood by those skilled in the art that the support plate 3041 may be in a shape of triangle, quadrangle, etc. at the air inlet end of the mounting head 302 to form a support for the wafer, and in the implementation, the support plate 3041 may also be configured as a rigid network structure. In specific implementation, the flexible member may be made of rubber, rock wool, or the like, as long as the surface of the flexible member can play a certain role in buffering and protecting the wafer.

In one embodiment, as shown in fig. 1-3, the support portion 202 is a tapered structure, and a reinforcing plate 205 is disposed between the swing portion 201 and the support portion 202. Because the width of the swinging portion 201 is gradually reduced from the rear end to the front end, the supporting portion 202 is set to be a tapered structure, that is, the height of the supporting portion 202 is gradually reduced from the rear end of the swinging portion 201 to the front end of the swinging portion 201, and the supporting portion can adapt to the width of the swinging portion 201, so that the swinging portion 201 is well supported and stabilized.

In one embodiment, as shown in fig. 2 and 3, the maximum height of the supporting portion 202 is 0.5 to 1.5 times the maximum width of the swing portion 201. When the maximum height of the support part 202 is less than 0.5 times of the maximum width of the swing part 201, the support stabilizing effect of the support part 202 on the swing part 201 is small; when the maximum height of the support portion 202 is greater than 1.5 times the maximum width of the swing portion 201, the support portion 202 is too high, causing instability of the center of gravity of the entire swing arm 2, thereby reducing stability of the swing arm 2. Therefore, the maximum height of the support portion 202 is set to be 0.5 to 1.5 times of the maximum width of the swing portion 201, so that the support effect of the support portion 202 on the swing portion 201 can be satisfied, and the stability of the swing arm 2 can be improved.

In one embodiment, as shown in fig. 4 and 5, a seal 305 is provided between the gas cylinder 301 and the mounting head 302. The present application can improve the sealing property between the gas cylinder 301 and the mounting head 302 by providing the sealing member 305 between the gas cylinder 301 and the mounting head 302. Of course, those skilled in the art will appreciate that the sealing member 305 may be a rubber sealing ring as long as it can provide a certain sealing function for the gas cylinder 301 and the mounting head 302.

In one embodiment, the mounting head 302 and the gas cartridge 301 are removably connected by threads (not shown). The present application can facilitate the detachment and attachment between the mounting head 302 and the gas cylinder 301 by detachably connecting the mounting head 302 and the gas cylinder 301 by a screw. Of course, those skilled in the art will appreciate that a snap-fit connection between the mounting head 302 and the gas cylinder 301 may be used, as long as the connection and disconnection between the mounting head 302 and the gas cylinder 301 are facilitated.

In one embodiment, as shown in fig. 3, the suction nozzle mounting position 204 includes a mounting hole 2041 provided at the front end of the swing portion 201, the gas cylinder 301 is vertically provided at the mounting hole 2041, and the swing portion 201 and the gas cylinder 301 are fixed by bolts.

In one embodiment, as shown in fig. 1 and 2, a gas tube 303 extends along the top of support 202, and gas tube 303 is connected to a blower. The fan draws air through the air duct 303 to generate negative pressure at the air inlet end of the mounting head 302, thereby enabling the adsorption of the wafer. Of course, it can be understood by those skilled in the art that the blower may be an ion blower, which not only can make the mounting head 302 generate negative pressure, but also can neutralize static electricity in the surrounding environment.

In one embodiment, as shown in fig. 6, the gas cylinder 301 includes a gas guiding section 3011, a transition section 3012 and a connection section 3013, which are connected in sequence, the transition section 3012 and the connection section 3013 are provided with steps, and the transition section 3012 is arranged obliquely. The installation head 302 is limited to a certain extent by the arrangement of the steps; this application is through setting up the transition section 3012 slope to certain water conservancy diversion effect has been played to gas.

In one embodiment, as shown in fig. 1, the swing arm 2 is connected to a driving device 4, the driving device 4 can drive the swing arm 2 to move back and forth in the vertical direction, and the driving device 4 can also drive the swing arm 2 to rotate between the carrier mechanism 101 and the wafer mechanism 102, so as to realize the crystal taking and crystal fixing. Of course, it can be understood by those skilled in the art that the driving device 4 can be configured as a linear servo motor capable of driving the swing arm 2 to reciprocate along the vertical direction and a rotary motor for driving the swing arm 2 to rotate, the swing arm 2 is connected with the servo motor, and the servo motor is connected with the rotary motor (not shown).

The method can be realized by adopting or referring to the prior art in places which are not described in the utility model.

The embodiments in the present specification are described in a progressive manner, and the same and similar parts among the embodiments are referred to each other, and each embodiment focuses on the differences from the other embodiments.

The above description is only an example of the present invention, and is not intended to limit the present invention. Various modifications and alterations to this invention will become apparent to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the scope of the claims of the present invention.

Claims

1. A remodeled 12-inch chip die bonder comprises a working platform, wherein a carrier mechanism for placing die bonding materials and a wafer mechanism for carrying wafers are arranged on the working platform, and is characterized by further comprising,

the swing arm is used for sucking the wafer by the wafer mechanism and moving the wafer to the carrier mechanism so as to fix the wafer; the swing arm comprises a swing part and a supporting part, the swing part is of a conical structure, the supporting part and the swing part are arranged vertically, and the supporting part extends along the central axis of the swing part; lightening holes are uniformly formed in the surfaces of the swinging part and the supporting part; the front end of the swinging part is provided with a suction nozzle mounting position;

the suction nozzle subassembly, it is used for adsorbing the wafer, the suction nozzle subassembly install in suction nozzle installation position, the suction nozzle subassembly includes gas cylinder and installation head, the one end and the gas duct intercommunication of gas cylinder, the other end of gas cylinder with the connection can be dismantled to the installation head, the inlet end of installation head is provided with and is used for supporting the support piece of wafer.

2. A modified 12-inch chip die bonder as claimed in claim 1, wherein said supporting member is a supporting plate, and a surface of said supporting plate is provided with a flexible member.

3. A modified 12-inch die bonder as claimed in claim 1, wherein said supporting portion is a conical structure, and a reinforcing plate is disposed between said swinging portion and said supporting portion.

4. A modified 12-inch die bonder as claimed in claim 1, wherein the maximum height of said supporting portion is 0.5-1.5 times the maximum width of said swinging portion.

5. A modified 12-inch die bonder as claimed in claim 1, wherein a sealing member is disposed between said gas cylinder and said mounting head.

6. A modified 12-inch die bonder as claimed in claim 1, wherein said mounting head and said gas cylinder are removably connected by threads.

7. The die bonder with 12-inch modified chips as claimed in claim 1, wherein said suction nozzle mounting position comprises a mounting hole arranged at the front end of said swing portion, said gas cylinder is vertically arranged in said mounting hole, and said swing portion and said gas cylinder are fixed by bolts.

8. The die bonder for 12-inch chips, according to claim 1, wherein the air duct extends along the top of the support portion, and the air duct is connected to a blower.

9. The improved 12-inch chip die bonder according to claim 1, wherein the gas cylinder comprises a gas guide section, a transition section and a connecting section which are sequentially communicated, the transition section and the connecting section are provided with steps, and the transition section is obliquely arranged.

10. The improved 12-inch chip die bonder according to claim 1, wherein the swing arm is connected with a driving device, the driving device can drive the swing arm to reciprocate in the vertical direction, and the driving device can also drive the swing arm to rotate between the carrier mechanism and the wafer mechanism so as to realize die picking and die bonding.