CN215401765U

CN215401765U - Wafer high accuracy automatic feed device

Info

Publication number: CN215401765U
Application number: CN202121817030.3U
Authority: CN
Inventors: 王小卫
Original assignee: Sifu Dean Semiconductor Equipment Technology Suzhou Co ltd
Current assignee: Sifu Dean Semiconductor Equipment Technology Suzhou Co ltd
Priority date: 2021-08-05
Filing date: 2021-08-05
Publication date: 2022-01-04
Anticipated expiration: 2031-08-05

Abstract

The utility model discloses a high-precision automatic wafer feeding device which comprises a lifting module, a basket unit driven by the lifting module to move up and down, a left centering butt joint unit and a right centering butt joint unit butted with the output end of the basket unit, and a clamping and transferring mechanism for pulling a wafer module out of the basket unit to the left centering butt joint unit and the right centering butt joint unit; the left and right centering butt joint unit comprises a second driving piece and left and right centering support supporting plates which are driven by the second driving piece to mutually approach or mutually open; the clamping transfer mechanism comprises a third driving part and a clamping jaw unit driven by the third driving part to horizontally move, the clamping jaw unit comprises a first sub-clamping jaw and a second sub-clamping jaw, a blocking block extends downwards from the lower surface of the second sub-clamping jaw, and the blocking block pushes the wafer module to horizontally move under the opening state of the clamping jaw unit to realize front and back centering. The utility model ensures the accuracy of the circle center of the wafer feeding, improves the feeding accuracy, can quickly identify the wafer clamping phenomenon and can give an alarm in time.

Description

Wafer high accuracy automatic feed device

[ technical field ] A method for producing a semiconductor device

The utility model belongs to the technical field of semiconductor equipment, and particularly relates to a high-precision automatic wafer feeding device.

[ background of the utility model ]

At present, in automatic wafer processing, wafers are usually clamped out through a clamp and then are conveyed to different stations through a conveying sucker, and in the process of clamping the wafers by the clamp, due to the difference of the positions of the wafers, the phenomena of inaccuracy of the front position, the rear position, the left position and the right position of the wafers after the wafers are taken out can occur, so that the difficulty is caused in subsequent accurate conveying to the next procedure. When the wafer size is great, because it is thin slice structure, appears warping easily, and the wafer is in the hand-basket, when pressing from both sides out through the clip, often appears the card pause phenomenon easily, leads to the clip to take off the clamp, and the wafer blocks. The feeding equipment in the prior art can not identify the phenomenon in time, so that feeding is in a problem.

Therefore, there is a need to provide a new high-precision automatic wafer feeding device to solve the above-mentioned problems.

[ Utility model ] content

The utility model mainly aims to provide a high-precision automatic wafer feeding device which can ensure that a wafer is located at a set position after being pulled out of a lifting basket, ensure the precision of the position of the circle center of the wafer, improve the feeding precision, quickly identify the wafer jamming phenomenon and give an alarm in time.

The utility model realizes the purpose through the following technical scheme: a high-precision automatic wafer feeding device comprises a lifting module, a basket unit driven by the lifting module to move up and down, a left centering butt joint unit and a right centering butt joint unit butted with the output ends of the basket unit, and a clamping and transferring mechanism for pulling a wafer module out of the basket unit onto the left centering butt joint unit and the right centering butt joint unit and centering the wafer module in the front-back direction; the left and right centering butt joint unit comprises a second driving piece and left and right centering support supporting plates which are driven by the second driving piece to mutually approach or mutually open; the clamping transfer mechanism comprises a third driving piece and a clamping jaw unit driven by the third driving piece to horizontally move, the clamping jaw unit comprises a first sub-clamping jaw and a second sub-clamping jaw, a blocking block extends downwards from the lower surface of the second sub-clamping jaw, and the blocking block pushes the wafer module to horizontally move under the opening state of the clamping jaw unit to realize front and back centering.

Furthermore, the lifting module comprises a first driving piece and a positioning support plate driven by the first driving piece to move up and down, and the basket unit is fixed on the positioning support plate; a plurality of layers of supporting slide rails are arranged in the basket unit, and a wafer module is arranged on each layer of supporting slide rails.

Furthermore, a supporting moving platform for supporting the wafer module is formed on the upper surface of the left and right centering supporting plates.

And a pair of first sensors is arranged on the left and right centering supporting plates along the moving direction of the wafer module.

Furthermore, a safety light curtain switch arranged in the vertical direction is arranged on the surface of one side, close to the basket unit, of the left and right centering butt joint unit.

Furthermore, a second sensor for sensing whether a wafer module is arranged on a supporting slide rail on a corresponding layer of the basket unit is arranged on the surface of one side, close to the basket unit, of the left and right centering and butting unit; the second sensor is provided with a pair of sensors and is aligned with the straight edge of the steel ring in the wafer module.

Furthermore, the first sub-clamping jaw comprises a first body and a first clamping plate located at the front end of the first body, and the second sub-clamping jaw comprises a second body and a second clamping plate located at the front end of the second body and matched with the first clamping plate to realize clamping action.

Further, the first clamping plate is flush with the upper surface of the first body, and the stop block extends downwards from the lower surface of the second body and protrudes out of the lower surface of the second clamping plate.

Furthermore, the upper surface of the first body is recessed downwards to form a containing groove for containing the blocking block.

Compared with the prior art, the high-precision automatic wafer feeding device has the beneficial effects that: by arranging the left and right centering butt joint unit, the left and right centering support plates are synchronously moved, so that the high-precision positioning of the whole wafer module in the left and right direction is realized; the clamping and transferring mechanism is provided with the blocking block structure, and the clamping jaw structure is ingeniously designed, so that on one hand, the clamping and transferring of the wafer module are realized, on the other hand, the high-precision positioning of the whole wafer module in the front and back directions is realized by utilizing a direction pushing mode, and further, the high-precision feeding of the whole wafer module is realized; and a plurality of sensors are arranged on the moving path of the wafer module in a matching way, so that whether the wafer module is blocked or not is detected, and the reliability and effectiveness of wafer feeding are improved.

[ description of the drawings ]

FIG. 1 is a schematic structural diagram of an embodiment of the present invention;

FIG. 2 is a schematic structural diagram of a left-right centering and docking unit according to an embodiment of the present invention;

FIG. 3 is a partial schematic view of another angle of the left and right centering and docking units according to the embodiment of the present invention;

FIG. 4 is a schematic view of a part of the structure of the clamping and transferring mechanism in the embodiment of the present invention;

FIG. 5 is a schematic view of a jaw unit according to an embodiment of the present invention;

the figures in the drawings represent:

100. a high-precision automatic feeding device for wafers;

101. a wafer module;

1. the lifting device comprises a lifting module 11, a first driving piece 12 and a positioning support plate; 2. a basket unit;

3. the device comprises a left and right centering butt joint unit 31, a second driving piece 32, a left and right centering support pallet 321, a support moving platform 33, a first sensor 34, a safety light curtain switch 35 and a second sensor;

4. clamping transfer mechanism, 41, third driving piece, 42, movable plate, 43, first cylinder, 44, second cylinder, 45, first sub-clamping jaw, 451, first body, 452, first clamping plate, 453, accommodating groove, 46, second sub-clamping jaw, 461, second body, 462, second clamping plate, 463 and blocking block.

[ detailed description ] embodiments

The first embodiment is as follows:

referring to fig. 1 to 5, the present embodiment is a high-precision automatic wafer feeding device 100, which includes a lifting module 1, a basket unit 2 driven by the lifting module 1 to move up and down, a left and right centering docking unit 3 docking with an output end of the basket unit 2, and a clamping and transferring mechanism 4 for pulling out a wafer module from the basket unit 2 to the left and right centering docking unit 3 and centering the wafer module in a front-back direction.

The lifting module 1 comprises a first driving member 11 and a positioning support plate 12 driven by the first driving member 11 to move up and down, and the basket unit 2 is fixed on the positioning support plate 12. The lifting basket unit 2 is of an existing structure, a plurality of layers of supporting slide rails are arranged in the lifting basket unit 2, each layer of wafer module comprises a steel ring and a wafer arranged in the steel ring, each layer of supporting slide rail is provided with one wafer module, and the lifting basket unit 2 is driven by the lifting module 1 to sequentially ascend or descend according to a set interval.

The left and right centering and docking unit 3 includes a second driving member 31, and left and right centering and supporting pallets 32 driven by the second driving member 31 to be moved close to or opened from each other. Second driving piece 31 is the motor, and second driving piece 31 passes through the hold-in range and realizes the transmission, and centering support plate 32 is fixed respectively on the both sides of hold-in range about two, drives hold-in range circulation through second driving piece 31 and rotates, and then drives centering support plate 32 about two and draw close each other or open the action. The adjustment and limitation of the left and right positions of the wafer module are realized by the left and right centering support plates 32.

A support moving platform 321 for supporting the wafer module to drag is formed on the upper surface of the left and right centering support plates 32. In order to ensure the positional accuracy of the wafer module in the front-rear direction, a pair of first sensors 33 are provided on the left and right centering support plates 32 in the wafer module moving direction. The position of the wafer module is detected by the pair of first sensors 33, and the position of the wafer module in the front-rear direction is more accurate by the clamping transfer mechanism 4.

In order to solve the clamping phenomenon of the wafer module in the basket unit 2, a safety light curtain switch 34 arranged in the vertical direction is arranged on the surface of one side, close to the basket unit 2, of the left centering butt joint unit 3 and the right centering butt joint unit 3, when the wafer module falls off in the clamping process and is not completely taken out, the safety light curtain switch 34 is inevitably blocked, so that an alarm is triggered, and manual intervention is prompted.

And a second sensor 35 for sensing whether the wafer module is arranged on the support slide rail on the corresponding layer of the basket unit 2 is further arranged on the surface of one side, close to the basket unit 2, of the left and right centering butt joint unit 3. The second sensor 35 is provided with a pair of linear edges aligned with the steel ring in the wafer module, and the second sensor 35 is a reflection-type photoelectric switch, and mainly functions as: 1) the positions and the number of the wafer modules in the basket lifting unit 2 can be scanned; 2) when the wafer module has torsion, one of the two photoelectric switches can detect the part to prevent misjudgment.

The grip transfer mechanism 4 includes a third driving member 41, a movable plate 42 horizontally moved by the third driving member 41, a first cylinder 43 fixed to the movable plate 42, a second cylinder 44 horizontally moved by the first cylinder 43, and a gripper unit vertically opened by the second cylinder 44. The clamping jaw unit comprises a first sub-clamping jaw 45 and a second sub-clamping jaw 46, the first sub-clamping jaw 45 comprises a first body 451 and a first clamping plate 452 located at the front end of the first body 451, the second sub-clamping jaw 46 comprises a second body 461 and a second clamping plate 462 located at the front end of the second body 461 and matched with the first clamping plate 452 to realize clamping action, the first clamping plate 452 is flush with the upper surface of the first body 451, and a pair of blocking blocks 463 protruding the lower surface of the second clamping plate 462 extend downwards from the lower surface of the second body 461. The upper surface of the first body 451 is recessed downward to form a receiving groove 453 for receiving the blocking block 461, so that when the first sub-clamping jaw 45 and the second sub-clamping jaw 46 are clamped and closed together, the first clamping plate 452 and the second clamping plate 462 can be closed together to the maximum extent, so as to meet clamping requirements of wafer modules with different thicknesses. Meanwhile, the blocking piece 463 is mainly used for pulling out the wafer module and then reversely pushing the wafer module to a set position, so that the front and rear direction centering is realized, and the feeding precision of the wafer module is greatly improved.

The working principle of the high-precision automatic wafer feeding device 100 of the embodiment is as follows: the wafer modules 101 are placed in the basket unit 2 layer by layer, and the basket unit 2 is driven to a set height through the lifting module 1, so that the height of the wafer modules 101 on the corresponding layer is consistent with the receiving height of the left and right centering butt joint unit 3; the clamping jaw unit in the clamping and transferring mechanism 4 moves to one side of the basket unit 2 and extends into the basket unit 2, and the corresponding wafer module is clamped by the first sub-clamping jaw 45 and the second sub-clamping jaw 46; then, the wafer module moves backwards, the wafer module is pulled out from the basket unit 2, the wafer module is located on the support moving platform 321 of the left and right centering support plates 32, the wafer module is pulled to a set position along the left and right centering support plates 32, the first sub-clamping jaw 45 and the second sub-clamping jaw 46 are separated to a set degree but are not completely separated, the wafer module is pushed forwards in a reverse direction to the set position under the action of the third driving piece 41 by utilizing the blocking block 461, so that the wafer module is prevented from moving slightly when the wafer module is loosened by the clamping jaw units, and the wafer module reaches the most accurate position in a pushing mode, so that the centering in the front-back direction is realized; then, the left and right centering support plates 32 are driven to mutually approach through the second driving piece 31, and the wafer module is centered in the left and right direction; and then waiting for the loading module to be conveyed to the next station.

According to the high-precision automatic feeding device 100 for the wafers, the left and right centering butt-joint units are arranged, and the left and right centering support plates are synchronously moved, so that the high-precision positioning of the whole wafer module in the left and right directions is realized; the clamping and transferring mechanism is provided with the blocking block structure, and the clamping jaw structure is ingeniously designed, so that on one hand, the clamping and transferring of the wafer module are realized, on the other hand, the high-precision positioning of the whole wafer module in the front and back directions is realized by utilizing a direction pushing mode, and further, the high-precision feeding of the whole wafer module is realized; and a plurality of sensors are arranged on the moving path of the wafer module in a matching way, so that whether the wafer module is blocked or not is detected, and the reliability and effectiveness of wafer feeding are improved.

What has been described above are merely some embodiments of the present invention. It will be apparent to those skilled in the art that various changes and modifications can be made without departing from the inventive concept thereof, and these changes and modifications can be made without departing from the spirit and scope of the utility model.

Claims

1. The utility model provides a wafer high accuracy automatic feed device which characterized in that: the wafer module clamping and transferring device comprises a lifting module (1), a basket unit (2) driven by the lifting module (1) to move up and down, a left centering and docking unit (3) docked with the output end of the basket unit (2), and a clamping and transferring mechanism (4) for pulling out the wafer module from the basket unit (2) to the left centering and docking unit (3) and centering the wafer module in the front-back direction; the left and right centering butt joint unit (3) comprises a second driving piece (31) and left and right centering support supporting plates (32) which are driven by the second driving piece (31) to mutually approach or mutually open; centre gripping moves and carries mechanism (4) and includes third driving piece (41), receives third driving piece (41) drive carries out horizontal migration's clamping jaw unit, the clamping jaw unit includes first sub-clamping jaw (45) and second sub-clamping jaw (46), the lower surface downwardly extending of second sub-clamping jaw (46) is provided with blocks piece (463), block piece (463) and be in it realizes front and back centering to push the wafer module to carry out horizontal migration under the clamping jaw unit state of opening.

2. The wafer high-precision automatic feeding device of claim 1, characterized in that: the lifting module (1) comprises a first driving piece (11) and a positioning support plate (12) driven by the first driving piece (11) to move up and down, and the basket lifting unit (2) is fixed on the positioning support plate (12); a plurality of layers of supporting slide rails are arranged in the basket unit (2), and a wafer module is arranged on each layer of supporting slide rails.

3. The wafer high-precision automatic feeding device of claim 1, characterized in that: and a supporting moving platform (321) for supporting the wafer module is formed on the upper surface of the left and right centering supporting plates (32).

4. The wafer high-precision automatic feeding device of claim 3, characterized in that: and a pair of first sensors (33) is arranged on the left and right centering supporting plates (32) along the moving direction of the wafer module.

5. The wafer high-precision automatic feeding device of claim 1, characterized in that: and a safety light curtain switch (34) arranged in the vertical direction is arranged on the surface of one side, close to the basket unit (2), of the left and right centering butt joint unit (3).

6. The wafer high-precision automatic feeding device of claim 5, characterized in that: a second sensor (35) for sensing whether a wafer module is arranged on a supporting slide rail on a corresponding layer of the basket unit (2) is further arranged on the surface of one side, close to the basket unit (2), of the left and right centering butt joint unit (3); the second sensor (35) is provided with a pair and is aligned with the straight edge of the steel ring in the wafer module.

7. The wafer high-precision automatic feeding device of claim 1, characterized in that: the first sub-clamping jaw (45) comprises a first body (451) and a first clamping plate (452) located at the front end of the first body (451), and the second sub-clamping jaw (46) comprises a second body (461) and a second clamping plate (462) located at the front end of the second body (461) and matched with the first clamping plate (452) to realize clamping action.

8. The high precision automatic feeding device for the wafers as claimed in claim 7, wherein: the first clamping plate (452) is flush with the upper surface of the first body (451), and the stopper (463) extends downward from the lower surface of the second body (461) and protrudes from the lower surface of the second clamping plate (462).

9. The wafer high-precision automatic feeding device of claim 8, characterized in that: the upper surface of the first body (451) is recessed downwards to form a containing groove (453) for containing the stop block (463).