CN215397770U - Integrated circuit encapsulates finished product and beats mark device with dust removal function - Google Patents

Abstract

The utility model provides an integrated circuit packaging finished product marking device with a dust removal function, which comprises a conveying mechanism, a plate material feeding and discharging mechanism and a dust pumping and marking mechanism, wherein the conveying mechanism comprises a rack and a conveying assembly, and the conveying assembly is arranged along the length direction of the rack; the plate material feeding and discharging mechanism and the dust-pumping marking mechanism are both arranged on the frame, and the plate material feeding and discharging mechanism is used for placing the integrated circuit packaging finished products 100 on the conveying assembly one by one; the dust-extracting marking mechanism comprises a laser marking machine, a dust-extracting cover and a dust-extracting nozzle, wherein the laser marking machine is positioned at the downstream position of the plate-shaped material feeding and discharging mechanism and corresponds to the conveying assembly, the dust-extracting cover is arranged outside the dust-extracting nozzle of the laser marking machine and is arranged on the dust-extracting cover and corresponds to the laser marking machine, an instrument is adopted to convey the integrated circuit packaging finished product 100 to the laser marking machine, waste gas and smoke dust generated in the marking process are intensively extracted and separated from the integrated circuit packaging finished product, and the pollution to the environment and the damage to the health of operators can be avoided.

Description

Integrated circuit encapsulates finished product and beats mark device with dust removal function

Technical Field

The utility model relates to the technical field of semiconductor electronic product production, in particular to a marking device with a dust removal function for an integrated circuit packaging finished product.

Background

In the prior production, the finished product after the integrated circuit is packaged needs to be manually placed on a laser marking machine for marking, so that the operation is multiple, the operation is complicated, the error is easy to occur, the efficiency is low, and the danger of being damaged by laser exists. In addition, waste gas and smoke dust can be generated in the laser marking process, most of the waste gas and the smoke dust can be lifted and float in the environment, if the waste gas and the smoke dust are not processed, the environment is polluted and the health of operators is damaged, and a small amount of the smoke dust can be attached to a marked finished product to influence the cleanliness of the finished product.

Disclosure of Invention

The utility model aims to solve one of the technical problems, and provides an integrated circuit packaging finished product marking device with a dust removal function.

In order to achieve the purpose, the technical scheme adopted by the utility model is as follows:

a marking device with a dust removal function for an integrated circuit packaging finished product comprises a conveying mechanism, a plate material feeding and discharging mechanism and a dust pumping and marking mechanism, wherein the conveying mechanism comprises a rack and a conveying assembly, and the conveying assembly is arranged along the length direction of the rack; the plate material feeding and discharging mechanism and the dust-pumping marking mechanism are both arranged on the rack, and the plate material feeding and discharging mechanism is used for placing integrated circuit packaging finished products on the conveying assembly one by one; the dust-extracting marking mechanism comprises a laser marking machine, a dust-extracting cover and a dust-extracting nozzle, wherein the laser marking machine is positioned at the downstream position of the plate-shaped material feeding and discharging mechanism and corresponds to the conveying assembly, the dust-extracting cover is arranged outside the laser marking machine, and the dust-extracting nozzle is arranged on the dust-extracting cover and corresponds to the laser marking machine.

Furthermore, integrated circuit encapsulates finished product and beats mark device with dust removal function still includes dust brush and a dust extraction section of thick bamboo, the dust brush install with rotating in the frame and be located the dust extraction cover deviates from one side of going up unloading mechanism on the sheet material, the dust extraction section of thick bamboo is located the dust brush deviates from one side of dust extraction cover and with the fixed plate of frame is connected, it is equipped with the dust extraction passageway to link up in the dust extraction section of thick bamboo, the dust extraction passageway is followed the direction of height of dust extraction section of thick bamboo link up.

Further, the conveying assembly comprises two conveying parts, and the two conveying parts are arranged at intervals along the width direction of the rack so as to form a through groove between the two conveying parts.

Furthermore, the dust-pumping marking mechanism comprises a lifting plate, an inductor and a limiting plate, wherein the lifting plate is arranged on one side of the laser marking machine facing the through groove, and the lifting plate can perform lifting motion relative to the laser marking machine; the sensor is positioned at one end of the laser marking machine, which is far away from the plate-shaped material feeding and discharging mechanism, and can do lifting motion relative to the laser marking machine; the limiting plate is located at one end, facing the plate material feeding and discharging mechanism, of the laser marking machine, and the limiting plate can move up and down relative to the laser marking machine.

Furthermore, take out dirt marking mechanism and include inductor cylinder and inductor installation piece, the inductor cylinder is located it deviates from to rise to lift the board one side of unloading mechanism on the sheet material and install in the frame, the inductor cylinder is connected the inductor installation piece, the inductor is installed on the inductor installation piece.

Further, the plate-shaped material loading and unloading mechanism comprises a vertical material rack, a separation support piece and a material receiving plate, wherein the vertical material rack is arranged on the rack, the vertical material rack is provided with a stack of material grooves in a penetrating manner, the stack of material grooves extend along the height direction of the vertical material rack and are communicated with the through groove, and the side surface of the vertical material rack is provided with a through hole which is communicated with the stack of material grooves; the separation support comprises a support plate which can move into or out of the stacking trough through the through hole; the material receiving plate is located in the through groove and corresponds to the material stacking groove, and can move up and down along the height direction of the material stacking groove.

Furthermore, the integrated circuit packaging finished product marking device with the dust removal function further comprises an integrated circuit packaging finished product automatic stacking mechanism, the integrated circuit packaging finished product automatic stacking mechanism comprises a vertical stacking frame, a limiting member, a ratchet block and a material lifting member, the vertical stacking frame is arranged on the rack, the vertical stacking frame is provided with a stacking groove in a penetrating manner, the stacking groove is communicated with the through groove, the limiting member comprises a limiting block, the limiting block is arranged at one end of the stacking groove, and the limiting block can move up and down along the length direction of the vertical stacking frame; the ratchet block can rotate relative to the rack, the ratchet block comprises a stacking surface, and the ratchet block has an initial position for keeping the stacking surface in a horizontal state; the material lifting part can drive the integrated circuit packaging finished products to ascend to the material stacking groove from the through groove and drive the ratchet block to rotate, so that the integrated circuit packaging finished products are sequentially stacked along the length direction of the vertical material stacking frame.

Furthermore, integrated circuit encapsulation finished product marking device with dust removal function still is equipped with the waste material district, and the waste material district is located the automatic material mechanism that folds of integrated circuit encapsulation finished product deviates from one side of taking out dirt marking mechanism.

Further, the rack comprises a fixed plate, a movable plate and an adjusting screw rod, the movable plate and the fixed plate are arranged oppositely, the adjusting screw rod penetrates through the fixed plate and the movable plate, and the adjusting screw rod is in threaded connection with the fixed plate and the movable plate respectively.

Furthermore, the frame still includes the shielding plate, one side of shielding plate with one side of fly leaf is connected, the opposite side of shielding plate towards deviate from the direction extension of shielding plate.

Due to the adoption of the technical scheme, the utility model has the following beneficial effects:

above-mentioned integrated circuit encapsulates finished product and beats mark device with dust removal function, the last unloading mechanism of sheet material places integrated circuit encapsulation finished product on the transfer assembly one by one, and the transfer assembly will encapsulate the finished product and convey to laser marking machine department and beat the mark, and the waste gas and the smoke and dust that raise in the marking process are taken out from the dust extraction nozzle, and the dust extraction cover can make the dust extraction scope of dust extraction nozzle concentrate on laser marking machine department, improves the dust extraction efficiency. Therefore, the utility model adopts an apparatus to convey the integrated circuit packaging finished product to the laser marking machine, and carries out concentrated extraction treatment on the waste gas and smoke dust generated in the marking process, thereby avoiding the pollution of the environment and the damage to the health of operators.

Drawings

Fig. 1 is a schematic structural diagram of a marking device for an integrated circuit package finished product with a dust removal function in a preferred embodiment of the utility model.

Fig. 2 is a cross-sectional view taken along line a-a of fig. 1.

Fig. 3 is a schematic structural view of fig. 1 from another view angle.

Fig. 4 is an enlarged view at C in fig. 3.

Fig. 5 is a sectional view taken along line D-D in fig. 4.

Fig. 6 is an enlarged view at E in fig. 4.

Fig. 7 is an enlarged view at B in fig. 1.

Fig. 8 is an enlarged view at F in fig. 7.

In the figure, 1-conveying mechanism, 11-frame, 111-fixed plate, 112-movable plate, 113-adjusting screw, 114-nut barrel, 115-screw, 116-guide rod, 117-baffle plate, 12-conveying assembly, 120-through groove, 121-conveying part, 122-gear set and 123-conveying belt;

2-plate material feeding and discharging mechanism, 21-vertical material rack, 210-material stacking tank, 211-vertical plate, 2110-through hole, 212-mounting plate, 213-guide rail, 22-separation support, 221-push-pull cylinder, 222-synchronous plate, 223-support plate, 224-guide flange, 23-reinforcement limiting part, 231-adjusting transverse plate, 232-end limiting plate, 24-regular vertical rod, 25-material receiving plate and 26-material receiving cylinder;

3-dust extraction marking mechanism, 31-laser marking machine, 32-dust extraction cover, 33-dust extraction nozzle, 34-dust sweeping brush, 35-dust extraction cylinder, 351-dust extraction channel, 36-servo motor, 37-lifting plate, 371-lifting cylinder, 38-inductor, 381-inductor cylinder, 382-inductor mounting block 39-limiting plate and 391-limiting plate cylinder;

4-automatic stacking mechanism of integrated circuit packaging finished products, 41-vertical stacking frame, 410-stacking groove, 411-groove body part, 412-length plate, 4120-rotation stop surface, 413-limit column, 414-stacking limit part, 4140-end plate, 4141-stacking transverse plate, 415-stacking vertical rod, 42-limit part, 421-limit part, 422-stay cylinder, 43-ratchet block, 431-stacking surface, 432-abutting surface, 433-limit surface, 434-avoiding surface, 435-rotating shaft, 44-lifting part, 441-lifting plate and 442-lifting cylinder;

5-waste area, 100-integrated circuit package finished product.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When a component is referred to as being "connected" to another component, it can be directly connected to the other component or intervening components may also be present. When a component is referred to as being "disposed on" another component, it can be directly on the other component or intervening components may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the utility model herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

As shown in fig. 1 to 8, a preferred embodiment of the present invention provides a marking device with a dust removing function for marking a finished ic package product 100. In the prior art, a plurality of integrated circuits are packaged in a packaging frame, and after the integrated circuits are packaged, the thickness of the packaged part of an integrated circuit body is larger than the thickness of the edge of the packaging frame.

Integrated circuit encapsulates finished product marking device with dust removal function includes transport mechanism 1, the unloading mechanism 2 of sheet material and takes out dirt marking mechanism 3, and transport mechanism 1 includes frame 11 and transfer module 12, and transfer module 12 sets up along the length direction of frame 11. The plate material loading and unloading mechanism 2 and the dust-pumping marking mechanism 3 are both arranged on the frame 11, and the plate material loading and unloading mechanism 2 is used for placing the integrated circuit packaging finished products 100 on the conveying component 12 one by one. The dust-extracting marking mechanism 3 comprises a laser marking machine 31, a dust-extracting cover 32 and a dust-extracting nozzle 33, wherein the laser marking machine 31 is positioned at the downstream position of the plate-shaped material loading and unloading mechanism 2 and corresponds to the conveying component 12. The dust hood 32 is covered outside the laser marking machine 31 to form a marking space, and specifically, the dust hood 32 is supported outside the laser marking machine 31 through two columns. The dust nozzle 33 is installed on the dust hood 32 and corresponds to the laser marking machine 31.

Above-mentioned integrated circuit encapsulates finished product marking device with dust removal function, the unloading mechanism 2 of platelike material puts integrated circuit encapsulation finished product 100 on transport assembly 12 one by one, transport assembly 12 will encapsulate the finished product and convey to laser marking machine 31 department and beat the mark, the waste gas and the smoke and dust that raise in the marking process take out from dust extraction nozzle 33, dust extraction cover 32 can make the dust extraction scope of dust extraction nozzle 33 concentrate on laser marking machine 31 department, improves dust extraction efficiency. Therefore, the utility model adopts an apparatus to convey the integrated circuit packaging finished product 100 to the laser marking machine, and carries out concentrated extraction treatment on the waste gas and smoke dust generated in the marking process, thereby avoiding the pollution of the environment and the damage to the health of operators.

In the present embodiment, the conveying assembly 12 includes two conveying portions 121, and the two conveying portions 121 are spaced apart in the width direction of the rack 11 to form a through groove 120 between the two conveying portions 121.

In the present embodiment, the frame 11 is linear. The frame 11 includes a fixed plate 111, a movable plate 112 and an adjusting screw 113. One side of the fixed plate 111 is fixed to a receiving surface, which is a worktable, and the movable plate 112 is disposed opposite to the fixed plate 111. The adjusting screws 113 penetrate through the fixed plate 111 and the movable plate 112, and the adjusting screws 113 are respectively screwed with the fixed plate 111 and the movable plate 112, specifically, the number of the adjusting screws 113 is two, and the two adjusting screws 113 are arranged at intervals along the length direction of the fixed plate 111. The fixed plate 111 is provided with a fixed screw hole, and the movable plate 112 is provided with a movable screw hole corresponding to the fixed screw hole; the adjusting screw 113 includes a nut barrel 114 and a screw 115, the nut barrel 114 penetrates through the fixed screw hole and is screwed with the fixed plate 111, the nut barrel 114 is provided with a screwing through groove, the screwing through groove faces the opening of the movable plate 112, one end of the screw 115 is screwed in the screwing through groove, the screw 115 extends towards the direction of the movable plate 112, and the other end of the screw 115 is fixed with the movable screw hole. The two transmitting portions 121 are respectively mounted on the fixed plate 111 and the movable plate 112 to form a through slot 120, and the two transmitting portions 121 extend along the length direction of the fixed plate 111.

When the screw 115 is screwed into the screw through groove in the direction of the fixed plate 111 by rotating the nut barrel 114, the screw 115 drives the movable plate 112 to move in the direction of the fixed plate 111, and the distance between the movable plate 112 and the fixed plate 111 decreases; when the screw 115 is screwed out of the screw through groove in a direction away from the fixed plate 111, the screw 115 drives the movable plate 112 to move in the direction away from the fixed plate 111, and the distance between the movable plate 112 and the fixed plate 111 increases. It can be seen that the distance between the movable plate 112 and the fixed plate 111 can be adjusted by rotating the nut barrel 114, so that the two conveying parts 121 can receive the ic packages 100 with different widths.

In this embodiment, the frame 11 includes two guide rods 116, one end of each guide rod 116 is fixed to the fixed plate 111, the guide rods 116 extend toward the movable plate 112, and the other end of each guide rod 116 movably penetrates through the movable plate 112. specifically, two guide rods 116 are provided at opposite ends of the fixed plate 111, the movable plate 112 is provided with a through hole corresponding to one guide rod 116, and the other end of each guide rod 116 movably penetrates through the through hole. The guide rod 116 can guide the movement of the movable plate 112 when adjusting the distance between the movable plate 112 and the fixed plate 111.

In this embodiment, the frame 11 further includes a shielding plate 117, one side of the shielding plate 117 is connected to one side of the movable plate 112, and the other side of the shielding plate 117 extends in a direction away from the shielding plate 117. The shielding plate 117 is arranged to shield the instrument between the fixed plate 111 and the movable plate 112, so as to prevent the extracted smoke from falling onto the instrument.

In the present embodiment, the transmission part 121 includes a gear set 122 and a transmission belt 123, the gear set 122 is mounted on the corresponding fixed plate 111 or the corresponding movable plate 112, the transmission belt 123 extends along the length direction of the fixed plate 111, and the transmission belt 123 is sleeved on the gear set 122. The gear set 122 is driven by a motor to rotate, and the gear set 122 can drive the conveyor belt 123 to convey the integrated circuit package finished product 100 after rotating.

In this embodiment, the marking device for the integrated circuit package finished product with the dust removing function further includes a dust brush 34 and a dust suction cylinder 35. The sweeping brush 34 is rotatably installed on the frame 11 and located at one side of the dust hood 32 departing from the plate-shaped material loading and unloading mechanism 2, specifically, bristles of the sweeping brush 34 face the through groove 120, the top of the sweeping brush 34 is connected with a servo motor 36, the servo motor 36 is installed on the fixing plate 111, and the servo motor 36 drives the sweeping brush 34 to axially rotate. The dust extraction cylinder 35 is located on one side of the dust sweeping brush 34 departing from the dust extraction cover 32 and connected with the fixing plate 111 of the frame 11, a dust extraction channel 351 is arranged in the dust extraction cylinder 35 in a penetrating manner, and the dust extraction channel 351 penetrates along the height direction of the dust extraction cylinder 35. Dust cylinder 35 and dust extraction nozzle 33 all communicate exhaust system through the pipeline, and exhaust system is used for carrying out centralized processing with waste gas and smoke and dust, and the dust extraction system can be the air discharge fan among the prior art etc. When the marked integrated circuit packaging finished product 100 is conveyed to the dust sweeping brush 34, the dust sweeping brush 34 which axially rotates cleans a small amount of smoke dust attached to the surface of the integrated circuit packaging finished product 100, so that the smoke dust is raised, and the raised smoke dust is pumped out of the production line through the dust pumping cylinder 35, so that the surface cleanliness of the integrated circuit packaging finished product 100 is improved.

In the present embodiment, the dust marking mechanism 3 includes a lifting plate 37, a sensor 38, and a limit plate 39, and the sensor 38 is a photoelectric sensor. The lifting plate 37 is arranged on one side of the laser marking machine 31 facing the through groove 120, the lifting plate 37 can move up and down relative to the laser marking machine 31, specifically, the dust-extraction marking mechanism 3 comprises a lifting cylinder 371, the lifting cylinder 371 is positioned on one side of the lifting plate 37 departing from the laser marking machine 31 and is arranged on the fixing plate 111, and the lifting cylinder 371 is connected with the lifting plate 37 to drive the lifting plate 37 to move up and down relative to the laser marking machine 31. Inductor 38 is located the one end that laser marking machine 31 deviates from unloading mechanism 2 on the plate-like material, inductor 38 can make elevating movement relative to laser marking machine 31, it is specific, take out dirt marking mechanism 3 and include inductor cylinder 381 and inductor installation piece 382, inductor cylinder 381 is located to lift cylinder 371 and deviates from one side that unloading mechanism 2 on the plate-like material and installs on fixed plate 111, inductor cylinder 381 connects inductor installation piece 382, inductor 38 is installed on inductor installation piece 382, inductor installation piece 382 drives inductor 38 and is the elevating movement relative to laser marking machine 31. Limiting plate 39 is located laser marking machine 31 towards the one end of unloading mechanism 2 on the plate-like material, and limiting plate 39 can make elevating movement relative to laser marking machine 31, and is concrete, takes out dirt marking mechanism 3 and includes limiting plate cylinder 391, and limiting plate cylinder 391 is located and lifts cylinder 371 towards one side of unloading mechanism 2 on the plate-like material and installs on fixed plate 111, and limiting plate cylinder 391 is connected limiting plate 39 and is made elevating movement in order to drive limiting plate 39 relative laser marking machine 31.

In an initial state, the sensor cylinder 381 drives the sensor mounting block 382 to be in a rising state and to be shielded at a position of the laser marking machine 31 away from one end of the plate-shaped material loading and unloading mechanism 2, when the integrated circuit packaging finished product 100 is conveyed below the laser marking machine 31, the integrated circuit packaging finished product 100 is limited below the laser marking machine 31 by the sensor mounting block 382, so that the integrated circuit packaging finished product 100 is prevented from moving out of a marking area of the laser marking machine 31 along with the transmission of the conveyor belt; at this time, the limiting plate 39 driven by the limiting plate cylinder 391 moves upward toward the laser marking machine 31, so that the limiting plate 39 can block the ic package finished product 100 on the conveyor belt 123 from being conveyed toward the laser marking machine 31; when the lifting cylinder 371 moves the lifting plate 37 upward toward the laser marking machine 31, the integrated circuit package product 100 is separated from the conveyor belt 123 and rises to a marking distance of the laser marking machine 31, and the laser marking machine 31 performs a marking operation. When the marking of the laser marking machine 31 is finished, the lifting cylinder 371 descends the lifting plate 37 in the direction departing from the laser marking machine 31, and the integrated circuit packaging finished product 100 is received on the conveyor belt 123 again; the sensor cylinder 381 drives the sensor mounting block 382 to move downwards in the direction departing from the laser marking machine 31, and the integrated circuit packaging finished product 100 is continuously conveyed to the next station along the conveyor belt 123; when the sensor 38 senses that the marked integrated circuit package finished product 100 leaves the marking area of the laser marking machine 31, the limiting plate cylinder 391 drives the limiting plate 39 to move downwards in the direction away from the laser marking machine 31, so that the blocked integrated circuit package finished product 100 is conveyed towards the laser marking machine 31.

In the present embodiment, referring mainly to fig. 4 to 6, the plate material loading and unloading mechanism 2 includes a vertical rack 21, a separating support 22 and a material receiving plate 25, the vertical rack 21 is installed on the frame 11, and specifically, the vertical rack 21 is installed on the fixed plate 111 and the movable plate 112. The vertical rack 21 is provided with a stack of material slots 210 in a penetrating manner, and the stack of material slots 210 extend along the height direction of the vertical rack 21 and are communicated with the through slots 120. The side of the vertical rack 21 is provided with a through hole 2110, and the through hole 2110 is communicated with the material stacking groove 210. The separation support 22 includes a support plate 223 that can be moved into the stacking channel 210 or removed from the stacking channel 210 through the through hole 2110. Connect the flitch 25 to be located logical groove 120 and correspond with fold silo 210, connect the flitch 25 can be along the direction of height that folds silo 210 to be elevating movement, and is concrete, the unloading mechanism 2 includes connects the material cylinder 26 on the panel material, connects the material cylinder 26 to install on the fixed plate 111 of frame 11, connects the material cylinder 26 to connect the flitch 25 towards the one end that folds silo 210, connects the material cylinder 26 to drive and connects the flitch 25 to be elevating movement along the direction of height that folds silo 210.

Because the thickness of the packaging position of the integrated circuit body is larger than the thickness of the edge of the packaging frame, when a plurality of integrated circuit packaging finished products 100 are stacked, a supporting groove is formed between the packaging frames of the two integrated circuit packaging finished products 100. Stacking a plurality of integrated circuit packaging finished products 100 in the stacking groove 210, wherein the support plate 223 supports the integrated circuit packaging finished products 100 facing the rack 11, that is, the support plate 223 supports the integrated circuit packaging finished products 100 positioned at the bottommost, the material receiving cylinder 26 drives the material receiving plate 25 to move upwards along the height direction of the stacking groove 210, when the distance from the material receiving plate 25 to the integrated circuit packaging finished products 100 positioned at the bottommost is only the thickness of one integrated circuit packaging finished product 100, the material receiving plate 25 stops lifting, the support plate 223 is moved out of the stacking groove 210, the stacked plurality of integrated circuit packaging finished products 100 fall onto the material receiving plate 25 under the action of gravity, and at the moment, the material receiving plate 25 supports the stacked plurality of integrated circuit packaging finished products 100; the supporting plate 223 moves into the stacking groove 210 and is located in the supporting groove, and then the supporting plate 223 supports the integrated circuit package finished product 100 located at the second last; the receiving cylinder 26 drives the receiving plate 25 to move downward along the height direction of the stacking groove 210, at this time, the receiving plate 25 drives the integrated circuit package finished product 100 located at the bottommost end to move downward along with the receiving plate 25, and when the receiving plate 25 moves downward to the initial position, the two opposite sides of the integrated circuit package finished product 100 are supported on the conveying belts 123 of the two conveying portions. It can be seen that the plate-shaped material loading and unloading mechanism 2 can sequentially load the stacked plate-shaped integrated circuit package finished products 100 onto the upper conveying assembly 12 without being placed by an operator. In addition, compare with the loading attachment among the prior art, there are characteristics that area is little, simple structure in the unloading mechanism 2 on the plate material to the probability that the trouble takes place has been reduced.

In the present embodiment, the vertical rack 21 includes two sets of length adjusting members, the two sets of length adjusting members are disposed opposite to each other along the width direction of the frame 11 to form the material stacking groove 210, and the two sets of length adjusting members are disposed on the frame 11. When the distance between the movable plate 112 and the fixed plate 111 is changed, the distance between the two length-adjusting members is also changed, so that the stacking chute 210 can accommodate integrated circuit package products 100 with different widths.

In the present embodiment, since the two length adjusters have the same structure, only the length adjuster attached to the fixing plate 111 will be described to avoid redundancy: the length adjusting piece comprises two vertical plates 211 and two mounting plates 212, the two vertical plates 211 are arranged at intervals along the length direction of the fixing plate 111 of the rack 11, one end of one vertical plate 211 is detachably connected with the fixing plate 111 of the rack 11 through one mounting plate 212, specifically, one end of the mounting plate 212 is detachably mounted on the fixing plate 111 of the rack 11 through a bolt, and the other end of the mounting plate 212 is detachably mounted on one end of the vertical plate 211 through a bolt; when the mounting plate 212 is removed from the fixing plate 111, the two vertical plates 211 can be moved along the length direction of the fixing plate 111, thereby adjusting the distance between the two vertical plates 211, so that the stacking bin 210 can place integrated circuit package products 100 of different lengths. Two vertical boards 211 are all provided with through holes 2110 in a penetrating manner, and the mounting plate 212 is provided with a position avoiding opening in a penetrating manner at a position corresponding to the through holes 2110.

The number of the separation supports 22 is two, and one separation support 22 is provided corresponding to one length adjustment member. The separation support 22 includes a push-pull cylinder 221, a synchronization plate 222 and two support plates 223, the push-pull cylinder 221 is mounted on the fixing plate 111 of the frame 11, and the synchronization plate 222 extends along the length direction of the fixing plate 111 of the frame 11 and is connected to the push-pull cylinder 221. Two backup pads 223 demountable installation are in synchronous board 222 one side that deviates from push-and-pull cylinder 221, two backup pads 223 set up and correspond with two vertical board 211's through-hole 2110 respectively along the length direction interval of the fixed plate 111 of frame 11, the backup pad 223 extends towards fold material groove 210 direction, it is concrete, synchronous board 222 is equipped with a plurality of screw hole along length direction, backup pad 223 passes through the bolt detachable spiro union on synchronous board 222, after the distance adjustment between two vertical board 211, detach backup pad 223 from synchronous board 222, and install backup pad 223 on synchronous board 222 once more corresponding to vertical board 211's through-hole 2110. When the push-pull cylinder 221 drives the synchronous plate 222 to move towards the stacking groove 210, the support plate 223 penetrates through the through hole 2110 to move into the stacking groove 210; when the push-pull cylinder 221 drives the synchronizing plate 222 to move away from the stacking groove 210, the supporting plate 223 moves out of the stacking groove 210.

In this embodiment, the vertical rack 21 further includes two guide rails 213, the two guide rails 213 respectively correspond to the through holes 2110 of the two vertical plates 211 and are fixedly connected to the corresponding mounting plates 212, the guide rails 213 extend in a direction away from the stacking slot 210, one side of the guide rails 213 facing the push-pull cylinder 221 is provided with a guide groove, and the guide groove extends in a direction away from the stacking slot 210 and penetrates through the guide rails 213; a support plate 223 is provided with guide flanges 224 corresponding to the guide grooves of a guide rail 213, and the guide flanges 224 are slidably provided in the guide grooves. When the push-pull cylinder 221 drives the synchronizing plate 222 to move towards the stacking groove 210 or away from the stacking groove 210, the supporting plate 223 moves along with the synchronizing plate 222, and the guide groove can guide the movement of the guide flange 224.

In this embodiment, the vertical rack 21 further includes a reinforcing limiting portion 23 and a regulating vertical rod 24, the reinforcing limiting portion 23 is mounted on one of the length adjusting members, the regulating vertical rod 24 is mounted on the reinforcing limiting portion 23, and the regulating vertical rod 24 extends along the length direction of the vertical rack 21, specifically, the number of the reinforcing limiting portions 23 is two, the two reinforcing limiting portions 23 are both mounted on the length adjusting member on the fixing plate 111 and are arranged at intervals along the height direction of the vertical plate 211, the reinforcing limiting portion 23 includes an adjusting transverse plate 231 and two end limiting plates 232, the adjusting transverse plate 231 extends along the length direction of the fixing plate 111 of the rack 11 and is detachably connected with the two vertical plates 211 through bolts, one end of each of the two end limiting plates 232 is connected with the opposite end of the adjusting transverse plate 231, and the end limiting plates 232 extend towards the direction of the other length adjusting member; the number of the regular vertical bars 24 is two, two regular vertical bars 24 are located at two opposite ends of the stacking groove 210, and one regular vertical bar 24 is connected with the end limiting plates 232 of the two reinforcing limiting parts 23. Before the distance between the two vertical plates 211 is adjusted, the adjusting horizontal plate 231 is detached from the two vertical plates 211, so that the distance between the two vertical plates 211 is adjusted; after adjusting the distance between two vertical plates 211, to adjust the horizontal plate 231 to be connected with two vertical plates 211, two regular vertical bars 24 are located the relative both ends of folding silo 210 respectively this moment, can carry on spacingly to the integrated circuit encapsulation finished product 100 that piles up, make the integrated circuit encapsulation finished product 100 after the pile up neatly pile up along the length direction of vertical plate 211.

In this embodiment, the marking device for the integrated circuit package finished products with the dust removal function further includes an automatic stacking mechanism 4 for the integrated circuit package finished products, and the automatic stacking mechanism 4 for the integrated circuit package finished products is used for sequentially stacking the marked integrated circuit package finished products 100. The automatic stacking mechanism 4 for the integrated circuit packaging finished products is positioned on one side of the dust-pumping marking mechanism 3, which is far away from the plate-shaped material loading and unloading mechanism 2, and is arranged on the frame 11.

In this embodiment, mainly refer to fig. 7 and 8, the automatic stacking mechanism 4 for the integrated circuit packaged finished products includes a vertical stacking rack 41, a limiting member 42, a ratchet block 43 and a material lifting member 44, the vertical stacking rack 41 is installed on the rack 11, the vertical stacking rack 41 is provided with a stacking trough 410 in a penetrating manner, the stacking trough 410 is communicated with the through trough 120, the limiting member 42 includes a limiting block 421, the limiting block 421 is arranged at one end of the stacking trough 410 departing from the dust extraction marking mechanism 3, and the limiting block 421 can move up and down along the length direction of the vertical stacking rack 41. The ratchet block 43 can rotate relative to the frame 11, the ratchet block 43 includes a stacking surface 431, and the ratchet block 43 has an initial position for keeping the stacking surface 431 in a horizontal state. The lifting member 44 can lift the finished ic packages 100 from the through slot 120 to the stacking slot 410 and drive the ratchet block 43 to rotate, so that the finished ic packages 100 are stacked sequentially along the length direction of the vertical stacking frame 41.

In an initial state, the ratchet block 43 keeps the stacking surface 431 in a horizontal state, the conveying assembly 12 conveys the integrated circuit package finished product 100 to the stacking groove 410, the limiting block 421 makes an ascending motion along the length direction of the vertical stacking frame 41, the integrated circuit package finished product 100 is limited at the position of the stacking groove 410 corresponding to the through groove 120, the material lifting member 44 drives the integrated circuit package finished product 100 to ascend from the through groove 120 to the stacking groove 410, the integrated circuit package finished product 100 pushes the ratchet block 43 to rotate in a direction away from the through groove 120, when the integrated circuit package finished product 100 ascends to a preset height, the ratchet block 43 restores to an initial position, that is, the stacking surface 431 is in a horizontal state, the material lifting member 44 drives the integrated circuit package finished product 100 to descend in a direction of the through groove 120, and the integrated circuit package finished product 100 is supported on the stacking surface 431 of the ratchet block 43; when the material lifting member 44 sequentially lifts the marked integrated circuit package finished products 100 from the through slots 120 to the stacking slots 410, the marked integrated circuit package finished products 100 are sequentially stacked on the stacking surface 431. It can be seen that the ic package finished products 100 are limited to the position of the through groove 120 corresponding to the material stacking groove 410 and then are driven by the material lifting member 44 to ascend from the through groove 120 to the material stacking groove 410, so that the neatness of the stacked edges of a plurality of ic package finished products 100 can be ensured. In addition, the automatic stacking mechanism of the integrated circuit packaging finished products converts the stacking work of a plurality of integrated circuit packaging finished products 100 into mechanical work, improves the operation efficiency, reduces the error rate and greatly improves the production efficiency.

In the present embodiment, the vertical stacking frame 41 includes two sets of frame portions, the two sets of frame portions are oppositely disposed along the width direction of the frame 11 to form the stacking slot 410, and the two sets of frame portions are mounted on the frame 11, specifically, one frame portion is mounted on the fixed plate 111, and the other frame portion is mounted on the movable plate 112. When the distance between the fixed plate 111 and the movable plate 112 is adjusted, the width of the stacking groove 410 is adjusted together, and the stacking groove 410 can adapt to the integrated circuit package finished products 100 with different widths.

Since the two frame portions have the same structure, only the frame portion mounted on the fixing plate 111 will be described to avoid redundancy: the support body portion includes two groove body pieces 411, and two groove body pieces 411 set up along the length direction interval of the fixed plate 111 of frame 11, and groove body piece 411 includes length board 412 and spacing post 413, and length board 412 installs on the fixed plate 111 of frame 11 through the bolt is removable, and the one end of spacing post 413 is installed on length board 412, and the other end of spacing post 413 extends towards the direction of keeping away from the fixed plate 111 of frame 11. When the length plate 412 is detached from the fixing plate 111, the distance between the length plates 412 of the two trough members 411 is adjusted, so that the length of the stacking trough 410 can be adjusted to be suitable for integrated circuit package finished products 100 with different lengths.

In the present embodiment, the ratchet block 43 includes a contact surface 432, a limiting surface 433, and a clearance surface 434. The contact surface 432 can be in contact with the frame 11, the stacking surface 431 is parallel to the contact surface 432, and the stacking surface 431 is located on the side of the contact surface 432 away from the through groove 120. One side of the limiting surface 433 is connected with one side of the abutting surface 432 departing from the material stacking groove 410, and the limiting surface 433 extends towards the direction of the material stacking surface 431 and is connected with one side of the material stacking surface 431 departing from the material stacking groove 410. One side of the avoiding surface 434 is connected with one side of the abutting surface 432 departing from the limiting surface 433, the avoiding surface 434 extends towards the stacking groove 410, the distance between the avoiding surface 434 and the through groove 120 is gradually increased to form an inclined surface inclining towards the stacking groove 410, and the other side of the avoiding surface 434 is connected with one side of the stacking surface 431 departing from the limiting surface 433. The number of the ratchet blocks 43 is four, one ratchet block 43 is rotatably installed on one slot member 411, specifically, a rotating shaft 435 is arranged on one side of the ratchet block 43 away from the material stacking slot 410, the rotating shaft 435 and the limiting surface 433 are positioned on the same side of the ratchet block 43, and the rotating shaft 435 is rotatably installed on the length plate 412 through a shaft pin. The length plate 412 is provided with a rotation stop face 4120, the rotation stop face 4120 corresponds to the limiting face 433, and the distance from the rotation stop face 4120 to the material stacking groove 410 is gradually increased along the direction far away from the material stacking groove 410 to form an inclined surface inclined towards the direction far away from the material stacking groove 410.

In the initial position, the contact surface 432 is in contact with the frame 11. When the lifting member 44 drives the integrated circuit package finished product 100 to ascend from the through groove 120 to the stacking groove 410, the integrated circuit package finished product 100 pushes the avoiding surface 434 to enable the ratchet block 43 to rotate relative to the frame 11 in a direction departing from the through groove 120, when the ratchet block 43 rotates until the limiting surface 433 abuts against the rotation stopping surface 4120, the rotation stopping surface 4120 limits the limiting surface 433 to continue rotating, at this time, the avoiding surface 434 between the two frame parts forms a avoiding channel, and the integrated circuit package finished product 100 continues to ascend from the avoiding channel in a direction departing from the through groove 120; when the finished integrated circuit package 100 is lifted to be no longer in contact with the avoiding surface 434, the rotation-stopping surface 4120 is inclined away from the stacking groove 410, so that the ratchet block 43 rotates toward the through groove 120 relative to the frame 11 under the action of gravity, and when the abutting surface 432 abuts against the frame 11 again, the ratchet block 43 returns to the original position.

In this embodiment, the vertical stacking rack 41 further includes a stacking limiting portion 414 and a stacking vertical rod 415, the stacking limiting portion 414 is installed on one of the rack portions, the stacking vertical rod 415 is installed on the stacking limiting portion 414, and the stacking vertical rod 415 extends along the length direction of the vertical stacking rack 41, specifically, the number of the stacking limiting portions 414 is two, and the two stacking limiting portions 414 are both installed on the rack portion on the fixing plate 111 and are arranged at intervals along the height direction of the limiting column 413. The stacking limiting portion 414 includes two end plates 4140 and a stacking transverse plate 4141, one end of each of the two end plates 4140 is sleeved on the two limiting posts 413 in the frame portion, and the other end of each of the two end plates 4140 extends toward the other frame portion. The stacking transverse plate 4141 extends along the length direction of the fixing plate 111 of the frame 11, and two opposite ends of the stacking transverse plate 4141 are detachably connected with one end of the two end plates 4140 sleeved on the limiting column 413 through bolts. The number of the vertical stacking rods 415 is two, two vertical stacking rods 415 are located at two opposite ends of the stacking groove 410, and one vertical stacking rod 415 is connected with the end plates 4140 of the two stacking limiting parts 414.

Before the distance between the two limiting columns 413 is adjusted, the stacking transverse plate 4141 is detached from the two end plates 4140, so that the distance between the two limiting columns 413 is adjusted; after the distance between the two limiting posts 413 is adjusted, the stacking transverse plate 4141 is connected with the two end plates 4140, and at this time, the two stacking vertical rods 415 are respectively located at the two opposite ends of the stacking groove 410, so that the stacked integrated circuit package finished products 100 can be limited, and the stacked integrated circuit package finished products 100 can be neatly stacked along the length direction of the limiting posts 413.

In the present embodiment, the material lifting member 44 includes a material lifting plate 441 and a material lifting cylinder 442, the material lifting plate 441 is disposed corresponding to the material piling slot 410 and is located in the through slot 120, the material lifting cylinder 442 is mounted on the fixing plate 111 of the frame 11, and the material lifting cylinder 442 is connected to a side of the material lifting plate 441 facing away from the material piling slot 410. The material lifting cylinder 442 can drive the material lifting plate 441 to move up and down in the height direction of the material stacking groove 410.

In this embodiment, a stacking sensor (not shown) is disposed at an end of the frame 11 corresponding to the stacking groove 410 away from the dust-pumping marking mechanism 3, the stacking sensor is a photoelectric sensor, and specifically, the stacking sensor is disposed on the fixing plate 111. The stacking sensor is used for sensing whether the integrated circuit package finished product 100 is conveyed to the stacking groove 410.

In this embodiment, the limiting member 42 includes a stopping cylinder 422, the stopping cylinder 422 is located at one end of the material piling slot 410 away from the dust-extraction marking mechanism 3 and is installed on the fixing plate 111 of the frame 11, and the limiting member 421 is installed on the stopping cylinder 422. The stay cylinder 422 drives the stopper 421 to move up and down along the length direction of the stopper 413. When the stacking sensor senses that the integrated circuit package finished product 100 is conveyed to the stacking groove 410, the stop cylinder 422 drives the limiting block 421 to move upward in a direction away from the workbench, so that the integrated circuit package finished product 100 is limited at the stacking groove 410, and the material lifting cylinder 442 drives the material lifting plate 441 to move upward in a direction toward the stacking groove 410.

In this embodiment, integrated circuit encapsulation finished product marking device with dust removal function still is equipped with waste material district 5, waste material district 5 frame 11 is outer and is located the automatic one side that folds material mechanism 4 and deviates from dust extraction marking mechanism 3 of integrated circuit encapsulation finished product, laser marking machine 31 department is equipped with the finished product finder, the finished product finder is used for examining whether integrated circuit encapsulation finished product 100 is qualified product, when integrated circuit encapsulation finished product 100 examines to be unqualified product, stop cylinder 422 does not drive stopper 421 and does the rising motion, then unqualified product is directly conveyed to waste material district 5.

In this embodiment, the marking device for the integrated circuit package finished product with the dust removing function includes a control system for controlling the operation of the motor connected to the gear set 122, the push-pull cylinder 221, the material receiving cylinder 26, the laser marking machine 31, the servo motor 36, the lifting cylinder 371, the sensor 38, the sensor cylinder 381, the limiting plate cylinder 391, the stopping cylinder 422 and the lifting cylinder 442, and the control and operation modes of the control system are well known to those skilled in the art, for example, the chinese patent application "a tapping device control system" with the publication number CN106227142A, the chinese utility model patent "a walker control system" with the publication number CN208506553U, and the like.

It is understood that the number of the adjusting screws 113 is not limited to two in the present embodiment, and in other embodiments, the number of the adjusting screws 113 may be several, and several adjusting screws 113 are arranged at intervals along the length direction of the fixing plate 111.

It is understood that the driving mechanism for driving the receiving plate 25 to move up and down along the height direction of the stacking chute 210 is not limited to the cylinder in the present embodiment, and in other embodiments, the driving mechanism may be other devices in the prior art, such as a hydraulic lift.

It should be understood that the usage of the plate loading and unloading mechanism 2 is not limited to placing the ic package finished products 100 on the conveying assembly 12 one by one in this embodiment, and in other embodiments, the plate loading and unloading mechanism 2 may be used to stack the ic package finished products 100 on the conveying assembly 12 in the stacking slot 210 one by one, specifically: in an initial state, the supporting plate 223 is located outside the material stacking groove 210, the material receiving cylinder 26 drives the material receiving plate 25 to perform an ascending motion along the height direction of the material stacking groove 210, the material receiving plate 25 ascends the integrated circuit packaging finished product 100 towards the material stacking groove 210, when the integrated circuit packaging finished product 100 ascends to one side of the supporting plate 223, which is far away from the material receiving cylinder 26, the supporting plate 223 moves into the material stacking groove 210, the material receiving cylinder 26 drives the material receiving plate 25 to perform a descending motion along the height direction of the material stacking groove 210, and the integrated circuit packaging finished product 100 descends towards the through groove 120 under the action of gravity and is received on the supporting plate 223; the material receiving cylinder 26 drives the material receiving plate 25 to make an ascending motion along the height direction of the material stacking groove 210 again, when the ic package product 100 of this time is lifted to abut against the side of the support plate 223 facing the material receiving cylinder 26, the supporting plate 223 is moved out of the stacking groove 210, the first-time raised ic package finished product 100 is stacked on the second-time raised ic package finished product 100 under the action of gravity, at this time, the material receiving plate 25 receives the first-time raised ic package finished product 100 and the second-time raised ic package finished product 100, the material receiving cylinder 26 drives the two ic package finished products 100 to make a rising movement again, when the support plate 223 is lifted to the side of the support plate 223 facing away from the through slot 120, the support plate 223 moves into the stacking slot 210 again, two ic package finished products 100 are dropped and stacked on the support plate 223 under the action of gravity, and the plate-shaped material loading and unloading mechanism 2 can stack a plurality of ic package finished products 100 in the stacking groove 210 by repeating the above process.

It is understood that the lifting motion driving of the lifting plate 441 is not limited to the air cylinder driving in the present embodiment, and in other embodiments, the lifting motion driving may be other devices in the prior art, such as a linear motor.

The above description is intended to describe in detail the preferred embodiments of the present invention, but the embodiments are not intended to limit the scope of the claims of the present invention, and all equivalent changes and modifications made within the technical spirit of the present invention should fall within the scope of the claims of the present invention.

Claims (10)

1. The utility model provides a mark device is beaten to integrated circuit encapsulation finished product with dust removal function which characterized in that: the plate-shaped material dust-pumping marking machine comprises a conveying mechanism (1), a plate-shaped material feeding and discharging mechanism (2) and a dust-pumping marking mechanism (3), wherein the conveying mechanism (1) comprises a rack (11) and a conveying assembly (12), and the conveying assembly (12) is arranged along the length direction of the rack (11); the plate material feeding and discharging mechanism (2) and the dust extraction marking mechanism (3) are both arranged on the rack (11), and the plate material feeding and discharging mechanism (2) is used for placing integrated circuit packaging finished products (100) on the conveying assembly (12) one by one; take out dirt marking mechanism (3) including laser marking machine (31), dust extraction cover (32) and take out dirt mouth (33), laser marking machine (31) are located go up the low reaches position of unloading mechanism (2) and with conveying component (12) correspond on the sheet material, dust extraction cover (32) cover is located laser marking machine (31) are outside, take out dirt mouth (33) install in take out on dust extraction cover (32) and with laser marking machine (31) correspond.

2. The marking device for the integrated circuit packaging finished product with the dust removing function as claimed in claim 1, wherein: integrated circuit encapsulates finished product marking device with dust removal function and still includes dust brush (34) and takes out a dirt section of thick bamboo (35), dust brush (34) install with rotating in frame (11) and be located take out dirt cover (32) and deviate from one side of unloading mechanism (2) on the sheet-like material, take out dirt section of thick bamboo (35) and be located dust brush (34) deviate from one side of taking out dirt cover (32) and with fixed plate (111) of frame (11) are connected, it is equipped with in the dust extraction section of thick bamboo (35) to run through takes out dirt passageway (351), take out dirt passageway (351) edge the direction of height of taking out dirt section of thick bamboo (35) link up.

3. The marking device for the integrated circuit packaging finished product with the dust removing function as claimed in claim 2, wherein: the conveying assembly (12) comprises two conveying parts (121), and the two conveying parts (121) are arranged at intervals along the width direction of the rack (11) to form a through groove (120) between the two conveying parts (121).

4. The marking device for the integrated circuit packaging finished product with the dust removing function as claimed in claim 3, wherein: the dust extraction marking mechanism (3) comprises a lifting plate (37), an inductor (38) and a limiting plate (39), the lifting plate (37) is arranged on one side, facing the through groove (120), of the laser marking machine (31), and the lifting plate (37) can move up and down relative to the laser marking machine (31); the sensor (38) is positioned at one end of the laser marking machine (31) departing from the plate-shaped material loading and unloading mechanism (2), and the sensor (38) can move up and down relative to the laser marking machine (31); the limiting plate (39) is located the orientation of laser marking machine (31) the one end of unloading mechanism (2) on the sheet material, limiting plate (39) can be relative laser marking machine (31) makes elevating movement.

5. The marking device for the integrated circuit packaging finished product with the dust removing function as claimed in claim 4, wherein: the dust extraction marking mechanism (3) comprises an inductor cylinder (381) and an inductor mounting block (382), the inductor cylinder (381) is located on one side, deviating from the plate-shaped material feeding and discharging mechanism (2), of the lifting plate (37) and is arranged on the rack (11), the inductor cylinder (381) is connected with the inductor mounting block (382), and the inductor (38) is mounted on the inductor mounting block (382).

6. The marking device for the integrated circuit packaging finished product with the dust removing function as claimed in claim 5, wherein: the plate-shaped material loading and unloading mechanism (2) comprises a vertical material rack (21), a separating support piece (22) and a material receiving plate (25), the vertical material rack (21) is arranged on the rack (11), the vertical material rack (21) is provided with a stack of material grooves (210) in a penetrating manner, the stack of material grooves (210) extend along the height direction of the vertical material rack (21) and are communicated with the through groove (120), the side surface of the vertical material rack (21) is provided with a through hole (2110), and the through hole (2110) is communicated with the stack of material grooves (210); the separation support (22) comprises a support plate (223), the support plate (223) can move into the stacking trough (210) or move out of the stacking trough (210) through the through hole (2110); the material receiving plate (25) is located in the through groove (120) and corresponds to the stacking groove (210), and the material receiving plate (25) can move up and down along the height direction of the stacking groove (210).

7. The marking device for the integrated circuit packaging finished product with the dust removing function as claimed in claim 6, wherein: the marking device for the integrated circuit packaging finished products with the dust removal function further comprises an automatic stacking mechanism (4) for the integrated circuit packaging finished products, the automatic stacking mechanism (4) for the integrated circuit packaging finished products comprises a vertical stacking frame (41), a limiting part (42), a ratchet block (43) and a lifting part (44), the vertical stacking frame (41) is arranged on the rack (11), a stacking groove (410) is arranged in the vertical stacking frame (41) in a penetrating manner, the stacking groove (410) is communicated with the through groove (120), the limiting part (42) comprises a limiting block (421), the limiting block (421) is arranged at one end of the stacking groove (410), and the limiting block (421) can move up and down along the length direction of the vertical stacking frame (41); the ratchet block (43) can rotate relative to the rack (11), the ratchet block (43) comprises a stacking surface (431), and the ratchet block (43) has an initial position for keeping the stacking surface (431) in a horizontal state; the material lifting piece (44) can drive the integrated circuit packaging finished products (100) to ascend from the through groove (120) to the material stacking groove (410) and drive the ratchet block (43) to rotate, so that the integrated circuit packaging finished products (100)1 are sequentially stacked along the length direction of the vertical material stacking frame (41).

8. The marking device for the integrated circuit packaging finished product with the dust removing function as claimed in claim 7, wherein: integrated circuit encapsulates finished product and beats mark device with dust removal function still is equipped with waste material district (5), and waste material district (5) are located automatic material mechanism (4) of folding of integrated circuit encapsulation finished product deviates from one side of taking out dirt marking mechanism (3).

9. The marking device for the finished integrated circuit packages with the dust removing function as claimed in any one of claims 1 to 8, wherein: the rack (11) comprises a fixed plate (111), a movable plate (112) and an adjusting screw rod (113), the movable plate (112) and the fixed plate (111) are arranged oppositely, the adjusting screw rod (113) penetrates through the fixed plate (111) and the movable plate (112), and the adjusting screw rod (113) is respectively in threaded connection with the fixed plate (111) and the movable plate (112).

10. The marking device for the integrated circuit packaging finished product with the dust removing function as claimed in claim 9, wherein: the rack (11) further comprises a shielding plate (117), one side of the shielding plate (117) is connected with one side of the movable plate (112), and the other side of the shielding plate (117) extends towards the direction departing from the shielding plate (117).

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