CN215396702U

CN215396702U - Injection mold with cooling water loop structure

Info

Publication number: CN215396702U
Application number: CN202121425726.1U
Authority: CN
Inventors: 罗义柏
Original assignee: Hangzhou Kaimei Mold Co ltd
Current assignee: Hangzhou Kaimei Mold Co ltd
Priority date: 2021-06-25
Filing date: 2021-06-25
Publication date: 2022-01-04
Anticipated expiration: 2031-06-25

Abstract

The utility model discloses an injection mold with a cooling water loop structure, which comprises a base, a lower mold body and an upper mold body, wherein the upper end of the base is fixedly connected with the lower mold body, the lower mold body is connected with the upper mold body through a limiting pin in an installing manner, the top end of the upper mold body is provided with an injection molding glue hole, the top end surface of the lower mold body is provided with a mold cavity, the outer side of the mold cavity is provided with a cooling device, and the inside of the base is provided with a buffer device; the utility model relates to the technical field of injection molds. The injection mold with the cooling water loop structure solves the problems that a lower mold body bears larger pressure in the use process and the service life of the injection mold is seriously influenced due to poor damping effect of the traditional injection mold through the arranged buffer device; through the arranged cooling device, the problem that the cooling effect of the original injection mold is poor is solved, and the cooling effect of the injection mold is improved.

Description

Injection mold with cooling water loop structure

Technical Field

The utility model relates to the technical field of injection molds, in particular to an injection mold with a cooling water loop structure.

Background

An injection mold is a tool for producing plastic products; and is also a tool for giving the plastic product complete structure and accurate dimension. Injection molding, also known as injection molding, is a method of molding by injection and molding. The injection molding method has the advantages of high production speed, high efficiency, automation of operation, various colors, various shapes from simple to complex, small sizes, accurate product size, easy replacement of products, capability of forming products with complex shapes, and suitability for the molding processing fields of mass production, products with complex shapes and the like.

The cooling effect of the existing injection mold is poor, the local heat dissipation effect is poor, the demolding effect is poor at last, the product quality is affected, the damping effect of the existing mold is poor, the bottom of the existing mold is easy to receive large pressure in the using process, and the service life of the injection mold is seriously affected.

SUMMERY OF THE UTILITY MODEL

Aiming at the defects of the prior art, the utility model provides an injection mold with a cooling water loop structure, and solves the problems that the existing injection mold is poor in damping effect, seriously influences the service life of the injection mold and is poor in cooling effect when in use.

In order to achieve the purpose, the utility model is realized by the following technical scheme: the injection mold with the cooling water loop structure comprises a base, a lower mold body and an upper mold body, wherein the upper end of the base is fixedly connected with the lower mold body, the lower mold body is connected with the upper mold body through a limiting pin in an installing mode, an injection molding glue hole is formed in the top end of the upper mold body, a mold cavity is formed in the surface of the top end of the lower mold body, a cooling device is arranged on the outer side of the mold cavity, and a buffering device is arranged inside the base; the buffer device comprises a fixed block fixedly connected inside the base, the fixed block is fixed inside the base, a supporting plate is connected to the inner cavity of the fixed block in a sliding mode, the bottom end of the supporting plate and the inner cavity of the fixed block are fixedly connected with symmetrical first hinged supports, a connecting rod and a second connecting rod are hinged to the first hinged supports, the connecting rod and the other end of the second connecting rod are hinged to a second hinged support, a telescopic rod is fixedly connected to one end of the outer side of the second hinged support, the other end of the telescopic rod is fixedly connected with the inner wall of the fixed block, a first spring is sleeved on the surface of the telescopic rod, a supporting block is fixedly connected to the top end of the supporting plate, and a second spring is sleeved on the surface of the supporting block.

Preferably, the inside of base has seted up the dashpot, the sliding tray has been seted up to the both sides of dashpot, there is the buffer board through slider sliding connection on the sliding tray.

Preferably, the top end of the buffer plate is fixedly connected with the bottom end of the lower die body, and the bottom end of the buffer plate is fixedly connected with the top end of the supporting block.

Preferably, a sealing ring is arranged on the surface of the top end of the lower die body and located around the die cavity, a cooling groove is formed in the lower die body, and the cooling groove is located on the periphery of the die cavity.

Preferably, the inside of die cavity is provided with the lifter plate, and lifter plate and the sealed sliding connection of die cavity lateral wall, the bottom fixedly connected with lift cylinder of lifter plate, lift cylinder fixed mounting is in the inside of die body down.

Preferably, cooling device includes the water inlet of seting up at die body front end surface down, the water inlet rear side is equipped with first tapping ware, the other end of first tapping ware is equipped with the inlet tube, the other end of inlet tube is equipped with the toroidal tube, the toroidal tube is located the cooling tank and encircles in the outside of die cavity, the other end of toroidal tube is equipped with the outlet pipe, the other end of outlet pipe is equipped with the second tapping ware, the other end of second tapping ware is equipped with the delivery port, the inside of cooling tank is equipped with the fin, be equipped with heat conduction silica gel on the fin.

Advantageous effects

The utility model provides an injection mold with a cooling water loop structure. Compared with the prior art, the method has the following beneficial effects:

(1) this take injection mold of cooling water loop structure, receive pressure through lower die body and drive the buffer board downstream, thereby it is located the downstream in the fixed block to drive supporting shoe and backup pad, make the backup pad drive second connecting rod and second free bearing extrusion telescopic link move to both sides, realize the shock attenuation through first spring and second spring, thereby better shock attenuation effect has been played, it is relatively poor to have solved traditional injection mold shock attenuation effect, lead to the lower die body to bear great pressure in the use, the problem of injection mold life has seriously been influenced.

(2) This take injection mold of cooling water return circuit structure, through passing through pipe and external cooling liquid interconnect with water inlet and delivery port, the coolant liquid is followed the water inlet along first tapping ware, the ring pipe is gone into to the inlet tube, the heat that the lower mould body produced carries out even heat conduction through heat conduction silica gel, then heat conduction silica gel transmits the heat to the fin, and carry out the heat exchange with heat conduction silica gel, improve the even cooling effect of lower mould body, the coolant liquid that carries the heat is discharged from the outlet pipe, and discharge along the delivery port through the second tapping ware, the problem that original injection mold cooling effect is not good has been solved, the cooling effect of the utility model has been improved.

Drawings

FIG. 1 is a perspective view of the external structure of the present invention;

FIG. 2 is a perspective sectional view of the base and the lower mold body according to the present invention;

FIG. 3 is an enlarged view taken at A in FIG. 2;

fig. 4 is a perspective view of a second partial structure of the present invention.

In the figure: 1. a base; 2. a lower die body; 3. feeding a mold body; 4. a spacing pin; 5. injecting a glue hole; 6. a mold cavity; 7. a cooling device; 8. a buffer device; 101. a buffer tank; 102. a sliding groove; 103. a slider; 104. a buffer plate; 201. a seal ring; 202. a cooling tank; 601. a lifting plate; 602. a lifting cylinder; 701. a water inlet; 702. a first tap; 703. a water inlet pipe; 704. an annular tube; 705. a water outlet pipe; 706. a second tap; 707. a water outlet; 708. a heat sink; 709. heat conducting silica gel; 801. a fixed block; 802. a first hinge base; 803. a connecting rod; 804. a second connecting rod; 805. a second hinge base; 806. a telescopic rod; 807. a first spring; 808. a support plate; 809. a support block; 810. a second spring.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1-4, the present invention provides a technical solution: the injection mold with the cooling water loop structure comprises a base 1, a lower mold body 2 and an upper mold body 3, wherein the upper end of the base 1 is fixedly connected with the lower mold body 2, the lower mold body 2 is connected with the upper mold body 3 through a limiting pin 4 in an installing manner, an injection molding glue hole 5 is formed in the top end of the upper mold body 3, a mold cavity 6 is formed in the top end surface of the lower mold body 2, a cooling device 7 is arranged on the outer side of the mold cavity 6, and a buffering device 8 is arranged inside the base 1; the buffer device 8 comprises a fixed block 801 fixedly connected inside the base 1, the fixed block 801, a supporting plate 808 connected with the inner cavity of the fixed block 801 in a sliding manner, a first hinge seat 802 connected with the bottom end of the supporting plate 808 and the inner cavity surface of the fixed block 801 in a symmetrical manner, a connecting rod 803 and a second connecting rod 804 hinged on the first hinge seat 802, a second hinge seat 805 hinged on the other end of the connecting rod 803 and the second connecting rod 804, a telescopic rod 806 fixedly connected with one end of the outer side of the second hinge seat 805, the other end of the telescopic rod 806 and the inner wall of the fixed block 801 fixedly connected, a first spring 807 sleeved on the surface of the telescopic rod 806, a supporting block 809 fixedly connected with the top end of the supporting plate 808, a second spring 810 sleeved on the surface of the supporting block 809, a better shock absorption effect is achieved through the buffer device 8, the problem that the traditional injection mold has a poor shock absorption effect is solved, and the problem that the body 2 bears a larger pressure in the use process is solved, the service life of the injection mold is seriously influenced; a buffer groove 101 is formed in the base 1, sliding grooves 102 are formed in two sides of the buffer groove 101, a buffer plate 104 is connected to the sliding grooves 102 in a sliding mode through a sliding block 103, and the lower die body 2 is convenient to buffer and absorb shock through an arranged sliding structure; the top end of the buffer plate 104 is fixedly connected with the bottom end of the lower die body 2, and the bottom end of the buffer plate 104 is fixedly connected with the top end of the supporting block 809; the sealing ring 201 is arranged on the surface of the top end of the lower die body 2, the sealing ring 201 is positioned around the die cavity 6, the cooling groove 202 is formed in the lower die body 2, the cooling groove 202 is positioned on the periphery of the die cavity 6, and the sealing performance can be further improved and the injection molding quality can be ensured through the arranged sealing ring 201; the lifting plate 601 is arranged inside the die cavity 6, the lifting plate 601 is connected with the side wall of the die cavity 6 in a sealing and sliding mode, the bottom end of the lifting plate 601 is fixedly connected with the lifting cylinder 602, the lifting cylinder 602 is fixedly installed inside the lower die body 2, and the lifting plate 601 arranged in the die cavity 6 can lift through the lifting cylinder 602, so that the size of the space in the die cavity 6 is changed, and dies with different sizes can be conveniently formed; the cooling device 7 comprises a water inlet 701 formed in the front end surface of the lower die body 2, a first adapter 702 is assembled on the rear side of the water inlet 701, a water inlet pipe 703 is assembled at the other end of the first adapter 702, an annular pipe 704 is assembled at the other end of the water inlet pipe 703, the annular pipe 704 is positioned in the cooling groove 202 and surrounds the outer side of the die cavity 6, a water outlet pipe 705 is assembled at the other end of the annular pipe 704, a second adapter 706 is assembled at the other end of the water outlet pipe 705, a water outlet 707 is assembled at the other end of the second adapter 706, cooling fins 708 are assembled in the cooling groove 202, heat-conducting silica gel 709 is assembled on the cooling fins 708, and by means of the arranged cooling device 7, the problem that the cooling effect of the original injection mold is poor is solved, and the cooling effect of the injection mold is improved.

And those not described in detail in this specification are well within the skill of those in the art.

When the injection mold works, a worker firstly connects the water inlet 701 and the water outlet 707 with an external cooling liquid through a guide pipe, the cooling liquid enters the annular pipe 704 from the water inlet 701 along the first splitter 702 and the water inlet pipe 703, heat generated by the lower mold body 2 is uniformly conducted through the heat conducting silica gel 709, then the heat conducting silica gel 709 transmits the heat to the radiating fins 708 and exchanges heat with the heat conducting silica gel 709, the uniform cooling effect of the lower mold body 2 is improved, the cooling liquid carrying the heat is discharged from the water outlet pipe 705 and is discharged along the water outlet 707 through the second splitter 706, the problem of poor cooling effect of the original injection mold is solved, and the cooling effect of the injection mold is improved; lower die body 2 receives pressure to drive buffer board 104 and moves down, thereby it moves down to drive supporting shoe 809 and backup pad 808 to be located fixed block 801, make backup pad 808 drive second connecting rod 804 and second free bearing 805 extrusion telescopic link 806 move to both sides, realize the shock attenuation through first spring 807 and second spring 810, thereby better shock attenuation effect has been played, it is relatively poor to have solved traditional injection mold shock attenuation effect, lead to die body 2 to bear great pressure in the use, the problem of injection mold life has seriously been influenced, above is exactly the theory of operation of taking the injection mold of cooling water loop structure.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. Take injection mold of cooling water circuit structure, including base (1), lower mould (2) and last mould (3), mould (2) under the upper end fixedly connected with of base (1), through spacer pin (4) erection joint, its characterized in that between lower mould (2) and the last mould (3): an injection molding glue hole (5) is formed in the top end of the upper die body (3), a die cavity (6) is formed in the top end surface of the lower die body (2), a cooling device (7) is arranged on the outer side of the die cavity (6), and a buffering device (8) is arranged inside the base (1);

the buffer device (8) comprises a fixed block (801) fixedly connected with the inside of the base (1), the fixed block (801), a supporting plate (808) is connected to the inner cavity of the fixed block (801) in a sliding manner, a symmetrical first hinged support (802) is fixedly connected to the bottom end of the supporting plate (808) and the inner cavity surface of the fixed block (801), a connecting rod (803) and a second connecting rod (804) are hinged to the first hinged support (802), a second hinged support (805) is hinged to the other end of the connecting rod (803) and the other end of the second connecting rod (804), a telescopic rod (806) is fixedly connected to one end of the outer side of the second hinged support (805), the other end of the telescopic rod (806) is fixedly connected with the inner wall of the fixed block (801), a first spring (807) is sleeved on the surface of the telescopic rod (806), and a supporting block (809) is fixedly connected to the top end of the supporting plate (808), and a second spring (810) is sleeved on the surface of the supporting block (809).

2. The injection mold with a cooling water circuit structure as claimed in claim 1, wherein: the buffer slot (101) is formed in the base (1), sliding slots (102) are formed in two sides of the buffer slot (101), and a buffer plate (104) is connected to each sliding slot (102) in a sliding mode through a sliding block (103).

3. The injection mold with a cooling water circuit structure as claimed in claim 2, wherein: the top end of the buffer plate (104) is fixedly connected with the bottom end of the lower die body (2), and the bottom end of the buffer plate (104) is fixedly connected with the top end of the supporting block (809).

4. The injection mold with a cooling water circuit structure as claimed in claim 3, wherein: the sealing structure is characterized in that a sealing ring (201) is arranged on the top end surface of the lower die body (2), the sealing ring (201) is located around the die cavity (6), a cooling groove (202) is formed in the lower die body (2), and the cooling groove (202) is located on the periphery of the die cavity (6).

5. The injection mold with a cooling water circuit structure as claimed in claim 4, wherein: the improved die is characterized in that a lifting plate (601) is arranged inside the die cavity (6), the lifting plate (601) is connected with the side wall of the die cavity (6) in a sliding mode in a sealing mode, a lifting cylinder (602) is fixedly connected to the bottom end of the lifting plate (601), and the lifting cylinder (602) is fixedly installed inside the lower die body (2).

6. The injection mold with a cooling water circuit structure as claimed in claim 5, wherein: the cooling device (7) comprises a water inlet (701) formed in the front end surface of the lower die body (2), a first adapter (702) is assembled on the rear side of the water inlet (701), a water inlet pipe (703) is assembled at the other end of the first adapter (702), a ring pipe (704) is assembled at the other end of the water inlet pipe (703), the ring pipe (704) is located in the cooling groove (202) and surrounds the outer side of the die cavity (6), a water outlet pipe (705) is assembled at the other end of the ring pipe (704), a second adapter (706) is assembled at the other end of the water outlet pipe (705), a water outlet (707) is assembled at the other end of the second adapter (706), cooling fins (708) are assembled in the cooling groove (202), and heat-conducting silica gel (709) is assembled on the cooling fins (708).