CN215394558U - Grinding clamp for quartz wafer processing - Google Patents

Abstract

The utility model discloses a grinding clamp for processing a quartz wafer, which comprises a clamp body, wherein an end plate is welded on one side of the clamp body, a clamp groove is formed in one side, far away from the end plate, of the clamp body, arc-shaped pads are arranged at two ends of the clamp groove, a fixing mechanism is arranged at the top of the clamp body and comprises a fixing plate, an adjusting plate and a reinforcing plate, a sliding groove is formed in one side, far away from the clamp body, of the fixing plate, a limiting groove is formed in the sliding groove, and the grinding clamp has the advantages that: this device is through being provided with the arc pad, after the wafer inserts the anchor clamps groove, the wafer is fixed between the anchor clamps groove under the extrusion of arc pad, and the arc pad has certain elasticity, can be very big carry out self-regulation according to the thickness of wafer to ensure to carry out the ascending fixed of vertical side to the wafer, later, carry out ascending fixed of horizontal direction through regulating plate and gusset plate to it, ensure that it can not appear the displacement when adding man-hour, and then ensured the precision of processing, improved the efficiency of grinding.

Description

Grinding clamp for quartz wafer processing

Technical Field

The utility model relates to the technical field of quartz wafer processing, in particular to a grinding clamp for quartz wafer processing.

Background

In the process of processing the quartz wafer, the corners of the quartz wafer need to be ground, most of the quartz wafers are held by people and then ground by aligning the wafers with a grinding machine, or the wafers are clamped by a clamping plate and the like for processing, the mode is not stable enough for fixing the wafers, and the wafers are easy to fall off and displace in the process of grinding to cause processing failure, so the utility model provides the grinding clamp for processing the quartz wafers.

SUMMERY OF THE UTILITY MODEL

The present invention is directed to a grinding jig for processing a quartz wafer, which solves the above problems of the prior art.

In order to achieve the purpose, the utility model provides the following technical scheme: the utility model provides a be used for quartz wafer processing with grinding anchor clamps, includes the anchor clamps body, the welding of one side of anchor clamps body has the end plate, the anchor clamps groove has been seted up on one side that the end plate was kept away from to the anchor clamps body, the both ends in anchor clamps groove all are provided with the arc pad, the top of anchor clamps body is provided with fixed establishment, fixed establishment includes fixed plate, regulating plate and gusset plate, the spout has been seted up on one side that the anchor clamps body was kept away from to the fixed plate, the spacing groove has been seted up on the spout, regulating plate sliding connection is on the spacing groove, the fixed welding in top of regulating plate has the handle board, it runs through in one of keeping away from the spout on the regulating plate and has seted up the adjustment tank, the activity is inserted on the adjustment tank and is equipped with the gusset plate, the one end fixedly connected with board of gusset plate.

Preferably, the arc pad adopts soft rubber to make, the arc pad is kept away from the one side in anchor clamps groove and is the cambered surface, be provided with anti-skidding line on the cambered surface of arc pad.

Preferably, the fixing plate is welded to one side of the top of the clamp body.

Preferably, both sides of the adjusting plate are in contact with the inner wall of the sliding groove, and the adjusting plate is fixedly connected with the inner wall of the sliding groove through a spring set.

Preferably, a first plate and an adjusting plate are fixedly connected through a second spring set, and a soft pad is arranged on one side, close to the sliding groove, of the reinforcing plate.

Compared with the prior art, the utility model has the beneficial effects that: the device is provided with the arc-shaped pad, after a wafer is inserted into the clamp groove, the wafer is fixed between the clamp grooves under the extrusion of the arc-shaped pad, the arc-shaped pad has certain elasticity, self-adjustment can be greatly carried out according to the thickness of the wafer so as to ensure that the wafer is fixed in the vertical direction, then, the wafer is fixed in the horizontal direction through the adjusting plate and the reinforcing plate, specifically, before the wafer is fixed, the reinforcing plate is manually pulled through the first plate so as to avoid the wafer from being blocked when being inserted into the clamp groove, after the wafer is inserted into the clamp groove, the adjusting plate is stretched out until the outer side edge of the wafer is exceeded, then the first plate and the adjusting plate are loosened, the reinforcing plate moves downwards under the action of the second spring group, the adjusting plate moves towards the clamp groove under the action of the first spring group, then the wafer is propped against by the reinforcing plate so as to carry out horizontal fixation on the wafer, the grinding device can ensure that the grinding device does not displace during processing, thereby ensuring the processing precision and improving the grinding efficiency.

Drawings

FIG. 1 is an overall block diagram of the present invention;

FIG. 2 is a view at A of the present invention;

fig. 3 is a partial view of the securing mechanism of the present invention.

In the figure: 1. an end plate; 2. a clamp body; 3. a clamp groove; 4. an arc-shaped pad; 5. a fixing mechanism; 51. a fixing plate; 52. a chute; 53. an adjusting plate; 54. a limiting groove; 55. a first spring set; 56. a handle plate; 57. an adjustment groove; 58. a reinforcing plate; 59. a first board; 510. and a second spring set.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1-3, the present invention provides a technical solution: the utility model provides a be used for quartz wafer processing with grinding anchor clamps, including anchor clamps body 2, the welding of one side of anchor clamps body 2 has end plate 1, anchor clamps groove 3 has been seted up on anchor clamps body 2 keeps away from one side of end plate 1, the both ends of anchor clamps groove 3 all are provided with arc pad 4, the top of anchor clamps body 2 is provided with fixed establishment 5, fixed establishment 5 includes fixed plate 51, regulating plate 53 and gusset plate 58, spout 52 has been seted up on one side that anchor clamps body 2 was kept away from to fixed plate 51, spacing groove 54 has been seted up on spout 52, regulating plate 53 sliding connection is on spacing groove 54, the fixed welding in top of regulating plate 53 has handle plate 56, regulating plate 53 is last to keep away from one of spout 52 and serves and run through and has seted up regulating groove 57, the activity is inserted on regulating groove 57 and is equipped with gusset plate 58, the one end fixedly connected with number plate 59 of gusset plate 58.

Wherein, arc pad 4 adopts soft rubber to make, and arc pad 4 keeps away from one side of anchor clamps groove 3 for the cambered surface, and arc pad 4 is provided with anti-skidding line in the cambered surface, not only can protect the wafer, and the design of anti-skidding line can ensure the stability of wafer on anchor clamps body 2.

Wherein, the fixing plate 51 is welded on the top side of the clamp body 2.

The two sides of the adjusting plate 53 are in contact with the inner wall of the sliding groove 52, the adjusting plate 53 is fixedly connected with the inner wall of the sliding groove 52 through a first spring set 55, the sliding groove 52 limits the moving direction of the adjusting plate 53 and can ensure that the adjusting plate can move linearly, and the elastic force of the springs in the first spring set 55 is used as power for fixing the wafer.

Wherein, the first plate 59 and the adjusting plate 53 are fixedly connected through a second spring group 510, and a soft pad is arranged on one side of the reinforcing plate 58 close to the chute 52, and the design of the soft pad can avoid abrasion of the wafer when the wafer is fixed in the horizontal direction.

Specifically, when the wafer polishing device is used, before the wafer is fixed, the reinforcing plate 58 is manually pulled through the first plate 59 to prevent the wafer from being blocked when being inserted into the clamp groove 3, the wafer is fixed between the clamp grooves 3 under the extrusion of the arc-shaped pads 4, the arc-shaped pads 4 have certain elasticity and can be adjusted automatically according to the thickness of the wafer to ensure that the wafer is fixed in the vertical direction, then the first plate 59 and the adjusting plate 53 are loosened, the reinforcing plate 58 moves downwards under the action of the second spring group 510, the adjusting plate 53 moves towards the clamp groove 3 under the action of the first spring group 55, the reinforcing plate 58 is abutted against the wafer to fix the wafer in the horizontal direction, the displacement of the wafer during processing can be ensured, the processing precision is further ensured, and the grinding efficiency is improved.

In the description of the present invention, it is to be understood that the terms "coaxial", "bottom", "one end", "top", "middle", "other end", "upper", "one side", "top", "inner", "front", "center", "both ends", and the like, indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present invention.

Furthermore, the terms "first", "second", "third", "fourth" are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated, whereby the features defined as "first", "second", "third", "fourth" may explicitly or implicitly include at least one such feature.

In the present invention, unless otherwise expressly specified or limited, the terms "mounted," "disposed," "connected," "secured," "screwed" and the like are to be construed broadly, e.g., as meaning fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; the terms may be directly connected or indirectly connected through an intermediate, and may be communication between two elements or interaction relationship between two elements, unless otherwise specifically limited, and the specific meaning of the terms in the present invention will be understood by those skilled in the art according to specific situations.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims (5)

1. The grinding clamp for processing the quartz wafer comprises a clamp body (2) and is characterized in that an end plate (1) is welded on one side of the clamp body (2), a clamp groove (3) is formed in one side, away from the end plate (1), of the clamp body (2), arc-shaped pads (4) are arranged at two ends of the clamp groove (3), a fixing mechanism (5) is arranged at the top of the clamp body (2), the fixing mechanism (5) comprises a fixing plate (51), an adjusting plate (53) and a reinforcing plate (58), a sliding groove (52) is formed in one side, away from the clamp body (2), of the fixing plate (51), a limiting groove (54) is formed in the sliding groove (52), the adjusting plate (53) is connected to the limiting groove (54) in a sliding mode, a handle plate (56) is fixedly welded on the top of the adjusting plate (53), an end, away from the sliding groove (52), of the adjusting plate (53) penetrates through and is provided with an adjusting groove (57), a reinforcing plate (58) is movably inserted into the adjusting groove (57), and one end of the reinforcing plate (58) is fixedly connected with a first plate (59).

2. A grinding jig for quartz wafer processing as set forth in claim 1, wherein: arc pad (4) adopt soft rubber to make, one side that anchor clamps groove (3) were kept away from in arc pad (4) is the cambered surface, be provided with anti-skidding line on the cambered surface of arc pad (4).

3. A grinding jig for quartz wafer processing as set forth in claim 1, wherein: the fixing plate (51) is welded on one side of the top of the clamp body (2).

4. A grinding jig for quartz wafer processing as set forth in claim 1, wherein: the both sides of regulating plate (53) all contact with the inner wall of spout (52), through a spring assembly (55) fixed connection between regulating plate (53) and spout (52) inner wall.

5. A grinding jig for quartz wafer processing as set forth in claim 1, wherein: the first plate (59) is fixedly connected with the adjusting plate (53) through a second spring set (510), and a cushion is arranged on one side, close to the sliding groove (52), of the reinforcing plate (58).

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