CN215391223U - Automatic silicon chip degumming and degumming equipment - Google Patents
Automatic silicon chip degumming and degumming equipment Download PDFInfo
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- CN215391223U CN215391223U CN202121751932.1U CN202121751932U CN215391223U CN 215391223 U CN215391223 U CN 215391223U CN 202121751932 U CN202121751932 U CN 202121751932U CN 215391223 U CN215391223 U CN 215391223U
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- silicon wafer
- degumming
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- tank body
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Abstract
The utility model belongs to the field of silicon wafer production, and particularly relates to automatic silicon wafer degumming and degumming equipment, which comprises a tank body; an equipment box is fixedly connected to one side of the outer surface of the pool body; after the silicon wafer box is placed on the silicon wafer to be degummed, the threaded box is driven to move up and down through the first motor, the silicon wafer box is driven to move up and down through the fixing piece, when the silicon wafer box enters the rotating barrel through the silicon wafer inlet, degummed reaction liquid is placed inside the rotating barrel, through soaking reaction, the silicon wafer inside the silicon wafer box is degummed, when degummed, the silicon wafer box is lifted to the outside of the rotating barrel through the lifting of the silicon wafer box, the rotating barrel is driven to rotate through opening of the second motor, residual liquid inside the rotating barrel is discharged through the residual liquid outlet through the silicon wafer inlet, residual liquid on the outer surface of the silicon wafer can be cleaned at the moment, the problem that the occupied area of the degumming work can be increased due to the fact that two regions are arranged is solved, if the degumming work cannot be conducted separately, the residual liquid which degummed can be adhered to the surface of the silicon wafer, and thorough cleaning is caused is achieved.
Description
Technical Field
The utility model relates to the field of silicon wafer production, in particular to automatic silicon wafer degumming and degumming equipment.
Background
With the progress of scientific research technology, silicon wafers are widely applied to the fields of chips, electronic products, batteries and the like, and meanwhile, the production and processing technology of the silicon wafers is also greatly advanced, and the silicon wafers need a plurality of working procedures in processing, wherein the degumming is one of the working procedures.
The existing silicon wafer degumming device generally comprises two steps of degumming and degumming, equipment generally needs to be provided with two degumming areas and two degumming areas for work respectively to completely remove colloids on the silicon wafer, the occupied area for the two degumming areas is increased, and the degumming residual liquid is adhered to the surface of the silicon wafer if the two degumming areas are not separately carried out, so that the problem of thorough cleaning is caused; therefore, the automatic silicon wafer degumming and degumming equipment is provided for solving the problems.
SUMMERY OF THE UTILITY MODEL
In order to make up for the defects of the prior art and solve the problems that the occupied area is increased when two areas are arranged for degumming, and the residual liquid after degumming is stuck on the surface of a silicon wafer to cause thorough cleaning if the two areas are not separately arranged, the utility model provides automatic silicon wafer degumming and degumming equipment.
The technical scheme adopted by the utility model for solving the technical problems is as follows: the utility model relates to an automatic silicon wafer degumming and degumming device, which comprises a pool body; an equipment box is fixedly connected to one side of the outer surface of the cell body, a first motor is installed at the bottom of the equipment box, a threaded rod is fixedly connected to an output shaft of the first motor, a threaded box is sleeved on the outer surface thread of the threaded rod, a lifting column is fixedly connected to the top of the threaded box, a fixing piece is fixedly connected to the top of the lifting column, a silicon wafer box is fixedly connected to one side of the outer surface of the fixing piece, a silicon wafer inlet is formed in the outer surface of the cell body, a rotating barrel is arranged in the cell body, rotating shafts are fixedly connected to two sides of the outer surface of the rotating barrel, the two rotating shafts are fixedly connected to two sides of an inner cavity of the cell body through two bearings respectively, one end of one rotating shaft is fixedly connected to an output shaft of a second motor, a residual liquid outlet is formed in the bottom of the cell body, and the problem that the occupied area for degumming work by arranging two areas is increased if the two areas are not separately arranged is solved, the degummed residual liquid can be adhered to the surface of the silicon wafer, so that the problem of thorough cleaning is caused.
Preferably, surface one side rigid coupling of cell body has the clean water tank, the top intercommunication of clean water tank has the raceway, the water pump is installed to the one end of raceway, the other end rigid coupling of raceway has the shunt tubes, the bottom of shunt tubes is provided with the shower nozzle, the inside rigid coupling of silicon wafer box has the baffle, the bottom of silicon wafer box is provided with the sieve, has solved the problem that the degumming degummed is removed and is glued inefficiency.
Preferably, the top of equipment box is equipped with the opening, the inside of opening is run through to the one end of lift post, is convenient for the lift post to go up and down in the inside of equipment box.
Preferably, the outer surface both sides of screw thread box and the laminating of the inner chamber both sides of equipment box mutually, the screw thread box of being convenient for carries out lifting operation through the rotation of first motor.
Preferably, the number of the spray heads is six, so that the glue removing operation can be conveniently carried out on the silicon wafers in the corresponding five regions through the arrangement of the five spray heads.
Preferably, one end of the rotating shaft extending to the outside of one side of the tank body is fixedly connected with an output shaft of the second motor, so that the second motor is conveniently opened to drive one rotating shaft to rotate, and the rotating barrel is enabled to rotate.
The utility model has the advantages that:
1. through the structural design of the equipment box, the thread box, the threaded rod, the first motor and the rotary barrel, when a silicon wafer needing degumming is placed in the silicon wafer box, the first motor is started to drive the thread box to move up and down, the lifting column is moved by the thread box to move synchronously, at the moment, the fixing piece drives the silicon wafer box to move up and down, when the silicon wafer box enters the rotary barrel through the silicon wafer inlet, degumming reaction liquid is placed in the rotary barrel, the silicon wafer in the silicon wafer box is subjected to degumming operation through soaking reaction, when the degumming is finished, the silicon wafer box is lifted to the outside of the rotary barrel, the rotary barrel is rotated by starting the second motor, the silicon wafer inlet faces the ground direction through the rotation of the rotary barrel, residual liquid in the rotary barrel is discharged through the residual liquid outlet through the silicon wafer inlet, at the moment, the degumming operation can be carried out on the silicon wafer in the silicon wafer box, the residual liquid on the outer surface of the silicon wafer is cleaned, so that the problem that the occupied area is increased when two areas are arranged for degumming, and the degummed residual liquid is adhered to the surface of the silicon wafer to cause thorough cleaning if the two areas are not separately arranged is solved;
2. according to the utility model, through the structural design of the clean water tank, the water pump, the sieve plate, the water delivery pipe and the spray heads, the interior of the silicon wafer box is divided into five regions through five baffles in the silicon wafer box, five silicon wafers needing degumming and degumming can be placed in the five regions, when the silicon wafer box is lifted to the outside of the rotary barrel after the degumming of the silicon wafers in the silicon wafer box is completed, the clean water in the clean water tank is conveyed to the interior of the shunt pipe through the sieve plate and is discharged through the spray heads by starting the water pump, and the degumming work can be carried out on the silicon wafers in the corresponding five regions through the arrangement of the five spray heads, so that the degumming and degumming work efficiency is ensured, and the problem of low degumming and degumming efficiency is solved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive exercise.
FIG. 1 is a schematic cross-sectional front view of an apparatus case according to a first embodiment;
FIG. 2 is a schematic cross-sectional top view of a silicon wafer cassette according to the first embodiment;
FIG. 3 is a schematic sectional top view of the apparatus box according to the first embodiment;
FIG. 4 is a schematic perspective view of a rotary barrel according to the first embodiment;
fig. 5 is a schematic structural view of a liquid storage tank according to a second embodiment.
In the figure: 1. a tank body; 2. a lifting column; 3. a fixing member; 4. a silicon wafer box; 5. an equipment box; 6. a thread box; 7. a threaded rod; 8. a first motor; 9. a rotating shaft; 10. a silicon wafer inlet; 11. a residual liquid outlet; 12. rotating the barrel; 13. a second motor; 14. a clear water tank; 15. a water pump; 16. a sieve plate; 17. a shunt tube; 18. a water delivery pipe; 19. a baffle plate; 20. a spray head; 21. a liquid storage tank.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example one
Referring to fig. 1-4, an automatic silicon wafer degumming and degumming apparatus includes a tank body 1; an equipment box 5 is fixedly connected to one side of the outer surface of a pool body 1, a first motor 8 is installed at the bottom of the equipment box 5, an output shaft of the first motor 8 is fixedly connected with a threaded rod 7, a threaded box 6 is sleeved on the outer surface of the threaded rod 7 in a threaded manner, a lifting column 2 is fixedly connected to the top of the threaded box 6, a fixing piece 3 is fixedly connected to the top of the lifting column 2, a silicon wafer box 4 is fixedly connected to one side of the outer surface of the fixing piece 3, a silicon wafer inlet 10 is formed in the outer surface of the pool body 1, a rotating bucket 12 is arranged inside the pool body 1, rotating shafts 9 are fixedly connected to two sides of the outer surface of the rotating bucket 12, the two rotating shafts 9 are fixedly connected to two sides of an inner cavity of the pool body 1 through two bearings respectively, one end of one rotating shaft 9 is fixedly connected to the output shaft of a second motor 13, and an outlet 11 is formed in the bottom of the pool body 1; when the silicon wafer degumming device works, after a silicon wafer needing degumming is placed in the silicon wafer box 4, the threaded rod 7 is driven to rotate by starting the first motor 8, the threaded box 6 is driven to move up and down by the threaded rotation of the threaded rod 7 through threaded fit, the lifting column 2 can be driven to move up and down synchronously by the lifting motion of the threaded box 6, when the lifting column 2 moves, the fixing piece 3 drives the silicon wafer box 4 to move up and down, when the silicon wafer box 4 enters the rotating barrel 12 through the silicon wafer inlet 10, degumming reaction liquid is placed in the rotating barrel 12, the silicon wafer in the silicon wafer box 4 is subjected to degumming operation through soaking reaction, when the degumming is completed, the silicon wafer box 4 is lifted to the outside of the rotating barrel 12, the rotating barrel 12 is rotated by starting the second motor 13, and the rotating barrel 12 is rotated by the rotating shaft 9, so that the silicon wafer inlet 10 faces to the ground direction through the rotation of the rotating barrel 12, residual liquid in the rotary barrel 12 is discharged through the residual liquid outlet 11 through the silicon wafer inlet 10, and the silicon wafer in the silicon wafer box 4 can be degummed at the moment, namely the residual liquid on the outer surface of the silicon wafer is cleaned.
A clean water tank 14 is fixedly connected to one side of the outer surface of the tank body 1, the top of the clean water tank 14 is communicated with a water delivery pipe 18, a water pump 15 is installed at one end of the water delivery pipe 18, a shunt pipe 17 is fixedly connected to the other end of the water delivery pipe 18, a spray head 20 is arranged at the bottom of the shunt pipe 17, a baffle 19 is fixedly connected to the inside of the silicon wafer box 4, and a sieve plate 16 is arranged at the bottom of the silicon wafer box 4; during operation, divide into five regions through the inside five baffle 19 of silicon chip box 4 with the inside of silicon chip box 4, can place five required silicon chips that come unstuck and remove the glue in five regions, after the silicon chip of silicon chip box 4 inside comes unstuck and accomplishes, silicon chip box 4 rises to the outside of changeing bucket 12, through opening water pump 15, carry the clear water of the inside clear water tank 14 to shunt tubes 17 inside and discharge through shower nozzle 20 through sieve 16, through the setting of five shower nozzles 20, can carry out the work of removing glue to the silicon chip in its five regions that correspond, abluent water source can follow sieve 16 and flow to raffinate export 11, discharge through raffinate export 11, the work efficiency of removing glue that comes unstuck has been guaranteed.
An opening is formed in the top of the equipment box 5, and one end of the lifting column 2 penetrates through the opening; during operation, the lifting column 2 can be conveniently lifted and lowered in the equipment box 5.
Two sides of the outer surface of the thread box 6 are attached to two sides of the inner cavity of the equipment box 5; during operation, the screw thread box 6 of being convenient for carries out lifting operation through the rotation of first motor 8.
The number of the spray heads 20 is six; during operation, the arrangement of the five nozzles 20 is convenient, and the silicon wafers in the corresponding five regions can be subjected to glue removing operation.
One end of the rotating shaft 9 extending to the outside of one side of the tank body 1 is fixedly connected with an output shaft of a second motor 13; when the rotary drum is in work, the second motor 13 is conveniently started to drive the rotary shaft 9 to rotate, so that the rotary drum 12 rotates.
Example two
Referring to fig. 5, in a first comparative example, as another embodiment of the present invention, a liquid storage tank 21 is fixedly connected to the bottom of the tank body 1; during operation, be convenient for collect from the raffinate 11 raffinate of department of flowing of raffinate export to carry out further processing to the raffinate.
The working principle is that after a silicon wafer needing degumming is placed in a silicon wafer box 4, a threaded rod 7 is driven to rotate by starting a first motor 8, the threaded rod 7 rotates by the aid of threads of the threaded rod 7, a threaded box 6 is driven to move up and down by means of thread matching, a lifting column 2 can be driven to move up and down synchronously by the aid of the lifting motion of the threaded box 6, when the lifting column 2 moves, a fixing piece 3 drives the silicon wafer box 4 to move up and down, when the silicon wafer box 4 enters a rotating barrel 12 through a silicon wafer inlet 10, degumming reaction liquid is placed in the rotating barrel 12, the silicon wafer in the silicon wafer box 4 is subjected to degumming operation by means of soaking reaction, when degumming is completed, the silicon wafer box 4 is lifted to the outside of the rotating barrel 12, the rotating barrel 12 is rotated by means of a rotating shaft 9 by starting a second motor 13, and the silicon wafer inlet 10 faces the ground direction by means of rotation of the rotating barrel 12, the residual liquid in the rotary barrel 12 is discharged through the residual liquid outlet 11 through the silicon wafer inlet 10, the degumming work can be carried out on the silicon wafer in the silicon wafer box 4 at the moment, namely, the residual liquid on the outer surface of the silicon wafer is cleaned, the interior of the silicon wafer box 4 is divided into five regions through five baffle plates 19 in the silicon wafer box 4, five silicon wafers needing degumming and degumming can be placed in the five regions, after the degumming of the silicon wafer in the silicon wafer box 4 is completed, the silicon wafer box 4 rises to the exterior of the rotary barrel 12, the water pump 15 is started, the clear water in the clear water tank 14 is conveyed to the shunt pipe 17 through the sieve plate 16 and is discharged through the spray head 20, the degumming work can be carried out on the silicon wafers in the corresponding five regions through the arrangement of the five spray heads 20, and the degumming and degumming work efficiency is ensured.
In the description herein, references to the description of "one embodiment," "an example," "a specific example" or the like are intended to mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the utility model. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The foregoing shows and describes the general principles, essential features, and advantages of the utility model. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the utility model as claimed.
Claims (6)
1. An automatic silicon chip degumming and degumming equipment is characterized in that: comprises a tank body (1); the device comprises a tank body (1), a device box (5) is fixedly connected to one side of the outer surface of the tank body (1), a first motor (8) is installed at the bottom of the device box (5), an output shaft of the first motor (8) is fixedly connected with a threaded rod (7), a threaded box (6) is sleeved on the outer surface of the threaded rod (7), a lifting column (2) is fixedly connected to the top of the threaded box (6), a fixing piece (3) is fixedly connected to the top of the lifting column (2), a silicon wafer box (4) is fixedly connected to one side of the outer surface of the fixing piece (3), a silicon wafer inlet (10) is formed in the outer surface of the tank body (1), a rotating barrel (12) is arranged in the tank body (1), rotating shafts (9) are fixedly connected to two sides of the outer surface of the rotating barrel (12), the two rotating shafts (9) are fixedly connected to two sides of the inner cavity of the tank body (1) through two bearings respectively, and one end of one rotating shaft (9) is fixedly connected to an output shaft of a second motor (13), and a residual liquid outlet (11) is formed at the bottom of the tank body (1).
2. The automatic silicon wafer degumming and degumming equipment according to claim 1, characterized in that: the utility model discloses a sewage treatment device, including cell body (1), the surface one side rigid coupling of cell body (1) has clean water tank (14), the top intercommunication of clean water tank (14) has raceway (18), water pump (15) are installed to the one end of raceway (18), the other end rigid coupling of raceway (18) has shunt tubes (17), the bottom of shunt tubes (17) is provided with shower nozzle (20), the inside rigid coupling of silicon wafer box (4) has baffle (19), the bottom of silicon wafer box (4) is provided with sieve (16).
3. The automatic silicon wafer degumming and degumming device according to claim 2, characterized in that: the top of the equipment box (5) is provided with an opening, and one end of the lifting column (2) penetrates through the opening.
4. The automatic silicon wafer degumming and degumming device according to claim 3, characterized in that: and two sides of the outer surface of the thread box (6) are attached to two sides of the inner cavity of the equipment box (5).
5. The automatic silicon wafer degumming and degumming equipment according to claim 4, characterized in that: the number of the spray heads (20) is six.
6. The automatic silicon wafer degumming and degumming device according to claim 5, characterized in that: one end of the rotating shaft (9) extending to the outside of one side of the tank body (1) is fixedly connected with an output shaft of a second motor (13).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121751932.1U CN215391223U (en) | 2021-07-29 | 2021-07-29 | Automatic silicon chip degumming and degumming equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121751932.1U CN215391223U (en) | 2021-07-29 | 2021-07-29 | Automatic silicon chip degumming and degumming equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215391223U true CN215391223U (en) | 2022-01-04 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121751932.1U Expired - Fee Related CN215391223U (en) | 2021-07-29 | 2021-07-29 | Automatic silicon chip degumming and degumming equipment |
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| CN (1) | CN215391223U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116399141A (en) * | 2023-05-04 | 2023-07-07 | 东营联合石化有限责任公司 | Three-stage cooling scaling treatment device for acid water |
-
2021
- 2021-07-29 CN CN202121751932.1U patent/CN215391223U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116399141A (en) * | 2023-05-04 | 2023-07-07 | 东营联合石化有限责任公司 | Three-stage cooling scaling treatment device for acid water |
| CN116399141B (en) * | 2023-05-04 | 2023-09-22 | 东营联合石化有限责任公司 | Three-stage cooling scaling treatment device for acid water |
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| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20220104 |
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| CF01 | Termination of patent right due to non-payment of annual fee |