CN215367926U

CN215367926U - Low-stress ceramic polystyrene board

Info

Publication number: CN215367926U
Application number: CN202121264200.XU
Authority: CN
Inventors: 陈益
Original assignee: Suzhou Huayan New Building Materials Co ltd
Current assignee: Suzhou Huayan New Building Materials Co ltd
Priority date: 2021-06-07
Filing date: 2021-06-07
Publication date: 2021-12-31
Anticipated expiration: 2031-06-07

Abstract

The application discloses ceramic polyphenyl board of low stress, including first ceramic layer, first strip groove, first draw-in groove, polyphenyl layer, crackle, ceramic strip pipe, second card post, second ceramic layer, second strip groove, second draw-in groove, first card post and square hole way. This application is rational in infrastructure, set up first strip groove and second strip groove respectively through subtend face between first ceramic layer and second ceramic layer, polyphenyl layer department between the first strip groove that distributes about being located and the second strip groove sets up the crackle simultaneously, do benefit to and form the brittle failure structure of low stress, through set up draw-in groove and card post respectively at ceramic layer lateral wall both ends all around, the assembly between the ceramic polyphenyl board of being convenient for is pre-fixed, set up a plurality of ceramic strip pipes that have the crackle in the polyphenyl in situ portion simultaneously, holistic syllable-dividing effect has been strengthened.

Description

Low-stress ceramic polystyrene board

Technical Field

The application relates to the field of polystyrene boards, in particular to a low-stress ceramic polystyrene board.

Background

Polystyrene board is used as heat insulating layer, and is named as foamed polystyrene board, foamed polystyrene board or EPS board, and is white solid with fine closed pore structure formed with expandable polystyrene bead containing volatile liquid foaming agent and through heating and pre-foaming in mold.

The ceramic polystyrene board used for special environment needs low stress performance, and the existing ceramic polystyrene board is mostly a structure with strong stress and mostly a solid structure, so that the sound insulation effect is relatively poor. Therefore, a low stress ceramic polystyrene board is proposed to solve the above problems.

Disclosure of Invention

In the present embodiment, a low stress ceramic polystyrene board is provided to solve the problems in the prior art.

According to an aspect of this application, a ceramic polyphenyl board of low stress is provided, including first ceramic layer, polyphenyl layer, ceramic strip pipe and second ceramic layer, first ceramic layer sets up in polyphenyl layer one side, polyphenyl layer opposite side is provided with the second ceramic layer, polyphenyl layer inside equidistance distributes and is provided with a plurality of ceramic strip pipes, and on the polyphenyl layer with ceramic strip pipe all be provided with the crackle on the surface.

Furthermore, first draw-in groove and first card post have been seted up respectively to first ceramic layer lateral wall both ends all around, and a plurality of first grooves have been seted up to first ceramic layer medial surface equidistance.

Furthermore, a second clamping groove and a second clamping column are respectively formed in two ends of the peripheral side wall of the second ceramic layer, and a plurality of second grooves are formed in the inner side surface of the second ceramic layer at equal intervals.

Furthermore, the first ceramic layer, the polyphenyl layer and the second ceramic layer form a complete ceramic polyphenyl board.

Further, the number of the first grooves is consistent with the number of the cracks and the number of the second grooves.

Further, the first groove and the crack on the same vertical plane and the second groove form a low-stress brittle fracture area.

Through the above-mentioned embodiment of this application, set up first strip groove and second strip groove respectively through subtend face between first ceramic layer and second ceramic layer, the while sets up the crackle in the polyphenyl layer department between the first strip groove that is located upper and lower distribution and the second strip groove, do benefit to and form the brittle failure structure of low stress, through set up draw-in groove and card post respectively at ceramic layer lateral wall both ends all around, it is pre-fixed to be convenient for assemble between the pottery polyphenyl board, set up a plurality of ceramic strip pipes that have the crackle in the polyphenyl in situ simultaneously, holistic syllable-dividing effect has been strengthened.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without inventive exercise.

Fig. 1 is a perspective view of the overall structure of an embodiment of the present application.

In the figure: 1. the ceramic tube comprises a first ceramic layer, 2, a first groove, 3, a first clamping groove, 4, a polyphenyl layer, 5, a crack, 6, a ceramic tube, 7, a second clamping column, 8, a second ceramic layer, 9, a second groove, 10, a second clamping groove, 11, a first clamping column, 12 and a square hole channel.

Detailed Description

In order to make the technical solutions better understood by those skilled in the art, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only partial embodiments of the present application, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

It should be noted that the terms "first," "second," and the like in the description and claims of this application and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It should be understood that the data so used may be interchanged under appropriate circumstances such that embodiments of the application described herein may be used. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.

In this application, the terms "upper", "lower", "left", "right", "front", "rear", "top", "bottom", "inner", "outer", "middle", "vertical", "horizontal", "lateral", "longitudinal", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings. These terms are used primarily to better describe the present application and its embodiments, and are not used to limit the indicated devices, elements or components to a particular orientation or to be constructed and operated in a particular orientation.

Moreover, some of the above terms may be used to indicate other meanings besides the orientation or positional relationship, for example, the term "on" may also be used to indicate some kind of attachment or connection relationship in some cases. The specific meaning of these terms in this application will be understood by those of ordinary skill in the art as appropriate.

Furthermore, the terms "mounted," "disposed," "provided," "connected," and "sleeved" are to be construed broadly. For example, it may be a fixed connection, a removable connection, or a unitary construction; can be a mechanical connection, or an electrical connection; may be directly connected, or indirectly connected through intervening media, or may be in internal communication between two devices, elements or components. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

Referring to fig. 1, a low-stress ceramic polystyrene board includes a first ceramic layer 1, a polystyrene layer 4, ceramic strip tubes 6 and a second ceramic layer 8, where the first ceramic layer 1 is disposed on one side of the polystyrene layer 4, the second ceramic layer 8 is disposed on the other side of the polystyrene layer 4, a plurality of ceramic strip tubes 6 are disposed in the polystyrene layer 4 at equal intervals, and cracks 5 are disposed on the polystyrene layer 4 and on the surfaces of the ceramic strip tubes 6.

A first clamping groove 3 and a first clamping column 11 are respectively formed at two ends of the peripheral side wall of the first ceramic layer 1, and a plurality of first grooves 2 are equidistantly formed in the inner side surface of the first ceramic layer 1; a second clamping groove 10 and a second clamping column 7 are respectively formed in two ends of the peripheral side wall of the second ceramic layer 8, and a plurality of second grooves 9 are formed in the inner side surface of the second ceramic layer 8 at equal intervals; the first ceramic layer 1, the polyphenyl layer 4 and the second ceramic layer 8 form a complete ceramic polyphenyl plate; the number of the first grooves 2 is consistent with the number of the cracks 5 and the number of the second grooves 9; the first groove 2, the crack 5 on the same vertical plane and the second groove 9 form a low-stress brittle fracture area.

When the ceramic material is used, the first grooves 2 and the second grooves 9 are respectively arranged on the opposite surfaces between the first ceramic layer 1 and the second ceramic layer 8, and the cracks 5 are arranged on the polyphenyl layer 4 between the first grooves 2 and the second grooves 9 which are distributed up and down, so that a low-stress brittle fracture structure is formed;

through set up draw-in groove and card post respectively at ceramic layer lateral wall both ends all around, the assembly between the pottery polyphenyl board of being convenient for is fixed in advance, sets up a plurality of ceramic strip pipes 6 that have crackle 5 simultaneously in polyphenyl layer 4 inside, has strengthened holistic syllable-dividing effect.

The application has the advantages that:

1. the structure is reasonable, the first grooves 2 and the second grooves 9 are respectively arranged on the opposite surfaces between the first ceramic layer 1 and the second ceramic layer 8, and the cracks 5 are arranged on the polyphenyl layer 4 between the first grooves 2 and the second grooves 9 which are distributed up and down, so that a low-stress brittle fracture structure is formed;

2. this application is rational in infrastructure, and through set up draw-in groove and card post respectively at ceramic layer lateral wall both ends all around, the assembly between the pottery polyphenyl board of being convenient for is pre-fixed, sets up a plurality of ceramic strip pipes 6 that have crackle 5 in polyphenyl layer 4 inside simultaneously, has strengthened holistic syllable-dividing effect.

The above description is only a preferred embodiment of the present application and is not intended to limit the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A low stress ceramic polystyrene board, characterized in that: including first ceramic layer (1), polyphenyl layer (4), ceramic bar pipe (6) and second ceramic layer (8), first ceramic layer (1) sets up in polyphenyl layer (4) one side, polyphenyl layer (4) opposite side is provided with second ceramic layer (8), the inside equidistance distribution of polyphenyl layer (4) is provided with a plurality of ceramic bar pipes (6), and all is provided with crackle (5) on polyphenyl layer (4) and ceramic bar pipe (6) surface.

2. The low stress ceramic polystyrene board as claimed in claim 1, wherein: first draw-in groove (3) and first card post (11) have been seted up respectively to first ceramic layer (1) lateral wall both ends all around, and a plurality of first grooves (2) have been seted up to first ceramic layer (1) medial surface equidistance.

3. The low stress ceramic polystyrene board as claimed in claim 1, wherein: and a second clamping groove (10) and a second clamping column (7) are respectively formed in two ends of the peripheral side wall of the second ceramic layer (8), and a plurality of second grooves (9) are formed in the inner side surface of the second ceramic layer (8) at equal intervals.

4. The low stress ceramic polystyrene board as claimed in claim 1, wherein: the first ceramic layer (1), the polyphenyl layer (4) and the second ceramic layer (8) form a complete ceramic polyphenyl board.

5. The low stress ceramic polystyrene board as claimed in claim 2, wherein: the number of the first grooves (2) is consistent with the number of the cracks (5) and the number of the second grooves (9).

6. The low stress ceramic polystyrene board as claimed in claim 5, wherein: the first groove (2) and the crack (5) and the second groove (9) on the same vertical plane form a low-stress brittle fracture area.